Interaction between antimony atoms and micropores in silicon

The interaction between Sb atoms and micropores of a getter layer in silicon is studied. The getter layer was obtained via implantation of Sb⁺ ions into silicon and subsequent heat treatment processes. The antimony atoms located in the vicinity of micropores are captured by micropores during gettering annealing and lose its electrical activity. The activation energy of capture process to the pores for antimony is lower than that of antimony diffusion in silicon deformation fields around microvoids on the diffusion process.     

Comparison of different gettering techniques for Cu–p+ versus polysilicon and oxygen precipitates

We performed measurements of gettering efficiencies for Cu in silicon wafers with competing gettering sites. Epitaxial wafers (p/p+) boron-doped with a polysilicon back side allowed us to compare p+ gettering with polysilicon gettering. We further measured metal distributions in p+/p- epitaxial test wafers, with the p- substrate wafers pretreated for oxygen precipitation to compare p+ gettering with oxygen precipitate gettering. Our test started with a reproducible spin-on contamination in the 10¹² atoms/cm² range, followed by thermal treatment in order to redistribute the metallic impurity. Wafers were then analyzed by a novel wet chemical layer-by-layer etching technique in combination with inductively coupled plasma mass spectrometry. This led to “stratigraphical” concentration profiles of the impurity, with typical detection limits of 5–10×10¹² atoms/cm³. Twenty-five percent of the total Cu contamination in the p/p+/poly wafer was found in the p+ layer, whilst 75% was gettered by the polysilicon. Obviously, polysilicon exhibits a stronger gettering than p+ silicon, but due to the large distance from the front surface, polysilicon was less effective in reducing impurities from the front side of a wafer compared with p+ gettering. An epitaxial layer p+ on top of p- substrates with oxygen precipitates gettered 50% of the total Cu; while the other 50% of the Cu was measured in the p- substrate wafer with oxygen precipitates. Without oxygen precipitates, 100% of the spiked Cu contamination was detected inside the p+ layer. Gettering by oxygen precipitates thus occurs in the same temperature range as that where p+ silicon begins to getter Cu. Received: 3 September 2001 / Accepted: 17 October 2001 / Published online: 27 March 2002     

Current-voltage characteristics of structures with a porous silicon layer at adsorption of carbon monoxide

The current-voltage characteristics of structures with a layer of porous silicon of 73% porosity were measured at adsorption of gas (carbon monoxide) at room temperature. Estimations are performed of the height of potential heterobarrier at the interface between porous silicon and p ⁺-type single-crystal silicon, of the perfectness factor and the resistance of a layer of porous silicon in air, in air with 0.4% CO, and in air with 2% CO. Physical causes explaining the experimental data are discussed.     

Peculiarities of the capacitance-voltage characteristic of a photoelectric solar energy convertor based on a silicon p-n junction with a porous silicon antireflection coating

Experimental results on the high-frequency capacitance-voltage characteristic of a photoelectric solar energy converter based on the n ⁺-p junction with a thin porous silicon film on the frontal surface are considered. It is shown that the capacitance-voltage characteristic is determined by the surface metal-insulator-semiconductor (MIS) structure formed as a result of growing of a porous silicon layer by electrochemical anode etching. The effective thickness of the insulator layer of the MIS structure, the impurity concentration in its semiconductor region, and the density of surface states are determined.     

n型掺杂层结构对n-i-p型微晶硅电池性能和光致衰退特性的影响

采用射频化学气相沉积法,制备了一系列具有不同晶化率n型掺杂层的n-i-p结构微晶硅薄膜太阳电池.发现本征层的结构很大程度上依赖于n型掺杂层的结构,特别是n/i界面处的孵化层厚度以及本征层的晶化率.该系列太阳电池在100 mW/cm²的白光下照射400 h,实验结果证实了本征层晶化率最大（X_c(i)=65%）的电池性能表现出最低的光致衰退率.拥有非晶/微晶过渡区n型掺杂层的电池（本征层晶化率X_c(i)=54%）分别 关键词： 微晶硅 n-i-p结构太阳电池 光致衰退 晶化率     

