A three-parameter elastic foundation model for interface stresses in curved beams externally strengthened by a thin FRP plate

Externally bonding of fiber reinforced polymer (FRP) plates or sheets has become a popular method for strengthening reinforced concrete structures. Stresses along the FRP–concrete interface are of great importance to the effectiveness of this type of strengthening because high stress concentration along the FRP–concrete interface can lead to the FRP debonding from the concrete beam. In this study, we develop an analytical solution of interface stresses in a curved structural beam bonded with a thin plate. A novel three-parameter elastic foundation model is used to describe the behavior of the adhesive layer. This adhesive layer model is an extension of the two-parameter elastic foundation commonly used in existing studies. It assumes that the shear stress in the adhesive layer is constant through the thickness, and the interface normal stresses along two concrete/adhesive and adhesive/FRP interfaces are different. Closed-form solutions are obtained for these two interfacial normal stresses, shear stress within the adhesive layer, and beam forces. The validation of these solutions is confirmed by finite element analysis.     

单搭接胶接接头拉伸剪切性能的数值模拟与实验研究

采用数值模拟和光测技术对单向拉伸载荷作用下单搭接胶接接头中的剪切性能进行分析,研究了不同厚度胶层中切应力的变化规律。用有限元方法(FEM)对不同胶层厚度的试件进行建模,得到了拉伸载荷下胶粘剂中的切应力分布及其统计参数。利用数字图像相关(digitalimage correlation,DIC)方法对试件的变形场进行测量。结果表明,当胶粘剂的厚度较小时,胶粘剂中的切应力的分布统计参数随着其厚度的增加会有显著的变化,但是当厚度超过一定的数值时,统计参数对厚度的变化不再敏感。     

Embedded piezoelectric sensors to measure peel stresses in adhesive joints

Although peel stresses are believed to be responsible for failure in many adhesive joint geometries, the measurement of these peel stresses has been elusive. In this work, embedded poly(vinylidene fluoride) piezoelectric sensors were used to measure peel stresses in adhesively bonded joints. Piezoelectric KYNAR^® film was etched to produce multi-area stress sensors which were bonded into adhesive joints. Calibration results and results for single-lap and elastomeric butt joints are presented. The elastomeric butt joint was compared to an analytical solution for the bond-normal stresses, and the single-lap joint results were compared to finite-element analysis. Promising features and liminations of this technique are discussed.     

Analytical solutions for adhesive composite joints considering large deflection and transverse shear deformation in adherends

This paper presents a novel formulation and analytical solutions for adhesively bonded composite single lap joints by taking into account the transverse shear deformation and large deflection in adherends. On the basis of geometrically nonlinear analysis for infinitesimal elements of adherends and adhesive, the equilibrium equations of adherends are formulated. By using the Timoshenko beam theory, the governing differential equations are expressed in terms of the adherend displacements and then analytically solved for the force boundary conditions prescribed at both overlap ends. The obtained solutions are applied to single lap joints, whose adherends can be isotropic adherends or composite laminates with symmetrical lay-ups. A new formula for adhesive peel stress is obtained, and it can accurately predict peel stress in the bondline. The closed-form analytical solutions are then simplified for the purpose of practical applications, and a new simple expression for the edge moment factor is developed. The numerical results predicted by the present full and simplified solutions are compared with those calculated by geometrically nonlinear finite element analysis using MSC/NASTRAN. The agreement noted validates the present novel formulation and solutions for adhesively bonded composite joints. The simplified shear and peel stresses at the overlap ends are used to derive energy release rates. The present predictions for the failure load of single lap joints are compared with those available in the literature.     

Non-uniform warping including the effects of torsion and shear forces. Part I: A general beam theory

This two-part contribution presents a beam theory with a non-uniform warping including the effects of torsion and shear forces, and valid for any homogeneous cross-section made of isotropic elastic material. Part I is devoted to the theoretical developments and part II discusses analytical and numerical results obtained for torsion and shear-bending of cantilever beams made of different kinds of cross-section. The theory is based on a kinematics assuming that the cross-section maintains its shape and including three independent warping parameters associated to the three warping functions corresponding to torsion and shear forces. Starting from this displacement model and using the principle of virtual work, the corresponding beam theory is derived. For this theory, closed-form results are obtained for the cross-sectional constants and the three-dimensional expressions of the normal and shear stresses. Comparison with classical beam theories is carried out and additional effects due to the non-uniformity of the warping are highlighted. In particular, the contributions of primary and secondary internal forces and the effect of the non-symmetry of the cross-section on the structural behavior of the beam are specified. Simplified versions of this theory, wherein the number of degrees of freedom is reduced, are also presented. The analytical and numerical analyzes presented in part II give responses on the quality of this non-uniform beam theory and indicate also when its simplified versions could be applied.     

