Kinetics of curing of diane and aliphatic epoxy oligomer blends: IR-spectroscopy study

The curing of diane and aliphatic epoxy oligomers and their blends is studied by IR spectroscopy. Methods for the quantitative determination of epoxy groups in diane and aliphatic oligomers and their blends during curing are developed. It is shown that, during the joint curing of epoxy oligomers, the reactivity of a more active (diane) oligomer remains practically the same, whereas the reactivity of a less active (aliphatic) epoxy oligomer increases. The rate constants for the consumption of epoxy groups of oligomers and primary amine groups of the curing agent are determined.     

The epoxy–polycarbonate blends cured with aliphatic amine—I. Mechanism and kinetics

Reaction mechanism of the PC–epoxy blends cured by aliphatic amine has been investigated by varying PC contents in the blends. The transamidation reaction tends to convert nearly all the carbonates into N-aliphatic aromatic carbamates even at ambient temperature before normal curing. The remaining amine proceeds the normal curing with epoxy at a higher temperature (80°C). For the PC–epoxy/aliphatic amine blend containing 6 wt % PC, the yielded N-aliphatic aromatic carbamate further reacts with amine to produce the urea structure. The urea undergoes substitution reaction with the hydroxyl formed from the normal curing to give the N-aliphatic aliphatic carbamate. For the blend containing 12 wt % PC, the N-aliphatic aromatic carbamate converts into the N-aliphatic aliphatic carbamate via two different routes. For the blend containing lower molecular weight of the aliphatic amine, the N-aliphatic aromatic carbamate reacts with hydroxyl to form the N-aliphatic aliphatic carbamate directly. For the blend containing higher molecular weight of aliphatic amine, the N-aliphatic aromatic carbamate decomposes into the aliphatic isocyanate accelerated by the presence of the residual oxirane. The isocyanate formed then reacts with hydroxyl to yield the N-aliphatic aliphatic carbamate. The activation energy (E_a) and preexponential factor (A) of the PC–epoxy/POPDA blends decrease with the increase of the PC content. Kinetic study by thermal analysis by the method of autocatalyzed model is able to correctly predict oxirane conversion vs. time relationship for the neat epoxy/aliphatic amine and the PC–epoxy/aromatic amine systems because the dominant reaction is the normal curing reaction between amine and oxirane. The model fails to predict the PC–epoxy/aliphatic amine system because the system is complicated by several other reactions besides the normal curing reaction. © 1997 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 35: 2169–2181, 1997     

Investigation of curing kinetics of various cycloaliphatic epoxy resins using dynamic thermal analysis

Curing reactions of three cycloaliphatic epoxy resins with methyltetrahydrophthalic anhydride (MTHPA) was investigated by differential scanning calorimetry at different heating rates. Activation energy was calculated based on Kissinger method and varied in the range of 67-72 kJ/mol depending on sample. The curing kinetic behavior was well described by Sestak-Berggren (SB) model and the order of the curing reaction is observed to be from 0.02 to 2.11 according to sample.     

Curing rheokinetics of epoxy diane oligomer mixtures with polyglycidyl ethers of oligooxypropylenetriol

The rheokinetics of curing of epoxy diane oligomer mixtures with the polyglycidyl ether of oligooxypropylenetriol by an oligomer aliphatic amine is investigated. The process can be generally divided into two stages with respect to the rate of the increase in viscosity. It is assumed that the adducts of the diane oligomer with the curing agent preferably form at the beginning of the process and, then, the residual epoxy oligomers react in an equivalent amount in relation to each other.     

Investigation of the curing reactions of some multifunctional epoxy resins using differential scanning calorimetry

Curing reaction of three tetrafunctional epoxy resins in the presence of tetraethylene tetramine was examined by differential scanning calorimetry at different heating rates. The kinetic parameters of the curing reaction were determined using various computational methods (Barrett, Borchardt–Daniels and Kissinger). The heating rate shows a great influence on the curing process. The activation energy varied in the range 43–80 kJ/mol, and the order of the curing reaction is observed to be ≈1.0 with slight variations.     

