Microstructuring of fused silica by laser-induced backside wet etching using picosecond laser pulses

The laser-induced backside wet etching (LIBWE) is an advanced laser processing method used for structuring transparent materials. LIBWE with nanosecond laser pulses has been successfully demonstrated for various materials, e.g. oxides (fused silica, sapphire) or fluorides (CaF₂, MgF₂), and applied for the fabrication of microstructures. In the present study, LIBWE of fused silica with mode-locked picosecond (t_p = 10 ps) lasers at UV wavelengths (λ₁ = 355 nm and λ₂ = 266 nm) using a (pyrene) toluene solution was demonstrated for the first time. The influence of the experimental parameters, such as laser fluence, pulse number, and absorbing liquid, on the etch rate and the resulting surface morphology were investigated. The etch rate grew linearly with the laser fluence in the low and in the high fluence range with different slopes. Incubation at low pulse numbers as well as a nearly constant etch rate after a specific pulse number for example were observed. Additionally, the etch rate depended on the absorbing liquid used; whereas the higher absorption of the admixture of pyrene in the used toluene enhances the etch rate and decreases the threshold fluence. With a λ₁ = 266 nm laser set-up, an exceptionally smooth surface in the etch pits was achieved. For both wavelengths (λ₁ = 266 nm and λ₂ = 355 nm), LIPSS (laser-induced periodic surface structures) formation was observed, especially at laser fluences near the thresholds of 170 and 120 mJ/cm², respectively.     

Raman spectroscopy of SWNTs produced by a XeCl excimer laser ablation at high temperatures

Synthesis of single-wall carbon nanotubes (SWNTs) was carried out by an ablation method using a XeCl excimer laser. It was irradiated onto a graphite target containing Co and Ni at the temperatures of 1073, 1173, 1273, 1373, 1473, 1523 and 1623 K under the atmosphere (0.1 MPa) of Ar gas with the flow rate of 12 ml/min. The measurement by a scanning/transmission electron microscope and Raman spectroscopy found the formation of SWNTs with the diameter of about 1.3 nm and the length of about 2 μm in ablated carbonaceous soot. The ratio of peak intensity of 1590 cm⁻¹ (G band) to that of 1335 cm⁻¹ (D band) in the high frequency Raman spectra increased with increasing the ambient temperature. The radial breathing mode (RBM) in the low frequency Raman spectra shows that the mean diameter of SWNTs increased with increasing the ambient temperature.     

Angular laser cleaning for effective removal of particles. from a solid surface

Laser removal of small particles from a metal surface is carried out by changing the incident angle of the laser beam. It has been found that a dramatic improvement of cleaning efficiency in terms of area and energy is observed when using the laser at glancing angle of incidence as compared to perpendicular. Furthermore substrate damage is greatly reduced and probably eliminated at glancing angles. The process mechanism is discussed by considering the adhesion and the laser-induced cleaning forces for different incident angles. It is shown that there are different laser–matter interactions operating. Received: 25 April 2000 / Accepted: 9 May 2000 / Published online: 5 October 2000     

KrF excimer laser dry and steam cleaning of silicon surfaces with metallic particulate contaminants

KrF excimer laser-assisted dry and steam cleaning of single-crystal silicon wafers contaminated with three different types of metallic particles was studied. The laser fluence used was 0.3 J/cm². In the dry process, for samples cleaned with 100 laser pulses the cleaning efficiency was 91, 71 and 59% for Au, Cu and W particles, respectively, whilst in steam cleaning the efficiency is about 100% after 5 laser pulses, independently of the type of contaminant. The effects of laser irradiation on the Si surface are investigated by scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM). Laser processing at 0.3 J/cm² does not deteriorate the Si-wafer surface, either in dry or steam cleaning. However, the measured XPS intensity coming from the metallic component is greater on the cleaned surfaces than in the initial condition. Quantification of the XPS results, assuming a stratified overlayer model for the detected species and accounting for the presence of the metallic particles on the surface, showed that the obtained results can be explained by the formation of a fractional metallic monolayer on the cleaned surfaces, due to partial vaporisation of small particles initially present on the sample surface. This contamination of the substrate could be considered excessive for some applications and it shows that the process requires careful optimisation for the required efficiency to be achieved without degradation of the substrate. Received: 14 January 2001 / Accepted: 19 February 2001 / Published online: 20 June 2001     

