高速率沉积磁控溅射技术制备Ge点的退火生长研究

采用磁控溅射技术在Si衬底上以350?C沉积14 nm的非晶Ge薄膜,通过退火改变系统生长热能,实现了低维Ge/Si点的生长.利用原子力显微镜(AFM)和拉曼(Raman)光谱所获得的形貌和声子振动信息,对Ge点的形成机理和演变规律进行了研究.实验结果表明:在675?C退火30 min后,非晶Ge薄膜转变为密度高达8.5×109cm-2的Ge点.通过Ostwald熟化理论、表面扩散模型和对激活能的计算,很好地解释了退火过程中,Ge原子在Si表面迁移、最终形成纳米点的行为.研究结果表明用高速沉积磁控溅射配合热退火制备Ge/Si纳米点的方法,可为自组织量子点生长实验提供一定的理论支撑.     

Si表面离子束辅助沉积Ti纳米膜的研究

用离子束技术探讨了Si表面纳米Ti薄膜制备的可行性以及Ti薄膜组织结构与离子束工艺之间的关系。实验进行试样表面预处理、轰击离子能量、离子密度、温度、沉积时间等离子束工艺参数对单晶Si(111)表面沉积的Ti薄膜结构的影响。采用原子力显微镜(AFM)和扫描电子显微镜(SEM)分析了Ti膜表面晶粒形貌，并用X射线衍射仪(XRD)和俄歇电子谱仪(AES)分析了Ti膜的结构和成分。由于残余气体的影响，Ti膜发生了不同程度的氧化，随温度升高和轰击离子强度增加氧化愈加明显。     

退火温度和溅射时间对磁控溅射法制备Mg2Si薄膜的影响

采用磁控溅射法和原位退火工艺在钠钙玻璃衬底上制备 Mg2Si 薄膜。首先在钠钙玻璃衬底上交替溅射沉积两层Si、Mg 薄膜,冷却至室温后原位退火4 h,制备出一系列 Mg2Si 薄膜样品。通过 X 射线衍射仪(XRD) 、 扫描电子显微镜(SEM)对所得薄膜样品的晶体结构和表面形貌进行表征, 讨论了退火温度和溅射Si/Mg/Si/Mg 时间对制备 Mg2Si 薄膜的影响。结果表明,采用磁控溅射法在钠钙玻璃衬底上交替溅射两层Si、Mg 薄膜, 通过原位退火方式成功制备出单一相的 Mg2Si 薄膜,溅射Si/Mg/Si/Mg 的时间为12.5/9/12.5/9 min,退火温度为550 ℃ 时,制备的 Mg2Si 薄膜结晶度最好,连续性和致密性最强。这对后续 Mg2Si 薄膜器件的设计与制备提供了重要的参考。 积两层Si、Mg 薄膜, 冷却至室温后原位退火4 h, 制备出一系列 Mg2Si 薄膜样品. 通过 X 射线衍射仪(XRD) 、 扫描 电子显微镜(SEM)对所得薄膜样品的晶体结构和表面形貌进行表征, 讨论了退火温度和溅射Si/Mg/Si/Mg 时间 对制备 Mg2Si 薄膜的影响. 结果表明, 采用磁控溅射法在钠钙玻璃衬底上交替溅射两层Si、Mg 薄膜, 通过原位退火 方式成功制备出单一相的 Mg2Si 薄膜, 溅射Si/Mg/Si/Mg 的时间为12.5/9/12.5/9 min, 退火温度为550 ℃ 时, 制 备的 Mg2Si 薄膜结晶度最好, 连续性和致密性最强. 这对后续 Mg2Si 薄膜器件的设计与制备提供了重要的参考.     

