化学沉积Ni—Cu—P合金镀层生长过程的原子力显微镜观察

用原子力显微镜（AFM）,对化学沉积Ni-Cu-P合金薄膜的表面形貌进行了观察,对多元化学沉积的机理进行了初步的研究。     

Ni—TM—P合金的自催化沉积

综述了获得成功沉积过程的自催化(化学镀)技术,像已被使用的Ni和Ni-P合金,以模具作为预备试样获得了优先的沉积,讨论了一系列Ni-P和Ni-TM-P自催化合金之间的关系及电化学和动力学参数,表面分析和镀后加工。     

化学镀Cu—Ni合金

概述了PH=5—10的化学镀Cu—Ni合金工艺,用以取代传统的以HCHO为还原剂的强碱性化学镀Cu工艺,特别适用于刚性印制板,挠性印制板磁带自动粘结等电子部品的制造。     

化学镀镍磷硼三元合金镀层

前言用化学镀方法已成功地镀出了许多类型具有不同性能的镍合金镀层。据报道,大多数工作只局限于二元合金Ni-P和Ni-B及三元合金Ni-W-P、Ni-Mo-P、Ni-W-B、Ni-Mo-B等。使用过次亚磷酸钠、二甲胺基硼烷(DMAB)或硼氢化物中的一种,还原剂作为镀液成分。但在一种化学镀液中同时使用两种或多种还原剂的复合体系还没有人作过尝试。     

非晶态镀怪的组织结构及性能研究

本文阐述了化学沉积法制取非晶态Ｎｉ－Ｐ镀层的方法，并对非晶态镀层的组织、结构、性能作了详细的研究。结果表明，镀层具有典型的非晶态特征，镀态下显微硬度为ＨＶ４９０，并具有优良的抗腐蚀性能。     

电沉积La—Fe—Co合金工艺的研究

对用电沉积方法制备稀土－铁系金属合金功能性薄膜进行了初步探讨。通过对从二甲亚砜溶液中电沉积Ｌａ－Ｆｅ－Ｃｏ合金的研究发现，镀液中Ｌａ＾３＋的含量应远高于Ｆｅ＾２＋及Ｃｏ＾２＋的含量，才能有Ｌａ沉积出来，控制镀液组成可获得含Ｌａ量在３％左右的Ｌａ－Ｆｅ－Ｃｏ合金镀层，镀层外观为灰白色。工艺条件对镀层组成影响不大，电镀过程中，二甲亚砜也被还原使镀层含硫，镀液阴极电流效率仅为２０％￣３０％。     

无电解镀Ni—P及Ni—P—PTFE的应用研究

介绍了无电解镀镍的应用领域，研究了Ｎｉ－Ｐ镀层在各种应用环境下的耐蚀性能及在油田管路上的应用，并研究了Ｎｉ－Ｐ－ＰＴＦＥ镀层的性能开发及应用前景。     

Al—Cu—Fe合金中的一个新相及其相关的无公度相

用电子衍射方法在Al-Cu-Fe合金系中发现了一个新相,它属四方晶系,a=b≌8.6A,c=21A。图1和2分别是其沿[001],[010]带轴拍摄的电子衍射花样。但是,不同晶粒[010]电子衍射花样上斑点间距和强度往往不同。例如图3中沿箭头所指方向看去,衍射斑点不在一条直线上。对所有衍射斑点的指标化都需要三个以上的指数。很显然,它具有一维无公度调制结构的特征。另一方面,这个特征又不同于一般。其一是从各个不同带轴的电子衍射花样上很难确定哪些衍射斑点是主衍射斑点,哪些是卫星衍射。因为在一般调制结构中,主衍射的强度都比其卫星斑点强。其二是如果不考虑强度,在图3中将     

The reactions between electroless Ni-Cu-P Deposit and 63Sn-37Pb flip chip solder bumps during reflow

This study investigates the interfacial reactions between electroless Ni-Cu-P deposit and 63Sn-37Pb solder bumps under various reflow conditions. The morphology of the intermetallic compounds formed at the Ni-Cu-P/Sn-Pb interface changes with respect to reflow cycle, reflow temperature, and reflow time. The (Ni,Cu)₃Sn₄ compounds with three different morphologies of fine grain, whisker, and polygonal grain form at the Ni-Cu-P/Sn-Pb interface after reflow at 220°C for 15 s. The whisker-shape and polygonal grains detach from the Ni-Cu-P deposit into the Sn-Pb solder during multiple reflows. The (Ni,Cu)₃Sn₄ compound grows rapidly when the reflow temperature is above the Ni-Sn eutectic temperature, 231°C. A continuous (Ni,Cu)₃Sn₄ layer forms after reflow at 220°C for 10 min. A 4.5 μm Ni-Cu-P deposit prevents the interdiffusion of Sn and Al atoms across the Ni-Cu-P deposit after 10 reflow cycles at 220°C for 15 s and after reflow at 220°C for 10 min.     

