Synthesis and Characterization of Fluorinated Polyimide Derived from 3,3′‐Diisopropyl‐4,4′‐diaminodiphenyl‐3′′,4′′‐difluorophenylmethane

A novel aromatic diamine monomer, 3,3′‐diisopropyl‐4,4′‐diaminodiphenyl‐3′′,4′′‐difluorophenylmethane (PAFM), was successfully synthesized by coupling of 2‐isopropylaniline and 3,4‐difluorobenzaldehyde. The aromatic diamine was adopted to synthesize a series of fluorinated polyimides by polycondensation with various dianhydrides: pyromellitic dianhydride (PMDA), 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA), 4,4′‐oxydiphthalic anhydride (ODPA) and 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride (BTDA) via the conventional one‐step method. These polyimides presented excellent solubility in common organic solvents, such as N,N‐dimethylformamide (DMF), N,N‐dimethyl acetamide (DMAc), dimethyl sulfoxide (DMSO), N‐methyl‐2‐pyrrolidone (NMP), chloroform (CHCl₃), tetrahydrofuran (THF) and so on. The glass transition temperatures (T_g) of fluorinated polyimides were in the range of 260–306°C and the temperature at 10% weight loss in the range of 474–502°C. Their films showed the cut‐off wavelengths of 330–361 nm and higher than 80% transparency in a wavelength range of 385–463 nm. Moreover, polymer films exhibited low dielectric properties in the range of 2.76–2.96 at 1 MHz, as well as prominent mechanical properties with tensile strengths of 66.7–97.4 MPa, a tensile modulus of 1.7–2.1 GPa and elongation at break of 7.2%–12.9%. The polymer films also showed outstanding hydrophobicity with the contact angle in the range of 91.2°–97.9°.     

Partially bio‐based aromatic polyimides derived from 2,5‐furandicarboxylic acid with high thermal and mechanical properties

Two novel bio‐based diamines are synthesized through introduction of renewable 2,5‐furandicarboxylic acid (2,5‐FDCA), and the corresponding aromatic polyimides (PIs) are then prepared by these diamines with commercially available aromatic dianhydrides via two‐step polycondensation. The partially bio‐based PIs possess high glass transition temperatures (T_gs) in the range from 266 to 364 °C, high thermal stability of 5% weight loss temperatures (T_5%s) over 420 °C in nitrogen and outstanding mechanical properties with tensile strengths of 79–138 MPa, tensile moduli of 2.5–5.4 GPa, and elongations at break of 3.0–12.3%. Some colorless PI films (PI‐1‐b and PI‐1‐c) with the transmittances at 450 nm over 85% are prepared. The overall properties of 2,5‐FDCA‐based PIs are comparable with petroleum‐based PI derived from isophthalic acid, displaying the potential for development of innovative bio‐based materials. © 2018 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2018 , 56, 1058–1066     

Novel Non‐Coplanar and Tertbutyl‐Substituted Polyimides: Solubility,Optical, Thermal and Dielectric Properties

A novel aromatic diamine monomer bearing tertbutyl and 4‐tertbutylphenyl groups, 3,3′‐ditertbutyl‐4,4′‐diaminodiphenyl‐4′′‐tertbutylphenylmethane (TADBP), was prepared and characterized. A series of non‐coplanar polyimides (PIs) were synthesized via a conventional one‐step polycondensation from TADBP and various aromatic dianhydrides including pyromellitic dianhydride (PMDA), 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA), 4,4′‐oxydiphthalic anhydride (OPDA), 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride (BTDA) and 4,4′‐(hexafluoroisopropylidene)dipthalic anhydride (6FDA). All PIs exhibit excellent solubility in common organic solvents such as N,N‐dimethylformamide (DMF), N,N‐dimethylacetamide (DMAc), N‐methyl‐2‐pyrrolidone (NMP), dimethyl sulfoxide (DMSO), chloroform (CHCl₃), tetrahydrofuran (THF), and so on. Furthermore, the obtained transparent, strong and flexible polyimide films present good thermal stability and outstanding optical properties. Their glass transition temperatures (T_gs) are in the range of 298 to 347°C, and 10% weight loss temperatures are in excess of 490°C with more than 53% char yield at 800°C in nitrogen. All the polyimides can be cast into transparent and flexible films with tensile strength of 80.5–101 MPa, elongation at break of 8.4%–10.5%, and Young's modulus of 2.3–2.8 GPa. Meanwhile, the PIs show the cutoff wavelengths of 302–356 nm, as well as low moisture absorption (0.30% –0.55%) and low dielectric constant (2.78–3.12 at 1 MHz).     

