A simple method of extracting the polarization charge density in the A1GaN/GaN heterostructure from current-voltage and capacitance-voltage characteristics

An Ni Schottky contact on the AlGaN/GaN heterostructure is fabricated. The flat-band voltage for the Schottky contact on the AlGaN/GaN heterostructure is obtained from the forward current-voltage characteristics. With the measured capacitance-voltage curve and the flat-band voltage, the polarization charge density in the AlGaN/GaN heterostructure is investigated, and a simple formula for calculating the polarization charge density is obtained and analyzed. With the approach described in this paper, the obtained polarization charge density agrees well with the one calculated by self-consistently solving Schrodinger’s and Poisson’s equations.     

Impact of dopants in GaN on the formation of two-dimensional electron gas in AlGaN/GaN heterostructure field-effect transistors

The two-dimensional electron gas distribution in AlGaN/GaN high electron mobility transistors is determined from the solution of the coupled Schr?dinger’s and Poisson’s equations. Considering the piezoelectric effect, the two-dimensional electron gas concentration is calculated to be as high as 7.7×10¹⁹ cm^-3. In order to obtain an understanding of how the two-dimensional electron gas distribution is influenced by dopants in GaN, we observed the two-dimensional electron gas concentration and occupation of sub-bands versus dopant concentration in the GaN layer of an AlGaN/GaN heterostructure. Our results show that the two-dimensional electron gas concentration is slightly increased at higher doping levels in GaN, while the quantum confinement in the AlGaN/GaN heterostructure is weakened with the increase of donor concentration in the GaN layer. Received: 26 May 2001 / Accepted: 23 July 2001 / Published online: 23 January 2002     

Influence of Schottky drain contacts on the strained AlGaN barrier layer of AlGaN/AlN/GaN heterostructure field-effect transistors

Rectangular Schottky drain AlGaN/AlN/GaN heterostructure field-effect transistors (HFETs) with different gate contact areas and conventional AlGaN/AlN/GaN HFETs as control were both fabricated with same size. It was found there is a significant difference between Schottky drain AlGaN/AlN/GaN HFETs and the control group both in drain series resistance and in two-dimensional electron gas (2DEG) electron mobility in the gate-drain channel. We attribute this to the different influence of Ohmic drain contacts and Schottky drain contacts on the strained AlGaN barrier layer. For conventional AlGaN/AlN/GaN HFETs, annealing drain Ohmic contacts gives rise to a strain variation in the AlGaN barrier layer between the gate contacts and the drain contacts, and results in strong polarization Coulomb field scattering in this region. In Schottky drain AlGaN/AlN/GaN HFETs, the strain in the AlGaN barrier layer is distributed more regularly.     

Comparison of electrical characteristic between AlN/GaN and AlGaN/GaN heterostructure Schottky diodes

Ni/Au Schottky contacts on AlN/GaN and AlGaN/GaN heterostructures are fabricated.Based on the measured current–voltage and capacitance–voltage curves,the electrical characteristics of AlN/GaN Schottky diode,such as Schottky barrier height,turn-on voltage,reverse breakdown voltage,ideal factor,and the current-transport mechanism,are analyzed and then compared with those of an AlGaN/GaN diode by self-consistently solving Schrdinger’s and Poisson’s equations.It is found that the dislocation-governed tunneling is dominant for both AlN/GaN and AlGaN/GaN Schottky diodes.However,more dislocation defects and a thinner barrier layer for AlN/GaN heterostructure results in a larger tunneling probability,and causes a larger leakage current and lower reverse breakdown voltage,even though the Schottky barrier height of AlN/GaN Schottky diode is calculated to be higher that of an AlGaN/GaN diode.     

AlGaN/GaN heterostructure-based surface acoustic wave-structures for chemical sensors

We present a new approach in forming of interdigital surface acoustic wave-structures on AlGaN/GaN heterostructure to be applied in chemical sensors technology. This approach uses a selective self-aligned SF₆ plasma treatment of the AlGaN/GaN barrier layer to modify 2DEG density and surface field distribution in the range of interdigital transducers (IDTs) thus enabling SAW excitation. Secondary ion mass spectroscopy was applied to explain the modification of 2DEG density in the plasma treated AlGaN/GaN heterostructure. The initial results in the process technology and characterization are presented.     

Optimization of two-dimensional electron gases and – characteristics for AlGaN/GaN HEMT devices

In this paper, we take account of the spontaneous and piezoelectric polarization effect at the heterointerface in the AlGaN/GaN HEMT device, and one-dimensional Schrödinger–Poisson equations are solved self-consistently using a nonuniform mesh; using our findings, the AlGaN/GaN heterostructure conduction band and the two-dimensional electron gas (2DEG) density are investigated. The dependences of the 2DEG characteristics on the Al fraction, the thickness of each layer, the donor concentration and the gate voltage are investigated through simulation. The output characteristics are simulated using a quasi-2D model; a saturation voltage and threshold voltage are also shown. The influence of the spacer layer width on the 2DEG density is calculated for the first time. An explanation and analyses are given.     