Density functional theory study on mechanisms of epoxy‐phenol curing reaction

A comprehensive picture on the mechanism of the epoxy‐phenol curing reactions is presented using the density functional theory B3LYP/ 6‐31G(d,p) and simplified physical molecular models to examine all possible reaction pathways. Phenol can act as its own promoter by using an addition phenol molecule to stabilize the transition states, and thus lower the rate‐limiting barriers by 27.0–48.9 kJ/mol. In the uncatalyzed reaction, an epoxy ring is opened by a phenol with an apparent barrier of about 129.6 kJ/mol. In catalyzed reaction, catalysts facilitate the epoxy ring opening prior to curing that lowers the apparent barriers by 48.9–50.6 kJ/mol. However, this can be competed in highly basic catalysts such as amine‐based catalysts, where catalysts are trapped in forms of hydrogen‐bonded complex with phenol. Our theoretical results predict the activation energy in the range of 79.0–80.7 kJ/mol in phosphine‐based catalyzed reactions, which agrees well with the reported experimental range of 54–86 kJ/mol. © 2014 Wiley Periodicals, Inc.     

聚酯型扩链脲改性环氧树脂E-51/DDS体系反应活性研究

提高二氨基二苯砜(DDS)固化环氧树脂体系的反应活性,降低反应温度、提高反应速率,具有重要的研究意义和实用价值.本研究以聚酯(PEGA1000,2000,PNGA1000,2000)、甲苯-2,4-二异氰酸酯(TDI)、二甲胺为原料合成了含有聚酯型柔性间隔基的扩链脲U-PEGA1000,2000,U-PNGA1000,2000,用其改性环氧树脂E-51/DDS体系,采用DSC系统考察了改性体系的固化反应活性.结果表明,改性体系固化反应活性明显提高,固化反应表现活化能降低,固化反应峰顶温度从230℃降至170℃,固化反应的表观活化能由67.74kJ/mol降至47.80kJ/mol.     

氮丙啶交联剂的交联性能及固化动力学研究

合成了一种氯丙啶交联剂，并以丙烯酸树脂乳液为模型化合物对交联剂的交联性能及固化动力学进行了研究。结果表明：在丙烯酸树脂乳液中加入适量的氯丙啶交联剂，可使胶膜的力学性能及耐水碱性，耐溶剂性都得到很大的提高；但交联对玻璃化转变温度的影响较小。用程序升温DSC（差示扫描量热法）方法对固化反应动力学进行了研究，计算出固化反应的活化能。     

松香改性酚醛环氧树脂的固化反应动力学研究

以自制的松香改性酚醛环氧树脂（RPAE）为对象,采用差示扫描量热法研究了其与4,4．二氨基二苯砜组成的体系（RPAE／DDS）的固化动力学,利用Kissinger方程计算得到体系的固化热约为109．29J／g,表观活化能为51．56kJ／mol,该体系反应级数为0．85,近似为1级反应,反应速率常数为2．69×10^4／s。采用Ozawa-Flynn-Wall方程分析,得到体系的表观活化能为70。1kJ／mol。     

Features of formation and viscoelastic properties of epoxyurethanes based on aliphatic cyclocarbonate oligomers

By the methods of dynamic mechanical analysis (DMA) and IR spectroscopy, the kinetics of curing and viscoelastic properties of epoxy urethanes of network structure based on epoxy diane resin and bifunctional oligocyclocarbonates (OCCs) are studied. The dependence of glass transition temperature and gel fraction of the obtained polymer on the amount of injected cyclocarbonate is established. It is shown that modification of epoxy diane oligomer by aliphatic OCCs results in an increase in its mechanical properties, particularly cohesive strength.     