Synthesis and properties of fluorinated polyimides. 1. Derived from novel 4,4″‐bis(aminophenoxy)‐3,3″‐trifluoromethyl terphenyl

A new diamine monomer, 4,4″‐bis(aminophenoxy)‐3,3″‐trifluoromethyl terphenyl (ATFT) was synthesized that led to a number of novel fluorinated polyimides by solution as well as thermal imidization routes when reacted with different commercially available dianhydrides like pyromellatic dianhydride (PMDA), benzophenone tetracarboxylic acid dianhydride (BTDA), or 2,2‐bis(3,4‐dicarboxyphenyl) hexafluoropropane (6FDA). The polyimides ATFT/BTDA and ATFT/6FDA derived from both routes were soluble in several organic solvents such as N,N‐dimethylformamide, N,N‐dimethylacetamide, and dimethyl sulfoxide. The polyimide ATFT/PMDA was only soluble in N‐methylpyrollidone. The polyimide films had low water absorption of 0.3–0.7%, low dielectric constants of 2.72–3.3 at 1 Hz, refractive indices of 1.594–1.647 at 589.3 nm, and optical transparency >85%. These polyimides showed very high thermal stability with decomposition temperatures (5% weight loss) up to 532 °C in air and good isothermal stability; only 7% weight loss occurred at 400 °C after 7 h, and less than 0.6% weight loss was observed at 315 °C for 5 h. Transparent thin films of these polyimides exhibited tensile strengths up to 112 MPa, a modulus of elasticity up to 3.05 GPa, and elongation at break up to 21% depending on the repeating unit structure. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 1016–1027, 2002     

Synthesis and properties of cross‐linkable high molecular weight fluorinated copolyimides

A series of novel high molecular weight fluorinated co‐polyimides (Co‐PIs) containing styryl side chain based on 1,3‐bis(2‐trifluoromethyl‐4‐aminophenoxy)‐5‐(2,3,4,5‐tetrafluorophenoxy)benzene (6FTFPB) were successfully synthesized. The weight‐average molecular weights (M_ws) and polydispersities of the co‐polyimides were in the range 8.93–10.81 × 10⁴ and 1.33–1.82, respectively. The co‐polyimide film showed excellent solubility in organic solvents, high tensile properties (tensile strength exceeded 91 MPa), excellent optical transparency (cutoff wavelength at 332–339 nm and light transparencies above 89% at a wavelength of 550 nm), and high thermal stability (5% thermal weight‐loss temperature up to 510 °C). The casting and spinning films could be cross‐linked by thermal curing. The cured films show better combination property (including excellent resistance to solvents) than that of co‐polyimides. For instance, the glass transition temperature of Co‐PI‐1 (the molar weight ratio of 6FTFPB was 30%) increased from 217 to 271 °C, the tensile strength enhanced from 94 to 96 MPa, the 5% thermal weight‐loss temperature improved from 514 to 525 °C. Moreover, after cured, Co‐PI‐1 film also has a coefficient of thermal expansion (CTE) value of 60.3 ppm °C^?1, low root mean square surface roughness (R_q) at 4.130 nm and low dielectric constant of 2.60. © 2013 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2014 , 52, 349–359     

Synthesis and properties of hyperbranched polyimides derived from novel triamine with prolonged chain segments

Novel pyridine‐containing hyperbranched polyimides (HBPIs) were synthesized by using a new triamine 2,4,6‐tris[3‐(4‐aminophenoxy)phenyl]pyridine with prolonged chain segments, ether linkage and meta‐linked units as a BB′₂‐like monomer, various commercial aromatic dianhydrides as A₂ monomers. Most of the obtained HBPIs were readily soluble in common organic solvents such as N,N‐dimethylformamide, N,N‐dimethylacetamide, N‐methyl‐2‐pyrrolidone, m‐Cresol, and so forth. Meanwhile, they also had good thermal stability with the glass transition temperatures (T_gs) all above 210 °C, the temperature at 10% weight loss of 537.1–574.4 °C in nitrogen atmosphere. Strong and flexible HBPI films were obtained, which had good mechanical properties with tensile strengths of 83.3–95.8 MPa, tensile modulus of 1.82–2.43 GPa and elongations at break of 4.84–6.98%. © 2013 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2013, 51, 2425–2437     

