尖端集电效应在薄膜沉积中的应用

本文利用尖端集电原理,在射频平衡磁控溅射过程中通过施加衬底偏压沉积了Cu2O薄膜。然后用原子力显微镜和掠入射X射线衍射仪对薄膜样品的形貌和结构进行表征。研究结果表明,不管施加的是正偏压还是负偏压,所制备Cu2O薄膜的形貌和结构相差不大,均呈现出疏松多孔和(111)择优取向的特点。进一步地,从尖端集电的角度对平衡磁控溅射沉积过程中的偏压效应进行了合理解释。     

用扫描隧道显微镜操纵Cu亚表面自间隙原子

在超高真空环境下使用扫描隧道显微镜研究了吸附有双甘氨肽分子的Cu(001)表面.在一定的 偏压条件下，针尖在该表面扫描后会形成纳米尺度的Cu团簇，这些团簇可以根据意愿排列成 字母或图形.团簇的高度同偏压、隧道电流以及时间等条件有密切关系.在室温下可以稳定存 在的团簇为制造纳米器件提供了技术上的可能性.实验结果表明，形成团簇的Cu原子不是来 自Cu衬底表面或是针尖.化学吸附在Cu表面的双甘氨肽分子，受到隧道电场的作用会在Cu表 面形成张应变场，Cu亚表面自间隙原子在张应变场作用下迁移到表面是形成团簇的原因. 关键词： 扫描隧道显微镜 纳米尺度Cu团簇 自间隙原子     

C2团簇在金刚石(111)表面吸附结构的分子动力学模拟

利用Brenner(#2)半经验多体相互作用势和分子动力学模拟方法研究荷能的C₂在金刚石(111)表面的化学吸附过程.模拟300 K时,初始入射动能分别为1,20,30 eV的C₂团簇从6个不同位置轰击金刚石(111)表面,观察到C₂团簇在金刚石(111)表面形成的吸附结构,表面C原子键的打开以及C₂团簇与表面C原子成键等物理过程,并讨论不同入射位置和入射能量对沉积团簇的结构特性的影响.结果表明,对于表面不同的局部构型,C₂团簇发生不同的碰撞过程,C₂团簇入射能量的提高有利于成键过程的发生,从原子尺度模拟沉积机制.     

低能单个Cu原子与Cu13团簇沉积到Fe（001）表面的比较

本文利用分子动力学模拟方法对相同初始沉积条件下的单个Cu原子和Cu13团簇与Fe(001)表面的相互作用分别进行了模拟研究, 并将两者的模拟结果进行了比较分析. 单个Cu原子和Cu13团簇的初始入射能量范围均为1eV/atom、3eV/atom、5eV/atom和10eV/atom, 初始入射角度均为0o、10o、30o和45o, 衬底温度分别为100K、300K和800K. 对单个Cu原子和Cu13团簇的原子动能、质心高度、迁移距离和最终沉积形貌进行了分析, 对比研究了相同初始沉积条件下单个Cu原子和Cu13团簇在沉积过程中和沉积效果上的具体差异. 模拟结果表明: 单个Cu原子和Cu13团簇与Fe(001)表面的相互作用机制存在差异, Cu13团簇表现出显著的集体效应. 在特定沉积条件下, 由于Cu13团簇的集体效应, 导致Cu13团簇与Fe(001)表面的结合能力和在Fe(001)表面上的扩散能力均强于单个Cu原子.     

低能单个Cu原子与Cu_(13)团簇沉积到Fe(001)表面的比较研究

本文利用分子动力学模拟方法对相同初始沉积条件下的单个Cu原子和Cu_(13)团簇与Fe(001)表面的相互作用分别进行了模拟研究,并将两者的模拟结果进行了比较分析.单个Cu原子和Cu_(13)团簇的初始入射能量范围均为1 e V/atom、3 e V/atom、5 e V/atom和10 e V/atom,初始入射角度均为0°、10°、30°和45°,衬底温度分别为100 K、300 K和800 K.对单个Cu原子和Cu_(13)团簇的原子动能、质心高度、迁移距离和最终沉积形貌进行了分析,对比研究了相同初始沉积条件下单个Cu原子和Cu_(13)团簇在沉积过程中和沉积效果上的具体差异.模拟结果表明:单个Cu原子和Cu_(13)团簇与Fe(001)表面的相互作用机制存在差异,Cu_(13)团簇表现出显著的集体效应.在特定沉积条件下,由于Cu_(13)团簇的集体效应,导致Cu_(13)团簇与Fe(001)表面的结合能力和在Fe(001)表面上的扩散能力均强于单个Cu原子.     