复合材料层合板单搭胶接力学性能检测技术与分析

胶接工艺缺陷对单搭胶接接头的拉伸剪切性能有着重要的影响。为了研究不同单搭接胶接层厚度对不同材质复合材料层合板胶接性能的影响规律,通过喷水穿透法超声C扫描对试样的剪切区域进行无损检测,并分别采用1mm、2mm、4mm的胶层厚度,以碳纤维/玻璃纤维复合材料层合板为被粘物,进行单搭胶接拉伸剪切性能试验。检测及试验结果表明:当胶层厚度h1mm时,对于相同材料的被粘物,胶层厚度越大,试件胶接接头剪切强度越小;相同的粘接剂厚度,以碳纤维增强复合材料板为被粘物的试件胶接接头剪切强度大于以玻纤增强复合材料板为被粘物的试件胶接接头强度;胶粘剂与碳纤维被粘物表面的润湿效果要优于胶粘剂与玻纤被粘物表面的润湿效果。     

Energy release rate and phase angle of delamination in sandwich beams and symmetric adhesively bonded joints

Delamination in sandwich structures along the interface between the face sheet and the core, or along the adherend/adhesive interface in adhesively bonded joints, is one of the most common failure modes of this type of tri-layer structure. This delamination is usually modeled as an interface crack problem, for which the energy release rate and phase angle can be calculated using interface fracture mechanics solutions. Existing interface fracture mechanics solutions, however, ignore the effect of transverse shear deformation, which can be significant for short crack. In an effort to overcome this shortcoming, this study presents new analytical solutions for the energy release rate and for the phase angle of the interface crack in sandwich structures or adhesively bonded joints. Since the new solutions incorporate relative rotation at the tip of the delamination, transverse shear effects are taken into account in this study. Typical delaminated sandwich and adhesively bonded joint specimens are analyzed by using the new solutions, as well as by the existing solutions. The energy release rate predicted by the present model agrees very well with that predicted by FEA, and furthermore it is considerably more accurate relative to existing models. As the existing model neglects the transverse shear force, it underestimates the total energy release rate. A stress field analysis is also conducted in this study in order to clarify some misunderstandings in the literature on the determination of the phase angle of adhesively bonded joints using an interface stress-based method.     

Exact dynamic solutions to piezoelectric smart beams including peel stresses I: Theory and application

This work presents exact dynamic solutions to piezoelectric (PZT) smart beams including peel stresses. The governing equations of partial differential forms are firstly derived for a PZT smart beam made of the identical adherends, and then general solutions of the governing equations are studied. The analytical solutions are applied to a cantilever beam with a partially bonded PZT patch to the fixed end. For the given boundary conditions, exact solutions of the steady state motions are obtained. Based on the exact solutions, frequency spectra, natural frequencies, normal mode shapes, harmonic responses of the shear and peel stresses are discussed for the PZT actuator. The details of the numerical results and sensing electric charges will be presented in Part II of this work. The exact dynamic solutions can be directly applied to a PZT bimorph bender. To compare with the classic shear lag model whose numerical demonstrations will be given in Part II, the related equations are also derived for the shear lag rod model and shear lag beam model.     

Reddy高阶组合梁弯曲的一般解析解法

基于Reddy高阶梁的轴向位移模式,考虑组合梁界面滑移变形,利用最小势能原理建立了Reddy组合梁弯曲问题的控制微分方程和边界条件,,并将控制方程转化为含12个基本未知量的一阶常微分方程组,给出一般求解方法和解表达式。其次,研究了横向均布荷载作用下Reddy简支组合梁的弯曲,所得结果与有限元解吻合良好,说明本文解析解的有效性和可靠性。最后,数值分析了组合梁界面滑移剪切刚度kcs、弹性模量-剪切模量比E/G、梁长-高比L/h和子梁厚度比hs/hc等参数对Reddy简支组合梁弯曲的影响。分析表明：滑移刚度显著影响横截面应力的分布;组合梁长-高比越小、弹性模量-剪切模量比越大或界面滑移刚度越大,组合梁的剪切效应对其挠度影响越显著,此时不宜忽略其剪切变形。     

Linear and higher order displacement theories for adhesively bonded lap joints

This work presents an adhesive model for stress analysis of bonded lap joints, which can be applied to model thin and thick adhesive layers. In this theory, linear variations of displacement components along the adhesive thickness are firstly assumed, and the longitudinal strain and the Poisson's effect of the adhesive are modeled. A differential form of the equilibrium equations for the adherends is analytically solved by means of compatible relations of the adhesive deformation. The derived shear and peel stresses are compared with the classical adhesive model of continuous springs with constant shear and peel stresses, and validated with two-dimensional finite element results of the geometrically nonlinear analysis using a commercial package. The numerical results show that the present linear displacement theory can be applied to both thin and moderately thick adhesive layers. The present formulation of the linear displacement theory is then extended to the higher order displacement theory for stress analysis of a thick adhesive, whose numerical results are also compared with those of the finite element computation.     

