Dry etching of zinc-oxide and indium-zinc-oxide in IBr and BI3 plasma chemistries

The dry etching characteristics of bulk single-crystal zinc-oxide (ZnO) and RF-sputtered indium-zinc-oxide (IZO) films have been investigated using an inductively coupled high-density plasma in Ar/IBr and Ar/BI₃. In both plasma chemistries, the etch rate of ZnO is very similar to that of IZO, which indicates that zinc and indium atoms are driven by a similar plasma etching dynamics. IBr and BI₃-based plasmas show no enhancement of the etch rate over pure physical sputtering under the same experimental conditions. The etched surface morphologies are smooth, independent of the discharge chemistry. From Auger electron spectroscopy, it is found that the near-surface stoichiometry is unchanged within experimental error, indicating a low degree of plasma-induced damage.     

Dry etching of bulk single-crystal ZnO in CH4/H2-based plasma chemistries

The effect of inert gas additive (He, Ar, Xe) to CH₄/H₂ discharges for dry etching of single crystal ZnO was examined. The etch rates were higher with Ar or Xe addition, compared to He but in all cases the CH₄/H₂-based mixtures showed little or no enhancement over pure physical sputtering under the same conditions. The etched surface morphologies were smooth, independent of the inert gas additive species and the Zn/O ratio in the near-surface region decreases as the mass number of the additive species increases, suggesting preferential sputtering of O. The plasma etching improved the band-edge photoluminescence intensity from the ZnO for the range of ion energies used here (290-355 eV), due possibly to removal of surface contamination layer.     

Comparison of CH4/H2 and C2H6/H2 inductively coupled plasma etching of ZnO

CH₄/H₂-based discharges are attractive for dry etching of single crystal ZnO because of their non-corrosive nature. We show that substitution of C₂H₆ for CH₄ increases the ZnO etch rate by approximately a factor of 2 both with and without any inert gas additive. The C₂H₆/H₂/Ar mixture provides a strong enhancement over pure Ar sputtering, in sharp contrast to the case of CH₄/H₂/Ar. The threshold ion energy for initiating etching is 42.4 eV for C₂H₆/H₂/Ar and 59.8 eV for CH₄/H₂/Ar. The etched surface morphologies were smooth, independent of the chemistry and the Zn/O ratio in the near-surface region was unchanged within experimental error after etching with both chemistries. The plasma etching improved the band-edge photoluminescence intensity and suppressed the deep level emission from the bulk ZnO under our conditions, due possibly to removal of surface contamination layer.     

Formation model of bulk etching rate for polymer detectors

Any detector is composed of an enormous number of sensitive microscopic volumes (SMV) mainly in the state “NO” (Katz 1970. Unified Track Theory. In: Seventh International Colloquium on Corpuscular Photography and Visual Solid Detectors. Barcelona, pp. 1–29.). Irradiation evokes some spatial distribution of SMV in the state “Yes”. It can be described by the many-hit model of the SMV response (Ditlov, 1980. Theory of spatial calculation of primary action of d-electrons in track detectors with account of multiple scattering. In: Francois, H., et al. (Eds.), Solid State Nuclear Track Detectors. Pergamon Press, Oxford, pp. 131–141.). It appears that the process of etching can be described by its own many-hit model too, when the etching molecule attacks SMV in the state “Yes”. As a first our step of research, only the bulk rate V_b was considered.     

Effect of cryogenic temperature deposition on Au contacts to bulk, single-crystal n-type ZnO

Au contacts were deposited on bulk, n-type single-crystal ZnO at either 77 K or 300 K.The room temperature deposition produced contacts with ohmic characteristics. By sharp contrast, the cryogenic deposition produced rectifying characteristics with barrier heights around 0.4 eV. The differences in contact behavior were stable to anneal temperatures of ∼300 °C. There were no differences in near-surface stoichiometry for the different deposition temperatures, while the low temperature contacts showed a more uniform appearance. With further optimization of the pre-deposition cleaning process, this may be a useful method for engineering barrier heights on ZnO.     

Dry etching of CuCrO2 thin films

Highly conducting films of p-type CuCrO₂ are attractive as hole-injectors in oxide-based light emitters. In this paper, we report on the development of dry etch patterning of CuCrO₂ thin films. The only plasma chemistry that provided some chemical enhancement was Cl₂/Ar under inductively coupled plasma conditions. Etch rates of ∼500 Å min⁻¹ were obtained at chuck voltages around −300 V and moderate source powers. In all cases, the etched surface morphologies were improved relative to un-etched control samples due to the smoothing effect of the physical component of the etching. The threshold ion energy for the onset of etching was determined to be 34 eV. Very low concentrations (≤1 at.%) of residual chlorine were detected on the etched surfaces but could be removed by simple water rinsing.     