Cu/SiO2/Si(111)体系中Cu和Si的扩散及界面反应

室温下利用磁控溅射在p型Si(111)衬底上沉积了Cu薄膜.利用X射线衍射和卢瑟福背散射分别对未退火以及在不同温度点退火后样品的结构进行了表征.在此基础上,研究了Cu/SiO2/Si(111)体系的扩散和界面反应.实验结果表明:当退火温度高于450 ℃时出现明显的扩散现象,并且随着温度的升高,体系扩散现象会更加显著.当退火温度低于450 ℃时没有铜硅化合物生成,当温度达到500 ℃时才有铜硅化合物生成.     

Cu/SiO2/Si(111)体系中Cu和Si的扩散及界面反应

室温下利用磁控溅射在p型Si(111)衬底上沉积了Cu薄膜. 利用X射线衍射和卢瑟福背散射分别对未退火以及在不同温度点退火后样品的结构进行了表征. 在此基础上，研究了Cu/SiO₂/Si(111)体系的扩散和界面反应. 实验结果表明：当退火温度高于450℃时出现明显的扩散现象，并且随着温度的升高，体系扩散现象会更加显著. 当退火温度低于450℃时没有铜硅化合物生成，当温度达到500℃时才有铜硅化合物生成. 关键词： 薄膜 扩散 界面反应 硅化物     

包埋于氮化硅薄膜中的硅团簇的光致发光特性

采用等离子体增强化学气相沉积(PECVD)技术,在低温下制备了富硅氢化氮化硅薄膜。利用红外吸收(IR)谱,光电子能谱(XPS)和光致发光(PL)谱,研究了在不同温度下退火的薄膜样品的结构和发光特性。在经过低温退火的薄膜中观测到一个强的可见发光峰。当退火温度较高时,随着与硅悬键有关的发光峰消失,可见发光峰位发生了蓝移。讨论了退火对薄膜中硅团簇的形成及其对发光的影响。根据Raman谱,计算了氮化硅薄膜中硅团簇的尺寸大小。通过实验结果和分析,我们认为PL谱中较强的室温可见发光峰来自于包埋于氮化硅中的硅团簇。     

纳米Cu3 N薄膜的制备与性能

采用柱状靶多弧直流磁控溅射法,100℃基底温度下在玻璃衬底上制备了纳米氮化铜(Cu3N)薄膜.用x射线衍射研究了不同氮气分压对Cu3N薄膜晶体结构及晶粒尺寸的影响.结果显示薄膜由Cu3N和Cu的纳米微晶复合而成,其中Cu3N纳米微晶具有立方反ReO3结构.通过原子力显微镜对薄膜表征显示,膜表面比较光滑,具有较低的粗糙度.x射线光电子能谱对薄膜表面的成分分析表明,Cu3N薄膜表面铜元素同时以+1价和+2价存在.Cu3N的Cu2p3/2,Cu2p1/2及Nls峰分别位于932.7,952.7和399.9 eV,Cu2p原子自旋-轨道耦合裂分能量间距为20eV.用台阶仪和四探针方法测量了薄膜的厚度及电阻率,薄膜的沉积速率和电阻率在很大程度上受到氮气分压的调制.     

单晶硅上化学气相沉积铜薄膜的机理研究

在自行设计、建立的MOCVD系统上,以Cu(hfac)2为反应前驱物在单晶硅上进行铜薄膜的化学气相沉积,并用AFM、SEM对铜核的成长机理进行了研究．结果表明,反应初期,单晶硅上铜核的成长为岛状,反应后期为先层状后岛状．利用XPS对铜薄膜成长的反应机理进行了探讨,由薄膜的Cu2p、Ols、Fls、Si2p谱可推论出,XPS谱中所出现的C=O、OH及CF3／CF2可能为Cu(hfac),当Cu(hfac)2在高温下分解成Cu(hfac)及hfac后,H2还原表面的hfac生成OH基,反应进行一段时间,OH基浓度大到一定的程度后,与Cu(hfac)2热裂解产生的hfac作用生成HO-hfac并脱附,使表面的铜的氧化物被还原以及发生Cu(hfac)2与H2的氧化还原反应．     