Syntheses and properties of organosoluble polyamides and polyimides based on the diamine 3,3‐bis[4‐(4‐aminophenoxy)‐3‐methylphenyl]phthalide derived from o‐cresolphthalein

Diamine 3,3‐bis[4‐(4‐aminophenoxy)‐3‐methylphenyl]phthalide (BAMP) was derived from the o‐cresolphthalein, and then it was polycondensated with various aromatic dicarboxylic acids and dianhydrides to synthesize polyamides (PAs) and polyimides (PIs), respectively. PAs have inherent viscosities of 0.78–2.24 dL/g. Most of the PAs are readily soluble in a variety of solvents such as DMF, DMAc, and NMP and afforded transparent and tough films from DMAc solutions. The cast films have tensile strengths of 75–113 MPa as well as initial moduli of 1.71–2.97 GPa. These PAs have glass transition temperatures (T_gs) in the range of 242–325°C, 10% weight loss temperatures occur up to 473°C, and char yields are between 57 and 64% at 800°C in nitrogen. PIs were first synthesized to form polyamic acids (PAAs) by a two‐stage procedure that included a ring‐opening reaction, followed by thermal or chemical conversion to polyimides. Inherent viscosities of PAAs are between 0.71 and 1.63 dL/g. Most of the PIs obtained through the chemical cyclodehydration procedure are soluble in NMP, o‐chlorophenol, m‐cresol, etc., and they have inherent viscosities of 0.58–1.32 dL/g. T_gs of these PIs are in the range of 270–305°C and show 10% weight loss temperatures up to 477°C. PIs obtained through the thermal cyclodehydration procedure have tensile strengths of 72–142 MPa, elongations at break of 8–19%, and initial moduli of 1.80–2.72 GPa. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 455–464, 1999     

Synthesis and properties of new aromatic polyimides based on 2,5‐bis(4‐amino‐2‐trifluoromethylphenoxy)‐tert‐butylbenzene and various aromatic dianhydrides

A novel, fluorinated diamine monomer, 2,5‐bis(4‐amino‐2‐ trifluoromethylphenoxy)‐tert‐butylbenzene ( II ) was synthesized through the nucleophilic substitution reaction of tert‐butylhydroquinone (t‐BHQ) and 2‐chloro‐5‐nitrobenzotrifluoride in the presence of potassium carbonate to yield the intermediate dinitro compound I , followed by catalytic reduction with hydrazine and Pd/C to afford diamine II . A series of fluorinated polyimides V were prepared from II with various aromatic dianhydrides ( III _a–f ) via the thermal imidization of poly(amic acid). Most of V _a–f could be soluble in amide‐type solvents and even in less polar solvents. These polyimide films showed tensile strengths up to 106 MPa, elongation at break up to 21%, and initial modulus up to 2.1 GPa. The glass‐transition temperature of V was recorded at 245–304 °C, the 10% weight loss temperatures were above 488 °C, and left more than 41% residue even at 800 °C in nitrogen. Low dielectric constants, low moisture absorptions, and higher and light‐colored transmittances were also observed. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 5424–5438, 2004     

Synthesis and Characterization of Organosoluble Polyimides Containing Pyridyl Moiety with Ether Linkages

Two novel diamine monomers, bis(4‐amino‐3,5‐dimethylphenyl)‐3‐pyridyl methane and bis(4‐aminophenoxy‐3,5‐dimethylphenyl)‐3‐pyridyl methane were synthesized. A series of pyridine containing aromatic polyimides derived from the diamines were synthesized through a typical two‐step polymerization method. Most of the polymers show good solubility in NMP, DMAc, DMF, DMSO and CHCl₃ at room temperature. These polyimides exhibit T_g in the range of 249–317°C and 10% wt loss (T₁₀) takes place in the range of 474–564°C in N₂ and 469–558°C in air. The polymers have tensile strength in the range of 88–96 MPa, elongation at break in the range of 8.5–12.5% and tensile modulus in the range of 1.5–2.1 GPa. These polyimides also have low dielectric constant (3.26–3.64 at 1 KHz and 3.24–3.61 at 10 KHz) and low moisture absorption (0.42–0.89%).     

