静态受载裂纹尖端附近的温度场

利用理想弹塑性介质中在小范围屈服的条件下静态Ⅲ型裂纹塑性变形的解析解建立了一个热源模型.由这个热源模型得到了裂纹尖端附近温度场的积分表达式.详细研究了温度场和加载速率之间的关系.证明了在快速加载的条件下,裂纹尖端附近的温升有r~(-1)阶的奇异性.当加载速率一定时,求出了裂纹尖端温升的上限的一个简单表达式.给出了温度场的数值计算结果及实际测量结果,其符合程度是令人满意的.     

电流通入瞬间导电板内裂尖附近的热电磁效应

研究了在向含裂纹的无限大导电薄板中通入电流的瞬时 ,裂纹尖端附近的电磁场和温度场。给出了导电薄板中裂纹尖端区域附近的电流密度以及由于集中效应而产生的焦耳热源功率的表达式。在此基础上 ,通过对热传导方程的求解 ,推得了裂纹尖端区域处温度的具体表达式。数值算例证实了 ,在给定参数的情况下 ,适当强度电流的通入 ,可使裂纹尖端处温度升高以至熔化 ,形成焊口 ,从而达到裂纹止裂的目的     

平面幂律塑性Ⅰ型裂纹尖端应力场全解

在航空航天、船舶、石油管道和核电等领域,服役结构或部件在长期极端条件下运行,不可避免地会产生裂纹,因此,为研究含裂纹结构的准静态断裂行为,必须了解裂纹尖端附近区域的应力应变场特点.对于幂律材料裂纹构元,研究平面应变和平面应力条件下Ⅰ型裂纹尖端应力场的解析分布.基于能量密度等效和量纲分析,推导了能量密度中值点代表性体积单元(representative volume element, RVE)的等效应力解析方程,并定义其为应力因子,进而针对有限平面应变和平面应力紧凑拉伸(compact tension, CT)试样和单边裂纹弯曲(single edge bend, SEB)试样,以应力因子作为应力特征量,并构造用于表征裂尖等效应力等值线的蝶翅轮廓式和扇贝轮廓式三角特殊函数,提出描述幂律塑性条件下平面I型裂纹尖端应力场的半解析模型.该半解析模型形式简单,对CT和SEB试样的裂尖应力场的预测结果与有限元分析的结果比较表明,两者之间均密切吻合,模型公式可直接用于预测Ⅰ型裂纹尖端应力分布,方便于断裂安全评价和理论发展.     

基于近场动力学微分算子的含裂纹正交各向异性板热传导分析方法

采用近场动力学微分算子(Peridynamic Differential Operator, PDDO)理论建立正交各向异性板热传导的非局部模型。通过构造近场动力学函数,将边界条件和热传导方程由局部微分形式转化为非局部积分形式,引入Lagrange乘子,采用变分分析对含裂纹正交各向异性板温度及裂纹尖端的热通量分布进行求解。通过对比算例,验证了该模型具有较好的收敛性和有效性。分析了正交各向因子、材料铺设角、裂纹倾角及间距对裂纹尖端热通量的影响。结果表明,基于PDDO建立的含裂纹正交各向异性板热传导模型,考虑了热传导问题中的非局部性,能有效提高计算精度,预测含裂纹板中裂纹尖端出现的奇异性。     

双材料界面Ⅰ型扩展裂纹尖端的弹黏塑性场

双材料界面中存在材料黏性效应, 对界面裂纹尖端场的分布和界面本身性能 的变化起着重要的影响. 考虑裂纹尖端的奇异性, 建立了双材料界面扩展裂纹尖端的弹黏塑 性控制方程. 引入界面裂纹尖端的位移势函数和边界条件, 对刚性-弹黏塑性界面I型界面 裂纹进行了数值分析, 求得了界面裂纹尖端应力应变场, 并讨论了界面裂纹尖端场随各影响 参数的变化规律. 计算结果表明, 黏性效应是研究界面扩展裂纹尖端场时的一个主要因素, 界面裂纹尖端为弹黏塑性场, 其场受材料的黏性系数、马赫数和奇异性指数控制.     