Effect of Substrate Bias on Microstructures of Zirconia Thin Films Deposited by Cathodic Vacuum Arc

Zirconium oxide （Zr02） thin films are deposited at room temperature by cathodic arc at substrate biases of 0 V, -60 V and -120 V, respectively. The crystal structure, composition, morphology, and deposition rate of the as-deposited thin films are systematically investigated by x-ray diffraction, x-ray photoelectron spectroscopy （XPS） as well as scanning electron microscopy. The results show that the crystal structure, morphology and deposition rate of the films all are dependant on substrate bias. With the increase of bias voltage from 0 V to -120 V, the zirconium oxide thin film grown on silicon wafer first exhibits monoclinic lattice and tetragonal lattice, further evolves monoclinic phase with the preferred orientation along the （-111） and （-222） directions at -60 V and finally along nearly one observed preferred （002） direction under -120 V. In addition, the variations of morphology with bias voltage are correlated to changes of the film structure. The results of XPS demonstrate that Zr elements are almost oxidized completely in the films achieved under -120 V bias.     

Oxidation study of silicon nanoparticle thin films on HOPG

Thin films of silicon nanoparticles (diameter 5-10 nm) were deposited on highly oriented pyrolytic graphite (HOPG) by low-pressure DC magnetron sputtering. The effect of different room-temperature oxidation techniques was investigated using XPS sputter-depth profiling. Both oxygen treatment during deposition (using an argon-oxygen mixture in the sputter gas) as well as post-deposition oxidation techniques (exposure to oxygen plasma beam, ambient air conditions) were studied. In all cases oxidation was found to involve the whole film down to the film/substrate interface, indicating a network of open pores. Depending on the type of oxidation between 15 and 25 at% of oxygen, mostly associated with low oxidation states of silicon, were detected in the interior of the film and attributed to oxidized surfaces of the individual silicon nanoparticles. The highest oxygen concentrations were found at the very film surface, reaching levels of 25-30% for films exposed to air or prepared by reactive magnetron sputtering. For the oxygen plasma-treated films even oxygen surface concentrations around 45% and fully oxidized silicon (i.e., SiO₂) were achieved. At the Si/HOPG interface formation of silicon carbide was observed due to intermixing induced by Ar-ion beam used for sputter-depth profiling.     

退火及超声处理对ZnO薄膜结构和发光特性的影响

 利用对向靶射频磁控溅射系统在Si（100）衬底上制备了ZnO薄膜,并对其进行了退火和超声处理。采用XRD,AFM和光致发光谱对其结构、表面形貌和性能进行了分析。结果表明：沉积态ZnO薄膜（002）择优取向稍差,尺寸较小,表面粗糙度较大。随退火温度的升高,颗粒粒径增大,样品的取向性和结晶度都明显变好,应力状态由压应力转变为张应力,粗糙度降低。超声处理缓解了薄膜中的张应力,晶粒尺寸更趋增大;用波长为280 nm的激发光激发薄膜时,沉积态薄膜无发光峰存在;随着退火温度升高,出现了一个378 nm的紫外峰和一个398 nm的紫峰;紫外峰峰值强度随退火温度升高不断增强,而紫峰的峰位随退火温度升高基本不发生变化,峰值强度增强;700 ℃退火后的薄膜经超声处理后,发光谱中出现了峰值波长为519 nm的绿色发光带。     

Growth,structure, and thermal stability of epitaxial BaTiO3 films on Pt(111)

The growth of epitaxial ultrathin BaTiO₃ films upon rf magnetron sputter deposition on a Pt(111) substrate has been studied by scanning tunnelling microscopy, low-energy electron diffraction, and X-ray photoelectron spectroscopy. The BaTiO₃ films have been characterized from the initial stages of growth up to a film thickness of 4 unit cells. The deposited films develop a long-range order upon annealing at 1050 K in UHV. In the submonolayer regime a wetting layer is formed on Pt(111). Thicker films reveal a Stranski–Krastanov-like structure as observed with STM. By XPS a good agreement of the thin film stoichiometry with BaTiO₃ single crystal data is determined. Due to annealing at 1150 K BaTiO₃ forms large two-dimensional islands on the Pt(111) substrate. Different surface structures develop on the islands depending on the O₂ partial pressure during annealing.     

