AlGaN/GaN HEMT器件电流坍塌和膝点电压漂移机理的研究

考虑了势垒层、缓冲层体陷阱及表面电荷的浓度变化对电流坍塌和膝点电压的影响,发现表面电荷和势垒层体陷阱浓度的变化对沟道电子的浓度影响较小,表面电荷浓度变化下的膝点电压的偏移和坍塌强度的大小与势垒层势阱能量的变化有着主要的关系.缓冲层有着比势垒层更强的局域作用,势垒层和缓冲层的体陷阱浓度在一定范围变化时的膝点电压偏移主要是由沟道电子浓度的变化而引起的,但偏移量却比表面电荷浓度变化的情况下小很多.势阱能量的变化是造成膝点电压偏移的重要原因,坍塌强度主要取决于势阱能量和沟道的电子浓度. 关键词： AlGaN/GaN高电子迁移率晶体管 电流坍塌 膝点电压 陷阱俘获     

Modeling of trap-assisted tunneling in AlGaN/GaN heterostructure field effect transistors with different Al mole fractions

Although significant progress has been achieved in GaN based high power/high frequency electronic devices, surface-related problems still need an immediate solution. In particular, leakage currents through Schottky contacts not only impede device reliability but also degrade power efficiency and noise performance in such devices. This article discusses the mechanism of leakage currents through GaN Schottky and AlGaN/GaN Schottky interfaces for both forward and reverse biases. A theoretical model for the calculation of currents based on trap-assisted tunneling is discussed. In the calculation the trap energy has been assumed as a fitting parameter which is about 0.48 eV for different Al mole fractions. The comparison of the results obtained with the existing experimental data in the literature shows a good agreement.     

Investigating gate metal induced reduction of surface donor density in GaN/AlGaN/GaN heterostructure by electroreflectance spectroscopy

The internal field of GaN/AlGaN/GaN heterostructure on Si-substrate was investigated by varying the thickness of an undoped-GaN capping layer using electroreflectance spectroscopy. The four samples investigated are AlGaN/GaN heterostructure without a GaN cap layer (reference sample) and three other samples with GaN/AlGaN/GaN heterostructures in which the different thickness of GaN cap layer (2.7 nm, 7.5 nm, and 12.4 nm) has been considered. The sheet carrier density (n_s) of a two-dimensional electron gas has decreased significantly from 4.66 × 10¹² cm⁻² to 2.15 × 10¹² cm⁻² upon deposition of a GaN capping layer (12.4 nm) over the reference structure. Through the analysis of internal fields in each GaN capping and AlGaN barrier layers, it has been concluded that the undiminished surface donor states (n_s) of a reference structure and the reduced n_s caused by the Au gate metal are approximately 5.66 × 10¹² cm⁻² and 1.08 × 10¹² cm⁻², respectively.     

Influence of surface states on deep level transient spectroscopy in AlGaN/GaN heterostructure

Deep level transient spectroscopy(DLTS) as a method to investigate deep traps in AlGaN/GaN heterostructure or high electron mobility transistors(HEMTs) has been widely utilized.The DLTS measurements under different bias conditions are carried out in this paper.Two hole-like traps with active energies of E_v + 0.47 eV,and E_v + 0.10 eV are observed,which are related to surface states.The electron traps with active energies of E_c-0.56 eV are located in the channel,those with E_c-0.33 eV and E_c-0.88 eV are located in the AlGaN layer.The presence of surface states has a strong influence on the detection of electron traps,especially when the electron traps are low in density.The DLTS signal peak height of the electron trap is reduced and even disappears due to the presence of plentiful surface state.     

用逆压电极化模型对AlGaN/GaN 高电子迁移率晶体管电流崩塌现象的研究

通过自洽求解一维Poisson-Schrdinger方程,模拟了AlGaN/GaN高电子迁移率晶体管在工作时等效外电场对AlGaN/GaN异质结沟道处二维电子气(2DEG)浓度的影响.分析了逆压电极化效应的作用,从正-逆压电极化现象出发,提出了逆压电极化模型.计算结果显示：逆压电极化明显影响2DEG性质,当Al组分x=0.3,AlGaN层厚度为20 nm时,不考虑逆压电极化,2DEG浓度为1.53×10¹³cm^-2;当等效外电压分别为10和15V 关键词： AlGaN/GaN高电子迁移率晶体管 Poisson-Schrdinger方程 逆压电极化模型 电流崩塌     

