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1.
The ever decreasing size of modern electronic packaging has induced researchers to search for an effective and efficient heat removal system to handle the continuously increasing power density. Investigations have involved different geometry, material and coolant to address the thermal management issues. This paper reports the potential improvement in the overall performance of a rectangular microchannel heat sink using a new gaseous coolant namely ammonia gas. Using a multi-objective general optimization scheme with the thermal resistance model as an analysis method in combination with a non-dominated sorting genetic algorithm as an optimization technique, it was found that significant reduction in the total thermal resistance up to 34?% for ammonia-cooled compared to air-cooled microchannel heat sink under the same operating conditions is achievable. In addition, a considerable decrease in the microchannel heat sink’s mass up to 30?% was achieved due to the different heat sink’s material used.  相似文献   

2.
This study utilizes a versatile superposition method with thermal resistance network analysis to design and experiment on a thermal module with embedded six L-shaped or two U-shaped heat pipes and plate fins under different fan speeds and heat source areas. This type of heat pipes-heat sink module successively transfer heat capacity from a heat source to the heat pipes, the heat sink and their surroundings, and are suitable for cooling electronic systems via forced convection mechanism. The thermal resistances contain all major components from the thermal interface through the heat pipes and fins. Thermal performance testing shows that the lowest thermal resistances of the representative L- and U-shaped heat pipes-heat sink thermal modules are respectively 0.25 and 0.17 °C/W under twin fans of 3,000 RPM and 30 × 30 mm2 heat sources. The result of this work is a useful thermal management method to facilitate rapid analysis.  相似文献   

3.
A three-dimensional numerical analysis of laminar fluid flow and conjugate heat transfer has been conducted for single- and two-layered micro-channel heat sinks. The validity of the numerical model has been confirmed by comparison with available experimental data. Results for the overall thermal resistance, pumping power, the maximum temperature difference on the heat-sink surface where the heat flux is applied, and an overall performance parameter were obtained for single- and two-layered sinks. The effects of Reynolds number, inlet velocity profile, and flow arrangement in the channels (parallel and counter) on these results are presented and discussed. A special emphasis was placed on the comparison between the thermal performances of the parallel and counter flow arrangements and further results were obtained in order to quantify and explain the relative performance under these flow arrangements.  相似文献   

4.
This paper inquires the effectiveness of a PCM-based heat sink as a reliable solution to portable electronic devices. This sink is composed of a PCM with low thermal conductivity and fins to boost its conductivity. The optimization is subjected to fixed heat sink volume filled with PCM between vertical equidistant fins. New fins are installed in the unheated space existing in each enclosure which is not involved in thermal distribution from vertical fins to the PCM. Based on the same principle, new fins generations are augmented stepwise to the multi-scale structure. The steps of adding fins will continue up to the point that the objective function reaches its maximal value, i.e., maximizing the longest safe operation time without allowing the electronics to reach the critical temperature. The results indicate that in each length of the enclosure, the optimum volume fraction and the best fins distance values exist in which the heat sink performance becomes maximum, and adding more fins lowers the performance of the heat sink. Increasing the enclosure’s length by \(2^{n}\) does not change them. For an enclosure with constant length, the optimal number of steps for adding fins within the enclosure is a function of the fin thickness. The results indicate that increasing the thickness changes the optimal number of adding fins inside the enclosure (normally a decrease). As the fin thickness is lowered, there will be a higher effect by adding vertical fins in the enclosure. Numerical simulations cover the Rayleigh number range \(2\times 10^{5}\le \hbox {Ra}_{\mathrm{H}} \le 2.7\times 10^{8}\), where H is the heat sink height.  相似文献   

5.
This study evaluated a silicon-based micro-jet impingement heat sink for electronic cooling applications. First, the pressure-drop and thermal characteristics were investigated for steady incompressible and laminar flow by solving three-dimensional Navier–Stokes equations, and the performance enhancement was carried out through parametric and optimization studies. Several parallel and staggered micro-jet configurations consisting of a maximum of 16 jet impingements were tested. The effectiveness of the micro-jet configurations, i.e. inline 2 × 2, 3 × 3 and 4 × 4 jets, and staggered 5-jet and 13-jet arrays with nozzle diameters 50, 76, and 100 μm, were analyzed at various flow rates for the maximum temperature-rise and pressure-drop characteristics. A design with a staggered 13-jet array showed the best performance among the various configurations investigated in the present study. The design optimization based on three-dimensional numerical analysis, surrogate modeling and a multi-objective evolutionary algorithm were carried out to understand the thermal resistance and pumping power correlation of the micro-jet impingement heat sink. Two design variables, the ratio of height of the channel and nozzle diameter, and the ratio of nozzle diameter and interjet spacing, were chosen for design optimization. The global Pareto-optimal front was achieved for overall thermal resistance and required pumping power of the heat sink. The Pareto-optimal front revealed existing correlation between pumping power and thermal resistance of the heat sink. Of the range of Pareto-optimal designs available, some representative designs were selected and their functional relationships among the objective functions and design variables were examined to understand the Pareto-optimal sensitivity and optimal design space. A minimum of 66 °C of maximum-temperature-rise was obtained for a heat flux of 100 W/cm2 at a pressure drop of about 24 kPa.  相似文献   

