Local structure around Zn and Ga in solution‐processed In–Ga–Zn–O and implications for electronic properties

We study by X‐ray absorption spectroscopy the local structure around Zn and Ga in solution‐processed In–Ga–Zn–O thin films as a function of thermal annealing. Zn and Ga environments are amorphous up to 450 °C. At 200 °C and 450 °C, the Ga atoms are in a β‐Ga₂O₃ like structure, mostly tetrahedral gallium oxide phase. Above 300 °C, the Zn atoms are in a tetrahedral ZnO phase for atoms inside the nanoclusters. The observed formation of the inorganic structure above 300 °C may be correlated to the rise of the mobility for IGZO TFTs. The Zn atoms localized at the nanocluster boundary are undercoordinated with O. Such ZnO cluster boundary could be responsible for electronic defect levels. Such defect levels were put in evidence in the upper half of the band gap. (© 2015 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

Wide band gap and p‐type conductive Cu–Nb–O films

Cu–Nb–O films with a thickness of ca. 150 nm were prepared on borosilicate glass substrates using CuNbO₃ ceramic target at substrate temperature of 500 °C by pulsed laser deposition. The X‐ray diffraction patterns showed that the Cu–Nb–O films were amorphous or an aggregation of fine crystals. The post‐annealed film at 300 °C in N₂ gas showed 80% transmission in visible light (band gap = 2.6 eV) and high p‐type conductivity of 21 S cm^–1. The Cu–Nb–O film with a thickness of 100 nm, fabricated from the target with a composition of Cu/Nb = 0.9, showed the highest p‐type conductivity of 116 S cm^–1. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Effects of Y incorporation in TaON gate dielectric on electrical performance of GaAs metal–oxide–semiconductor capacitor

In this study, GaAs metal–oxide–semiconductor (MOS) capacitors using Y‐incorporated TaON as gate dielectric have been investigated. Experimental results show that the sample with a Y/(Y + Ta) atomic ratio of 27.6% exhibits the best device characteristics: high k value (22.9), low interfacestate density (9.0 × 10¹¹ cm^–2 eV^–1), small flatband voltage (1.05 V), small frequency dispersion and low gate leakage current (1.3 × 10^–5A/cm² at V_fb + 1 V). These merits should be attributed to the complementary properties of Y₂O₃ and Ta₂O₅:Y can effectively passivate the large amount of oxygen vacancies in Ta₂O₅, while the positively‐charged oxygen vacancies in Ta₂O₅ are capable of neutralizing the effects of the negative oxide charges in Y₂O₃. This work demonstrates that an appropriate doping of Y content in TaON gate dielectric can effectively improve the electrical performance for GaAs MOS devices.

Capacitance–voltage characteristic of the GaAs MOS capacitor with TaYON gate dielectric (Y content = 27.6%) proposed in this work with the cross sectional structure and dielectric surface morphology as insets.     

Passivation of aluminium–n+ silicon contacts for solar cells by ultrathin Al2O3 and SiO2 dielectric layers

Ultra‐thin thermally grown SiO₂ and atomic‐layer‐deposited (ALD) Al₂O₃ films are trialled as passivating dielectrics for metal–insulator–semiconductor (MIS) type contacts on top of phosphorus diffused regions applicable to high efficiency silicon solar cells. An investigation of the optimum insulator thickness in terms of contact recombination factor J_{0_cont} and contact resistivity ρ_c is undertaken on 85 Ω/□ and 103 Ω/□ diffusions. An optimum ALD Al₂O₃ thickness of ～22 Å produces a J_{0_cont} of ～300 fAcm^–2 whilst maintaining a ρ_c lower than 1 mΩ cm² for the 103 Ω/□ diffusion. This has the potential to improve the open‐circuit voltage by a maximum 15 mV. The thermally grown SiO₂ fails to achieve equivalently low J_{0_cont} values but exhibits greater thermal stability, resulting in slight improvements in ρ_c when annealed for 10 minutes at 300 °C without significant changes in J_{0_cont}. The after‐anneal J_{0_cont} reaches ～600 fAcm^–2 with a ρ_c of ～2.5 mΩ cm² for the 85 Ω/□ diffusion amounting to a maximum gain in open‐circuit voltage of 6 mV. (© 2013 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Influence of polarity inversion on the electrical properties of Ga‐doped ZnO thin films