Phase separation,porous structure,and cure kinetics in aliphatic epoxy resin containing hyperbranched polyester

Thermosetting blends of an aliphatic epoxy resin and a hydroxyl‐functionalized hyperbranched polymer (HBP), aliphatic hyperbranched polyester Boltorn H40, were prepared using 4,4′‐diaminodiphenylmethane (DDM) as the curing agent. The phase behavior and morphology of the DDM‐cured epoxy/HBP blends with HBP content up to 40 wt % were investigated by differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), and scanning electron microscopy (SEM). The cured epoxy/HBP blends are immiscible and exhibit two separate glass transitions, as revealed by DMA. The SEM observation showed that there exist two phases in the cured blends, which is an epoxy‐rich phase and an HBP‐rich phase, which is responsible for the two separate glass transitions. The phase morphology was observed to be dependent on the blend composition. For the blends with HBP content up to 10 wt %, discrete HBP domains are dispersed in the continuous cured epoxy matrix, whereas the cured blend with 40 wt % HBP exhibits a combined morphology of connected globules and bicontinuous phase structure. Porous epoxy thermosets with continuous open structures on the order of 100–300 nm were formed after the HBP‐rich phase was extracted with solvent from the cured blend with 40 wt % HBP. The DSC study showed that the curing rate is not obviously affected in the epoxy/HBP blends with HBP content up to 40 wt %. The activation energy values obtained are not remarkably changed in the blends; the addition of HBP to epoxy resin thus does not change the mechanism of cure reaction of epoxy resin with DDM. © 2006 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 44: 889–899, 2006     

Effect of P/Si polymeric silsesquioxane and the monomer compound on thermal properties of epoxy nanocomposite

The unique polymeric silsesquioxane/4,4′-diglycidyether bisphenol A (DGEBA) epoxy nanocomposites have been prepared by sol-gel method. The structure of nanocomposites was characterized by attenuated total reflectance (ATR) and solid state ²⁹Si NMR. The characteristic intensity of trisubstituted (T) structure was higher than that of tetrasubstituted (Q) structure from solid state ²⁹Si NMR spectra of 3-isocyanatopropyltriethoxysilane (IPTS) modified epoxy. The activation energies of curing reaction of epoxy system and IPTS modified epoxy system are 28-66 kJ/mol and 57-75 kJ/mol, respectively, by Ozawa’s and Kissinger’s methods. The triethyoxysilane side chain of IPTS modified epoxy might interfere the curing reaction of epoxy/amine and increase the activation energy of curing. The thermal degradation of nanocomposites was investigated by Thermogravimetric analysis (TGA). The char yield of nanocomposites was proportional to the 2-(diphenylphosphino)ethyltriethoxysilane (DPPETES) moiety content at high temperature. A higher char content could inhibit thermal decomposition dramatically and enhance the thermal stability. Moreover, the nanocomposites possess high optical transparency.     

不同温度下环氧树脂代木搪塑模具的固化过程

采用流变学的方法研究了环氧树脂代木搪塑模具在不同温度下的固化过程。 为了找到合适的测试条件,首先研究了应变和振荡频率对环氧树脂代木搪塑模具的测试结果的影响。 环氧树脂代木搪塑模具固化过程中,体系交联程度逐渐变大;在不同的固化阶段,固化程度的变化快慢不同,先缓慢增加,然后迅速增加,最后缓慢增加至平台值;储能模量和损耗模量的变化速度在不同阶段的变化与固化程度的变化相似,根据储能模量和损耗模量的最快增长速率与温度的关系得到体系的活化能约为27.2 kJ/mol;随着固化温度升高,环氧树脂代木搪塑模具固化完全所需的时间减少,同时环氧树脂的施工容留时间也相应地减少。     

CURING KINETICS AND PROPERTIES OF ACRYLIC RESIN CURED WITH AZIRIDINE CROSSLINKER

A kind of aziridine crosslinkers was synthesized and used to crosslink acrylate copolymers. The crosslinkingproperties and curing kinetics of the resin were studied. It was found that with the increase of the content of crosslinker in theemulsion, the mechanical properties and solvent resistance of the resin will be apparently improved, but its glass transitiontemperature (T_g) is very low. The lowest amount of crosslinker used in the acrylic resin emulsion is 0.25%. Curing kineticsstudied by DSC show that this curing reaction occurs readily because the apparent activation energy of the reaction is low(65.1 kJ/mol). These results demonstrate that the aziridine crosslinker is indeed a low temperature crosslinking agent and canbe used at room temperature.     