极化效应对AlGaN/GaN异质结p-i-n光探测器的影响

基于等效薄层电荷近似模拟表征极化电荷的作用, 通过自洽求解Poisson-Schrödinger方程以及求解载流子连续性方程, 计算并且讨论了p-AlGaN层掺杂浓度和界面极化电荷对AlGaN/GaN异质结p-i-n紫外探测器能带结构和电场分布以及光电响应的影响. 结果表明, 极化效应与p-AlGaN层掺杂浓度相互作用对探测器性能有较大影响. 其中, 在完全极化条件下, p-AlGaN层掺杂浓度越大, p-AlGaN层的耗尽区越窄, i-GaN层越容易被耗尽, 器件光电流越小. 在一定掺杂浓度条件下, 极化效应越强, p-AlGaN层的耗尽区越宽, 器件的光电流越大. 最后还分析了该结构在不同温度下的探测性能, 证明了该结构可以在高温下正常工作.     

界面电偶极子对GaN/AlGaN/GaN光电探测器紫外/太阳光选择比的影响

在GaN/AlGaN/GaN倒置异质结光电二极管（IHP）中，存在于AlGaN/GaN异质结界面处强烈的极化效应对器件的紫外/太阳光(UV/Solar)选择比产生了重要的影响.将极化效应总的影响分为两部分：电偶极子和极化项，在建立的GaN/AlGaN/GaN结构IHP模型的基础上，对电偶极子 对器件UV/Solar选择比的影响进行了分析.分析结果表明，只有在考虑电偶极子的影响时， 光电探测器的UV/Solar选择比在10³数量级左右，与实验结果符合较好.因此， 在IHP中必须考虑电偶极子的影响. 关键词： 紫外/太阳光选择比 太阳盲区探测器 极化 电偶极子     

Effects of the strain relaxation of an AlGaN barrier layer induced by various cap layers on the transport properties in AlGaN/GaN heterostructures

The strain relaxation of an AlGaN barrier layer may be influenced by a thin cap layer above, and affects the transport properties of AlGaN/GaN heterostructures. Compared with the slight strain relaxation found in AlGaN barrier layer without cap layer, it is found that a thin cap layer can induce considerable changes of strain state in the AlGaN barrier layer. The degree of relaxation of the AlGaN layer significantly influences the transport properties of the two-dimensional electron gas (2DEG) in AlGaN/GaN heterostructures. It is observed that electron mobility decreases with the increasing degree of relaxation of the AlGaN barrier, which is believed to be the main cause of the deterioration of crystalline quality and morphology on the AlGaN/GaN interface. On the other hand, both GaN and AlN cap layers lead to a decrease in 2DEG density. The reduction of 2DEG caused by the GaN cap layer may be attributed to the additional negative polarization charges formed at the interface between GaN and AlGaN, while the reduction of the piezoelectric effect in the AlGaN layer results in the decrease of 2DEG density in the case of AlN cap layer.     

Influence of thermal stress on the relative permittivity of the AlGaN barrier layer in an AlGaN/GaN heterostructure Schottky contacts

Ni Schottky contacts on AlGaN/GaN heterostructures were fabricated. Some samples were thermally treated in a furnace with N₂ ambience at 600 °C for different times (0.5 h, 4.5 h, 10.5 h, 18 h, 33 h, 48 h, and 72 h), the others were thermally treated for 0.5 h at different temperatures (500 °C, 600 °C, 700 °C, and 800 °C). With the measured current—voltage (I—V) and capacitance—voltage (C—V) curves and by self-consistently solving Schrodinger's and Poisson's equations, we found that the relative permittivity of the AlGaN barrier layer was related to the piezoelectric and the spontaneous polarization of the AlGaN barrier layer. The relative permittivity was in proportion to the strain of the AlGaN barrier layer. The relative permittivity and the strain reduced with the increased thermal stress time until the AlGaN barrier totally relaxed (after 18 h at 600 °C in the current study), and then the relative permittivity was almost a constant with the increased thermal stress time. When the sample was treated at 800 °C for 0.5 h, the relative permittivity was less than the constant due to the huge diffusion of the contact metal atoms. Considering the relation between the relative permittivity of the AlGaN barrier layer and the converse piezoelectric effect, the conclusion can be made that a moderate thermal stress can restrain the converse piezoelectric effect and can improve the stability of AlGaN/GaN heterostructure devices.     