Practical uses of femtosecond laser micro-materials processing

We describe several approaches to basic femtosecond machining and materials processing that should lead to practical applications. Included are results on high-throughput deep hole drilling in glasses in ambient air, and precision high-speed micron-scale surface modification of composite materials and chalcogenide glasses. Ablation of soda-lime silicate glass and PbO lead-silicate is studied under three different sets of exposure conditions, for which both the wavelength and pulse duration are varied. Ablation rates are measured below and above the air ionization threshold. The differences observed are explained in terms of self-channeling in the ablated hole. Fabrication of practical devices such as waveguides and gratings is demonstrated in chalcogenide glass. Received: 11 December 2002 / Accepted: 20 January 2003 / Published online: 28 May 2003 RID="*" ID="*"Corresponding author. Fax: +1-407/8233-570, E-mail: mrichard@mail.ucf.edu     

High-speed energy efficient selective removal of large area copper layer by laser induced delamination

An indirect laser-induced method for selective removal of large copper areas from a printed circuit board is theoretically and experimentally investigated. The results show that the threshold condition for the process involves phase transition of the epoxy-based substrate resin. Optimal parameters for maximizing process speed are found and discussed.     

Photoablation and microstructuring of polyestercarbonates and their blends with a XeCl excimer laser

Received: 23 October 1997/Accepted: 18 November 1997     

Temporally and spectrally resolved analysis of a copper plasma plume produced by ultrafast laser ablation

We report an experimental analysis of the plasma plume produced during ultrafast laser ablation of a copper target, in high vacuum. The plasma plume optical emission is studied by using a hybrid time-gated imaging technique which allows obtaining simultaneous information on the spectral and spatial characteristics of the emitting species. We used both single and double pulse ablation scheme, observing their influence on the characteristics of the ablated atomic species.     

Analysis by using X-ray photoelectron spectroscopy for polymethyl methacrylate and polytetrafluoroethylene etched by KrF excimer laser

The C 1s, F 1s, and O 1s electron spectra for polymethyl methacrylate (PMMA) and polytetrafluoroethylene (PTFE) irradiated by KrF excimer laser with 248 nm wavelength were analyzed by the X-ray photoelectron spectroscopy (XPS) method. The results show that, after irradiation by the laser, the percentage of the carbon atoms of C-C bond decreases and the percentage of CO bond increases for PMMA, while for PTFE percentages of both C-C bond and CF₂ group decrease drastically, respectively. Moreover, it was found that C-O bond and other complex carbon-oxygen groups appeared for PTFE. The photon-chemical processes associated with the energy level transitions, energy diversion, and dissociation of bonds in the interaction were theoretically analyzed based on the chemical structures of PTFE and PMMA. Our analyses can successfully explain that PMMA can be effectively etched by KrF excimer laser with 248 nm wavelength can efficiently etch the PMMA, but the surface of PTFE can only be modified by it.     

Femtosecond laser-induced concentric ring microstructures on Zr-based metallic glass

Surface morphological evolution of Zr-based metallic glass ablated by femtosecond lasers is investigated in atmosphere condition. Three types of permanent ring structures with micro-level spacing are observed for different laser shots and fluences. In the case of low laser fluences, the generation of annular patterns with nonthermal features is observed on the rippled structure with the subwavelength scale, and the ring spacing shows a decrease tendency from the center to the margin. While in the case of high laser fluences, the concentric rings formation within the laser spot is found to have evident molten traces and display the increasing ring spacing along the radial direction. Moreover, when the laser shots accumulation becomes large, the above two types of ring microstructures begin to develop into the common ablation craters. Analysis and discussion suggests that the stress-induced condensation of ablation vapors and the frozen thermocapillary waves on the molten surfaces should be responsible for the formation of two different types of concentric ring structures, respectively. Eventually, a processing window for each resulting surface microstructure type is obtained experimentally and indicates the possibility to control the morphological transitions among different types.     