The relationship of etching behavior and crystal orientation of aluminum doped zinc oxide films

Aluminum doped zinc oxide (AZO) transparent conducting films were dynamically deposited on corning glass substrates in an in-line sputtering system operated at mid-frequency sputtering mode with excitation frequency of 40 kHz. This study addressed the surface structure as well as the electrical and optical properties after wet-chemical etching. With the increase of substrate temperature, the dominant orientation of the as-deposited films changes from (0 0 2) to (1 0 3). After wet-chemical etching, due to the quick etching rate of the (0 0 2) plane relative to the (1 0 3) plane, the surface morphology of the films deposited at different temperatures show a transition from craterlike to granular surface morphology. The experimental results demonstrate that the crystal orientation of the as-deposited films plays an important role for the etching behavior of the films.     

ZrB2/Pt/Au Ohmic contacts on bulk, single-crystal ZnO

There is a strong interest in developing thermally stable metallization schemes for ZnO and boride-based contact stacks are expected to have potential because of their thermodynamic stability. The contact characteristics on bulk single-crystal n-ZnO of a ZrB₂/Pt/Au metallization scheme deposited by sputtering are reported as a function of annealing temperature in the range 300-800°C. The contacts were rectifying for anneal temperatures <500 °C but exhibited Ohmic behavior at higher temperatures and exhibit a minimum specific contact resistivity of 9 × 10⁻³ Ω cm after 700 °C anneals. The contact stack reverts to rectifying behavior after annealing above 800 °C, coincident with a degraded surface morphology and intermixing of the Au, Pt and ZrB₂. The boride-based contacts exhibit higher thermal stability but poorer specific contact resistivity than conventional Ti/Au metal stacks on ZnO.     

大高宽比纳米硅立柱的感应耦合等离子体刻蚀工艺优化

针对氢基硅倍半氧烷(hydrogen silsesquioxane,HSQ)作为深反应离子刻蚀(DRIE)掩膜形成大高宽比纳米硅立柱的工艺进行了系统研究。优化了刻蚀工艺中线圈功率、极板功率和气体流量参数,减小了横向刻蚀,使形貌垂直性得到了更好的控制,并实现了13.3 m高度和低侧壁粗糙度的垂直硅纳米柱阵列,其高宽比（高度/半高宽）达到了36。利用不同的刻蚀工艺条件得到了不同侧壁形貌以及不同尺寸、高度的硅纳米柱结构。     

Laser etching of Thoria pellets for microstructural investigations

Metallographic investigation of the microstructure of sintered Thoria pellets necessitates appropriate surface preparation of these pellets. Conventional etching methods involving either chemical or thermal etching techniques being unsuitable for surface etching of irradiated Thoria fuel, laser-based surface treatment was envisaged as a potential alternative technique. Thoria pellets were subjected to laser surface treatment using a pulsed Nd:YAG laser.Our preliminary studies have successfully demonstrated laser etching of sintered Thoria pellets with good reproducibility, clearly revealing grain structures and well-defined grain boundaries. Detailed parametric investigations determining optimum laser parameters for the process, are presented. Our results on ultra-short laser-based etching of sintered Thoria pellets are also discussed.     

CVD金刚石中的氮对等离子体刻蚀的影响

采用非对称磁镜场电子回旋共振等离子体分别对沉积过程中掺氮和未掺氮的化学气相沉积金刚石膜进行了刻蚀研究, 结果表明: 掺氮制备的金刚石膜的刻蚀主要集中在晶棱处, 经过4h刻蚀后其表面粗糙度由刻蚀前的4.761 μm下降至3.701 μm, 刻蚀对金刚石膜的表面粗糙度的影响较小; 而未掺氮制备的金刚石膜的刻蚀表现为晶面的均匀刻蚀, 晶粒坍塌,刻蚀4h后其表面粗糙度由刻蚀前的3.061 μm下降至1.083 μm. 刻蚀导致表面粗糙度显著降低. 上述差别的主要原因在于金刚石膜沉积过程中掺氮导致氮缺陷在金刚石晶棱处富集, 晶棱处电子发射加强, 引导离子向晶棱运动并产生刻蚀, 从而加剧晶棱的刻蚀. 而未掺氮金刚石膜,其缺陷相对较少且分布较均匀 ,刻蚀时整体呈现为 (111) 晶面被均匀刻蚀继而晶粒坍塌的现象. 关键词： 掺氮 金刚石膜 刻蚀 非对称磁镜场     

Comparison between rf-sputtered and electron beam evaporated thin electrode and electrolyte films for application in rechargeable lithium microbateries

The electrochemical performance of ion conducting thin films depends strongly on the deposition method. This provides a possibility of tailoring thin films with new functional properties. A comparative study was made between rf-sputtering and electron beam evaporation which are the two most commonly employed methods for the preparation of thin films. For this purpose, thin films of Li_3±xPO_4±yN_z were rf-sputtered and electron beam evaporated and investigated with regard to the electrochemical properties. It was found that solid thin films of the electrolyte Li_3±xPO_4±yN_z may be sputtered, but not electron beam evaporated. Compared to rf-sputtered Li_1±xCoO_2±y and C thin films, electron beam evaporated Li_1±xCoO_2±y and C thin films show chemical diffusion coefficients which are at least one order of magnitude higher. Paper presented at the 4^th Euroconference on Solid State Ionics, Renvyle, Galway, Ireland, Sept. 13–19, 1997     

