非掺杂GaN的黄光发射模型确定

提出了一种新的光谱———吸收归一化光致发光激发谱,并用这种光谱研究了非掺杂GaN的黄光发射.实验上首次直接测量出了黄光发射的初始态的共振吸收峰位,从而解决了长期争论的有关黄光发射的发光模型问题 关键词： GaN薄膜 黄光发射 吸收归一化光致发光激发谱     

GaN薄膜的蓝光和红光发射机理研究

由于生长工艺的不完善，非掺杂GaN薄膜中通常存在未知的杂质和缺陷，产生与这些未知杂质和缺陷能级相关的发光。报道了非掺杂GaN薄膜的692nm红色发光．并研究了非掺杂GaN薄膜的蓝、红色发光的发射机理；利用作者提出的吸收归一化光致发光激发光谱，直接测量出了非掺杂GaN薄膜的蓝、红色发光的初始态能级，确定蓝色发光为施主-价带跃迁复合，而红色发光为施主-受主跃迁复合；给出了黄、蓝、红光的发射模型。所取得的结果对于确定未知杂质和缺陷的种类具有重要的参考价值。     

HVPE外延GaN膜中黄带的光致发光激发谱研究

测量了氢化物气相外延方法生长的非特意掺杂和掺碳GaN外延膜的光致发光谱，并在光致发光谱峰位2．25eV(550nm)附近分别测量了光致发光激发谱，对两者进行了比较．从光致发光谱中发现掺碳使黄带明显增强，从光致发光激发谱中看到了掺碳引起的约3．38～2．67eV(367～465nn)范围内的特征激发带．利用CC曲线模型说明了特征激发带和黄带之间的关系，分析了黄带的可能起因．     

金刚石薄膜的蓝光发射

利用氮化铝陶瓷作为衬底，在不同甲烷与氢气的配比流量下，利用热丝ＣＶＤ方法制备了一个系列的金刚石薄膜，通过测量样品在４３０ｎｍ处的光致荧光（ＰＬ）谱及其Ｒａｍａｎ光谱，给出了金刚石薄膜的结构与生长信息，薄膜ＰＬ强度随甲烷浓度增加到３％时达到最大，继续增加了甲烷浓度ＰＬ强度下降。     

量子阱生长气压对InGaN/GaN黄光LED光电性能的影响

采用MOCVD技术在图形化硅衬底上生长了InGaN/GaN多量子阱黄光LED外延材料,研究了不同的量子阱生长气压对黄光LED光电性能的影响。使用高分辨率X射线衍射仪（HRXRD）和荧光显微镜（FL）对晶体质量进行了表征,使用电致发光系统积分球测试对光电性能进行了表征。结果表明：随着气压升高,In的并入量略有降低且均匀性更好,量子阱中的点缺陷数目降低,但是阱垒间界面质量有所下降。在实验选取的4个气压4,6.65,10,13.3 kPa下,外量子效率最大值随着量子阱生长气压的上升而显著升高,分别为16.60%、23.07%、26.40%、27.66%,但是13.3 kPa下生长的样品在大电流下EQE随电流droop效应有所加剧,在20 A·cm^-2的工作电流下,样品A、B、C、D的EQE分别为16.60%、19.77%、20.03%、19.45%,10 kPa下生长的量子阱的整体光电性能最好。     

硅衬底阳极氧化铝膜的荧光发射研究

报道了用电子束蒸发技术在硅守底上沉积，并于１５ｗｔ％Ｈ２ＳＯ４，温度２５℃和４０Ｖ直流电压条件下阳极氧化铝薄的制备（膜厚约４００ｎｍ）。研究了该阳极氧化铝膜的红外吸收光谱（ＦＴＩＲ）、光致荧光光谱（ＰＬ）和荧光激发光谱（ＰＬＥ）。发现其荧光光谱在２８０￣５００ｎｍ范围内由三个主发射带组成，其峰值分别位于３１２ｎｍ，３６７ｎｍ和４４９ｎｍ。所有这三个ＰＬ带，经分析都与阳极氧化铝膜中的氧化铝膜中的氧空     