Structural and phase changes in single-crystalline silicon treated with compression plasma flows

The structural-phase changes in p-type single-crystalline silicon treated with compression plasma flows (CPFs) with an energy density of 5–12 J/cm² are investigated by the X-ray diffraction method depending on the crystallographic orientation of the silicon and the plasma energy density. In addition, the conductivity type on the treated silicon surface is determined by means of measuring the sign of the thermopower.; the surface morphology, by scanning electron microscopy; and the open-circuit voltage, upon illumination of the treated silicon surface (AM1.5 spectrum). It is found that treatment with CPFs results in the occurrence of the photovoltaic effect conditioned by the formation of an n-type modified surface layer. Depending on the crystallographic orientation, the modified layer either remains single crystalline (for the initial orientation (111)) or is subjected to amorphization (for the initial orientation (100)). At an energy density of ～8–9 J/cm² the action of CPFs leads to texture formation on the silicon surface.     

Efficient loading of a Rb dark magneto-optical trap by controlling current through a getter source

We report a study on the loading of a Rb dark magneto-optical trap from a current-controlled getter source. The effect of changing the temperature and number density of the background atoms on the cold atomic population in the dark state has been investigated by passing current of different magnitudes through the getter source. We observe that the dark state collection rate of the cold atoms is maximized for an optimum value of the getter current used. In our experiments, cold atoms in the dark state have been collected with the maximum collection rate 3.6 × 10⁷ atoms/s and background atom collision rate γ = 1.9 ± 0.2 s⁻¹ for the getter current ∼4 A.     

Epitaxial growth of zinc oxide by the method of atomic layer deposition on SiC/Si substrates

For the first time, zinc oxide epitaxial films on silicon were grown by the method of atomic layer deposition at a temperature T = 250°C. In order to avoid a chemical reaction between silicon and zinc oxide (at the growth temperature, the rate constant of the reaction is of the order of 10²²), a high-quality silicon carbide buffer layer with a thickness of ~50 nm was preliminarily synthesized by the chemical substitution of atoms on the silicon surface. The zinc oxide films were grown on n- and p-type Si(100) wafers. The ellipsometric, Raman, electron diffraction, and trace element analyses showed that the ZnO films are epitaxial.     

Photoluminescence and EPR of porous silicon formed on <Emphasis Type="Italic">n</Emphasis><Superscript>+</Superscript> and <Emphasis Type="Italic">p</Emphasis><Superscript>+</Superscript> single crystals implanted with boron and phosphorus ions

The effect of combined doping by shallow donor and acceptor impurities on boosting the quantum yield of porous-silicon photoluminescence (PL) in the visible and near IR range was studied using phosphorus and boron ion implantation. Nonuniform doping of samples and subsequent oxidizing annealing were performed before and after porous silicon was formed on silicon single crystals strongly doped by arsenic or boron up to ≈10¹⁹ cm^?3. The concentration of known P_b centers of nonradiative recombination was controlled by electron paramagnetic resonance. It is shown that there is an optimal joined content of shallow donors and acceptors that provides a maximum PL intensity in the vicinity of the red part of the visible spectrum. According to estimates, the PL quantum yield in the transitional n ⁺⁺-p ⁺ or p ⁺⁺-n ⁺ layer of porous silicon increases by two orders of magnitude as compared to that in porous silicon formed on silicon not subjected to ion irradiation.     

Changes in the silicon microhardness induced by a low-intensity electron beam

It is shown that nonequilibrium point defects are of primary importance in the changes in the silicon microhardness induced by a low-intensity (I ～ 10⁵ cm^?2 s^?1) electron beam. It is found that the necessary condition for softening under low-intensity electron irradiation is the presence of an oxide layer on the surface. The thickness of the surface layer in which anomalous changes in the microhardness are observed is determined by the layer-by-layer etching technique.     

Determination of the g-factor of electrons in N-type silicon surface inversion layers

The g-factor of conduction electrons in the surface inversion layer on a silicon (100) surface has been determined using the tilted magnetic field method developed by Fang and Stiles.The value of (m¹/m₀)·g at the fixed magnetic field was independent of surface carrier density n_s, whereas it had a sharp peak at about 97 koe. At strong magnetic field limit the value was constant and 0.4. If we take the effective mass of conduction electrons in the inversion layer on the (100) surface as 0.2m₀, the g-factor is about two which is the same as that for conduction electrons in bulk silicon.     