含埋藏椭圆形裂纹金属构件电磁热止裂时热应力场分析

对带有椭圆埋藏裂纹金属构件在脉冲放电瞬间的热应力场进行了理论分析。在热应力场的求解中,利用了热传导和非定常热应力理论,由求解的热应力场公式发现：在脉冲放电瞬间,电磁热在裂纹尖端形成热压应力场,热压力场可有效地抑制裂纹的扩展。以Cr12MoV模具钢中埋藏椭圆裂纹止裂为例,具体计算了脉冲放电瞬间的热应力场分布情况,为空间裂纹电磁热止裂技术的实际应用提供了理论基础。     

Ⅱ型动态扩展裂纹尖端场的仿真分析

采用弹粘塑性力学模型,对Ⅱ型动态扩展裂纹尖端的对数奇异性,进行了数值仿真计算。详细地分析了粘性系数α、马赫数M^2对裂纹尖端的应力场影响。指出了文献[1]中对数奇异性区域存在的问题,解释了文献[1]中过度区的成因,对过度区尖端场解的形式和求解方法做了合理的推测。     

II型动态扩展裂纹尖端场的仿真分析

采用弹粘塑性力学模型,对II型动态扩展裂纹尖端的对数奇异性,进行了数值仿真计算。详细地分析了粘性系数α、马赫数M2对裂纹尖端的应力场影响。指出了文献[1]中对数奇异性区域存在的问题,解释了文献[1]中过度区的成因,对过度区尖端场解的形式和求解方法做了合理的推测。     

动态裂纹尖端弹粘塑性场的研究

本文利用弹一粘一塑性材料力学模型,对动态扩展裂纹尖端的指数奇异性和对数奇异性进行了渐近分析。文中假定,弹性阶段的粘性效应可以略去,仅在塑性应变中粘性才起作用,对于这种模型,推导出了其率敏感型的本构关系。以Ⅱ型裂纹为例,进一步推导了两种奇异性下裂纹尖端场的渐近微分控制方程,并进行了数值仿真分析。同时讨论了粘性系数α、马赫数M^2对裂纹尖端应力应变场的影响,即,弹粘塑性材料扩展裂纹的奇异性取决于其粘性系数和马赫数,粘性系数较大时,裂纹尖端场具有对数奇异性;粘性系数较小时,裂纹尖端场具有指数奇异性。修正了文献中对数奇异性区域的大小;解释了文献中过渡区的成因;给出了过渡区尖端应力场解的形式,从而建立了裂纹尖端场的统一解。     

用全息和散斑干涉法对含穿透裂纹的有限宽薄板进行弹塑性分析

本文用激光全息和散斑干涉法,测量了含中心疲劳裂纹、双边切缝、45°斜切缝的有限宽铝合金板试件(LY12—CZ),在均匀单向拉伸载荷作用下,直至大范围屈服时,裂纹尖端附近区域的三维位移场.给出了下列结果:①裂纹尖端塑性区的尺寸、形状随载荷增加的变化情况.中心疲劳裂纹与双边切缝试件的裂纹尖端塑性区形状的比较;②裂纹尖端特征点的COD—σ/σ_s 曲线,裂纹起裂点的张开位移δ_(?)(即COD);③试件对称轴上一定标距内△—σ/σ_s 曲线,标称应变ε_0与载荷比σ/σ_s 关系,即ε_0—σ/σ_s 曲线,实验表明标称应变ε_0是衡量试件屈服情况的参数;④定量地测定了裂纹尖端附近的位移场;⑤裂纹尖端附近的应变场;⑥对失稳断裂载荷进行了塑性极限分析.并将上述结果与有关理论,实验及数值计算结果进行了比较.     