This study investigates how polarity inversion influences the relationship between the electrical properties of heavily Ga‐doped ZnO (GZO) films deposited by RF magnetron sputtering and their thickness. The electrical properties observed in very thin films are correlated with a change of polarity from O‐polar to Zn‐polar face upon increasing the film thickness based on results of valence band spectra measured by X‐ray photoelectron spectroscopy. It is found that the electrical properties of very thin GZO films deposited on Zn‐polar ZnO templates are significantly improved compared to those deposited on O‐polar face. A low resistivity of 2.62 × 10^–4 Ω cm, high Hall mobility of 26.9 cm²/V s, and high carrier concentration of 8.87 × 10²⁰ cm^–3 being achieved with 30 nm‐thick GZO films using Zn‐polar ZnO templates on a glass substrate. In contrast, the resistivity of 30 nm‐thick GZO films on bare glass that shows more likely O‐polar is very poor about 1.44 × 10^–3 Ω cm with mobility and carrier concentration are only 11.9 cm²/V s and 3.64 × 10²⁰ cm^–3, respectively. It is therefore proposed that polarity inversion plays an important role in determining the electrical properties of extremely thin GZO films. (© 2016 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

Large enhancement of the thermoelectric Seebeck coefficient for amorphous oxide semiconductor superlattices with extremely thin conductive layers

Herein we demonstrate that amorphous oxide semiconductor (AOS) superlattices composed of a‐In–Zn–O (well) and a‐In–Ga–Zn–O (barrier) layers, fabricated on SiO₂ glass substrate by pulsed laser deposition at room temperature, exhibited an enhanced Seebeck coefficient |S |. The |S | value increases drastically with decreasing a‐In–Zn–O thickness (d_IZO) when d_IZO < ∼5 nm, and reached 73 µV K^–1 (d_IZO = 0.3 nm), which is ∼4 times larger than that of bulk |S |_3D (19 µV K^–1), while it kept its high electrical conductivity, clearly demonstrating that the quantum size effect can be utilized in AOS superlattices. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

On the observation of electron–hole liquid luminescence under low excitation in Al2O3‐passivated c‐Si wafers

We report on low‐temperature photoluminescence (PL) from aluminum oxide (Al₂O₃)‐passivated c‐Si wafers, which surprisingly exhibits clear signature of the formation of the so‐called electron–hole liquid (EHL), despite the use of excitation powers for which the condensed phase is not usually observed in bulk Si. The elevated incident photon densities achieved with our micro‐PL setup together with the relatively long exciton lifetimes associated with a good quality, indirect band‐gap semiconductor such as our float‐zone c‐Si, are considered the key aspects promoting photogenerated carrier densities above threshold. Interestingly, we observe a good correlation between the intensity of the EHL feature in PL spectra and the passivation performance of the Al₂O₃ layer annealed at different temperatures. The change in the extension of the sub‐surface space‐charge region that results from the balance between the induced fixed charge in the Al₂O₃ and the defect states at the alumina/Si interface is at the origin of the observed correlation. (© 2014 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

High performance Zn–Sn–O thin film transistors with Cu source/drain electrode

Zn–Sn–O (ZTO) thin film transistors (TFTs) were fabricated with a Cu source/drain electrode. Although a reasonably high mobility (μ_FE) of 13.2 cm²/Vs was obtained for the ZTO TFTs, the subthreshold gate swing (SS) and threshold voltage (V_th) of 1.1 V/decade and 9.1 V, respectively, were inferior. However, ZTO TFTs with Ta film inserted as a diffusion barrier, exhibited improved SS and V_th values of 0.48 V/decade and 3.0 V, respectively as well as a high μ_FE value of 18.7 cm²/Vs. The improvement in the Ta‐inserted device was attributed to the suppression of Cu lateral diffusion into the ZTO channel region. (© 2013 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Effect of III‐nitride polarization on VOC in p–i–n and MQW solar cells

