锗/多孔硅和锗/氧化硅薄膜光致发光的比较研究

采用磁控溅射技术,以锗为溅射靶,在多孔硅上沉积锗薄膜,沉积时间分别为4,8和12 min,及以锗-二氧化硅复合靶为溅射靶,在n型硅衬底上沉积了含纳米锗颗粒的氧化硅薄膜,锗与总靶的面积比分别为5%,15%,30%.各样品在氮气氛中分别经过300,600及900℃退火30 min.对锗/多孔硅和锗/氧化硅薄膜进行了光致发光谱的对比研究,用红外吸收谱分析了锗/多孔硅的薄膜结构.实验结果显示,锗/多孔硅薄膜的发光峰位于517 nm附近,沉积时间对发光峰的强度有显著影响,锗层越厚峰强越弱.锗/氧化硅薄膜的发光峰位于580 nm附近,锗与总靶的面积比对发光峰的强度影响较大,锗/氧化硅薄膜中的锗含量越高峰强越弱.不同的退火温度对样品的发光峰强及峰位均没有明显影响.可以认为锗/多孔硅的发光峰是由多孔硅与孔间隙中的锗纳米晶粒两者界面的锗相关缺陷引起的,而锗/氧化硅的发光峰来自于二氧化硅的发光中心.     

硅薄膜沉积过程中等离子发光基团的一维空间分布研究

使用光发射谱(OES)对甚高频等离子增强化学气相沉积(VHF-PECVD)技术沉积硅薄膜时的等离子体发光基团的空间分布进行了在线监测和研究. 研究表明：等离子体的不同发光基团都存在着一个中间强度较大的区域和两边电极附近的暗区;增大硅烷浓度和提高辉光功率都会增大SiH^*峰强度;硼烷的加入,使得SiH^*和Hα^*峰强度增大,但硼烷流量变化的影响很小;硼烷流量增大,材料的晶化率下降,而I_{［Hα^*］关键词： 甚高频等离子增强化学气相沉积 等离子体 发光基团 空间分布}     

脉冲偏压占空比对多孔氧化硅薄膜性质的影响

采用由脉冲负偏压调节的等离子体增强化学气相沉积方法,以硅烷为源气体,在玻璃基片上沉积得到了多孔二氧化硅薄膜。将反应过程中加在沉积区域的脉冲偏压固定在-350V,当占空比从0.162增大到0.864时,薄膜样品的形貌、成份和结构均不相同。扫描电镜照片表明,组成多孔氧化硅薄膜的颗粒在占空比增大时变得细腻,并且薄膜整体变得多孔且蓬松。拉曼光谱和红外光谱结果显示,薄膜样品中的非晶硅和Si-H键在较高的占空比下减弱甚至消失。占空比升高时氧化硅桥键所占比例持续增加。     

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采用由脉冲负偏压调节的等离子体增强化学气相沉积方法,以硅烷为源气体,在玻璃基片上沉积得到了多孔二氧化硅薄膜。将反应过程中加在沉积区域的脉冲偏压固定在-350V,当占空比从0.162增大到0.864时,薄膜样品的形貌、成份和结构均不相同。扫描电镜照片表明,组成多孔氧化硅薄膜的颗粒在占空比增大时变得细腻,并且薄膜整体变得多孔且蓬松。拉曼光谱和红外光谱结果显示,薄膜样品中的非晶硅和Si-H键在较高的占空比下减弱甚至消失。占空比升高时氧化硅桥键所占比例持续增加。     

包埋于氮化硅薄膜中的硅团簇的光致发光特性

采用等离子体增强化学气相沉积(PECVD)技术,在低温下制备了富硅氢化氮化硅薄膜。利用红外吸收(IR)谱,光电子能谱(XPS)和光致发光(PL)谱,研究了在不同温度下退火的薄膜样品的结构和发光特性。在经过低温退火的薄膜中观测到一个强的可见发光峰。当退火温度较高时,随着与硅悬键有关的发光峰消失,可见发光峰位发生了蓝移。讨论了退火对薄膜中硅团簇的形成及其对发光的影响。根据Raman谱,计算了氮化硅薄膜中硅团簇的尺寸大小。通过实验结果和分析,我们认为PL谱中较强的室温可见发光峰来自于包埋于氮化硅中的硅团簇。     