高温AlN插入层对AlGaN/GaN异质结材料和HEMTs器件电学特性的影响

研究了在GaN缓冲层中插入40 nm厚高温AlN层的GaN外延层和AlGaN/GaN异质结材料, AlN插入层可以增加GaN层的面内压应力并提高AlGaN/GaN高电子迁移率晶体管（HEMTs）的电学特性. 在精确测量布拉格衍射角的基础上定量计算了压应力的大小. 增加的压应力一方面通过增强GaN层的压电极化电场, 提高了AlGaN/GaN异质结二维电子气（2DEG）面密度, 另一方面使AlGaN势垒层对2DEG面密度产生的两方面影响相互抵消. 同时, 这种AlN插入层的采用降低了GaN与AlGaN层之间的 关键词： 高温AlN插入层 AlGaN/GaN异质结 二维电子气 应力     

Electron mobility in the linear region of an AlGaN/AlN/GaN heterostructure field-effect transistor

We simulate the current-voltage （I-V） characteristics of AlGaN/AlN/GaN heterostructure field-effect transistors （HFETs） with different gate lengths using the quasi-two-dimensional （quasi-2D） model. The calculation results obtained using the modified mobility model are found to accord well with the experimental data. By analyzing the variation of the electron mobility for the two-dimensional electron gas （213EG） with the electric field in the linear region of the AlGaN/AlN/GaN HFET I-V output characteristics, it is found that the polarization Coulomb field scattering still plays an important role in the electron mobility of AlGaN/AlN/GaN HFETs at the higher drain voltage and channel electric field. As drain voltage and channel electric field increase, the 2DEG density reduces and the polarization Coulomb field scattering increases, as a result, the 2DEG electron mobility decreases.     

阶梯AlGaN外延新型Al_(0.25)Ga_(0.75)N/GaNHEMTs击穿特性分析

为了优化AlGaN/GaN HEMTs器件表面电场,提高击穿电压,本文首次提出了一种新型阶梯AlGaN/GaN HEMTs结构.新结构利用AlGaN/GaN异质结形成的2DEG浓度随外延AlGaN层厚度降低而减小的规律,通过减薄靠近栅边缘外延的AlGaN层,使沟道2DEG浓度分区,形成栅边缘低浓度2DEG区,低的2DEG使阶梯AlGaN交界出现新的电场峰,新电场峰的出现有效降低了栅边缘的高峰电场,优化了AlGaN/GaN HEMTs器件的表面电场分布,使器件击穿电压从传统结构的446 V,提高到新结构的640 V.为了获得与实际测试结果一致的击穿曲线,本文在GaN缓冲层中设定了一定浓度的受主型缺陷,通过仿真分析验证了国际上外延GaN缓冲层时掺入受主型离子的原因,并通过仿真分析获得了与实际测试结果一致的击穿曲线.     

Electron mobility limited by surface and interface roughness scattering in AlxGa1-xN/GaN quantum wells

The electron mobility limited by the interface and surface roughness scatterings of the two-dimensional electron gas in AlxGa1-xN/GaN quantum wells is studied. The newly proposed surface roughness scattering in the AlGaN/GaN quantum wells becomes effective when an electric field exists in the AlxGa1-xN barrier. For the AlGaN/GaN potential well, the ground subband energy is governed by the spontaneous and the piezoelectric polarization fields which are determined by the barrier and the well thicknesses. The thickness fluctuation of the AlGaN barrier and the GaN well due to the roughnesses cause the local fluctuation of the ground subband energy, which will reduce the 2DEG mobility.     

The low-temperature mobility of two-dimensional electron gas in AlGaN/GaN heterostructures

To reveal the internal physics of the low-temperature mobility of two-dimensional electron gas （2DEG） in Al- GaN/GaN heterostructures, we present a theoretical study of the strong dependence of 2DEG mobility on Al content and thickness of AlGaN barrier layer. The theoretical results are compared with one of the highest measured of 2DEG mobility reported for AlGaN/GaN heterostructures. The 2DEG mobility is modelled as a combined effect of the scat- tering mechanisms including acoustic deformation-potential, piezoelectric, ionized background donor, surface donor, dislocation, alloy disorder and interface roughness scattering. The analyses of the individual scattering processes show that the dominant scattering mechanisms are the alloy disorder scattering and the interface roughness scattering at low temperatures. The variation of 2DEG mobility with the barrier layer parameters results mainly from the change of 2DEG density and distribution. It is suggested that in AlGaN/GaN samples with a high Al content or a thick AlGaN layer, the interface roughness scattering may restrict the 2DEG mobility significantly, for the AlGaN/GaN interface roughness increases due to the stress accumulation in AlGaN layer.     