Thin film stress measurement by instrumented optical fibre displacement sensor

Residual stress can adversely affect the mechanical, electronic, optical and magnetic properties of thin films. This work describes a simple stress measurement instrument based on the bending beam method together with a sensitive non-contact fibre optical displacement sensor. The fibre optical displacement sensor is interfaced to a computer and a Labview programme enables film stress to be determined from changes in the radius of curvature of the film-substrate system. The stress measurement instrument was tested for two different kinds of thin film, hard amorphous carbon nitride (CN) and soft copper (Cu) films on silicon substrates deposited by RF magnetron sputtering. Residual stress developed in 500 nm thick CN thin films deposited at substrate temperatures in the range 50-550 °C was examined and it was found that stress in CN films decreased from 0.83 to 0.44 GPa compressive with increase of substrate temperature. Residual stress was found to be tensile (121 MPa) for Cu films of thickness 1500 nm deposited at room temperature.     

Characteristics of Cu films prepared using a magnetron sputter type negative ion source (MSNIS)

Cu films have been deposited at room temperature using a magnetron sputter type negative ion source (MSNIS) at various conditions. By the principle of operation, the negative ion production probability is the function of the Cs flow rate in MSNIS. A set of films were deposited at different Cs flow rates and compared with normal-magnetron-sputtered films. The long-throw method was combined to MSNIS to increase the directionality and the negative ion arrival ratio. The film properties, such as resistivity, surface roughness, film structure, and step coverage on high aspect-ratio trench samples were obtained and analyzed using SEM, SIMS and AFM methods. The results showed that the resistivity of the film improved toward the theoretical values from 2.3 to 1.8 μΩ cm for the 100 nm thickness films. AFM scan of the film showed surface roughness was improved using MSNIS by ion bombarding effect. Depth profiling SIMS result showed Cs level resided in the film was less than 1 × 10¹⁹ at./cm³. As an application, Cu seed layer deposition on trench structure was investigated. Cross-sectional SEM was employed to see the step coverage of the film. The biasing effect was investigated. The different biasing conditions resulted as the clearly different coverage mode.     

铒掺杂富硅热化SiO2／Si发光薄膜的显微结构

利用金属蒸气真空弧(MEVVA)离子源将稀土元素Er离子掺杂到富硅热氧化SiO2/Si薄膜中.卢瑟福背散射(RBS)和X-射线电子能谱仪(XPS)分析表明,Er浓度可达原子百分数(x)～10,即Er的原子体浓度为～1021·     

In2O3 透明薄膜晶体管的制备及其电学性能的研究

采用磁控溅射方法在玻璃衬底上生长了In₂O₃晶体薄膜.该薄膜具有(111)晶面择优取向,晶粒尺寸达到33 nm.利用光刻工艺制作了以In₂O₃晶体薄膜为沟道层的底栅式薄膜晶体管.In₂O₃薄膜晶体管具有良好的栅压调制特性,场效应迁移率达到6.3 cm²/(V·s),开关电流比为3×10³,阈值电压为-0.9 V.结果表明,In相似文献   

Two-step sputtered ZnO piezoelectric films for film bulk acoustic resonators

This study investigates high-performance ZnO piezoelectric films used for thin film bulk acoustic resonators (TFBAR). The ZnO piezoelectric film was deposited on a Pt/Ti electrode using an RF magnetron sputter by a two-step method at room temperature. The Pt/Ti electrode was deposited by a DC sputtering system, on which, ZnO piezoelectric films were deposited in one step and in two steps to minimize roughness in the first step and produce the preferred orientation in the second. Both field-emission scanning electron microscopy (FESEM) and atom force microscopy (AFM) revealed that ZnO piezoelectric film deposited by two-step sputtering exhibited favorable characteristics, such as a rigidly precise surface structure with surface roughness of 7.37 nm, even better than in one-step sputtering. Examining the ZnO thin film by X-ray diffraction (XRD) showed a much higher c-axis-preferring orientation than in one-step sputtering. The reflection coefficient of the resonator device was measured using an HP8720 network analyzer. The frequency response of the FBAR device exhibited a return loss of -25 dB at a resonant frequency of 2212 MHz with a high coupling coefficient of 6.7%. PACS 68.55.Jk; 43.35.Ns; 81.15.-z