多孔氧化铝薄膜的光致发光起源:三种缺陷中心

在草酸溶液中用二次阳极氧化法制备了纳米多孔氧化铝薄膜,分析了制备过程中氧化铝薄膜中缺陷的形成机理.场发射电子显微镜给出了薄膜的表面形貌和结构.X射线色散能谱和傅里叶红外透射光谱测试表明,进入薄膜中的草酸杂质加热到500℃未全部分解.对多孔氧化铝薄膜的光致发光PL光谱做了高斯拟合,结合测试结果和薄膜中的缺陷分析指出:多孔氧化铝薄膜的发光由F+,F和草酸杂质相关缺陷引起,对应发光中心分别在402,433,475 nm处,并提出F中心起主导作用.对不同草酸浓度中制备的多孔氧化铝薄膜的PL光谱讨论指出:随草酸浓度增加,三种发光中心的峰位不会发生变化,但相对强度发生改变,F+中心和F中心减少,草酸杂质相关发光中心增加,PL峰红移.最后提出通过控制草酸浓度来控制多孔氧化铝薄膜中的草酸杂质.此研究将对多孔氧化铝薄膜发光起源和机理有更深入的理解,同时也为多孔氧化铝薄膜的制备提供一种全新的思路.     

反应溅射氧化锌薄膜的结构特点及性质

以金属Zn(纯度为99.99%)作为靶材,采用离子束反应溅射法在玻璃衬底上溅射沉积了一系列ZnO薄膜样品。通过对薄膜样品X射线衍射(XRD)谱的分析,发现尽管溅射条件不同,但是ZnO薄膜只沿(0002)晶面取向生长。衬底温度和溅射气体的氧分压对薄膜沿c轴取向生长有影响,其中衬底温度的影响较明显。溅射过程中发现衬底温度为360℃最适合(0002)晶面的生长,在此温度下溅射获得了完全沿c轴取向生长且衍射峰最强的ZnO薄膜。室温下测量了ZnO薄膜的发射光谱,发现薄膜在紫外区(364nm附近)、蓝绿区(470nm附近)有较强的发光峰,在紫光区(398nm附近)、蓝光区(452nm附近)和红外区(722nm附近)有较弱的发光峰。ZnO薄膜在空气中退火,对薄膜的结构、发光和电学性质都有一定影响。合适的退火温度可以促进薄膜沿c轴的取向生长;退火后ZnO多晶薄膜的晶粒比未退火的略大;退火使部分发光峰的位置发生偏移并使薄膜的发光强度增强;退火使薄膜的电阻率显著增大,薄膜的电阻率随氧分压的增大而增大。     

高脉冲功率能量PLD法制备MgZnO薄膜中的沉积机理

用PLD法成功制备了一系列高质量的MgZnO薄膜。实验中发现高脉冲能量沉积薄膜的结构和发光特性随基片温度的变化规律与低脉冲能量下的结果不一样:基片在室温时高脉冲能量制备薄膜的XRD峰的半峰全宽比高基片温度时的结果相对更小;AFM显示其颗粒变大,柱状生长突出;PL谱紫峰与绿峰强度比最大,结晶质量反而提高。另一方面,与低脉冲能量时相反,增大氧气压强后高脉冲能量沉积的薄膜XRD半峰全宽变窄。结合实验现象和表征,合理解释了高脉冲能量沉积的机理。室温制备高质量MgZnO薄膜的PLD沉积机理对于以后在柔性衬底上沉积薄膜的研究有重要的参考价值。     

蓝光发射和红光发射多孔硅的XPS分析

绿色发光多孔硅在空气中经两种不同的氧化处理分别得到红色发光和蓝色发光.X射线光电子能谱分析显示红色发光多孔硅中含有一定比例的Si、SiOx(x=1～2)以及少量的氟化物;蓝色发光多孔硅的主要成份是SiO2及少量的氟化物.红处透射谱显示蓝光发射多孔硅几乎只存在Si-O-Si峰,而红光发射多孔硅除主要有Si-O-Si峰外,还有明显的SiHx峰.分析表明多孔硅中的蓝光发射来源于SiO2中的缺陷中心.     