阴极充氢对结构钢裂尖形变行为的影响

采用微机控制激光散斑干涉技术，原位研究了结构钢单边缺口预裂纹试样在３．５％Ｎａｄ水溶液中，－１４００ｍＶ（ＳＣＥ）电位下阴极完氢６小时前后，裂尖材料形变行为的变化。同时，还对充氢与未充氢条件下光滑圆柱试样的应力－应变行为进行了对比研究，用扫描电镜观察了断口形貌。结果表明：由于氢的进入，使材料的加工硬化程度加剧，从而导致了变形困难。     

Heat generation and fracture initiation in a stretched steel plate with a process-induced structural defect

The localization of heat release during deformation of a notched steel plate is studied. It is shown that the source of heat generation in the metal specimen is not the whole region of plastic deformation near the tip of the defect (crack), but only the slip bands occupying the relatively small part of the zone (Chernov-Luders bands), in which the deformation initiates physical and chemical processes. It was found that in the slip bands, the metal temperature increases by several tens of degrees (or more). The deformation of notched specimens is characterized by uneven development of plastic deformation in the volume of the material and a high velocity of heat-wave propagation in the direction of the maximum slip stresses.     

Rayleigh waves emitted by a propagating crack in a strain-rate dependent elastic medium

A simple model was proposed for the interpretation of the non-circular form of the Rayleigh wavefronts emitted by a fast running crack in a plate. The surface deformation around the crack tip, due to the high stress concentration there, propagated as a surface wave after fracture of this zone. On the other hand, the moving singularity of the crack tip created a dynamic stress field of varying intensity with time all over the specimen. This dynamic stress field resulted in a significant change of the mechanical properties of a strain-rate dependent material and therefore it influenced the velocity of propagation of fracture-Rayleigh wavefronts. An analysis of this varying dynamic strain field explained the non-circular form of Rayleigh waves, accompanying the propagating crack. For the experimental evaluation of the K₁-factor the method of dynamic caustics was used in conjunction with the high-speed photography technique.     

氢对体心立方金属裂纹尖端变形过程的影响

利用扫描电镜(SEM)原位拉伸,观察了 Fe-3％Si 单晶体裂尖的变形和断裂过程。用网格法加计算机处理系统测出了裂纹尖端的应变场及氢对应变分布的影响。发现在Ⅰ型载荷下,主裂纹尖端应变呈不对称分布,形变带内应变梯度很大。形变带内应变分布为: ε_(yy)=f(x)exp(-Ar).氢不改变裂纹尖端塑性变形特征,但能明显促进裂纹尖端局部塑性变形的非均匀增加。     

A multiscale model for the ductile fracture of crystalline materials

In this paper, a multiscale model that combines both macroscopic and microscopic analyses is presented for describing the ductile fracture process of crystalline materials. In the macroscopic fracture analysis, the recently developed strain gradient plasticity theory is used to describe the fracture toughness, the shielding effects of plastic deformation on the crack growth, and the crack tip field through the use of an elastic core model. The crack tip field resulting from the macroscopic analysis using the strain gradient plasticity theory displayes the 1/2 singularity of stress within the strain gradient dominated region. In the microscopic fracture analysis, the discrete dislocation theory is used to describe the shielding effects of discrete dislocations on the crack growth. The result of the macroscopic analysis near the crack tip, i.e. a new K-field, is taken as the boundary condition for the microscopic fracture analysis. The equilibrium locations of the discrete dislocations around the crack and the shielding effects of the discrete dislocations on the crack growth at the microscale are calculated. The macroscopic fracture analysis and the microscopic fracture analysis are connected based on the elastic core model. Through a comparison of the shielding effects from plastic deformation and the discrete dislocations, the elastic core size is determined.     