F2-laser ablation patterning of dielectric layers

Spatially defined patterning of multi-layer dielectric optical systems by laser-induced ablation is demonstrated. A 49-layer high-reflectivity mirror for 193-nm light was irradiated with F₂-laser light through the CaF₂-substrate to cleanly remove the whole dielectric stack by rear-sided ablation. The 157-nm light is absorbed efficiently by dielectric layers such as SiO₂ and Al₂O₃ that are typically used for ultraviolet (UV) transmission at 193-nm and longer wavelengths. Thus it is possible to ablate highly reflective UV-laser mirrors (HR 193 nm) and to create dielectric masks that withstand high power levels at 193 nm. A single 157-nm pulse with a fluence of less than 500 mJ/cm² is sufficient to cleanly ablate the whole layer stack with sharp edges and without debris deposition. Received: 31 October 2000 / Accepted: 14 November 2000 / Published online: 10 January 2001     

Enhanced cleaning of photoresist film on a transparent substrate by backward irradiation of a Nd:YAG laser

Laser cleaning of a photoresist (PR) on a glass substrate using ns-pulsed Nd:YAG laser was studied. The direction of the substrate facing the laser beam was varied as a main parameter as well as the power of the laser beam. The backward irradiation (BWI) of the third harmonic beam (355 nm) completely removed 1.2 μm thick PR layer with three pulses at 1.5 J/cm² leaving no residues behind; while the forward irradiation (FWI) at the same condition just partially cleaned it. To investigate the difference of removal mechanisms between irradiation directions, the size distributions of particulates generated during laser cleaning were observed using an optical particle counter. The concentration of micron-sized particulates increased with increasing laser fluence up to 1 J/cm² for FWI and 0.5 J/cm² for BWI and then decreased at higher fluences because the target was a very thin film. The concentration of larger particulates for BWI was much higher than that for FWI implying the difference in removal mechanisms. In consideration of the size characteristics of the particulates and the temperature profiles of the PR layer, the most probable distinct mechanism for the BWI would be a blasting due to high temperature at the PR/glass interface. The particulate number concentration decreased rapidly after the completion of cleaning, suggesting that the measurement of the particulate concentration could detect the progress of the cleaning. Our results demonstrated that the backward irradiation will be useful for the laser cleaning of film-type contaminants on an optically transparent substrate.     

Detection of neutral products formed during excimer laser ablation of polyimide by UV and VUV laser photoionization/mass spectrometry

Some of the neutral species which are produced in the laser ablation of polyimide have been characterized using multiphoton ionization/time of flight mass spectrometry. Three different wavelengths (193 nm, 157 nm, and 118 nm) have been used in an attempt to effect soft ionization of the products formed during or after the initial laser ablation of the polymer. Neutral photo-ablation products detected using this scheme range from atomic to high molecular weight species which, depending on the probe wavelength, include pure carbon clusters as well as a broad distribution of heteroatom containing clusters. However, there is virtually no overlap in the mass spectra recorded at each probe wavelength. When probing with 193 nm, marked changes are observed in the mass spectra as a function of the probe flux used. At moderate fluxes, pure carbon clusters (fullerenes) are observed. The identification of a large distribution of species other than pure carbon clusters is in dramatic contrast to the recent observation [W.R. Creasy, J.T. Brenna: Chem. Phys. 126, 453 (1988)] of the positively charged ionic species produced, which are solely carbon clusters. These results suggest that the neutral and ionic products observed after ablation of the polymer are due to both condensation of the atomic and molecular fragments which form during the ablation laser pulse and nascent polymer fragments. Various implications of this result for the unambiguous determination of the true ablation product distribution are discussed.     

Underwater excimer laser ablation of polymers

In this paper, we study the photoablation kinetic of poly (ethylene terephthalate) (PET), polycarbonate (PC), polyimide (PI) and polystyrene (PS) in both air and water. Compared to the results obtained in air, we highlight the decrease of the ablation threshold (AT) of polyesters in contact with water as a function of polymer chemical structure. In order to check the expected hydrolytic reaction of polyesters near the ablation threshold, the chemical modification of the polymer surfaces, as well the composition of the ablation products, were investigated after irradiation near the fluence of ablation threshold in air (air-F _t ) by X-ray photoelectron spectroscopy (XPS) and confocal Raman microspectroscopy. The morphology of polymers obtained by underwater irradiation and near the air-F _t was also examined using scanning electron microscopy (SEM). To understand the process and its dynamics in contact with water, we consider the model of temperature at the polymer-water interface based on the semi-analytical solution of the transit heat-diffusion equation.     

