Study of temperature profile and specific heat capacity in temperature modulated DSC with a low sample heat diffusivity

One important application of temperature modulated DSC (TMDSC) is the measurement of specific heat of materials. When the sample has very good thermal conductivity as in the case of metals, the temperature gradient is not normally an important factor and can be ignored most of the time. However, in the case of materials with poor heat transfer properties, for example, polymers, the thermal conductivity is only in the order of 1/1000 or so of that of metals. This could have a major effect on the test results. In this paper, a round analytical solution is given and a numerical model is used to analyze the effects of thermal diffusivity on temperature distribution inside the test sample and specific heat measurement by TMDSC, PET sample test results are presented to demonstrate the effects of material thermal diffusivity.     

Evaluation of effective thermal conductivity of fireworks compositions

Effective thermal conductivity of fireworks raw materials and their mixture have been measured by the temperature modulated DSC and the hot wire method, in order to predict spontaneous ignition properties precisely. As a result, an excellent linear correlation has been obtained between the density and the λ_e by the TMDSC method. Moreover, the low-density data by the hot wire method lie on the extrapolated point of the linear correlation. Thus, the λ_e within the ordinary limit of fireworks composition can be measured by the TMDSC method. Krupiczka’s estimation method shows a good agreement with the experimental values.     

Investigation of thermal properties of some basalt samples in Egypt

This work aims in studying the temperature dependence of the thermal properties (thermal diffusivity, k, specific heat, C _p and thermal conductivity, ) of some basalt group samples, collected from different regions in the eastern desert of Egypt. The thermal properties of these samples were measured in the temperature range from r.t. to 900 K. The average values of the thermal conductivity of these investigated samples lie in the range from 0.4·10^–3 to 2.01·10^–3 cal cm^–1 s^–1 K^–1. This means that these samples are considered as thermal insulating materials. The thermogravimetric analysis (TG) confirmed that these investigated samples are dry rocks. X-ray fluorescence (XRF) and X-ray diffraction (XRD) confirmed that these rock samples have a crystalline phase, the peaks of XRD have a small change in their location as a result of heat treatment. This behaviour was attributed to the oxidation and firing of some minerals after the heat treatment.This revised version was published online in November 2005 with corrections to the Cover Date.     

Thermal analysis of protein–metallic ion systems

Advanced thermal analysis methods, such as temperature modulated DSC (differential scanning calorimetry) and quasi-isothermal TMDSC were used to analyze the protein–metallic ion interactions in silk fibroin proteins. The precise heat capacities were measured and theoretically predicted in this study. To remove bound water and simplify the system, a thermal cycling treatment through both standard DSC and TMDSC was used to detect the underlying heat capacity and reveal the phase transitions of the silk–metallic salts system. Results show that K⁺ metallic salts play the role of plasticizer in silk fibroin proteins, which reduces the glass transition (T_g) of the pure silk protein and negatively affects its structural thermal stability. On the other hand, Ca²⁺ metallic salts act as an anti-plasticizer, and increase the glass transition and the thermal stability of the silk protein structure. This indicates that the thermal analysis methods offer a new pathway to study protein–metallic ion systems, yielding very fruitful information for the study of protein structures in the future.     

Thermal conductivity of high strength polyethylene fiber in low temperature

High strength polyethylene fiber (Toyobo, Dyneema® fiber, hereinafter abbreviated to DF) used as reinforcement of fiber‐reinforced plastics for cryogenic use has a high thermal conductivity. To understand the thermal conductivity of DF, the relation between fiber structure and thermal conductivity of several kinds of polyethylene fibers having different modulus from 15 to 134 GPa (hereinafter abbreviated to DFs) was investigated. The mechanical series‐parallel model composed of crystal and amorphous was applied to DFs for thermal conductivity. This mechanical model was obtained by crystallinity and crystal orientation angle measured by solid state NMR and X‐ray. Thermal conductivity of DF in fiber direction was dominated by that of the continuous crystal region. The thermal conductivity of the continuous crystal part estimated by the mechanical model increases from 16 to 900 mw/cmK by the increasing temperature from 10 to 150K, and thermal diffusivity of the continuous crystal part was estimated to about 100 mm²/s, which is almost temperature independent. The phonon mean free path of the continuous crystal region of DF obtained by thermal diffusivity is almost temperature independent and its value about 200 Å. With the aforementioned, the mechanical series‐parallel model composed of crystal and amorphous regions could be applied to DFs for thermal conductivity. © 2005 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 43: 1495–1503, 2005     

