V形坑尺寸对硅衬底InGaN/AlGaN近紫外LED光电性能的影响

使用MOCVD在图形化Si衬底上生长了InGaN/AlGaN近紫外LED,通过改变低温GaN插入层的厚度调控V形坑尺寸,系统地研究了V形坑尺寸对InGaN/AlGaN近紫外LED(395 nm)光电性能的影响。结果表明,低温GaN插入层促进了V形坑的形成,并且V形坑尺寸随着插入层厚度的增加而增大。在电学性能方面,随着V形坑尺寸的增大,-5 V下的漏电流从5.2×10~(-4)μA增加至6.5×10~2μA;350 mA下正向电压先从3.55 V降至3.44 V,然后升高至3.60 V。在光学性能方面,随着V形坑尺寸的增大,35 A/cm~2下的归一化外量子效率先从0.07提高至最大值1,然后衰退至0.53。对V形坑尺寸影响InGaN/AlGaN近紫外LED光电性能的物理机理进行了分析,结果表明:InGaN/AlGaN近紫外LED的光电性能与V形坑尺寸密切相关,最佳的V形坑尺寸为120~190 nm,尺寸太大或者太小都会降低器件性能。     

Performance enhancement of an InGaN light-emitting diode with an AlGaN/InGaN superlattice electron-blocking layer

The efficiency enhancement of an InGaN light-emitting diode(LED) with an AlGaN/InGaN superlattice(SL)electron-blocking layer(EBL) is studied numerically,which involves the light-current performance curve,internal quantum efficiency electrostatic field band wavefunction,energy band diagram carrier concentration,electron current density,and radiative recombination rate.The simulation results indicate that the LED with an AlGaN/InGaN SL EBL has better optical performance than the LED with a conventional rectangular AlGaN EBL or a normal AlGaN/GaN SL EBL because of the appropriately modified energy band diagram,which is favorable for the injection of holes and confinement of electrons.Additionally,the efficiency droop of the LED with an AlGaN/InGaN SL EBL is markedly improved by reducing the polarization field in the active region.     

高温AlN插入层对AlGaN/GaN异质结材料和HEMTs器件电学特性的影响

研究了在GaN缓冲层中插入40 nm厚高温AlN层的GaN外延层和AlGaN/GaN异质结材料, AlN插入层可以增加GaN层的面内压应力并提高AlGaN/GaN高电子迁移率晶体管（HEMTs）的电学特性. 在精确测量布拉格衍射角的基础上定量计算了压应力的大小. 增加的压应力一方面通过增强GaN层的压电极化电场, 提高了AlGaN/GaN异质结二维电子气（2DEG）面密度, 另一方面使AlGaN势垒层对2DEG面密度产生的两方面影响相互抵消. 同时, 这种AlN插入层的采用降低了GaN与AlGaN层之间的 关键词： 高温AlN插入层 AlGaN/GaN异质结 二维电子气 应力     

反对称n-AlGaN层对GaN基双蓝光波长发光二极管性能的影响

采用数值分析方法对在InGaN/GaN混合多量子阱活性层和n-GaN之间引入n-AlGaN层的GaN基双蓝光波长发光二极管进行模拟分析.结果发现,与传统的具有p-AlGaN电子阻挡层的双蓝光波长发光二极管相比,这种反对称n-AlGaN层能有效改善电子和空穴在混合多量子阱活性层中的分布均匀性及减少电子溢出,实现电子空穴在各个量子阱中的平衡辐射,从而减弱了双蓝光波长发光二极管的效率衰减.此外,通过改变Al组分可以提高双蓝光波长发光二极管发射光谱的稳定性:当Al组分为0.16时,双蓝光波长发光二极管的光谱在小电流下比较稳定,而Al组分为0.12时,光谱在大电流下比较稳定.     

量子阱层和垒层具有不同Al组分的270/290/330nm AlGaN基深紫外LED光电性能

为了研究AlGaN量子阱层和垒层中Al组分不同对AlGaN基深紫外发光二极管(LED)光电性能的影响,本文利用MOCVD生长、光刻和干法刻蚀工艺制备了AlGaN量子阱层和垒层具有不同Al组分的270/290/330nm深紫外LED,通过实验和数值模拟计算方法发现,量子阱层和垒层中具有低Al组分紫外LED的AlGaN材料具有较低的位错密度、较高的光输出功率和外量子效率。通过电流-电压(I-V)曲线拟合出的较大的理想因子(3.5)和能带结构图表明,AlGaN深紫外LED的电流产生是隧穿机制占据主导作用,这是因为高Al组分AlGaN量子阱中强极化场造成了有源层区域较大的能带弯曲和电势降。     