单晶硅化学机械抛光划痕演变研究

化学机械抛光法是制作超光滑单晶硅镜片的常用工艺,抛光过程中的各类杂质粒子经常会导致加工表面产生划痕,降低镜片的表面质量。为系统研究不同晶向单晶硅表面塑性划痕与抛光液中杂质的关系,设计了金刚石微粉掺杂抛光Si(111)、Si(110)和Si(100)晶面的实验。利用轮廓仪测量了不同晶向、不同掺杂浓度下的划痕形貌,并通过计算载荷归一化后的划痕宽度分布、划痕深度分布、粗糙度和二维功率谱密度来评估划痕形貌。结果显示,抛光液中杂质粒子粒径、硅片表面的划痕宽度均服从正态分布。随着杂质粒子浓度的增加,划痕形貌从非周期性特征转变为周期性波动,粗糙度出现突跃点。此外,在同浓度金刚石微粉掺杂情况下,Si(110)面在划痕产生初期有更好的杂质粒子容忍度。     

基于小波变换Cu-W薄膜表面形貌表征与硬度值分散性评价

提出了一种基于小波变换描述薄膜表面形貌的方法.运用离散小波变换法研究磁控溅射Cu-W薄膜表面特征随溅射时间的演变.结果表明，Cu-W薄膜在溅射时间超过600s时才达到稳定.不同薄膜表面形貌的变化主要是由高频部分引起.薄膜的粗糙表面会引起纳米压入硬度值的分散，这种分散性可用基于小波变换的薄膜表面形貌多尺度分解评价. 关键词： Cu-W 薄膜 表面形貌 小波变换 纳米压入     

Au诱导形成有序Si纳米孔阵列及其应用

以自组装聚苯乙烯小球(PS)单层膜为掩膜,利用Au对Si表面的催化氧化作用以及KOH溶液对单晶Si的各向异性腐蚀特性,在Si(100)面上制备了一系列尺寸小于100 nm有序可控的Si纳米孔阵列.扫描电镜(SEM)和原子力显微镜(AFM)等的测试结果显示:当PS小球溶液与甲醇溶液的体积比为9:11时,可形成大面积无缺陷的单层膜;但当体积比过大时,会导致类似双层膜结构的形成;而当体积比过小时,会诱导形成点缺陷和线缺陷.对PS小球及溅射Au处理过的Si晶片进行KOH溶液腐蚀,随着腐蚀时间变长,纳米孔的横向尺寸和深度增大,其形貌由圆形逐渐变为倒金字塔型,当腐蚀时间超过10 min,纳米孔阵列的有序性遭到破坏.采用离子束溅射技术在倒金字塔型纳米孔衬底上获得了有序Ge/Si纳米岛,而在圆形纳米孔衬底上获得了有序Ge/Si纳米环.进一步对有序Ge/Si纳米岛及纳米环的形成机理进行了解释.     

高择优取向Mo薄膜的直流磁控溅射制备及其电学性能

使用直流磁控溅射法在玻璃基底上沉积Mo薄膜,采用X射线衍射仪、原子力显微镜和四探针测试系统研究了溅射工艺对Mo薄膜的结构、形貌和电学性能的影响.结果表明:当基片温度为150 ℃时,薄膜获得(211)晶面择优取向生长,而在低于250 ℃的其它温度条件下,样品则表现为(110)晶面择优取向生长.进一步的表面形貌分析显示:薄膜的粗糙度随基片温度变化不明显,其值大约为0.35 nm,随溅射功率密度的增大而变大|电学性能方面:随着溅射功率密度的升高,薄膜导电性能迅速增强,电阻率呈现近似指数函数衰减|随着基底温度的升高,薄膜的电阻率先减小后增大,当基底温度为150 ℃时,薄膜电阻率降低至最小值2.02×10-5 Ω·cm.     

快速热退火对Co/Si0.85Geo.15肖特基结电学特性的影响

用离子束溅射技术分别在SiO2和单晶Si衬底上沉积了Si1-xGex和Co薄膜.在不同温度下,对Co/Si1-xGex肖特基结进行快速热退火处理(RTA),对处理后的样品进行了表面形貌和电学测量.发现退火温度升高,样品表面粗糙度变大,理想因子也变大,但对肖特基势垒高度(SBH)的影响很小.分析认为,随着退火温度的升高,...     