Thermal conductivity of poly(vinyl chloride)/polycaprolactone blends

Thermal diffusivity, heat capacity, and density of polyvinyl chloride/polycaprolactone (PVC/PCL) blends were measured by the laser flash method, DSC, and pycnometry, respectively. The thermal conductivity of the PVC/PCL blends was determined from the results. The miscibility of the blend and crystallinity of PCL were determined by DSC. The effect of blend structure on thermal conductivity is discussed. The phase compositions of the PVC/PCL blends are of three types depending on PCL content: i.e., up to 33%, from 33 to 70%, and above 70% PCL by weight. Thermal conductivity, thermal diffusivity, and heat capacity of the PVC/PCL blends are strongly affected by the phase composition of the blend, which changes in a complicated way with PCL content. © 1994 John Wiley & Sons, Inc.     

Thermal diffusivity measurement of low-k dielectric thin film by temperature wave analysis

Thermal diffusivity of thin film with low dielectric constant (k), what is called low-k dielectric thin film, 0.31-1.14 μm, including hydrogen-silsesquioxane (HSQ), methyl-silsesquioxane (MSQ), and poly(arylen ether) was examined by temperature wave analysis. The phase shift of temperature wave was observable up to 100 kHz. Thermal diffusivity of HSQ was 4.7 × 10⁻⁷ m² s⁻¹, on the other hand it was not higher than 1.1 × 10⁻⁷ m² s⁻¹ for MSQ or poly(arylen ether) at room temperature. Temperature dependence of thermal diffusivity/thermal conductivity of MSQ was obtained, thermal diffusivity decreased but thermal conductivity increased in a heating scan at 30-150 °C. It was shown that the thermal diffusivity of low-k thin film was correlated with the chemical and the physical structures, the latter was formed in the spin-coating and the curing process.     

Thermal Dehydration and Miscibility of PHEMA/PMAA Blends

Miscibility and dehydration of poly(2-hydroxyethyl methacrylate) and poly(methacrylic acid) (PHEMA/PMAA) blends were investigated by temperature modulated DSC (TMDSC), TG and solid-state ¹³C NMR methods. TMDSC spectra and ¹H spin-relaxation times showed that the blends are homogeneous on a scale of 5-10 nm for all compositions. From TG and ¹³C NMR, we elucidated that the mass loss of the blends at 300°C is ascribed to the dehydration between the hydroxyl group of PHEMA and the carboxyl group of PMAA. This revised version was published online in August 2006 with corrections to the Cover Date.     

TMDSC analysis of single-site copolymer blends after thermal fractionation

Temperature-modulated differential scanning calorimetry (TMDSC) has been used to study the melting of a series of blends containing linear low-density polyethylene (LLDPE) and very low-density polyethylenes (VLDPE) with long chain branches. After the blends were subjected to different thermal histories including thermal fractionation by stepwise isothermal cooling, they were examined by TMDSC. TMDSC curves have been interpreted in terms of a combination of the reversing and non-reversing specific heats that result from reversible and irreversible events at the time and temperature, which they are detected, respectively. It was found that crystals formed at different crystallisation conditions had different internal order; hence they showed different amounts of reversing and non-reversing contributions. There is no exothermic activity seen in the non-reversing signal for the thermally fractionated polymers and their blends suggesting formation of crystals approaching equilibrium. In contrast, polymers and blends cooled at 10°C min^-1 cooling rate showed large exothermic contributions corresponding to irreversible effects. In addition, a true reversible melting contribution is also detected for both fast-cooled and thermally-fractionated samples during the quasi-isothermal measurements. This revised version was published online in July 2006 with corrections to the Cover Date.     