Spherical aberration corrected STEM studies of Ge nanodots grown on Si(0 0 1) surfaces with an ultrathin SiO2 coverage

Germanium (Ge) nanodots of about 7 nm size and 2 × 10¹² cm⁻² density were formed on slightly oxidized silicon surfaces. The spherical aberration corrected scanning transmission electron microscopy (Cs-corrected STEM) revealed clearly the size, aspect ratio and interface structures among the nanodots, oxide layers and silicon substrates. In particular, a Ge-rich thin layer underneath SiO₂ layers was found for the first time in these kinds of samples. The elemental distribution through the interface was analyzed by EELS and EDX in the Cs-corrected STEM. The high-resolution Cs-corrected annular dark field (ADF)-STEM image shows clearly the existence of a Ge-rich crystalline layer and its geometry against the oxide layer from the Z-contrast image. A new growth model of the Ge nanodots on slightly oxidized silicon surfaces was proposed.     

Structural and optical properties of porous silicon prepared from a p +-epitaxial layer on n-Si(111)

The structural and optical properties of porous silicon prepared by anodic etching of an n-Si(111) wafer with a p ⁺-homoepitaxial layer on one side are studied by scanning electron microscopy and multiple-crystal X-ray diffraction. A considerable difference between the microstructures on the sides of the wafer is found. Upon aging for 4.5 months, diffraction peaks of the por-Si structures shift from that of the substrate by δθ = ?42″ for the n-Si porous layer and ?450″ for the p ⁺-Si porous layer. The photoluminescence band associated with the p ⁺-layer is twice as narrow as the band associated with the n-layer and is shifted toward shorter wavelengths (higher energies) by 0.4 eV, with the intensities of the bands being the same.     

Plasmon enhancement of optical absorption in ultra-thin film solar cells by rear located aluminum nanodisk arrays

In this work, in order to enhance the light absorption in one micron thick crystalline silicon solar cells, a back reflecting and rear located plasmonic nanodisk scheme is proposed. We investigate the scattering properties of aluminum nanostructures located at the back side and optimize them for enhancing absorption in the silicon layer by using finite difference time domain simulations. The results indicate that the period and diameters of nanodisks, thickness of spacer layer have a strong impact on short circuit current enhancements. The optimized Al nanoparticle arrays embedded in rear located SiO₂ layer enhance J _sc with an increase of 47% from the non-plasmonic case of 18.9 to 27.8 mA/cm² when comparing with a typical stack with a planar aluminum back reflector and a back reflector with plasmonic nanoparticles. This finding could lead to improved light trapping within a thin silicon solar cell device.     

Kinetics of redistribution of point defects in a silicon plate with an internal getter

A study was made of the redistribution of rapidly-diffusing impurities during the cooling of silicon plates with an internal getter. It was found that a linear cooling rate is not optimal for gettering. An optimum cooling law was established. With a cooling time t > 10³ sec, this law makes it possible to reduce the concentration of rapidly-diffusing impurities in the free zone of the plate by one order of magnitude. Experimental results confirm the principles established.Translated from Izvestiya Vysshikh Uchebnykh Zavedenii, Fizika, No. 9, pp. 41–45, September, 1985.     

Photophysical processes stimulated in nanoporous silicon by high-power laser radiation

Photoprocesses initiated on the surface of porous silicon irradiated with laser radiation with wavelengths (λ = 266, 337, and 532 nm) in a wide range of intensities (up to 2 × 10⁷W/cm²) were investigated. Laser-induced luminescence and laser mass-spectrometry were used as experimental procedures. X-ray reflection was used to determine the parameters of the porous silicon films. The photoluminescence spectra obtained at different wavelengths and low intensities were analyzed. This analysis showed that for an optically thin layer of porous silicon the luminescence spectrum does not depend on the wavelength of the exciting radiation. This indicates the existence of a separate system of levels in porous silicon that are responsible for the luminescence. The behavior of the photoluminescence spectra as a function of the intensity q of the exciting radiation was investigated. It was shown that the luminescence intensity is a nonlinear function of q. At high intensities of the exciting radiation, the luminescence intensity saturates and a short-wavelength shift of the spectra is observed; this is due to the high concentrations of photoexcited carriers. This increases the probability of the experimentally observed nonequilibrium photodesorption of H₂ and Si from the surface of porous silicon.     