Synthesis and characterization of highly transparent and hydrophobic fluorinated polyimides derived from perfluorodecylthio substituted diamine monomers

Two new perfluorodecylthio substituted aromatic diamines, namely 2,4‐diamino‐1‐(1H,1H,2H,2H‐perfluorodecathio)benzene (DAPFB) and 2,2'‐Bis((1H,1H,2H,2H‐perfluorodecyl)thio)[1,1'‐biphenyl]4,4'‐diamine (BPFBD) were synthesized and polycondensed with 4,4′‐(hexafluoroisopropylidene)diphthalic anhydride (6FDA) to produce two new perfluorinated polyimides (PI2 and PI4). The chemical structures of these polyimides were confirmed by Fourier transform infrared (FTIR) and nuclear magnetic resonance (NMR) spectroscopy and elemental analysis. Two other polyimides (PI1 and PI3) were also synthesized from 6FDA and analogous perfluorodecylthio unsubstituted diamines to investigate the incorporation effect of perfluorodecylthio group on various physical and chemical properties of the synthesized PIs. Compared with PI1 and PI3, PI2 and PI4 exhibited improved solubility, optical transparency, and hydrophobicity, lower moisture absorption, dielectric constant, and thermo‐mechanical stabilities owing to the presence of the perfluorodecylthio side group in the polymer chain. Even though thermo‐mechanical properties of PI2 and PI4 ( : 413 and 404 °C, T_g: 220 and 209 °C, tensile strength of 101 and 76 MPa, tensile modulus of 1.7 and 1.5 GPa and elongation at break of 8 and 10%, respectively) were reduced in comparison to PI1 and PI3 but still were good enough for most of the practical applications. Most importantly, the presence of the perfluorodecylthio side group in BPFBD considerably reduced the dielectric constant of PI4 to 2.71 which was quite low as aromatic polyimide. © 2014 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2015 , 53, 479–488     

Highly organosoluble and flexible polyimides with color lightness and transparency based on 2,2‐bis[4‐(2‐trifluoromethyl‐4‐aminophenoxy)‐3,5‐dimethylphenyl]propane

A new diamine containing isopropylidene, methyl substituted arylene ether, and trifluoromethyl groups, 2,2‐bis[4‐(2‐trifluoromethyl‐4‐aminophenoxy)‐3,5‐dimethylphenyl]propane (BTADP), was synthesized and used in preparation of a series of polyimides by direct polycondensation with various aromatic tetracarboxylic dianhydrides in N, N‐dimethylacetamide (DMAc). All polymers derived from diamine (BTADP) with trifluoromethyl substituents were highly organosoluble in the solvents, like N‐methyl‐2‐pyrrolidinone (NMP), N,N‐dimethylacetamide, N,N‐dimethylformamide (DMF), pyridine, chloroform, tetrahydrofuran (THF), dimethyl sulfoxide (DMSO), dichloromethane, cyclohexanone, and γ‐butyrolactone at room temperature or upon heating at 70 °C. Inherent viscosities of the polyimides were found to range between 0.58 and 0.97 dL·g^?1. These polyimides had glass transition temperatures between 256 and 307 °C, and their 10% mass loss temperatures ranged from 440 to 462 °C and 421 to 443 °C under nitrogen and air, respectively. These polyimides had low dielectric constants in the range of 2.84–3.09. All the polyimides could be cast into films from DMAc solutions and were thermally converted into color lightness, optically transparent, flexible, and tough polyimides. The polyimide films had a tensile strength in the range of 83–97 MPa and a tensile modulus in the range of 2.0–2.2 GPa. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 5766–5774, 2004     

Synthesis and characterization of new cardo polyimides prepared from 5,5-Bis[4-(4-aminophenoxy)phenyl]-4,7-methanohexahydroindane