Metal and polymer melt jet formation by the high-power laser ablation

The laser-induced metal and polymer melt jets are studied experimentally. Two classes of physical phenomena of interest are: first, the process of explosive phase change of laser induced surface ablation and second, the hydrodynamic jetting of liquid melts ejected from a beamed spot. We focus on the dynamic link between these two distinct physical phenomena in a framework of forming and patterning of metallic and polymer jets using a high-power Nd:YAG laser. The microexplosion of ablative spot on a target first forms a pocket of hot liquid melt and then it is followed by a sudden volume change of gas-liquid mixture leading to a pressure-induced spray jet ejection into surrounding medium.     

Thin layer laser bonding using spin-on-glass materials

We developed and characterized a new laser bonding process with a nano adhesive layer for transparent materials. The adhesive is spin-coated on a glass substrate and cured locally with a focused laser beam. The minimum viscosity of the adhesive is very low, so that a thin layer only a few hundred nanometers thick can be coated on a cover substrate. Laser irradiation from a Nd:YAG laser system with a wavelength of 1064 nm is employed as the curing source for the localized nano layer bonding process. The measured thickness of the bonding layer is in the range of 400 nm to 3 μm. This process can be applied to the nano or micro bonding of various transparent systems such as flat panel displays, biochips, and heat-sensitive microelectronics. We present experimental results and discuss the process characteristics.     

Femtosecond laser ablation of aluminium

We investigate femtosecond laser ablation of aluminium using a hybrid simulation scheme. Two equations are solved simultaneously: one for the electronic system, which accounts for laser energy absorption and heat conduction, the other for the dynamics of the lattice where the ablation process takes place. For the electron-temperature a generalized heat-conduction equation is solved by applying a finite difference scheme. For the lattice properties, e.g. pressure, density or temperature, we use common molecular dynamics. Energy transfer between the subsystems is allowed by introducing an electron-phonon coupling term. This combined treatment of the electronic and atomic systems is an extension of the well known two-temperature model [Anisimov, Kapeliovich, Perel’man, Electron emission from metal surfaces exposed to ultra short laser pulses, JETP Lett. 39 (2)].     

Femtosecond laser ablation of carbon reinforced polymers

Interaction of intense ultrashort laser pulses (120 fs at 795 nm) with polymer based composites has been investigated. We have found that carbon filled polymers exhibit different ultrafast ablation behaviour depending on whether the filling material is carbon black or carbon fiber and on the polymer matrix itself. The shape and dimensions of the filling material are responsible for some geometrical bad quality effects in the entrance and inner surfaces of drilled microholes. We give an explanation for these non-quality effects in terms of fundamentals of ultrafast ablation process, specifically threshold laser fluences and material removal paths. Since carbon fiber reinforced polymers seemed particularly concerned, this could prevent the use of ultrafast ablation for microprocessing purposes of some of these materials.     

Mechanisms of absorption in pulsed excimer laser-induced plasma

2 . Received: 20 January 1997/Accepted: 23 June 1997     

Enhancement of pulsed laser removal of metal oxides by electrochemical control

Pulsed laser irradiation of oxidized metallic surfaces in an electrolytic cell under proper voltage conditions is demonstrated to be a promising new approach for effective removal of oxide films. Systematic measurements on simulated corrosion-product films by optical reflectance profile and energy dispersive X-ray spectroscopy are used to study the physical mechanisms of this novel phenomenon, the physical conditions for its observation and its possible generality. It was observed that the utilization of a basic electrolyte solution and the imposition of a certain cathodic potential prior to laser irradiation is an essential requirement for a high removal efficiency. This new technique has potential applications in metallurgy, semiconductor fabrication technology and decontamination of nuclear power plans and is suitable for maskless patterning of oxidized surfaces.