We performed detailed studies of the effect of polarization on III‐nitride solar cells. Spontaneous and piezoelectric polarizations were assessed to determine their impacts upon the open circuit voltages (V_OC) in p–i(InGaN)–n and multi‐quantum well (MQW) solar cells. We found that the spontaneous polarization in Ga‐polar p–i–n solar cells strongly modifies energy band structures and corresponding electric fields in a way that degrades V_OC compared to non‐polar p–i–n structures. In contrast, we found that piezoelectric polarization in Ga‐polar MQW structures does not have a large influence on V_OC compared to non‐polar MQW structures. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Sustainability and renewable energies – a critical look at photovoltaics

The current status of photovoltaic modules from wafer‐based Si and thin films of Si, CuInGaSe₂ (CIGS), CdTe and III–V compound semiconductors in terms of efficiencies and market volumes is shortly summarized and evaluated with respect to sustainability. We discuss the critical raw materials such as gallium, indium and germanium. These materials are either incorporated into the absorber layers or used as substrate materials, i.e. Ge in the case of III–V semiconductor based cells. On a 100 GW per year production level the availability of indium and tellurium will limit the growth of the respective photovoltaic technology. Alternative materials are on the horizon, such as the kesterite‐type materials which offer the possibility to replace In and Ga in CuInGaSe₂, but it may take a long period of time for modules of these materials to reach the production‐level efficiencies of today's established technologies. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

High‐performance In–Zn–O thin‐film transistors with a soluble processed ZrO2 gate insulator

Spin‐coated zirconium oxide films were used as a gate dielectric for low‐voltage, high performance indium zinc oxide (IZO) thin‐film transistors (TFTs). The ZrO₂ films annealed at 400 °C showed a low gate leakage current density of 2 × 10^–8 A/cm² at an electric field of 2 MV/cm. This was attributed to the low impurity content and high crystalline quality. Therefore, the IZO TFTs with a soluble ZrO₂ gate insulator exhibited a high field effect mobility of 23.4 cm²/V s, excellent subthreshold gate swing of 70 mV/decade and a reasonable I_on/off ratio of ～10⁶. These TFTs operated at low voltages (～3.0 V) and showed high drain current drive capability, enabling oxide TFTs with a soluble processed high‐k dielectric for use in backplane electronics for low‐power mobile display applications. (© 2013 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Improved device performance in nonpolar a ‐plane GaN LEDs using a Ni/Al/Ni/Au n‐type ohmic contact

The authors report upon the increased light‐output power (P_out) via a reduction in the forward voltage (V_f) for nonpolar a ‐plane GaN LEDs using Ni/Al/Ni/Au n‐type ohmic contacts. The specific contact resistivity of the Ni/Al/Ni/Au contact is found to be as low as 5.6 × 10^–5 whereas that of a typical Ti/Al/Ni/Au contact is 6.8 × 10^–4 Ω cm², after annealing at 700 °C. The X‐ray photoelectron spectroscopy results show that the upward surface band bending is less pronounced for the Ni/Al contact compared to the Ti/Al contact, leading to a decrease in the effective Schottky barrier height (SBH). The V_f of the nonpolar LEDs decreases by 10% and P_out increases by 15% when the Ni/Al/Ni/Au scheme is used instead of the typical Ti/Al/Ni/Au metal scheme. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Field emission graphene–oxide–silicon field effect based photodetector