Influence of temperature on strain-induced polarization Coulomb field scattering in AlN/GaN heterostructure field-effect transistors

Electron mobility scattering mechanism in AlN/GaN heterostuctures is investigated by temperature-dependent Hall measurement, and it is found that longitudinal optical phonon scattering dominates electron mobility near room temperature while the interface roughness scattering becomes the dominant carrier scattering mechanism at low temperatures(～100 K).Based on measured current–voltage characteristics of prepared rectangular AlN/GaN heterostructure field-effect transistor under different temperatures, the temperature-dependent variation of electron mobility under different gate biases is investigated. The polarization Coulomb field(PCF) scattering is found to become an important carrier scattering mechanism after device processing under different temperatures. Moreover, it is found that the PCF scattering is not generated from the thermal stresses, but from the piezoelectric contribution induced by the electrical field in the thin AlN barrier layer. This is attributed to the large lattice mismatch between the extreme thinner AlN barrier layer and GaN, giving rise to a stronger converse piezoelectric effect.     

具有部分本征GaN帽层新型AlGaN/GaN高电子迁移率晶体管特性分析

为了优化传统Al GaN/GaN高电子迁移率晶体管(high electron mobility transistors,HEMTs)器件的表面电场,提高击穿电压,本文提出了一种具有部分本征GaN帽层的新型Al GaN/GaN HEMTs器件结构.新型结构通过在Al GaN势垒层顶部、栅电极到漏电极的漂移区之间引入部分本征GaN帽层,由于本征GaN帽层和Al GaN势垒层界面处的极化效应,降低了沟道二维电子气(two dimensional electron gas,2DEG)的浓度,形成了栅边缘低浓度2DEG区域,使得沟道2DEG浓度分区,由均匀分布变为阶梯分布.通过调制沟道2DEG的浓度分布,从而调制了Al GaN/GaN HEMTs器件的表面电场.利用电场调制效应,产生了新的电场峰,且有效降低了栅边缘的高峰电场,Al GaN/GaN HEMTs器件的表面电场分布更加均匀.利用ISE-TCAD软件仿真分析得出:通过设计一定厚度和长度的本征GaN帽层,Al GaN/GaN HEMTs器件的击穿电压从传统结构的427 V提高到新型结构的960 V.由于沟道2DEG浓度减小,沟道电阻增加,使得新型Al GaN/GaN HEMTs器件的最大输出电流减小了9.2%,截止频率几乎保持不变,而最大振荡频率提高了12%.     

Distribution of donor states on the surfaceof AlGaN/GaN heterostructures

The uniform distribution model of the surface donor states in AlGaN/GaN heterostructures has been widely used in the theoretical calculation. A common and a triple-channel AlGaN/GaN heterostructure Schottky barrier diodes have been fabricated to verify the models, but the calculation results show the uniform distribution model can not provide enough electrons to form three separate 2DEGs in the triple-channel AlGaN/GaN heterostructure. Our experiments indicate the uniform distribution model is not quite right, especially for the multiple-channel AlGaN/GaN heterostructures. Besides, it is found the exponential distribution model possibly matches the actual distribution of the surface donor states better, which allows the 2DEG to form in each channel structure during the calculation. The exponential distribution model would be helpful in the research field.     

AlGaN/GaN双异质结F注入增强型高电子迁移率晶体管

理论模拟了不同GaN沟道厚度的双异质结(AlGaN/GaN/AlGaN/GaN)材料对高电子迁移率晶体管(HEMT)特性的影响,并模拟了不同F注入剂量下用该材料制作的增强型器件的特性差异.采用双异质结材料,结合F注入工艺成功地研制出了较高正向阈值电压的增强型HEMT器件.实验研究了三种GaN沟道厚度制作的增强型器件直流特性的差异,与模拟结果进行了对比验证.采用降低的F注入等离子体功率,减小了等离子体处理工艺对器件沟道迁移率的损伤,研制出的器件未经高温退火即实现了较高的跨导和饱和电流特性.对14 nm GaN沟道厚度的器件进行了阈值电压温度稳定性和栅泄漏电流的比较研究,并且分析了双异质结器件的漏致势垒降低效应.     

The effect of single A1GaN interlayer on the structural properties of GaN epilayers grown on Si （111） substrates

High-quality and nearly crack-free GaN epitaxial layer was obtained by inserting a single AlGaN interlayer between GaN epilayer and high-temperature AlN buffer layer on Si (111) substrate by metalorganic chemical vapor deposition. This paper investigates the effect of AlGaN interlayer on the structural properties of the resulting GaN epilayer. It confirms from the optical microscopy and Raman scattering spectroscopy that the AlGaN interlayer has a remarkable effect on introducing relative compressive strain to the top GaN layer and preventing the formation of cracks. X-ray diffraction and transmission electron microscopy analysis reveal that a significant reduction in both screw and edge threading dislocations is achieved in GaN epilayer by the insertion of AlGaN interlayer. The process of threading dislocation reduction in both AlGaN interlayer and GaN epilayer is demonstrated.