A smart single-lap adhesive joint integrated with partially distributed piezoelectric patches

The powerful electro-mechanical coupling attribute of piezoelectric materials enables these materials to act as effective actuators. Using this attribute, a smart single-lap adhesive joint was developed by anti-symmetrically surface bonding piezoelectric patches onto a typical single-lap joint. The forces and bending moments at the edges of the developed smart joint can be adaptively controlled by adjusting the applied electric field in the piezoelectric patches, thus reducing the stress concentration in the joint edges. In order to further verify the effect of surface bonding of the piezoelectric patches, a first-order shear deformation theory based analytical model was developed to evaluate the stress distribution in the adhesive layer. It was established that the piezoelectric patched joint could significantly reduce the stress concentration in the joint edges. The influence of location and size of the piezoelectric patches was also investigated. Furthermore, the state-space method was used to obtain the analytical solution. A series of finite element analyses were also carried out to verify the integrity of the developed solution. Results from the computational analyses were in good agreement with those obtained from the proposed results, thus validating the solutions.     

Exact static solutions to piezoelectric smart beams including peel stresses. II. Numerical results,comparison and discussion

This part presents the numerical results, comparisons and discussion for the exact static solutions of smart beams with piezoelectric (PZT) actuators and sensors including peel stresses presented in Part I. (International Journal of Solids and Structures, 39, 4677–4695) The actuated stress distributions in the adhesive and the adhesive edge stresses varying with the thickness ratios are firstly obtained and presented. The actuated internal stress resultants and displacements in the host beam are then calculated and compared with those predicted by using the shear lag model. The stresses in the adhesive caused by an applied axial force, bending moment and shear force are calculated, and then used to compute the sensing electric charges for comparison with those predicted using the shear lag model. The numerical results are given for the smart beam with (a) one bonded PZT and (b) two symmetrically bonded PZTs, with a comparison to those predicted using the shear lag model. Novel, simple and more accurate formulas for the equivalent force and bending moment induced by applied electric field are also derived for the host beam with one PZT or two symmetrically bonded PZTs. The symmetric shear stress and the anti-symmetric peel stress components caused by a shear force are discussed. In addition, in the case of PZT edge debonding, the stress redistribution in the adhesive and the self-arresting mechanism are also investigated.     

Mechanics and fracture of crack tip deformable bi-material interface

Novel interface deformable bi-layer beam theory is developed to account for local effects at crack tip of bi-material interface by modeling a bi-layer composite beam as two separate shear deformable sub-layers with consideration of crack tip deformation. Unlike the sub-layer model in the literature in which the crack tip deformations under the interface peel and shear stresses are ignored and thus a “rigid” joint is used, the present study introduces two interface compliances to account for the effect of interface stresses on the crack tip deformation which is referred to as the elastic foundation effect; thus a flexible condition along the interface is considered. Closed-form solutions of resultant forces, deformations, and interface stresses are obtained for each sub-layer in the bi-layer beam, of which the local effects at the crack tip are demonstrated. In this study, an elastic deformable crack tip model is presented for the first time which can improve the split beam solution. The present model is in excellent agreements with analytical 2-D continuum solutions and finite element analyses. The resulting crack tip rotation is then used to calculate the energy release rate (ERR) and stress intensity factor (SIF) of interface fracture in bi-layer materials. Explicit closed-form solutions for ERR and SIF are obtained for which both the transverse shear and crack tip deformation effects are accounted. Compared to the full continuum elasticity analysis, such as finite element analysis, the present solutions are much explicit, more applicable, while comparable in accuracy. Further, the concept of deformable crack tip model can be applied to other bi-layer beam analyses (e.g., delamination buckling and vibration, etc.).     

Direct determination of interlaminar stresses in polymeric adhesive layer

A method for direct measurement of shear and normal displacements, and a simple way of determining the distribution of the respective average stresses along an interlaminar adhesive layer (IAL), were successfully examined on a symmetrical doubler model. Experimental data proved to be in agreement with available analytical solutions for this model in the elastic stage. The method was also examined beyond the elastic linear range and may be used to follow up the initiation of delamination.     