介质阻挡放电等离子体沉积多孔硅纳米颗粒膜的光发射及红外光谱

用介质阻挡放电(DBD)等离子体增强化学气相沉积(PECVD)的方法,以硅烷为源气体,在沉积区域加载脉冲负偏压进行调节,在玻璃基片上沉积得到具有荧光特征的多孔硅纳米颗粒膜。沉积过程的发射光谱结果表明,在412 nm处出现S iH*(A2Δ→X2Π0-0)特征峰,证明放电沉积过程中存在不同程度的硅烷裂解。将脉冲负偏压固定在-300 V,当占空比从0.162增大到0.864时,薄膜的红外光谱显示S i—O—S i在1 070cm-1伸缩振动吸收峰与800 cm-1的弯曲振动峰都有所增强,而930 cm-1的S i—H弯曲振动减弱。说明随着占空比的增加,S i—O—S i键的结合越来越明显。     

Effect of substrate bias on negative bias temperature instability of ultra-deep sub-micro p-channel metal--oxide--semiconductor field-effect transistors

The effect of substrate bias on the degradation during applying a negative bias temperature (NBT) stress is studied in this paper. With a smaller gate voltage stress applied, the degradation of negative bias temperature instability (NBTI) is enhanced, and there comes forth an inflexion point. The degradation pace turns larger when the substrate bias is higher than the inflexion point. The substrate hot holes can be injected into oxide and generate additional oxide traps, inducing an inflexion phenomenon. When a constant substrate bias stress is applied, as the gate voltage stress increases, an inflexion comes into being also. The higher gate voltage causes the electrons to tunnel into the substrate from the poly, thereby generating the electron--hole pairs by impact ionization. The holes generated by impact ionization and the holes from the substrate all can be accelerated to high energies by the substrate bias. More additional oxide traps can be produced, and correspondingly, the degradation is strengthened by the substrate bias. The results of the alternate stress experiment show that the interface traps generated by the hot holes cannot be annealed, which is different from those generated by common holes.     

The effect of applied negative bias voltage on the structure of Ti-doped a-C:H films deposited by FCVA

Ti-doped hydrogenated diamond-like carbon (DLC) films were deposited on Si(1 0 0) substrates by a filtered cathodic vacuum arc (FCVA) method using Ar and CH₄ as the feedstock. The composition and microstructure of the films were investigated by Raman spectroscopy, X-ray photoelectron spectroscopy and IR spectroscopy. The internal stress was determined by the radius of curvature technique. The influence of the bias voltage on the microstructure of the as-deposited films was investigated. It was found that the graphite-like bonds was dominated in the Ti-doped DLC film deposited at 0 V bias voltage. When bias voltage was increased to −150 V, more diamond-like bond were produced and the sp³ content in film reached the maximum value, after which it decreased and more graphite-like bonds feature produced with further increase of the negative bias voltage. The compressive internal in the Ti-doped DLC films also exhibited a maximum value at −150 V bias voltage. IR results indicated that CH bonded intensity reduced, and H atoms bonded with C atoms were substituted for the Ti atoms as the negative bias voltage increasing. All the composition and microstructure change can be explained by considering the plasma conditions and the effect of negative bias voltage applied to the substrate.     

Charge recombination mechanism to explain the negative capacitance in dye-sensitized solar cells

Negative capacitance(NC) in dye-sensitized solar cells(DSCs) has been confirmed experimentally. In this work, the recombination behavior of carriers in DSC with semiconductor interface as a carrier's transport layer is explored theoretically in detail. Analytical results indicate that the recombination behavior of carriers could contribute to the NC of DSCs under small signal perturbation. Using this recombination capacitance we propose a novel equivalent circuit to completely explain the negative terminal capacitance. Further analysis based on the recombination complex impedance show that the NC is inversely proportional to frequency. In addition, analytical recombination resistance is composed by the alternating current(AC) recombination resistance(Rrac) and the direct current(DC) recombination resistance(Rrdc), which are caused by small-signal perturbation and the DC bias voltage, respectively. Both of two parts will decrease with increasing bias voltage.     