MOVPE 生长GaN薄膜的 光致黄带发光与激发光源的相关性

用四种不同光源作为激发光源,研究了蓝宝石衬底金属有机物汽相外延方法生长的氮化镓薄膜的光致发光特性。结果发现用连续光作为激发光源时,光致发光谱中除出现365 nm的带边发射峰外,同时观察到中心波长位于约550 nm 的较宽黄带发光;而用脉冲光作为激发光源时其发光光谱主要是365 nm附近的带边发光峰,未观察到黄带发光。氮化镓薄膜的光致发光特性依赖于所用的激发光源性质。     

脉冲激光沉积GaN薄膜的结构和光学特性研究

采用准分子脉冲激光,在Si(111)衬底上生长了带有AlN缓冲层的GaN薄膜, 利用X射线衍射(XRD)、原子力显微镜(AFM)和光致发光光谱(PL)等测试手段研究了不同沉积温度所生长的GaN薄膜结构特征和光学性能.研究表明:沉积温度影响GaN薄膜结构和光学性能,黄带发射峰主要与晶体缺陷有关.在400～700℃沉积范围内随着温度升高,GaN薄膜结构和光学性能提高.     

GaN基量子阱的激子跃迁和光学性质

采用光致发光谱、光致发光激发谱以及拉曼光谱对GaN基量子阱材料进行了实验观察和分析 .实验结果表明样品中量子点结构不均匀及InGaN层中In成分分布不均匀 ,且其光致发光谱的波峰是由自由激子辐射复合发光引起的 .同时由室温下InGaN/GaN量子阱的拉曼谱可得知InGaN/GaN多量子阱的结构特征     

Investigation of yellow luminescence intensity of N-polar unintentionally doped GaN

This paper reports that the yellow luminescence intensity of N-polar GaN Epi-layers is much lower than that of Ga-polar ones due to the inverse polarity,and reduces drastically in the N-polar unintentionally-doped GaN after etching in KOH solution.The ratio of yellow luminescence intensity to band-edge emission intensity decreases sharply with the etching time.The full width at half maximum of x-ray diffraction of(10-12) plane falls sharply after etching,and the surface morphology characterized by scanning electron microscope shows a rough surface that changes with the etching time.The mechanism for the generation of the yellow luminescence are explained in details.     

Carrier transport and luminescence properties of n-type GaN

The surface morphology, electrical properties and optical properties of Si doped n-type GaN were investigated. The intentional SiH₄ doped GaN films were grown by metal organic chemical vapor deposition with the electron concentration varying from 3×10¹⁶ cm⁻³ to 5.4×10¹⁸ cm⁻³. The surface morphology shows that the roughness and dislocation pits increase as the mass flow rate of SiH₄ increases, which indicates that the quality of GaN degrades gradually. The activation energy of Si in GaN with different n concentrations varies from 12 to 22 meV, which may originate from the interactions of donor wave functions. The carrier transport mechanism with increasing temperature from 100 to 420 K was concluded as the complex effect of both impurity scattering and phonon scattering. The position of the near band edge emission peak was determined by both renormalization of the band gap and B-M effect. The intensity variations of the yellow luminescence could be explained by the change of Ga vacancy concentration caused by Si doping. Supported by the National Basic Research Program of China (Grant No. 2006CB6049), the National Hi-Tech Research and Development Program of China (Grant No. 2006AA03A142), the National Natural Science Foundation of China (Grant Nos. 60721063, 60731160628 and 60676057), the Research Fund for the Doctoral Program of Higher Education of China (Grant No. 20050284004) and the Natural Science Foundation of Jiangsu Province of China (Grant No. BK2005210)     

Luminescence of a GaN grain with a nonpolar and semipolar plane in relation to microstructural characterization

We report on the growth of the high-quality GaN grain on a r-plane sapphire substrate by using a self-organized SiN interlayer as a selective growth mask.Transmission electron microscopy,scanning electron microscopy,and Raman spectroscopy are used to reveal the effect of SiN on the overgrown a-plane GaN growth.The SiN layer effectively terminates the propagation of the threading dislocation and basal plane stacking faults during a-plane GaN regrowth through the interlayer,resulting in the window region shrinking from a rectangle to a "black hole".Furthermore,strong yellow luminescence(YL) in the nonpolar plane and very weak YL in the semipolar plane on the GaN grain is revealed by cathodoluminescence,suggesting that C-involved defects are responsible for the YL.     