Dual-blue light-emitting diode based on strain-compensated InGaN-AlGaN/GaN quantum wells

Strain-compensated InGaN quantum well (QW) active region employing tensile AlGaN barrier is analyzed. Its spectral stability and efficiency droop for dual-blue light-emitting diode (LED) are improved compared with those of the conventional InGaN/GaN QW dual-blue LED based on stacking structure of two In_0.18Ga_0.82N/GaN QWs and two In_0.12Ga_0.88N/GaN QWs on the same sapphire substrate. It is found that the optimal performance is achieved when the Al composition of strain-compensated AlGaN layer is 0.12 in blue QW and 0.21 in blue-violet QW. The improvement performance can be attributed to the strain-compensated InGaN-AlGaN/GaN QW that can provide a better carrier confinement and effectively reduce leakage current.     

Improved carrier injection and confinement in InGaN light-emitting diodes containing GaN/AlGaN/GaN triangular barriers

In this study, an InGaN lighting-emitting diode(LED) containing GaN/AlGaN/GaN triangular barriers is proposed and investigated numerically. The simulation results of output performance, carrier concentration, and radiative recombination rate indicate that the proposed LED has a higher output power and an internal quantum efficiency, and a lower efficiency droop than the LED containing conventional GaN or AlGaN barriers. These improvements mainly arise from the modified energy bands, which is evidenced by analyzing the LED energy band diagram and electrostatic field near the active region.The modified energy bands effectively improve carrier injection and confinement, which significantly reduces electron leakage and increases the rate of radiative recombination in the quantum wells.     

A dual-blue light-emitting diode based on strain-compensated InGaN-AlGaN/GaN quantum wells

A strain-compensated InGaN quantum well(QW) active region employing a tensile AlGaN barrier is analyzed.Its spectral stability and efficiency droop for a dual-blue light-emitting diode(LED) are improved compared with those of the conventional InGaN/GaN QW dual-blue LEDs based on a stacking structure of two In0.18Ga0.82N/GaN QWs and two In0.12Ga0.88N/GaN QWs on the same sapphire substrate.It is found that the optimal performance is achieved when the Al composition of the strain-compensated AlGaN layer is 0.12 in blue QW and 0.21 in blue-violet QW.The improvement performance can be attributed to the strain-compensated InGaN-AlGaN/GaN QW,which can provide a better carrier confinement and effectively reduce leakage current.     

GaN基蓝绿光LED电应力老化分析

对InGaN/GaN多量子阱蓝光和绿光LED进行了室温20,40,60 mA加速电流下的电应力老化研究,发现蓝光与绿光样品经过60 mA电流老化424 h后,其电学性能表现出一定的共性与差异性:在小测量电流下,绿光样品的光衰减幅度较蓝光样品大~9%;而在较大测量电流 (20 mA)下,两者的光衰减幅度基本相同 (18%)。同时,蓝绿光样品的正向电学性能随老化时间的变化幅度基本一致,反映出它们具有相似的退化机制,绿光样品老化后增多的缺陷大部分体现为简单的漏电行为,而并非贡献于非辐射复合中心。在此基础上对GaN基外延结构进行了优化,优化后的LED长期老化的光衰减幅度较参考样品降低了3%。     

高Al组分AlGaN多量子阱结构材料发光机制探讨

紫外LED的发光功率和效率还远不能令人们满意,波长短于300 nm的深紫外LED的发光效率普遍较低。厘清高Al组分Al Ga N多量子阱结构的发光机制将有利于探索改善深紫外LED的发光效率的新途径、新方法。为此,本文通过金属有机气相外延技术外延生长了表面平整、界面清晰可辨且陡峭的高Al组分AlGa N多量子阱结构材料,并对其进行变温光致发光谱测试,结合数值计算,深入探讨了Al Ga N量子阱的发光机制。研究表明,量子阱中具有很强的局域化效应,其发光和局域激子的跳跃息息相关,而发光的猝灭则与局域激子的解局域以及位错引起的非辐射复合有关。     

新型电子阻挡层结构对蓝光InGaN发光二极管性能的提高

分别对3种不种电子阻挡层的蓝光AlGaN LED进行数值模拟研究。3种阻挡层结构分别为传统AlGaN电子阻挡层,AlGaN-GaN-AlGaN电子阻挡层和Al组分渐变的AlGaN-GaN-AlGaN电子阻挡层。此外对这对三种器件的活性区的载流子浓度、能带图、静电场和内量子效率进行比较和分析。研究结果表明,相较于传统AlGaN和AlGaN-GaN-AlGaN两种电子阻挡层的LED,具有Al组分渐变的AlGaN-GaN-AlGaN电子阻挡层结构的LED具有较高的空穴注入效率、较低的电子外溢现象和较小的静电场(活性区)。同时,具有Al组分渐变的AlGaN-GaN-AlGaN电子阻挡层结构的LED的efficiency droop现象也得到一定的缓解。     