Matching Cure Characteristics of Automotive Rubber Compound and Polyurethane Coating

The present investigation focuses on matching cure characteristics of EPDM rubber compound and polyurethane (PU) coating using temperature modulated and pressure differential scanning calorimetry (TMDSC, PDSC). TMDSC provides a detailed and better understanding of the curing process of model rubber system as well as complex automotive rubber compounds. The low level of unsaturation present in EPDM, results in the small heat of vulcanization (2–5 J g^–1), which is difficult to accurately measure using conventional differential scanning calorimetry (DSC). Thus, curing of highly filled EPDM compound was investigated using TMDSC. The kinetics of PU curing was monitored using pressure DSC (PDSC), and heat of curing was determined as 4.2 J g^–1 at 10°C min^–1 heating rate. It is found that complex automotive compounds and the PU coating are curing simultaneously. This revised version was published online in July 2006 with corrections to the Cover Date.     

Reversible Melting of Thermally Fractionated Polyethylene

Different grades of linear low density polyethylenes (LLDPEs) have been quenched cooled step-wise and crystallised isothermally at (a series of increasing) temperatures in a DSC (thermal fractionated samples). These samples have been investigated by temperature modulated DSC (MDSC). The heat flow curves of the thermal fractionated materials were compared with those obtained from samples crystallised at a relatively slow cooling rate of 2 K min^-1(standard samples). The melting enthalpy obtained from the total heat flow of the thermal fractionated samples was 0-10 J g^-1higher than those of standard samples. The melting enthalpy obtained from the reversing heat flows was 13-31 J g^-1lower in the thermal fractionated samples than in the standard samples. The ratio of the reversing melting enthalpy to the total melting enthalpy increased with decreasing density of the PE. The melting temperature of the endotherms formed by the step-wise cooling was 9 K higher than the crystallisation temperature. This revised version was published online in July 2006 with corrections to the Cover Date.     

The linear thermal expansion and the thermal diffusivity measurements for near-stoichiometric (U, Ce)O2 solid solutions

The thermal diffusivities of near-stoichiometric (U, Ce)O₂ solid solutions containing CeO₂ up to 22 mol% were investigated in the temperature range of 298-1273 K using the laser flash method. Also, linear thermal expansion measurements were performed in the temperature range of 298-1673 K using a thermomechanical analysis. The thermal conductivities were determined by a calculation of the thermal diffusivity, the density and the specific heat. The thermal conductivities of the tested samples could be expressed as a function of the temperature by the phonon conduction equation k = (A + BT)⁻¹. The thermal conductivity decreased gradually with an increasing Ce content. This was attributable to the increasing lattice defect thermal resistance caused by the U⁴⁺, Ce⁴⁺ and O²⁻ ions as phonon scattering centers.     

Synthesis,characterization, and thermal and dielectric properties of three different methacrylate polymers with zwitterionic pendant groups

The synthesis, characterization, thermal, and dielectric properties of three different zwitterionic methacrylates of the sulfobetaine type are presented. Diethylamine-ethyl-, 2-(diethylaminoethoxy)-ethyl-, and 2-(2-diethylaminoethoxy) ethoxy-ethyl-methacrylates were made to react with butanosultone to prepare monomers with variable flexibility. The flexibility of the lateral chain of the polymethacrylates decreased the glass transition temperature (T_g down to 300 K) of the polymers. A linear relationship between T_g and the number of carbon atoms was shown for these materials. X-ray diffraction and DSC experiments showed the formation of new ordered phases in these polymers, which inhibited their dipole conductivity. On heating, these phases were destroyed and values of conductivity of 10⁻⁷–10⁻³ S cm⁻¹ were obtained in the studied range of temperature. Variation of conductivity with temperature was established according to the Arrhenius equation. Dielectric properties exhibited a small deviation of the Debye type behavior, and β parameters of the Cole–Cole equations were calculated for the synthesized polymers. © 1997 John Wiley & Sons, Inc.     