A new cardo diamine monomer, 5,5-bis[4-(4-aminophenoxy)phenyl]-4,7-methanohexahydroindane (II), was prepared in two steps with high yield. The monomer was reacted with six different aromatic tetracarboxylic dianhydrides in N,N-dimethylacetamide (DMAc) to obtain the corresponding cardo polyimides via the poly(amic acid) precursors and thermal or chemical imidization. All the poly(amic acid)s could be cast from their DMAc solutions and thermally converted into transparent, flexible, and tough polyimide films which were further characterized by x-ray and mechanical analysis. All of the polymers were amorphous and the polyimide films had a tensile strength range of 89–123 MPa, an elongation at break range of 6–10%, and a tensile modulus range of 1.9–2.5 GPa. Polymers V_c, V_e, and V_f exhibited good solubility in a variety of solvents such as N-methyl-2-pyrrolidinone (NMP), DMAc, N,N-dimethylformamide (DMF), dimethyl sulfoxide (DMSO), pyridine, γ-butyrolactone, and even in tetrahydrofuran and chloroform. These polyimides showed glass-transition temperatures between 274 and 299°C and decomposition temperatures at 10% mass loss temperatures ranging from 490 to 521°C and 499 to 532°C in nitrogen and air atmospheres, respectively. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 2815–2821, 1999     

Synthesis and properties of polyimides derived from 1,4-bis(4-aminophenoxy)2,5-di-tert-butylbenzene

Novel aromatic polyimides containing symmetric, bulky di-tert-butyl substituents unit were synthesized from 1,4-bis(4-aminophenoxy)2,5-di-tert-butylbenzene (BADTB) and various aromatic tetracarboxylic dianhydrides by the conventional two-stage procedure that included ring-opening polyaddition in a polar solvent such as N,N-dimethylacetamide to give poly(amic acid)s, followed by cyclodehydration to polyimides. The diamine was prepared through the nucleophilic displacement of 2,5-di-tert-butylhydroquinone with p-chloronitrobenzene in the presence of K₂CO₃, followed by catalytic reduction. Depending on the dianhydrides used, the poly(amic acid)s obtained had inherent viscosities of 0.83–1.88 dL g⁻¹. Most of the polyimides formed transparent, flexible, and tough films. Tensile strength and elongation at break of the BADTB-based polyimide films ranged from 68–93 MPa and 7–11%, respectively. The polyimide derived from 4,4′-hexafluoro-isopropylidenebisphathalic anhydride had better solubility than the other polyimides. These polyimides had glass transition temperatures between 242–298°C and 10% mass loss temperatures were recorded in the range of 481–520°C in nitrogen. © 1997 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 35: 1527–1534, 1997     

Impact of chain architecture (branching) on the thermal and mechanical behavior of polystyrene thin films

The modulus and glass transition temperature (T_g) of ultrathin films of polystyrene (PS) with different branching architectures are examined via surface wrinkling and the discontinuity in the thermal expansion as determined from spectroscopic ellipsometry, respectively. Branching of the PS is systematically varied using multifunctional monomers to create comb, centipede, and star architectures with similar molecular masses. The bulk‐like (thick film) T_g for these polymers is 103 ± 2 °C and independent of branching and all films thinner than 40 nm exhibit reductions in T_g. There are subtle differences between the architectures with reductions in T_g for linear (25 °C), centipede (40 °C), comb (9 °C), and 4 armed star (9 °C) PS for ≈ 5 nm films. Interestingly, the room temperature modulus of the thick films is dependent upon the chain architecture with the star and comb polymers being the most compliant (≈2 GPa) whereas the centipede PS is most rigid (≈4 GPa). The comb PS exhibits no thickness dependence in moduli, whereas all other PS architectures examined show a decrease in modulus as the film thickness is decreased below ～40 nm. We hypothesize that the chain conformation leads to the apparent susceptibility of the polymer to reductions in moduli in thin films. These results provide insight into potential origins for thickness dependent properties of polymer thin films. © 2011 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys, 2012     

Synthesis and properties of polyimides derived from 1,6-bis(4-aminophenoxy)naphthalene and aromatic tetracarboxylic dianhydrides