C(膜)/Si(SiO2)(纳米微粒)/C(膜)热处理的形态及结构分析

用直流辉光溅射＋真空镀膜法制备了一种新型结构的硅基纳米发光材料－C（膜）／Si（SiO2)(纳米微粒）／C（膜）夹层膜,并对其进行了退火处理,用TEM,SEM,XRD和XPS对其进行了形态结构分析,TEM观察表明：Si(SiO2)纳米微粒基本呈球形,粒径在30nm左右,SEM观察表明：夹层膜样品总厚度约为50um ,膜表面比较平整,致密,400度退火后,样品表面变得凹凸不平,出现孔状结构;650度退火后,样品表面最平整,致密且颗粒均匀,XRD分析表明：制备出的夹层膜主要由SiO2和Si 组成,在C原子的还原作用和氧气的化作用的共同作用下,SiO2和Si含量随加热温度的升高而呈现交替变化;400度时,C的还原作用占主导地位,SiO2几乎全部被还原成了Si,此时Si含量最高;400－650度时,氧化作用占主导地位,Si又被氧化成SiO2,Si 含量降低,SiO含量逐渐上升,在650度达到最高,XS分析表明：在加热过程中,C原子逐渐扩散进入Si(SiO2)_微粒层,在650度与Si反应生成了新的SiC。     

离子束溅射自组装Ge/Si量子点生长的演变

采用离子束溅射技术,通过改变Ge的沉积量,在n型Si(100)衬底上自组装生长了一系列Ge量子点样品. 利用AFM和Raman光谱对样品表面形貌和结构进行表征,系统地研究了Ge量子点形貌、密度、尺寸大小以及Ge的结晶性和量子点中组分等随Ge沉积量的演变规律. 结果表明:Ge层从二维薄层向三维岛过渡过程中,没有观察到传统的由金字塔形向圆顶形量子点过渡,而是直接呈圆顶形生长;且随着Ge沉积量的增加,量子点密度先增大后减小,Ge的结晶性增强同时Ge/Si互混加剧,量子点中Si的组分增加. 关键词： 离子束溅射 量子点 表面形貌 Raman光谱     

Synergetic effect between ion energy and sample temperature in the formation of distinct dot pattern on Si(1 1 0) by ion-sputter erosion

We observed a synergetic effect between ion energy and sample temperature in the formation of distinct dot pattern on Si(1 1 0) by Ar⁺ ion sputtering. The ion flux was 20 μA/cm², a value smaller than those used in preceding reports by one or two orders of magnitude. In experiments, the ion energy was from 1 to 5 keV, and the temperature from room temperature to 800 °C. A phase diagram indicating the ranges of ion energy and temperature within which distinct dot patterns can be achieved has been obtained. Data analyses and simulation results reveal that the synergetic effect is consistent with the effect of the Ehrlich-Schwoebel step-edge barrier, rather than the Bradley-Harper model.     

Self-organized dot patterns on Si surfaces during noble gas ion beam erosion

The erosion of target materials with energetic ions can lead to the formation of patterns on the surface. During low-energy (?2000 eV) noble gas (Ne⁺, Ar⁺, Kr⁺, Xe⁺) ion beam erosion of silicon surfaces dot patterns evolve on the surface. Dot structures form at oblique ion incidence of 75° with respect to surface normal, with simultaneous sample rotation, at room temperature. The lateral ordering of dots increases while the dot size remains constant with ion fluence, leading to very well ordered dot patterns for prolonged sputtering. Depending on ion beam parameters, dot nanostructures have a mean size from 25 nm up to 50 nm, and a mean height up to 15 nm. The formation of dot patterns depends on the ion/target mass ratio and on the ion energy. The temporal evolution and the lateral ordering of these nanostructures is studied using scanning force microscopy (AFM).     