Narrow pulse formation using nonlinear LC ladder networks

Soliton propagation in a nonlinear lossy LC ladder network has been studied. We propose a quadratic polynomial expression to model the C-V characteristic of the nonlinear capacitor of the LC ladder network. This fits the experimental C-V data better over a wider range of the applied voltage, compared with the conventionally used formulae.

Using this C-V expression, the Korteweg-de Vries (KdV) equation with a loss term has been obtained. This nonlinear equation has been solved by employing a novel technique that is based on Fourier series analysis. We have investigated the effects of bias voltage on the soliton pulse width and peak voltage and found a good agreement between the theoretical and experimental results.     

Scanning tunneling microscopy luminescence from nanoscale surface of GaAs(1 1 0)

Scanning tunneling microscopy luminescence (STML) was induced from the nanometer scale surfaces of cleaved n-type and p-type GaAs(1 1 0) wafers by using of an ITO-coated optical fiber probe in an ultrahigh-vacuum chamber. The STML from n-type GaAs(1 1 0) surface was induced under negative sample bias when the applied bias exceeds a threshold voltage around −1.5 V. Whereas the STML from p-type GaAs(1 1 0) surface was induced under positive sample bias when the applied bias exceeds a threshold voltage around +1.5 V. The excitation energies at the threshold voltages are consistent with the band gap of GaAs (1.42 eV) at 295 K. The typical quantum efficiencies for n-type and p-type GaAs are about 3 × 10⁻⁵ and 2 × 10⁻⁴ photons/electron, respectively. The observed STML from are attributed to a radiative recombination of electron-hole pairs generated by a hole injection for n-type GaAs under negative sample bias and an electron injection for p-type GaAs under positive sample bias, respectively.     

Electrical conductance properties for magnetic tunnel junctions with MgO barriers

We measured inelastic electron tunneling (IET) spectra and conductance for MgO tunneling magnetoresistance (TMR) films to obtain information on the ferromagnetic/barrier layer interface. The IET spectra showed the difference between amorphous and crystalline structures in the barrier. In the magnetic tunnel junction (MTJ) with a crystalline barrier the IET spectra indicated an Mg-O phonon peak at a low bias voltage by measurement with a parallel magnetization configuration. On the other hand, no peak was observed in the MTJ with an amorphous barrier.     

偏压在隧道效应中的作用

从隧道扫描势垒模型出发。用量子力学导出隧道电流与针尖间的偏压、间距及它们的逸出功之间的关系,并从能带模型的角度导出样品与针尖的间距不变时,隧道电流与偏压成正比关系．指出偏压的作用主要是提高针尖上电子的能量,使针尖上的电子比样品上的电子更容易穿过势垒,从而形成隧道电流．     

Growth of Ni-Mn-Ga high-temperature shape memory alloy thin films by magnetron sputtering technique

Ni-Mn-Ga thin films have been fabricated by using magnetron sputtering technique under various substrate negative bias voltages. The effect of substrate negative bias voltage on the compositions and surface morphology of Ni-Mn-Ga thin films was systematically investigated by energy dispersive X-ray spectrum and atomic force microscopy, respectively. The results show that the Ni contents of the thin films increase with the increase of the substrate negative bias voltages, whereas the Mn contents and Ga contents decrease with the increase of substrate negative bias voltages. It was also found that the surface roughness and average particle size of the thin films remarkably decrease with the increase of substrate negative bias voltages. Based on the influence of bias voltages on film compositions, a Ni₅₆Mn₂₇Ga₁₇ thin film was obtained at the substrate negative bias voltage of 30 V. Further investigations indicate that the martensitic transformation start temperature of this film is up to 584 K, much higher than room temperature, and the film has a non-modulated tetragonal martensitic structure at room temperature. Transmission electron microscopy observations reveal that microstructure of the thin film exhibits an internally (1 1 1) type twinned substructure. The fabrication of Ni₅₆Mn₂₇Ga₁₇ high-temperature shape memory alloy thin film will contribute to the successful development of microactuators.