An experimental study of the deformation fields around a propagating crack tip

Digital image processing was used to obtain the deformation fields around a propagating crack tip from photographic films recorded by a high-speed Cranz-Schardin camera. The in-plane displacements and strains determined from the process were then used to compute the dynamic stress intensity factor and the remote stress component parallel to the crack face.K dominance is discussed using the experimental data. Surface roughness of the fractured surface is also examined.     

Role of elasticity in elastic–plastic fracture: Analytical bi-linear crack-tip fields and finite element analysis

A solution for Model-I plane strain crack tip fields in a bi-linear elastic–plastic material is presented. The elastic–plastic Poisson's ratio is introduced to characterize the influence of elastic deformation on the near tip constraint. Attention is focused on the distribution of elastic/plastic strain energy in the sensitive region of the forward sector ahead of a crack tip. The present study shows that the elastic strain energy can be higher than the plastic strain energy in this sensitive sector while large amount of the plastic strain energy develops outside this sector around the crack tip. The effect of elastic deformation in this sensitive region on the structure of crack-tip fields is considerable and the assumption in some important solutions for crack-tip fields reported in literature that the elastic deformation is small and can be ignored is therefore not physically reasonable. Besides, finite element analysis is carried out to validate the analytical solution and good agreement between them is found. It is seen that the present solution with T-stress can properly describe the crack-tip fields under various constraints for different specimens and an analytical relation is established between the critical value of J-integral, J_c, and T-stress for elastic–plastic fracture.     

Effect of rising elastic modulus in surface layer on stress intensity and gradient

The relaxation element method is applied to obtain the stress field around a crack under normal tension. A surface layer is assumed to surround the crack periphery taken to be in the shape of a narrow ellipse. The elastic modulus within this layer increases from zero to the bulk value of the medium outside. Calculations show that the stresses are finite at the crack tip; they reach a maximum in the layer and then decay to the well known solution of Griffith outside the layer. The influence of plastic deformation on the crack front stresses can also be simulated by the surface layer model. Stress concentration at the crack front is found to be lower when plastic deformation takes place. Sharp decay of stress next to the crack is accompanied by increase of local stress gradients. Severity of the local stress fluctuation depends on the width of the crack surface layer.     

Thermo-electro-structural coupled analyses of crack arrest by Joule heating

Using the finite element method, thermo-electro-structural coupled analyses of the cracked conducting plate under high electric current have been solved. The crack contact condition and temperature-dependent material properties are considered in this analysis. The crack tip temperature, electric current density factor, stress intensity factor and strain energy density factor are obtained for discussions. Due to high electric current density and Joule heating at the crack tip, a circular melting area may exist around the tip. After cooling, a circular void or hole may occur at the crack tip and the crack arrest is achieved. The crack tip temperature decreases when the crack contact area increases. The proper tensile load is necessary for making the crack open enough and causing high current density at the crack tip and associated crack arrest. On the other hand, the crack tip temperature increases with time by the increasing external current and Joule heating. The values of mode-I stress intensity factor and strain energy density factor decrease with time due to the thermal deformation around the crack tip. Because of the temperature-dependent resistivity, the variation of the electric current density factor is complicated. In addition, it is not easy to create a crack-arrest condition when the crack length relative to the plate width is too small.     

Observation of Stress Field Around an Oscillating Crack Tip in a Quenched Thin Glass Plate

The variation of stress field around an oscillating crack tip in a quenched thin glass plate is observed using instantaneous phase-stepping photoelasticity. The successive images around the propagating crack are recorded by a CCD camera that is equipped with a pixelated micro-retarder array. Then, the phase maps of the principal stress difference and the principal direction are easily obtained even though the photoelastic fringes cannot be visualized. The path of the crack growth as well as the stress intensity factors and the crack tip constraint are obtained from these phase distributions. Results show that the mode I stress intensity factor and the crack tip constraint vary remarkably with the crack growth. In addition, the results show that the mode-II stress intensity factor exists even though the crack propagates smoothly.