First principles study of Si etching by CHF3 plasma source

A model of CF₃ etching Si (2 × 4) surface has been developed based on density functional theory. We find that the reconstruction Si surface tends to be fully F-terminated. Meanwhile, C-C chain forms spontaneously on the top of the surface to resist further F-Si interacting. Over-saturated Si bonds could still be stable as well due to the strong F-Si bonding, however, it needs to overcome an energy barrier of 1.85 eV to achieve this doubly saturated bonding. Two reaction paths are found to investigate chemical reaction of CF₃ with the full F-terminated Si surface. The first path displays that all fully saturated F-Si bonds could be over-saturated and thus produce F-Si-F bonds with an energy barrier of ∼1.85 eV. For this path, there is no product of SiF₄; the second path indicates a formation of SiF₄ with a much lower surface energy than the first path. The formation of SiF₄ shows the possible etching mechanism.     

Spectral investigation of the process of plasma etching of aluminum films

Translated from Zhurnal Prikladnoi Spektroskopii, Vol. 50, No. 3, pp. 374–380, March, 1989.     

Diamond surface modification following thermal etching of Si supported hydrogenated diamond films by DBr

In this work, we study the modification of hydrogenated diamond films deposited on silicon resulting from its exposure to DBr followed by an annealing above 600 K, using high resolution electron energy loss spectroscopy (HREELS). This procedure results in silicon carbide SiC formation within the diamond film, as evidenced by the observation of a loss peak at 117 meV and its first harmonic at 233 meV in HREEL spectra. This diamond surface modification is interpreted as resulting from the reaction of products of the silicon support thermally activated etching with hydrogenated diamond.     

A surface sensitive optical method for the evaluation of processed ZnO: exploitation of LO phonon interaction

We report on a surface property of bulk ZnO crystals and an optical method to evaluate it. Bulk ZnO crystals have a damaged surface layer due to chemomechanical polishing. We prepared the ZnO crystals by etching, and evaluated the improvement of the surface by high-resolution X-ray diffraction (XRD) and photoluminescence (PL). In PL measurements, the relative intensity of the first order longitudinal optical phonon replica of free exciton (FX-1LO) to second order process (FX-2LO) was compared. The relative intensity becomes weak with increasing etched depth and finally saturates at the etched depth of 5 μm. This result agrees well with XRD results.     

The study of the solution concentration influencing on laser-induced electrochemical etching silicon

The laser electrochemical etching process, which combines the laser direct etching process and the electrochemical etching process, is a compound etching technique. In order to further understand the solution concentration influencing on the laser-induced electrochemical etching of silicon; a 248 nm excimer laser as a light source and KOH solution as an electrolyte were adopted in this study. The experiments of micromachining silicon by laser-induced electrochemical etching were carried out. On the basis of the experiments results, the solution concentration influencing on the etching rates in the process of laser electrochemical etching of silicon was researched. The reasons of the etching phenomena were analyzed in detail. The experimental results indicate that the solution concentration influencing on the etching process is mainly rooted in the absorption of different concentration solutions to laser. In general, less absorption and low solution concentration are good for the etching role in the process of laser electrochemical etching.     

Controlling the infrared optical properties of rf-sputtered NiO films for applications of infrared window

In this paper, we will focus on an IR transmittance enhancement technique from the window material point of view by using metal oxides, especially nickel oxide (NiO). At first, anti-reflection (AR) coatings were modeled by using the optical properties of NiO films. The transmittance of the model was predicted using Swanepoel’s model and verified with NiO film prepared by rf magnetron sputtering. Also, post-deposition annealing was performed and was found to change the optical properties of the NiO film. Therefore, we analyzed the annealing effect on the IR optical properties of the NiO film. Furthermore, we confirmed the durability of the NiO film and verified the possibility of this material being used in infrared optics.     

Deposition and fabrication of alkanethiolate gold nanocluster films on TiO2(1 1 0) and the effects of plasma etching

Deposition and fabrication of films of Au nanoclusters protected by alkanethiolate ligands are attempted on a TiO₂(1 1 0) surface and the structures of films are observed by a scanning tunneling microscope (STM). Effects of oxygen and hydrogen-plasma etching in addition to UV irradiation on the structure and chemical composition of the films are also investigated by using STM and X-ray photoelectron spectroscopy. Alkanethiolate Au nanoclusters are produced using a modified Brust synthesis method and their LB films are dip-coated on TiO₂(1 1 0). Alkanethiolate Au nanoclusters are weakly bound to the substrate and can be manipulated with an STM tip. Net-like structures of alkanethiolate Au nanoclusters are formed by a strong blast of air. Oxygen-plasma etching removes alkanethiolate ligands and simultaneously oxidizes Au clusters. At room temperature, prolonged oxygen-plasma etching causes agglomeration of Au nanoclusters. UV irradiation removes ligands partly, which makes Au nanoclusters less mobile. The net-like structure of alkanethiolate Au clusters produced by a blast of air is retained after oxygen and hydrogen-plasma etching.