Silicon‐based devices keep moving into smaller dimension for improving the speed, efficiency, and low‐power consumption. Novel designed semiconductor device architectures are needed to overcome the physical limitations. An integration of well‐designed nanostructure and nanomaterials can potentially establish new principles and approaches to nanoelectronic and photonic devices. We herein demonstrate a graphene/SiO₂/p‐Si (GOS) heterostructure with an embedded nanoscale mesa, forming a GOS‐Mesa field‐effect photodetector. The proposed structure exhibits that multiple exciton generation (MEG) can occur in a quantum‐confined two‐dimensional electron gas (2DEG) region via impact ionization, leading to high internal quantum efficiency (η_IQE). The numerical simulation of the carrier multiplication (CM) factor in our designed structure finds a reasonable agreement with empirical data. Simulated and measured internal quantum efficiency demonstrate ～195% and ～135% of UV–Vis radiation, respectively. A vertically confined 2DEG plays an important role not only in enabling the electron emission process which is responsible for the flowing of electron current, but also in developing a highly localized electric field (up to ～10⁶ V/cm) at the SiO₂/Si interface, enabling an impact ionization process under photon energy of merely ～1.95 eV. Our findings demonstrate that carrier multiplication can be achieved in a suitably designed nanoscale structure in conjunction with nanomaterial on silicon‐based devices, providing incentive to better understand MEG within quantum wells in 2DEG systems, and being a research path to enhancing the efficiency of future solar harvesting technologies. (© 2015 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

Study of radiation damage induced by 12 keV X‐rays in MOS structures built on high‐resistivity n‐type silicon

Imaging experiments at the European X‐ray Free Electron Laser (XFEL) require silicon pixel sensors with extraordinary performance specifications: doses of up to 1 GGy of 12 keV photons, up to 10⁵ 12 keV photons per 200 µm × 200 µm pixel arriving within less than 100 fs, and a time interval between XFEL pulses of 220 ns. To address these challenges, in particular the question of radiation damage, the properties of the SiO₂ layer and of the Si–SiO₂ interface, using MOS (metal‐oxide‐semiconductor) capacitors manufactured on high‐resistivity n‐type silicon irradiated to X‐ray doses between 10 kGy and 1 GGy, have been studied. Measurements of capacitance/conductance–voltage (C/G–V) at different frequencies, as well as of thermal dielectric relaxation current (TDRC), have been performed. The data can be described by a dose‐dependent oxide charge density and three dominant radiation‐induced interface states with Gaussian‐like energy distributions in the silicon band gap. It is found that the densities of the fixed oxide charges and of the three interface states increase up to dose values of approximately 10 MGy and then saturate or even decrease. The shapes and the frequency dependences of the C/G–V measurements can be quantitatively described by a simple model using the parameters extracted from the TDRC measurements.     

Low voltage organic field effect transistors with a poly(hexylthiophene)–ZnO nanoparticles composite as channel material

We report on solution processable organic field effect transistors prepared using a poly(3‐hexylthiophene)–ZnO nanoparticles composite as channel semiconductor material and cross‐linked polyvinyl alcohol as gate insulator. Our transistors show a field effect mobility of 0.35 ± 0.06 cm²/V s, threshold voltage of –1.30 ± 0.11 V, and I_on/I_off ratio of (1.0 ± 0.1) × 10³. (© 2012 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

High‐gain Zn1–xMgx O‐based ultraviolet photodetectors on Al2O3 and LiGaO2 substrates

We report the fabrication and characterization of highly responsive ZnMgO‐based ultraviolet (UV) photodetectors in the metal–semiconductor–metal (MSM) configuration for solar‐blind/visible‐blind optoelectronic application. MSM devices were fabricated from wurtzite Zn_1–xMg_x O/ZnO (x ～ 0.44) thin‐film heterostructures grown on sapphire (α‐Al₂O₃) substrates and w‐Zn_1–xMg_x O (x ～ 0.08), grown on nearly lattice‐matched lithium gallate (LiGaO₂) substrates, both by radio‐frequency plasma‐assisted molecular beam epitaxy (PAMBE). Thin film properties were studied by AFM, XRD, and optical transmission spectra, while MSM device performance was analyzed by spectral photoresponse and current–voltage techniques. Under biased conditions, α‐Al₂O₃ grown devices exhibit peak responsivity of ～7.6 A/W at 280 nm while LiGaO₂ grown samples demonstrate peak performance of ～119.3 A/W, albeit in the UV‐A regime (～324 nm). High photoconductive gains (76, 525) and spectral rejection ratios (～10³, ～10⁴) were obtained for devices grown on α‐Al₂O₃ and LiGaO₂, respectively. Exemplary device performance was ascribed to high material quality and in the case of lattice‐matched LiGaO₂ films, decreased photocarrier trapping probability, presumably due to low‐density of dislocation defects. To the best of our knowledge, these results represent the highest performing ZnO‐based photodetectors on LiGaO₂ yet fabricated, and demonstrate both the feasibility and substantial enhancement of photodetector device performance via growth on lattice‐matched substrates. (© 2015 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