1,6-Bis(4-aminophenoxy)naphthalene ( I ) was used as a monomer with various aromatic tetracarboxylic dianhydrides to synthesize polyimides via a conventional two-stage procedure that included ring-opening polyaddition in a polar solvent such as N,N-dimethylacetamide (DMAc) to give poly(amic acid)s, followed by thermal cyclodehydration to polyimides. The diamine ( I ) was prepared through the nucleophilic displacement of 1,6-dihydroxynaphthal-ene with p-chloronitrobenzene in the presence of K₂CO₃, followed by catalytic reduction. Depending on the dianhydrides used, the poly(amic acid)s obtained had inherent viscosities of 0.73–2.31 dL/g. All the poly(amic acid)s could be solution cast and thermally converted into transparent, flexible, and tough polyimide films. The polyimide films had a tensile modulus range of 1.53–1.84 GPa, a tensile strength range of 95–126 MPa, and an elongation range at break of 9–16%. The polyimide derived from 4,4′-sulfonyldiphthalic anhydride (SDPA) had a better solubility than the other polyimides. These polyimides had glass transition temperatures between 248–286°C (DSC). Thermogravimetric analyses established that these polymers were fairly stable up to 500°C, and the 10% weight loss temperatures were recorded in the range of 549–595°C in nitrogen and 539–590°C in air atmosphere. © 1995 John Wiley & Sons, Inc.     

Synthesis of soluble branched polyimides derived from an ABB′ monomer

A novel ABB′ monomer, an isomeric mixture of 4‐[4‐(2,4‐diaminophenoxy)phenoxy]phthalic acid 2‐methyl ester, was successfully prepared. The direct polycondensation of the ABB′ monomer was carried out to form polyamic acid monomethyl ester as a precursor with an inherent viscosity of 0.30 dL/g and a number‐average molecular weight of 12,000. The degree of branching of the precursor, determined by ¹H NMR, was 0.07. The low degree of branching was caused by the differences in the reactivities of the amino groups. The shape factor was calculated to be 0.72. End‐modified reactions with acetyl chloride, benzoyl chloride, and phthalic anhydride were carried out. After the chemical imidization of the end‐modified precursors, end‐modified polyimides were successfully prepared. The end‐modified polyimides were soluble in dimethyl sulfoxide, dimethylformamide (DMF), and N‐methyl‐2‐pyrrolidinone. On the basis of thermogravimetry and differential scanning calorimetry measurements of the polyimides, the 5 wt % thermal loss temperatures were determined to be 400–520 °C, and the glass‐transition temperatures were determined to be 200–258 °C. According to the X‐ray diffraction measurements, the end‐modified polyimides were amorphous. A strong but brittle film was prepared from an acetamide end‐modified polyimide solution, via casting from a DMF solution, with a tensile strength of 46 MPa, an elongation at break of 4%, and a modulus of 1.3 GPa. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 3200–3211, 2004     

Synthesis and characterization of fully aliphatic polyimides from an aliphatic dianhydride with piperazine spacer for enhanced solubility,transparency, and low dielectric constant

A new series of fully aliphatic polyimide (API) based on a novel aliphatic dianhydride monomer‐2,2′‐(1,4‐piperazinediyl)‐disuccinic anhydride (PDA), in which two units of succinic anhydride have been connected by an aliphatic heterocyclic piperazine spacer that possesses aminomethylene (‐NCH₂) moiety in the aliphatic/alicylic backbone capable of inducing charge transfer (CT) interactions in the polyimide network, was successfully synthesized. The APIs were soluble in common polar organic solvents. The polyimide films of PDA with alicyclic diamines were almost colorless. T₁₀ (temperature of 10% weight loss) of APIs were ranged from 299–418 °C and T_g of API3‐API6 were in the temperature range of 170 to 237 °C. The light‐colored polyimide films of API3‐API6 possessed good mechanical properties with tensile strength of 54–72 Mpa, tensile modulus of 1.6–2.3 Gpa and elongation at break of 4–9%. The polyimide films of API3‐API6 were highly flexible and free‐standing which is quite rare in fully APIs. The dielectric constant of one of the synthesized API (API4) was as low as 2.14. © 2014 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2014 , 52, 2316–2328     

Novel method for preparation of poly(benzoxazinone‐imide)