The effect of Ehrlich-Schwoebel step-edge barrier on the formation of self-organized Si nanodots by ion-sputter erosion

The ion flux dependence of the self-organized Si nanodots induced by 1.5 keV Ar⁺ ion sputter erosion has been studied. It shows that for the regime with ion flux >∼280 μA/cm², the currently adopted Bradley-Harper (BH) model, which is incorporated in a dynamic continuum equation holds valid. However, for ion flux <∼280 μA/cm², the measured dot size and surface roughness deviate drastically from the BH model. To interpret the data for this lower ion flux regime, the effect of the Ehrlich-Schwoebel (ES) step-edge barrier was introduced into the continuum equation. A consistency between the calculated and the experimental results was reached, furthermore, a reasonable trend was found, that is, the effective ES diffusion decreases steadily with the increasing ion flux, and at ∼280 μA/cm², it became negligibly small.     

A refined Ehrlich-Schwoebel effect on the modification of Si surface nanostructures by post ion milling

A modeling work has been conducted on a phenomenon called post ion milling (PIM), a post-treatment of Ar⁺ ion sputtering to modify nanostructures on solid surface. It was found by experiments that for PIM with a sufficiently low ion flux, both the average dot size and the surface roughness of Si nanodot arrays on Si(1 0 0) decline steadily against milling time. However, the usually adopted Kuramoto-Sivashinsky (KS) model involving the Bradley-Harper (BH) theory failed to explain the experimental results, nor the KS model that combines both the BH and Ehrlich-Schwoebel (ES) effects. We reexamined the ES term in the KS equation, and derived new terms reflecting the ES contribution. With such a modification, the KS model involving both the BH and the refined ES effects finally gave a qualitative explanation to the PIM result.     

衬底温度对PLD制备的Mo薄膜结构及表面形貌的影响

 运用脉冲激光沉积(PLD)技术在Si(100)基片上沉积了金属Mo薄膜。在激光重复频率2 Hz,能量密度5.2 J/cm²,本底真空10^－6 Pa的条件下,研究Mo薄膜的结构和表面形貌,讨论了衬底温度对薄膜形貌与结构的影响。原子力显微镜(AFM)图像和X射线小角衍射(XRD)分析表明,薄膜表面平整、光滑,均方根粗糙度小于2 nm。沉积温度对Mo薄膜结构和表面形貌影响较大,在373~573 K范围内随着温度升高,薄膜粗糙度变小,结晶程度变好。     

Light Trapping and Down‐Shifting Effect of Periodically Nanopatterned Si‐Quantum‐Dot‐Based Structures for Enhanced Photovoltaic Properties

Periodically nanopatterned Si structures have been prepared by using a nanosphere lithography technique. The formed nanopatterned structures exhibit good anti‐reflection and enhanced optical absorption characteristics. The mean surface reflectance weighted by AM1.5 solar spectrum (300–1200 nm) is as low as 5%. By depositing Si quantum dot/SiO₂ multilayers (MLs) on the nanopatterned Si substrate, the optical absorption is higher than 90%, which is significantly improved compared with the same multilayers deposited on flat Si substrate. Furthermore, the prototype n‐Si/Si quantum dot/SiO₂ MLs/p‐Si heterojunction solar cells has been fabricated, and it is found that the external quantum efficiency is obviously enhanced for nanopatterned cell in a wide spectral range compared with the flat cell. The corresponding short‐circuit current density is increased from 25.5 mA cm^?2 for flat cell to 29.0 mA cm^?2 for nano‐patterned one. The improvement of cell performance can be attributed both to the reduced light loss and the down‐shifting effect of Si quantum dots/SiO₂ MLs by forming periodically nanopatterned structures.     