Electric-stress reliability and current collapse of different thickness SiNx passivated AlGaN/GaN high electron mobility transistors

This paper investigates the impact of electrical degradation and current collapse on different thickness SiNx passivated AlGaN/GaN high electron mobility transistors.It finds that higher thickness SiNx passivation can significantly improve the high-electric-field reliability of a device.The degradation mechanism of the SiNx passivation layer under ON-state stress has also been discussed in detail.Under the ON-state stress,the strong electric-field led to degradation of SiNx passivation located in the gate-drain region.As the thickness of SiNx passivation increases,the density of the surface state will be increased to some extent.Meanwhile,it is found that the high NH 3 flow in the plasma enhanced chemical vapour deposition process could reduce the surface state and suppress the current collapse.     

AlGaN/GaN 高电子迁移率晶体管漏电流退化机理研究

本文首先制备了与AlGaN/GaN高电子迁移率晶体管 (HEMT) 结构与特性等效的AlGaN/GaN异质结肖特基二极管, 采用步进应力测试比较了不同栅压下器件漏电流的变化情况, 然后基于电流-电压和电容-电压测试验证了退化前后漏电流的传输机理, 并使用失效分析技术光发射显微镜 (EMMI) 观测器件表面的光发射, 研究了漏电流的时间依赖退化机理. 实验结果表明: 在栅压高于某临界值后, 器件漏电流随时间开始增加, 同时伴有较大的噪声. 将极化电场引入电流与电场的依赖关系后, 器件退化前后的 log(I_FT/E)与√E 都遵循良好的线性关系, 表明漏电流均由电子Frenkel-Poole (FP) 发射主导. 退化后 log(I_FT/E)与√E 曲线斜率的减小, 以及利用EMMI在栅边缘直接观察到了与缺陷存在对应关系的“热点”, 证明了漏电流退化的机理是: 高电场在AlGaN层中诱发了新的缺陷, 而缺陷密度的增加导致了FP发射电流I_FT的增加. 关键词： AlGaN/GaN 高电子迁移率晶体管 漏电流 退化机理     

Characterization of Al2O3 /GaN/AlGaN/GaN metalinsulator-semiconductor high electron mobility transistors with different gate recess depths

In this paper,in order to solve the interface-trap issue and enhance the transconductance induced by high-k dielectric in metal-insulator-semiconductor (MIS) high electron mobility transistors (HEMTs),we demonstrate better performances of recessed-gate Al 2 O 3 MIS-HEMTs which are fabricated by Fluorine-based Si 3 N 4 etching and chlorinebased AlGaN etching with three etching times (15 s,17 s and 19 s).The gate leakage current of MIS-HEMT is about three orders of magnitude lower than that of AlGaN/GaN HEMT.Through the recessed-gate etching,the transconductance increases effectively.When the recessed-gate depth is 1.02 nm,the best interface performance with τ it =(0.20-1.59) μs and D it =(0.55-1.08)×10 12 cm 2 ·eV 1 can be obtained.After chlorine-based etching,the interface trap density reduces considerably without generating any new type of trap.The accumulated chlorine ions and the N vacancies in the AlGaN surface caused by the plasma etching can degrade the breakdown and the high frequency performances of devices.By comparing the characteristics of recessed-gate MIS-HEMTs with different etching times,it is found that a low power chlorine-based plasma etching for a short time (15 s in this paper) can enhance the performances of MIS-HEMTs effectively.     

Transport mechanism of reverse surface leakage current in AlGaN/GaN high-electron mobility transistor with SiN passivation