Heterojunction light emitting diodes fabricated with different n-layer oxide structures on p-GaN layers by magnetron sputtering

We grew heterojunction light emitting diode (LED) structures with various n-type semiconducting layers by magnetron sputtering on p-type GaN at high temperature. Because the undoped ZnO used as an active layer was grown under oxygen rich atmosphere, all LED devices showed the EL characteristics corresponding to orange-red wavelength due to high density of oxygen interstitial, which was coincident with the deep level photoluminescence emission of undoped ZnO. The use of the Ga doped layers as a top layer provided the sufficient electron carriers to active region and resulted in the intense EL emission. The LED sample with small quantity of Mg incorporated in MgZnO as an n-type top layer showed more intense emission than the LED with ZnO, in spite of the deteriorated electrical and structural properties of the MgZnO film. This might be due to the improvement of output extraction efficiency induced by rough surface.     

Si(110)和Si(111)衬底上制备InGaN/GaN蓝光发光二极管

分别在Si(110)和Si(111)衬底上制备了In Ga N/Ga N多量子阱结构蓝光发光二极管(LED)器件.利用高分辨X射线衍射、原子力显微镜、室温拉曼光谱和变温光致发光谱对生长的LED结构进行了结构表征.结果表明,相对于Si(111)上生长LED样品,Si(110)上生长的LED结构晶体质量较好,样品中存在较小的张应力,具有较高的内量子效率.对制备的LED芯片进行光电特性分析测试表明,两种衬底上制备的LED芯片等效串联电阻相差不大,在大电流注入下内量子效率下降较小;但是,相比于Si(111)上制备LED芯片,Si(110)上LED芯片具有较小的开启电压和更优异的发光特性.对LED器件电致发光(EL)发光峰随驱动电流的变化研究发现,由于Si(110)衬底上LED结构中阱层和垒层存在较小的应力/应变而在器件中产生较弱的量子限制斯塔克效应,致使Si(110)上LED芯片EL发光峰随驱动电流的蓝移量更小.     

Analysis of junction temperatures for groups III–V semiconductor materials of light-emitting diodes

This study utilizes the Shockly equation and Fourier’s law with the optical, electrical and thermal properties of LEDs to predict the variation of the junction temperature with the injection current. It is shown that the relationship of the junction temperature with the injection current can be determined by the effective thermal conductivity, temperature coefficient of junction voltage, series resistance, integral constant (forward voltage at the initial forward current and junction temperature), ambient temperature and external quantum efficiency. The effective thermal conductivity, temperature coefficient of junction voltage, and series resistance are calculated from the material properties based on the structures of LEDs instead of measurements in this study. The junction temperature of AlGaInP/GaInP MQW red LED predicted from this study agrees with the available experimental data and the junction temperatures of GaInN UV LED and AlGaN UV LED calculated by this work are also consistent with these obtained from the emission peak shift method. The elevated temperatures of AlGaN and GaInN are larger than that of AlGaInP/GaInP MQW red LED due to the difference of the thermal conductivity for the LED substrate. This study also presents the effects of the parameters on the variation of the junction temperature with the injection current. The effective thermal conductivity and ambient temperature significantly affect the junction temperature of LEDs.     

Performance improvement of blue light-emitting diodes with an AlInN/GaN superlattice electron-blocking layer

The characteristics of a blue light-emitting diode (LED) with an AlInN/GaN superlattice (SL) electron-blocking layer (EBL) are analyzed numerically. The carrier concentrations in the quantum wells, energy band diagrams, electrostatic fields, and internal quantum efficiency are investigated. The results suggest that the LED with an AlInN/GaN SL EBL has better hole injection efficiency, lower electron leakage, and smaller electrostatic fields in the active region than the LED with a conventional rectangular AlGaN EBL or a AlGaN/ GaN SL EBL. The results also indicate that the efficiency droop is markedly improved when an AlInN/GaN SL EBL is used.     