How much is the accuracy of activation energy affected by ignoring thermal inertia?

This work estimates the magnitude of the effect of thermal inertia on the value of the activation energy determined from heat-flux differential scanning calorimetry (DSC) data. The estimates are obtained via analysis of the literature data on crystallization of copper and thermal degradation of isotactic polystyrene (iPS). The copper crystallization data have been obtained for very large masses (200 mg) and fast heating rates up to 80 K min⁻¹. The iPS degradation data have been collected on small masses (3 mg) and at the heating rates up to 20 K min⁻¹. For crystallization of copper, the Kissinger activation energy obtained from the DSC data corrected for thermal inertia is 34% larger than the value estimated from uncorrected data. This difference drops to 8% and becomes statistically insignificant when the fastest heating rate used is decreased to 10 K min⁻¹. For iPS degradation, the difference in the isoconversional activation energies estimated, respectively, from corrected and uncorrected DSC data is less than 3% and is not statistically significant. Overall, the effect of thermal inertia on the activation energy appears negligible provided that DSC measurements are conducted on smaller samples and at slower heating rates, that is, as advised by the International Confederation for Thermal Analysis and Calorimetry (ICTAC) recommendations. It is suggested that the difference in the activation energies should generally be within the typical 5-10% uncertainty as long as the product of the time constant and the maximum heating rate does not exceed 2-3 K.     

The preparation and thermoelectric properties of molten salt electrodeposited boron wafers

We have prepared electrodeposited boron wafer by molten salts with KBF₄-KF at 680°C using graphite crucible for anode and silicon wafer and nickel plate for cathodes. Experiments were performed by various molar ratios KBF₄/KF and current densities. Amorphous p-type boron wafers with purity 87% was deposited on nickel plate for 1 h. Thermal diffusivity by ring-flash method and heat capacity by DSC method produced thermal conductivity showing amorphous behavior in the entire temperature range. The systematical results on thermoelectric properties were obtained for the wafers prepared with KBF₄-KF (66-34 mol%) under various current densities in the range 1-2 A/cm². The temperature dependencies of electrical conductivity showed thermal activated type with activation energy of 0.5 eV. Thermoelectric power tended to increase with increasing temperature up to high temperatures with high values of (1-10) mV/K. Thermoelectric figure-of-merit was 10⁻⁴/K at high temperatures. Estimated efficiency of thermoelectric energy conversion would be calculated to be 4-5%.     

Application of DSC as a tool for honey floral species characterization and adulteration detection

The thermal behaviour of authentic honeys and sugar syrups (industrial and homemade) was investigated by DSC. To confirm the first previous results concerning the effect of adulteration on the thermal behaviour of authentic honeys, 30 honey samples (Robinia, Lavender, Chestnut and Fir) were analyzed by DSC and their T _g were measured following a suited experimental protocol. The results indicated that this parameter was useful to characterize and to distinguish significantly these varieties between them. Applied to honey samples artificially adulterated with different industrial syrups, DSC showed a detection level of 5–10% depending on the type of syrup. An endothermic phenomenon occurring between 40–90°C during the heating was studied by TMDSC and a new thermal transition similar to a glass-transition was highlighted.This revised version was published online in November 2005 with corrections to the Cover Date.     