The transport mechanism of reverse surface leakage current in the AlGaN/GaN high-electron mobility transistor(HEMT) becomes one of the most important reliability issues with the downscaling of feature size.In this paper,the research results show that the reverse surface leakage current in AlGaN/GaN HEMT with SiN passivation increases with the enhancement of temperature in the range from 298 K to 423 K.Three possible transport mechanisms are proposed and examined to explain the generation of reverse surface leakage current.By comparing the experimental data with the numerical transport models,it is found that neither Fowler-Nordheim tunneling nor Frenkel-Poole emission can describe the transport of reverse surface leakage current.However,good agreement is found between the experimental data and the two-dimensional variable range hopping(2D-VRH) model.Therefore,it is concluded that the reverse surface leakage current is dominated by the electron hopping through the surface states at the barrier layer.Moreover,the activation energy of surface leakage current is extracted,which is around 0.083 eV.Finally,the SiN passivated HEMT with a high Al composition and a thin AlGaN barrier layer is also studied.It is observed that 2D-VRH still dominates the reverse surface leakage current and the activation energy is around 0.10 eV,which demonstrates that the alteration of the AlGaN barrier layer does not affect the transport mechanism of reverse surface leakage current in this paper.     

Effects of SiNx on two-dimensional electron gas and current collapse of AlGaN/GaN high electron mobility transistors

SiN_x is commonly used as a passivation material for AlGaN/GaN high electron mobility transistors (HEMTs). In this paper, the effects of SiN_x passivation film on both two-dimensional electron gas characteristics and current collapse of AlGaN/GaN HEMTs are investigated. The SiN_x films are deposited by high- and low-frequency plasma-enhanced chemical vapour deposition, and they display different strains on the AlGaN/GaN heterostructure, which can explain the experiment results.     

High vertical breakdown strength in with low specific on‐resistance AlGaN/AlN/GaN HEMTs on silicon

Off‐state and vertical breakdown characteristics of AlGaN/AlN/GaN high‐electron‐mobility transistors (HEMTs) on high‐resistivity (HR)‐Si substrate were investigated and analysed. Three‐terminal off‐state breakdown (BV_gd) was measured as a function of gate–drain spacing (L_gd). The saturation of BV_gd with L_gd is because of increased gate leakage current. HEMTs with L_gd = 6 µm exhibited a specific on‐resistance R_DS[ON] of 0.45 mΩ cm². The figure of merit (FOM = BV_gd²/R_DS[ON]) is as high as 2.0 × 10⁸ V² Ω^–1 cm^–2, the highest among the reported values for GaN HEMTs on Si substrate. A vertical breakdown of ～1000 V was observed on 1.2 µm thick buffer GaN/AlN grown on Si substrate. The occurrence of high breakdown voltage is due to the high quality of GaN/AlN buffer layers on Si substrate with reduced threading dislocations which has been confirmed by transmission electron microscopy (TEM). This indicates that the AlGaN/AlN/GaN HEMT with 1.2 µm thick GaN/AlN buffer on Si substrate is promising candidate for high‐power and high‐speed switching device applications. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Deep level transient spectroscopy investigation of deep levels in CdS/CdTe thin film solar cells with Te:Cu back contact

Deep levels in Cds/CdTe thin film solar cells have a potent influence on the electrical property of these devices. As an essential layer in the solar cell device structure, back contact is believed to induce some deep defects in the CdTe thin film. With the help of deep level transient spectroscopy (DLTS), we study the deep levels in CdS/CdTe thin film solar cells with Te:Cu back contact. One hole trap and one electron trap are observed. The hole trap H1, localized at E_v+0.128~eV, originates from the vacancy of Cd (V_Cd. The electron trap E1, found at E_c-0.178~eV, is considered to be correlated with the interstitial Cu_i⁼ in CdTe.     

Breakdown voltage analysis of Al_0.25Ga_0.75N/GaN high electron mobility transistors with partial silicon doping in the AlGaN layer

In this paper,two-dimensional electron gas(2DEG) regions in AlGaN/GaN high electron mobility transistors(HEMTs) are realized by doping partial silicon into the AlGaN layer for the first time.A new electric field peak is introduced along the interface between the AlGaN and GaN buffer by the electric field modulation effect due to partial silicon positive charge.The high electric field near the gate for the complete silicon doping structure is effectively decreased,which makes the surface electric field uniform.The high electric field peak near the drain results from the potential difference between the surface and the depletion regions.Simulated breakdown curves that are the same as the test results are obtained for the first time by introducing an acceptor-like trap into the N-type GaN buffer.The proposed structure with partial silicon doping is better than the structure with complete silicon doping and conventional structures with the electric field plate near the drain.The breakdown voltage is improved from 296 V for the conventional structure to 400 V for the proposed one resulting from the uniform surface electric field.