基于量子点和MEH-PPV的白光发光二极管的研究

利用无机纳米材料与有机聚合物材料相结合的方法制备白光发光二极管器件, 研究了蓝光量子点QDs(B)掺杂聚[2-甲氧基-5-(2-乙基己氧基-1, 4-苯撑乙烯撑](MEH-PPV) 复合体系的发光特性及量子点QDs(B) 掺杂浓度(质量分数)不同对器件发光特性的影响. 制备了ITO/PEDOT:PSS/MEH-PPV:QDs(B)/LiF/Al 结构的电致发光器件, 测试了器件的电致发光光谱和电学、光学特性. 当QDs掺杂浓度为40%, 驱动电压为8 V时器件能得到较为理想的白光发射. 同时, 对比研究了非掺杂体系的发光特性, 制备了结构为ITO/PEDOT:PSS/MEH-PPV/QDs(B)/LiF/Al的器件, 掺杂体系相较于非掺杂体系, 器件的最大亮度增大, 启亮电压降低, 并分析了掺杂体系器件性能改善的原因.     

p-GaN插入层调控InGaN基黄绿双波长LED发光光谱

采用MOCVD技术在硅衬底上生长了含有7个黄光量子阱和1个绿光量子阱的混合有源区结构的InGaN基黄绿双波长LED外延材料,研究了电子阻挡层前p-GaN插入层厚度对黄绿双波长LED载流子分布及外量子效率(EQE)的影响。通过LED变温电致发光测试系统对LED光电性能进行了表征。结果表明,100 K小电流时随着电流密度的增大,三组样品的绿光峰与黄光峰相对强度的比值越来越大,且5.5 A·cm^-2的电流密度下,随着温度从300 K逐步降低至100 K,三组样品的绿光峰与黄光峰相对强度的比值也越来越大,说明其载流子都在更靠近p型层的位置发生辐射复合。三组样品的p-GaN插入层厚度为0,10,30 nm时,EQE峰值依次为29.9%、29.2%和28.2%,呈现依次减小的趋势,归因于p-GaN插入层厚度越大,p型层越远离有源区,空穴注入也越浅。电子阻挡层前p-GaN插入层可以有效减小器件EL光谱中绿光峰随着电流密度增加时峰值波长的蓝移(33 nm),实现了对低温发光光谱的调控。     

Investigations on AlGaN‐Based Deep‐Ultraviolet Light‐Emitting Diodes With Si‐Doped Quantum Barriers of Different Doping Concentrations

In this work, we investigate the impact of Si doped AlGaN quantum barriers on the optical powers for [0001] oriented III‐nitride based deep‐ultraviolet light‐emitting diodes (DUV LEDs). The polarization‐induced electric field in the active region is screened as the result of Si‐doped quantum barriers, which gives rise to the improved spatial overlap between electron and hole wave functions. The polarization screening effect within the quantum wells is further proven by the observation of the blue shift for the wavelength. However, the hole distribution across the active region can be significantly retarded if the Si dosage in the quantum barriers is too high. Therefore, the improved radiative recombination within the active region can be realized provided that the Si dosage in the quantum barriers is moderately adjusted to guarantee both the better hole injection efficiency and the screened polarization effect in the multiple quantum wells.     

Improved color rendering of phosphor-converted white light-emitting diodes with dual-blue active layers and n-type AlGaN layer

An InGaN/GaN blue light-emitting diode (LED) structure and an InGaN/GaN blue-violet LED structure were grown sequentially on the same sapphire substrate by metal-organic chemical vapor deposition. It was found that the insertion of an n-type AlGaN layer below the dual blue-emitting active layers showed better spectral stability at the different driving current relative to the traditional p-type AlGaN electron-blocking layer. In addition, color rendering index of a Y3Al5O12:Ce3+ phosphor-converted white LED based on a dual blue-emitting chip with n-type AlGaN reached 91 at 20 mA, and Commission Internationale de L'Eclairage coordinates almost remained at the same point from 5 to 60 mA.     

Reliability analysis of GaN-based light emitting diodes for solid state illumination

In this paper, we have discussed the effect of electrical stress on GaN light emitting diode （LED）. With the lapse of time, the LED with an applied large current stress can reduce its current more than without such a stress under a large forward-voltage drop. Its scanning electron microscopy （SEM） image shows that there exist several pits on the surface of the p-metal. With an electrical stress applied, the number of pits greatly increases. We also find that the degradation of GaN LED is related to the oxidized Ni/Au ohmic contact to p-GaN. The electrical activation of H-passivated Mg acceptors is described in detail. Annealing is performed in ambient air for 10 min and the differential resistances at a forward-voltage drop of 5 V are taken to evaluate the activation of the Mg acceptors. These results suggest some mechanisms of degradation responsible for these phenomena, which are described in the paper.