Quantitative study of oxygen enhancement of sputtered ion yields. I. Argon ion bombardment of a silicon surface with O2 flood

A novel quantification approach is applied to determine in situ the amount of surface oxygen within the sputtered particle escape depth during steady-state sputter depth profiling of silicon under simultaneous oxygenation with an oxygen flood gas or with an oxygen primary ion beam. Quantification is achieved by comparing the secondary ion intensities of ¹⁶O that is adsorbed or implanted at the Si surface with the measured peak intensities of a calibrated ¹⁸O ion implant used as a reference standard. Sputtered ion yields can thereby be related to surface oxygen levels. In the present work the dependences of the partial silicon sputter yield Y and of the positive and negative secondary ion useful yields UY(X^±) (X = B, O, Al, Si, P) on the oxygen/silicon ratio, O/Si, in the sputtered flux are studied for ⁴⁰Ar⁺ bombardment of Si with simultaneous O₂ flooding. The silicon sputter yield is found to decrease with increasing flood pressure and O/Si ratio by up to a factor of 3. Both positive and negative secondary ion yields are enhanced by the presence of oxygen at the silicon surface. The useful ion yield of Si⁺ scales non-linearly with the atom fraction of surface oxygen; this behavior is shown to invalidate models that suggest that Si⁺ ion yield enhancement is dominated either by isolated oxygen atoms or by formation of SiO₂ precipitates. In contrast a microscopic statistical model that assumes that local Si⁺ ion formation depends only on the number of oxygen atoms coordinated to the Si atom to be ejected fits the ion yield data quantitatively.     

溅射沉积自诱导混晶界面与Ge量子点的生长研究

在不同的沉积温度下采用离子束溅射技术,在Si基底上生长得到分布密度高、尺寸单模分布的圆顶形Ge量子点.研究发现:随沉积温度的升高Ge量子点的分布密度增大,尺寸减小,当沉积温度升高到750 ℃时,溅射沉积15个单原子层厚的Ge原子层,生长得到高度和底宽分别为14.5和52.7 nm的Ge量子点,其分布密度高达1.68×10¹⁰ cm^-2;Ge量子点的形貌、尺寸和分布密度随沉积温度的演变规律与热平衡状态下气相凝聚的量子点不同,具有稳定形状特征和尺寸分布的Ge量子点是 关键词： Ge量子点 离子束溅射沉积 表面原子行为 混晶界面     

Mechanism and enhancement of photoluminescence from silicon nanocrystals implanted in SiO2 matrix

Photoluminescence (PL) spectra of Si nanocrystals (NCs) prepared by 130 keV Si ions implantation onto SiO2 matrix were investigated as a function of annealing temperature and implanted ion dose. PL spectra consist of two PL peaks, originated from smaller Si NCs due to quantum confinement effect (QCE) and the interface states located at the surface of larger Si NCs. The evolution of number of dangling bonds (DBs) on Si NCs was also investigated. For hydrogen-passivated samples, a monotonic increase in PL peak intensity with the dose of implanted Si ions up to 3×1017 ions /cm2 is observed. The number of DBs on individual Si NC, the interaction between DBs at the surface of neighbouring Si NCs and their effects on the efficiency of PL are discussed.     

Synthesis of molybdenum silicide by both ion implantation and ion beam assisted deposition

Two groups of Mo/Si films were deposited on surface of Si(1 0 0) crystal. The first group of the samples was prepared by both ion beam assisted deposition (IBAD) and metal vapor vacuum arc (MEVVA) ion implantation technologies under temperatures from 200 to 400 °C. The deposited species of IBAD were Mo and Si, and different sputtering Ar ion densities were selected. The mixed Mo/Si films were implanted by Mo ion with energy of 94 keV, and fluence of Mo ion was 5 × 10¹⁶ ions/cm². The second group of the samples was prepared only by IBAD under the same test temperature range. The Mo/Si samples were analyzed by X-ray diffraction (XRD), atomic force microscopy (AFM), scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), sheet resistance, nanohardness, and modulus of the Mo/Si films were also measured. For the Mo/Si films implanted with Mo ion, XRD results indicate that phase of the Mo/Si films prepared at 400 and 300 °C was pure MoSi₂. Sheet resistance of the Mo/Si films implanted with Mo ion was less than that of the Mo/Si films prepared without ion implantation. Nanohardness and modulus of the Mo/Si films were obviously affected by test parameters.