Density functional theory study of mechanism of epoxy‐carboxylic acid curing reaction

A comprehensive picture on the mechanism of the epoxy‐carboxylic acid curing reactions is presented using the density functional theory B3LYP/6‐31G(d,p) and simplified physical molecular models to examine all possible reaction pathways. Carboxylic acid can act as its own promoter by using the OH group of an additional acid molecule to stabilize the transition states, and thus lower the rate‐limiting barriers by 45 kJ/mol. For comparison, in the uncatalyzed reaction, an epoxy ring is opened by a phenol with an apparent barrier of about 107 kJ/mol. In catalyzed reaction, catalysts facilitate the epoxy ring opening prior to curing that lowers the apparent barriers by 35 kJ/mol. However, this can be competed in highly basic catalysts such as amine‐based catalysts, where catalysts can enhance the nucleophilicity of the acid by forming hydrogen‐bonded complex with it. Our theoretical results predict the activation energy in the range of 71 to 94 kJ/mol, which agrees well with the reported experimental range for catalyzed reactions. © 2017 Wiley Periodicals, Inc.     

Réactivité du groupement époxyde vis à vis d'une amine aromatique en fonction de l'environnement moléculaire

Analysis of the reaction (mechanistic and kinetic) between diepoxy aromatic compounds and aniline, taken as a model for the curing of epoxy resins with diamines, shows (a) the network build-up is dependent on the reactivity of functional groups and their position on the aromatic ring, (b) the curing proceeds by competitive mechanisms viz. an autocatalytic process characterized by an activation energy of ∼ 62.7 kJ/mol and a non-catalytic path characterized by a second order reaction.     

Curing of epoxy oligomers by the eutectic mixture of aromatic amines

Kinetics of curing of structurally different epoxy oligomers (ED-20 and PDI-3AK resins) in a mixture with other low-molecular-weight epoxy oligomers and plasticizers by the eutectic mixture of aromatic amines UP-0638/1 is studied by the DSC method. The activation energy and the heats of curing reactions are determined. It is established that crosslinked epoxy polymers cured at moderate temperatures (40–80°C) are strong moisture-resistant compositions with different mechanical characteristics. Plasicized elastomers based on PDI-3AK resin with glass transition temperatures of ?78 and ?95°C are freeze-and heat-resistant materials.     

Kinetics of thermoset cure and polymerization in the glass transition region

A theoretical approach to thermoset cure kinetics based on Arrhenius kinetics and mobility was developed by considering the activation of the reacting group and chain mobility as elementary steps for reaction. This extended kinetic equation was successfully applied to the curing of an epoxy by an amine, the trimerization of a cyanate, and to the polymerization of methyl methacrylate. Full agreement between theory and experimental data was obtained in all cases. The activation energies for chain mobility were exceptionally low (0.3–1 kJ/mol for bisphenol-A-based epoxy and cyanate) which indicates that the structural units must undergo only small-angle rotational oscillations to allow a reaction. A theoretical time–temperature–transformation (TTT) diagram is also presented. © 1993 John Wiley & Sons, Inc.     

含联苯结构环氧树脂体系固化反应动力学研究

用示差扫描量热仪(DSC)对含联苯结构环氧树脂(TMBP)/4,4′-二氨基二苯砜(DDS)固化体系的固化反应过程进行了分析,并用Kissinger和Ozawa方法分别求得体系固化反应的表观活化能ΔE为69.7和74.2kJ/mol,根据Crane理论计算得到该体系的固化反应级数n=0.89及在不同升温速率下的频率因子A,确定了使用DDS作为固化剂的固化反应条件.