Characteristic evaluation of electroless nickel-phosphorus deposits with different phosphorus contents

The surface morphology, electrical property and reaction with solder alloy of two electroless nickel-phosphorus (EN-P) deposits (Ni-7wt.%P and Ni-10wt.%P) were investigated in this study. The P content of the EN-P layer decreased with increasing pH value. The EN-P plating layers had an amorphous structure and the electrical resistivity of the layer increased with increasing P content. Reaction layers of Ni₃Sn₄, Ni₂SnP and Ni₃P formed at the interfaces between the Sn-3.5Ag solder and the two EN-P deposit layers. The thickness of the interfacial Ni₃Sn₄ intermetallic compound (IMC) layer in the Sn-3.5Ag/Ni-7wt.%P joint was thicker than that in the Sn-3.5Ag/Ni-10wt.%P joint, whereas the thickness of the Ni₃P layer increased with increasing P content. These study results confirmed that the interfacial reaction between solder and the EN-P layer is significantly affected by the composition (P content) of the EN-P layer.     

The effects of bath composition on the morphologies of electroless nickel under-bump metallurgy on Al input/output pad

The electroless nickel plating on an aluminum input/output (I/O) pad was investigated. The aluminum pad was pretreated in a zincate solution prior to electroless nickel plating. Zinc particles on the aluminum pad gave a good adherent nickel layer. The adhesion and uniformity of zinc on the aluminum is the key factor in under-bump metallurgy (UBM). The electrode potential changes with and without zinc ions in the bath were measured to analyze the sequence of two competing reactions: zinc deposit and hydrogen evolution. The relationship between aluminum dissolution and the ratio of zinc and NaOH was investigated. The electroless nickel deposition rate was dependent on bath composition. The effects of complexing ligand and additive on the nickel deposit were analyzed. Electrode potential changes were measured with time to confirm nucleation and grain growth. Adhesion of the UBM was related to zinc-particle dissolution and nickel nucleation. The uniform nickel UBM was fabricated on a real Al I/O pad.     

陶瓷表面Ni-Cu-P金属化工艺的研究

用化学镀Ｎｉ－Ｃｕ－Ｐ合金的方法使陶瓷表面金属化。结果表明：用Ｎｉ－Ｃｕ－Ｐ合金代替贵金属银作为陶瓷元件的电极材料是可行的,其产品的各项技术指标（容量、损耗、结合力、软钎焊性）均达到电极材料的要求。     

化学镀镍铜磷在钕铁硼表面处理上的应用研究

为提高钕铁硼表面镀层的耐蚀性,使其具有更高的经济附加值,采用在化学镀镍磷合金液中添加适量的铜离子及其复合络合剂,制得镍铜磷三元合金。研究了镍离子、铜离子、次亚磷酸钠、复合络合剂添加量,沉积温度、pH值对合金镀层沉积速度的影响。利用中性盐雾试验比较了其与电镀镍、化学镀镍磷合金的耐蚀性能。结果表明：化学镀镍铜磷合金能明显提高钕铁硼表面处理后的耐蚀能力。     

PTCR元件化学镀镍电极的最优工艺条件

采用正交试验法研究了络合剂浓度、镀液 pH值、施镀温度与时间对BaTiO3 陶瓷PTCR元件化学镀镍电极的影响 ,得到制备化学镀镍电极的最优工艺条件。重复试验证明 ,在该工艺条件下获得的以Ni镀层为底层电极的PTCR元件 ,其耐电压和耐工频电流冲击性能良好。     

PCB基材上化学镀Ni-P合金层用于埋置电阻的工艺方法研究

文章研究了在PCB基材上化学镀Ni-P合金层用于埋置电阻的工艺方法。基于埋入电阻在挠性及刚性PCB板中的应用,分别研究了Ni-P合金在无卤的FR-4、无卤的PI两种PCB基材上镀层厚度与试验时间之间的关系,初步得出了在两种不同基材上化学沉积Ni-P合金的规律,该规律对后期的试验具有重要的指导作用。     

Electromigration properties of electroless plated Cu metallization

The electromigration properties of electroless plated copper films have been evaluated under DC stress conditions. The formation of microvoids and the diffusion of copper through the seed layer caused an increase of the line resistance in the initial stage of the stressing. The current density dependence and the activation energy of the lifetime were determined     

Vacuum heated electroless nickel plated contacts

Electroless nickel plating has been tried on steel or brass substrates. By selected conditions of heat treatment in a high vacuum environment the plating can produce chromium equivalent hardness without the effluents of the hard chromium plating process. The resulting surfaces were examined and characterized under an optical and a scanning electron microscope. X-ray diffraction analysis was also performed to investigate recrystallization effects. The fabricated contact materials were also tested under corrosion conditions and linear polarization measurements were performed. To exploit possible utilization of produced coatings as electrical contact or connector materials, semispherical nickel plated steel joints were tested under the simultaneous application of mechanical fretting and a low-voltage electrical load. Their contact resistance was monitored during 20,000 cycle tests. The results show that after a 2-min heat treatment under 800/spl deg/C in a high vacuum environment, the plating acquires a crystalline structure with microhardness exceeding 1100 HV and a very good adhesion to the substrate material, without deteriorating its corrosion wear properties. In addition they exhibit a low and stable electrical contact resistance when operating in adverse environments i.e. fretting conditions or corrosive atmosphere.