Highly stable hafnium–tin–zinc oxide thin film transistors with stacked bilayer active layers

Hf–Sn–Zn–O (HTZO) thin films were prepared on SiO₂/SiN_x substrates at room temperature by the direct current (DC) magnetron sputtering of Hf-doped Sn–Zn–O targets. The characteristics of films with different amounts of Hf were analyzed. Amorphous HTZO films were obtained by increasing the Hf content, while polycrystalline films have not shown with Hf doping. With the proper Hf concentration in the HTZO films (∼2.0 atomic % Hf/(Hf + Sn + Zn + O)), HTZO films demonstrated good performance as an oxide semiconductor channel material in thin film transistors (TFTs) with a field effect mobility (μ_FE) of 10.9 cm²V⁻¹ s⁻¹, an on/off current ratio of 10⁹, and a subthreshold voltage swing of 0.71 V/decade.     

Hall Mobility of As‐Grown Cu2O Thin Films Obtained Via Electrodeposition on Patterned Au Substrates

Hall measurement of an electrodeposited Cu₂O film is rendered difficult as the bilayer structure of semiconductor on top of a conductive substrate obviates the measurement. Here, we propose the use of a patterned Au on glass substrate in line/space configuration for the Hall measurement of electrodeposited Cu₂O. A continuous, (111) oriented Cu₂O film was electrodeposited on 8 μm/2 μm Au‐line/space on glass substrate and Hall measurement was performed. The room temperature Hall measurement of the Cu₂O film on the patterned substrate indicates p‐type conduction with a hole concentration of 2.2 × 10¹⁷ cm^?3 and mobility of 4.7 × 10^?3 cm² V^?1 s^?1. Additionally, the temperature dependent resistivity exhibits a negative slope that is characteristic of a semiconductor. Therefore, the measured electrical characteristics can be attributed to the electrodeposited Cu₂O semiconductor film rather than the conductive substrate. This method can be applied for the Hall measurement of any other electrodeposited semiconductor by optimizing the line/space geometry of the conductive substrate.     

Raman study of photo‐induced degradation of the Ru(II) complex adsorbed on nanocrystalline TiO2 films

Photo‐induced degradation of a monolayer of the Ru(II) complex adsorbed on anatase TiO₂ thin films was studied by using resonant micro‐Raman spectroscopy. We developed two contrastive experiments to analyze the degradation mechanism. An exponential decay law was found when the dye was irradiated in the absence of a reducing agent. While the sensitized TiO₂ thin film electrode was covered by the I^–/I₃^– redox couple, the dye degradation exhibited a slowed linear decay. The experimental result was compared and the degradation mechanism was analyzed. (© 2007 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Radiation resistance of 4<Emphasis Type="Italic">H</Emphasis>-SiC Schottky diodes under irradiation with 0.9-MeV electrons

Degradation of the parameters of 4H-SiC Schottky diodes after irradiation with 0.9-MeV electrons is studied. A charge-carrier removal rate of 0.07–0.09 cm^–1 is determined. The Schottky diodes under investigation are shown to retain rectifying current-voltage characteristics up to doses of ~10¹⁷ cm^–2. The radiation resistance of SiC Schottky diodes is found to be much greater than that of Si p–i–n-diodes with the same breakdown voltage.