Nonlinear interface shear fracture of end notched flexure specimens

The nonlinear analytical solutions of an end notched flexure adhesive joint or fracture test specimen with identical or dissimilar adherends are investigated. In the current study, a cohesive zone model (with arbitrary nonlinear cohesive laws) based analytical solution is obtained for the interface shear fracture of an end notched flexure (ENF) specimen with sufficiently long bond length. It is found that the scatter and inconsistency in calculating Mode II toughness may be significantly reduced by this model. The present work indicates that the Mode II toughness G_IIc under pure shear cracking condition is indeed very weakly dependent on the initial crack length. And this conclusion is well supported by the experimental results found in the literature. The parametric studies show that the interface shear strength is the most dominant parameter on the critical load. It is also interesting to note that with very short initial crack length and identical interface shear strength, higher Mode II toughness indeed cannot increase the critical load. Unlike the high insensitivity of critical load to the detailed shape of the cohesive law for Mode I peel fracture, the shape of the cohesive law becomes relatively important for the critical load of joints under pure Mode II fracture conditions, especially for joints with short initial crack length. The current study may help researchers deepen the understanding of interface shear fracture and clarify some previous concepts on this fracture mode.     

Cohesive failure analysis of an array of IC chips bonded to a stretched substrate

The paper presents a mechanical model for predicting the cohesive failure of a periodic array of integrated circuit (IC) chips adhesively bonded to a stretched substrate. A unit cell of the layered structure consisting of the IC chips, adhesive layer, and substrate is modeled as an assembly of two elastic Timoshenko beams, representing the chip and substrate, connected by an elastic interface, representing the adhesive. Accordingly, the stresses and energy release rate (ERR) in the adhesive layer – responsible for the premature cracking of the adhesive and debonding of the IC chips – are identified with the corresponding quantities computed for the elastic interface. Expressions for the adhesive stresses and ERR are given in terms of geometrical dimensions and material properties, combined with integration constants obtained numerically via the multi-segment analysis method. For comparison, the stresses in the adhesive are also computed based on a finite element model, and the ERR is evaluated using the virtual crack-closure technique (VCCT). The analytical predictions and numerical results match fairly well, considering the effects of key factors, such as the distance between adjacent chips, the chip size, the material properties of adhesive and substrate. The interaction between the chips is shown to have relevant effects on the adhesive stresses. In particular, only the mode II contributes to the ERR which increases with the ratio of the chip size to the distance between the chips and with the compliance of the adhesive and substrate layers.     

Stress-function variational method for interfacial stress analysis of adhesively bonded joints

High interfacial stresses at the free edges of adherends are responsible for the debonding failure of adhesively bonded joints (ABJs). In this paper, a general stress-function variational method is formulated to determinate the interfacial shear and normal (peeling) stresses in ABJs in high accuracy. By extending authors’ prior work in stress analysis of bonded joints (Wu and Jenson, 2011), all the planar stress components in the adherends and adhesive layer of an ABJ are expressed in terms of four unknown interfacial stress functions, which are introduced at the upper and lower surfaces of the adhesive layer. A set of governing ordinary differential equations (ODEs) of the four interfacial stress functions is obtained via minimizing the complimentary strain energy of the ABJ, which is further solved by using eigenfunctions. The obtained semi-analytic stress field can satisfy all the traction boundary conditions (BCs) of the ABJ, especially the stress continuity across the bonding lines and the shear-free condition at the ends of adherends and adhesive layer. As an example, the stress field in an adhesively single-sided strap joint is determined by the present method, whose numerical accuracy and reliability are validated by finite element method (FEM) and compared to existing models in the literature. Parameter studies are performed to examine the dependencies of the interfacial stresses of the exemplified ABJ upon the geometries, moduli and temperature change of the adherends and adhesive layer, respectively. The present method is applicable for scaling analysis of joint strength, optimal design of ABJs, etc.     

多亚层柔性节点模型及其在双材料4ENF试件界面分析中的应用

提出了多亚层柔性节点模型用于分析双材料裂纹尖端的应力和变形。该模型考虑了胶层的变形,各亚层视为独立的剪切变形梁,采用两个界面柔度系数考虑界面应力对各亚层界面变形的影响,界面变形包括双材料界面和胶层的变形。通过对FRP-混凝土末端切口四点弯试件(Four-point bending end-notched flexure specimen,简称4ENF)进行界面分析,并与其他模型和有限元分析对比表明:刚性节点模型忽略了裂纹尖端的应力和变形集中,只能粗略地估计构件的整体变形和界面应力;半刚性节点容许裂纹尖端的转动,对裂纹尖端的变形估计优于刚性节点模型,但精度依然不高;多亚层柔性节点模型反映了裂纹尖端的应力和变形集中,与数值分析结果吻合很好,该研究对进行双材料结构的工程设计具有理论指导和参考价值。