Thermal conductivity of gel-spun polyethylene fibers

The thermal conductivities of unidirectional gel-spun polyethylene fiber-reinforced composites have been measured parallel (K∥?) and perpendicular (K⊥) to the fiber axis from 15 to 300K. The axial thermal conductivity K∥? varies linearly with volume fraction v_f of fiber, while the transverse thermal conductivity K⊥ follows the Halpin-Tsai equation. Extrapolation to v_f = 1 gives the thermal conductivity of gel-spun polyethylene fiber which, at 300K, has values of 380 and 3.3 mW cm^?1K^?1 along and perpendicular to the fiber axis, respectively. The axial thermal conductivity is exceptionally high for polymers, and is more than twice the thermal conductivity of stainless steel. This high value arises from the presence of a large fraction of long (> 50 nm) extended chain crystals in the fiber. Further improvement of up to a factor of 10 is possible if the length and volume fraction of the extended chain crystals can be increased. © 1993 John Wiley & Sons, Inc.     

Ligand Crosslinking Boosts Thermal Transport in Colloidal Nanocrystal Solids

The ongoing interest in colloidal nanocrystal solids for electronic and photonic devices necessitates that their thermal‐transport properties be well understood because heat dissipation frequently limits performance in these devices. Unfortunately, colloidal nanocrystal solids generally possess very low thermal conductivities. This very low thermal conductivity primarily results from the weak van der Waals interaction between the ligands of adjacent nanocrystals. We overcome this thermal‐transport bottleneck by crosslinking the ligands to exchange a weak van der Waals interaction with a strong covalent bond. We obtain thermal conductivities of up to 1.7 Wm^?1 K^?1 that exceed prior reported values by a factor of 4. This improvement is significant because the entire range of prior reported values themselves only span a factor of 4 (i.e., 0.1–0.4 Wm^?1 K^?1). We complement our thermal‐conductivity measurements with mechanical nanoindentation measurements that demonstrate ligand crosslinking increases Young's modulus and sound velocity. This increase in sound velocity is a key bridge between mechanical and thermal properties because sound velocity and thermal conductivity are linearly proportional according to kinetic theory. Control experiments with non‐crosslinkable ligands, as well as transport modeling, further confirm that ligand crosslinking boosts thermal transport.     

Thermal conductivity and thermal diffusivity of poly(acrylic acid) by transient hot wire technique

The paper describes a new transient hot wire instrument which employs 25.4 μm diameter tantalum wire with an insulating tantalum pentoxide coating. This hot-wire cell with a thin insulating layer is suitable for measurement of the thermal conductivity and the thermal diffusivity of electrically conducting and polar liquids. This instrument has been used for experimental measurement of the thermal conductivity and the thermal diffusivity of poly(acrylic acid) solution (50 mass%) in the temperature range of 299 to 368 K at atmospheric pressure. The thermal conductivity data is estimated to be accurate within ±4%. Thermal diffusivity measurements have a much higher uncertainty (±30%) and need further refinement.     

Photoacoustic infrared spectroscopy and thermophysical properties of syncrude cokes

This paper presents and interprets photoacoustic (PA) infrared spectra and four different thermophysical properties (thermal conductivity, thermal diffusivity, volumetric specific heat and thermal effusivity) for four sets of hydrocarbon cokes. A total of 12 samples, with varying histories, were analyzed. These cokes are a by-product of the upgrading of bitumen to Syncrude Sweet Blend (a blend of hydrotreated components), and were obtained from several locations in the thermal cokers operated by Syncrude Canada Ltd. in Fort McMurray, Alberta, Canada. PA infrared spectroscopy provides detailed information on the amount and type of residual aromatic hydrocarbons in cokes; aliphatic hydrocarbons are sometimes detected in smaller quantities. Three of the thermophysical properties (thermal conductivity, diffusivity and effusivity) display systematic differences among the cokes. On the other hand, volumetric specific heat hardly varies, a phenomenon that accounts for the observed proportionality between thermal diffusivity and conductivity. Analogous relationships exist between thermal effusivity and both thermal conductivity and thermal diffusivity for these cokes. The magnitudes of these three thermophysical properties tend to increase as aromatics contents, determined by PA spectroscopy, decrease.This revised version was published online in November 2005 with corrections to the Cover Date.