Effects of ion implantation on yellow luminescence in unintentional doped n-type GaN

The effects of Si, O, C and N ion implantation with different implantation doses on yellow luminescence (YL) of GaN have been investigated. The as-grown GaN samples used in the work were of unintentional doped n-type, and the photoluminescence (PL) spectra of samples had strong YL. The experimental results showed that YL of ion implanted samples exhibited marked reductions compared to samples with no implantation, while the near band edge (NBE) emissions were reduced to a lesser extent. The deep-level centers associated with YL may be produced in GaN films by O and C ion implantation, and identities of these deep-level centers were analyzed. It was also found that the dose dependence of YL was analogous with the one of the intensity ratios of YL to the near band edge (NBE) emission (I _YL /I _NBE ) for ion implanted samples. The possible reason for this comparability has been proposed.      

AlN插入层对硅衬底GaN薄膜生长的影响

利用金属有机化合物气相外延沉积技术在2inch(5.08cm)Si(111)图形衬底上生长了GaN外延薄膜,在Al组分渐变AlGaN缓冲层与GaN成核层之间引入了AlN插入层,研究了AlN插入层对GaN薄膜生长的影响。结果表明,随着AlN插入层厚度的增加,GaN外延膜(002)面与(102)面X射线衍射摇摆曲线半峰全宽明显变小,晶体质量变好,同时外延膜在放置过程中所产生的裂纹密度逐渐减小直至不产生裂纹。原因在于AlN插入层的厚度对GaN成核层的生长模式有明显影响,较厚的AlN插入层使GaN成核层倾向于岛状生长,造成后续生长的nGaN外延膜具有更多的侧向外延成分,从而降低了GaN外延膜中的位错密度,减少了GaN外延膜中的残余张应力。同时还提出了一种利用荧光显微镜观察黄带发光形貌来表征GaN成核层形貌和生长模式的新方法。     

GaN:Zn发光的显微观察

利用扫描电子显微镜(SEM)观察了气相外延GaN:Zn晶片的表面形貌、Zn浓度分布和阴极射线发光微区光谱及其MIS结构的电致发光微区光谱。研究表明,Zn杂质掺入GaN可以形成四种能量位置的发光中心;它们的形成与Zn浓度和晶体的微区结构有关;二者的不均匀决定了发光的不均匀性。     

铒铥共掺氧化锌薄膜近红外宽带发射及变温行为的研究

采用磁控共溅射技术制备了铒铥共掺杂氧化锌发光薄膜. 通过优化退火温度, 实现了薄膜的近红外 平坦宽带发射, 总带宽可达到~ 500 nm, 覆盖了光通信S+C+L+U 区波段. 此发射带由Er³⁺ 的1535 nm (⁴I_13/2 → ⁴I_15/2) 发射峰及Tm³⁺ 的1460 nm (³H₄ → ³F₄), 1640 nm (¹G₄ → ³F₂), 1740 nm (³F₄ → ³H₆) 发射峰组成. 研究表明: 退火温度低于800 ℃ 时, 没有观察到薄膜样品明显的光致发光现象; 随着退火温度 从800 ℃ 升高到1000 ℃, I₁₆₄₀/I₁₅₃₅ 发射峰强度比从0.2 升高到0.3, I₁₇₄₀/I₁₅₃₅ 发射峰强度比从0.5 降低 到0.4, 发射峰强度比均基本保持稳定; 当退火温度高于1000 ℃ 时, I₁₆₄₀/I₁₅₃₅ 发射峰强度比从0.3 升高到 0.6, I₁₇₄₀/I₁₅₃₅ 发射峰强度比从0.4 升高到0.8, 发射峰强度比均急剧增加. 变温行为表明: 随着温度从10 K 逐渐升高到300 K, 谱线的总带宽基本不变, 在340—360 nm 之间; Tm³⁺ 在1640 和1740 nm 处的发射峰强度 分别降低了2/3 和1/2, Er³⁺ 在1535 nm 的发射峰强度增大了1.2 倍. 这是因为随着温度的升高, 声子数目增 多, Er³⁺ 与Tm³⁺ 离子之间发生能量传递的概率不断变大, 并且在Tm³⁺ 离子之间没有发生交叉弛豫现象.