离子注入形成SOI结构的界面及埋层的俄歇能谱研究

本文中研究了O⁺(200keV,1.8×10¹⁸/cm²)和N⁺(190keV,1.8×10¹⁸/cm²)注入Si形成SOI(Silicon on Insulator)结构的界面及埋层的化学组成。俄歇能谱的测量和研究结果表明:注O⁺的SOI结构在经1300℃,5h退火后,其表层Si和氧化硅埋层的界面存在一个不饱和氧化硅状态,氧化硅埋层是由SiO₂相和这不饱和氧化硅态组成,而且氧化硅埋层和体硅界面不同于表层Si和氧化硅埋层界面;注N⁺的SOI结构在经1200℃,2h退火后,其氮化硅埋层中存在一个富N的疏松夹层,表层Si和氮化硅埋层界面与氮化硅埋层和体硅界面性质亦不同。这些结果与红外吸收和透射电子显微镜及离子背散射谱的分析结果相一致。还对两种SOI结构界面与埋层的不同特征的原因进行了分析讨论。 关键词：     

Silicon nitride/silicon oxide interlayers for solar cell passivating contacts based on PECVD amorphous silicon

This Letter demonstrates improved passivating contacts for silicon solar cells consisting of doped silicon films together with tunnelling dielectric layers. An improvement is demonstrated by replacing the commonly used silicon oxide interfacial layer with a silicon nitride/silicon oxide double interfacial layer. The paper describes the optimization of such contacts, including doping of a PECVD intrinsic a‐Si:H film by means of a thermal POCl₃ diffusion process and an exploration of the effect of the refractive index of the SiN_x. The n⁺ silicon passivating contact with SiN_x /SiO_x double layer achieves a better result than a single SiN_x or SiO_x layer, giving a recombination current parameter of ～7 fA/cm² and a contact resistivity of ～0.005 Ω cm², respectively. These self‐passivating electron‐selective contacts open the way to high efficiency silicon solar cells. (© 2015 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

Substrate effects on the microstructure of hydrogenated amorphous carbon films

In this work, plasma enhanced chemical vapour deposition was used to prepare hydrogenated amorphous carbon films (a-C:H) on different substrates over a wide range of thickness. In order to observe clear substrate effect the films were produced under identical growth conditions. Raman and near edge X-ray absorption fine structure (NEXAFS) spectroscopies were employed to probe the chemical bonding of the films. For the films deposited on silicon substrates, the Raman I_D/I_G ratio and G-peak positions were constant for most thickness. For metallic and polymeric substrates, these parameters increased with film thickness, suggesting a change from a sp³-bonded hydrogenated structure to a more sp² network, NEXAFS results also indicate a higher sp² content of a-C:H films grown on metals than silicon. The metals, which are poor carbide precursors, gave carbon films with low adhesion, easily delaminated from the substrate. The delamination can be decreased/eliminated by deposition of a thin (∼10 nm) silicon layer on stainless steel substrates prior to a-C:H coatings. Additionally we noted the electrical resistivity decreased with thickness and higher dielectric breakdown strength for a-C:H on silicon substrate.     

Superconducting thin films of MxMo6S8 type

Thin films of M_xMo₆S₈, where M=Pb, Sn, Sn-Al and Cu, known as the Chevrel phases have been prepared by d.c. getter sputtering method and the optimal conditions of their preparation have been determined. The transition temperatures reached: 10.16, 13.66, 11.74 and 12.86 K for thin films with M=Cu, Sn, Sn-Al and Pb respectively. The highest critical fields H_c²(0) of 428 kG were obtained for Pb compounds.