A novel method was developed to prepare poly(benzoxazinone‐imide) by the dealcoholization of poly(amide‐imide), having pendent ethoxycarbonyl groups, which was prepared from poly(amide acid). The poly(amide acid) was prepared from the reaction of pyromellitic dianhydride and 4,4′‐diamino‐6‐ethoxycarbonyl benzanilide. The curing behavior of the poly(amide acid) was monitored by DSC, which indicated the presence of two broad endotherms, one with maximum at 153 °C due to imide‐ring formation and the other with maximum at 359 °C due to benzoxazinone‐ring formation. The poly(amide acid) was thermally treated at 300 °C/1 h to get poly(amide‐imide) with pendent ester groups, then at 350 °C/2 h to convert into poly(benzoxazinone‐imide) by dealcoholization. Viscoelastic measurements of the poly(amide‐imide) showed that the storage modulus dropped at about 280 °C with glass‐transition temperature (T_g ) at about 340 °C. The storage modulus of poly(benzoxazinone‐imide), however, was almost constant up to 400 °C and no T_g was detected below 400 °C. Also, the tensile modulus and tensile strength of the poly(benzoxazinone‐imide) was much higher than that of the poly(amide‐imide). The 5% decomposition of poly(benzoxazinone‐imide) film was at 535 °C, which reflects its excellent thermal stability. Also, poly(benzoxazinone‐imide) showed more hydrolytic stability against alkali in comparison to polyimides. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 1647–1655, 2000     

Synthesis and characterization of unsymmetrical benzonitrile‐containing polyimides: Viscosity‐lowering effect and dielectric properties

A new unsymmetrical diamine, 2‐(3‐aminophenoxy)‐6‐(4‐aminophenoxy)benzonitrile (3,4‐APBN), is synthesized via two consecutive S_NAr reactions and the temperature‐dependent reactivity of the fluorides in 2,6‐difluorobenzonitrile, whose first S_NAr reaction occurs at 70 °C and second, at 100 °C, allowing timing control of reaction sequence and circumventing the transetherification side reaction. Thus, a series of polyimides (PIs) is prepared from the polymerization of 3,4‐APBN with five common dianhydrides (6FDA, DSDA, OPDA, BTDA, and PMDA). For comparison, a second series is also prepared from two symmetrical diamines ([2,6‐bis(3‐aminophenoxy)benzonitrile (3,3‐APBN) and 2,6‐bis(4‐aminophenoxy)benzonitrile (4,4‐APBN)] and 6FDA or PMDA. The processability of the poly(amic acids) (PAAs), for the first series is greatly improved since their solution viscosities are much lower than PAAs based on symmetrical diamines. Besides having high glass‐transition temperatures (249–332 °C), and thermal stability [5% weight loss in the range of 505–542 °C (air) and 512–546 °C (nitrogen)], these PIs form tough, transparent and flexible films that have a tensile‐strength range of 82.1–121.3 MPa, elongations‐at‐break of 5.33–9.81%, and tensile moduli of 2.11–2.97 GPa. Their film dielectric constants are 3.08–3.62 at 10 kHz, moderately higher than that (2.92) of analogous PI (CP2) without nitrile groups. Overall, we found that the reduction of structural symmetry in repeat units can improve the polymer processibility as well as increasing their dielectric constants. © 2013 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2013 , 51, 4998–5011     

Approaches to improve the film ductility of colorless cycloaliphatic polyimides

This study described approaches for improving the film ductility of colorless cycloaliphatic polyimides (PIs). An unexpected toughening effect was observed when a PI derived from pyromellitic dianhydride (PMDA) and 4,4′‐methylenebis(cyclohexylamine) was modified by copolymerization with a low isophoronediamine (IPDA) content of 5 to 30 mol%, despite there being no film‐forming ability in the homo PMDA/IPDA system. For example, at an IPDA content of 20 mol%, the copolymer showed significantly improved film toughness (maximum elongation at break, ε_{b max} = 57%), excellent optical transparency (light transmittance at 400 nm, T₄₀₀ = 83.7%), and a high glass transition temperature (T_g = 317°C). This toughening effect can be interpreted on the basis of the concept of chain slippage. In this study, the PIs derived from bicyclo[2.2.2]octane‐2,3,5,6‐tetracarboxylic dianhydride (H‐BTA) with various diamines were also systematically investigated to evaluate the potential of H‐BTA‐derived systems. The combinations of H‐BTA with ether‐containing diamines led to highly tough PI films (ε_{b max} > 100%) with very high T_gs, strongly contrasting with the results of an earlier study. The observed excellent properties are related to the steric structure of H‐BTA. Our interest also extended to the solution processability. A copolyimide derived from H‐BTA with a sulfone‐containing diamine and an ether‐containing diamine achieved a very high optical transparency (T₄₀₀ = 86.8%), a very high T_g (313°C), and good ductility (ε_{b max} = 51%) while maintaining solution processability. Thus, these approaches enabled us to dramatically improve the ductility of cycloaliphatic PI films that have, to date, been considered brittle.