6.
The paper considers the flow of a power-law fluid past a vertical stretching sheet. Effects of variable thermal conductivity and non-uniform heat source/sink on the heat transfer are addressed. The thermal conductivity is assumed to vary linearly with temperature. Similarity transformation is used to convert the governing partial differential equations into a set of coupled, non-linear ordinary differential equations. Two different types of boundary heating are considered, namely Prescribed power-law Surface Temperature (PST) and Prescribed power-law Heat Flux (PHF). Shooting method is used to obtain the numerical solution for the resulting boundary value problems. The effects of Chandrasekhar number, Grashof number, Prandtl number, non-uniform heat source/sink parameters, wall temperature parameter and variable thermal conductivity parameter on the dynamics are shown graphically in several plots. The skin friction and heat transfer coefficients are tabulated for a range of values of the parameters. Present study reveals that in a gravity affected flow buoyancy effect has a significant say in the control of flow and heat transfer.  相似文献   

7.
A simple model was established to predict microchannel heat sink performance based on energy balance. Both hydrodynamically and thermally developed effects were included. Comparisons with the experimental data show that this model provides satisfactory thermal resistance prediction. The model is further extended to carry out geometric optimization on the microchannel heat sink. The results from the simple model are in good agreement as compared with those obtained from three-dimensional simulations.  相似文献   

8.
The steady increase in internal heat production of cost and high performance electronic components has lead researchers to seek improved ways to remove the heat generated. Single-phase liquid flow has been considered as a potential solution for solving this cooling problem. However, when considering that any solution needs to be of low cost and low mass fluxes and yet retain low temperature gradients across the electronic components, it seems that two-phase boiling flow is preferred. Surfactant solutions have been introduced in connection with enhancement of the boiling processes. We investigated the effects of surfactant solution flows through a micro-channel heat sink. The experimental setup included a high-speed IR radiometer and a CCD camera that were used to characterize the test module. The module consisted of inlet and outlet manifolds that distributed surfactant solutions through an array of 26 parallel micro-channels. The experimental results have shown that there exists an optimal solution concentration and mass flux for enhancing heat removal. Surfactant solution boiling flows were also found to stabilize the maximum and average surface temperatures for a wide range of applied heat fluxes. In addition, the use of surfactant solutions at low mass fluxes has led to CHF enhancement when compared to regular water flows. In the last part of this work, possible explanations for the observed non-ionic surfactant effects are presented.  相似文献   

9.
刚度和强度是薄板结构的两个主要性能。在瞬态传热过程中,考虑热-力耦合,随时间和空间变化的非均匀温度场在结构中会引起热变形和热应力,温度场随时间变化的规律和空间分布依赖于板的厚度变化,进而影响板的刚度和强度。因此,考虑瞬态传热的薄板优化问题具有更强的非线性,更加难以求解。本文给出一种包络-准则方法处理这类结构优化问题。首先,针对外力荷载,进行一个结构柔顺性的优化设计;以这一设计为基础,通过瞬态热-力耦合分析及优化准则,计算多个时刻的优化设计变量并取其包络,对上述优化结果进行迭代修正,以消除瞬态温度场作用下较高的局部应力。优化算例表明,该方法对于考虑瞬态传热薄板优化问题有效。  相似文献   

10.
The present paper deals with the analysis of boundary layer flow and heat transfer of a dusty fluid over a stretching sheet with the effect of non-uniform heat source/sink. Here we consider two types of heating processes namely (i) prescribed surface temperature and (ii) prescribed surface heat flux. The momentum and thermal boundary layer equations of motion are solved numerically using Runge Kutta Fehlberg fourth–fifth order method (RKF45 Method). The effects of fluid particle interaction parameter, Eckert number, Prandtl number, Number of dust particle and non-uniform heat generation/absorption parameter on temperature distribution are analyzed and also the effect of wall temperature gradient function and wall temperature function are tabulated and discussed.  相似文献   

11.
A general analytical solution for an isotropic trimaterial interacted with a point heat source is provided in this paper. Based on the method of analytical continuation in conjunction with the alternating technique, the solutions to heat conduction and thermoelasticity problems for three dissimilar media are first derived. A rapidly convergent series solution for both the temperature and stress functions, which is expressed in terms of an explicit general term of the complex potential of the corresponding homogeneous problem, is obtained in an elegant form. As a numerical illustration, the distributions of thermal stresses along the interface are presented for various material combinations and for different positions of the applied heat source and heat sink.  相似文献   

12.
This paper investigates the thermal behaviour of two micro-channel elements cooled by Newtonian and non-Newtonian fluids, with the objective to maximise thermal conductance subject to constraints. This is done firstly for a two-dimensional duct micro-channel and secondly for a three-dimensional complex micro-channel. A numerical model is used to solve the governing equations relating to flow and temperature fields for both cases. The geometric configuration of each cooling channel is optimised for Newtonian and non-Newtonian fluid at a fixed inlet velocity and heat flux. In addition, the effect of porosity on thermal conductance is investigated. It was found, in both cases, that the non-Newtonian fluid characteristics result in a significant variation in thermal conductance as inlet velocity is increased. The characteristics of a dilatant fluid greatly reduce thermal conductance on account of shear thickening on the boundary surface. In contrast, a pseudoplastic fluid shows increased thermal conductance. A comparison of the complex micro-channel and the duct micro-channel shows the improved thermal conductance resulting from greater flow access to the conductive area, achieved by the complex micro-channel.  相似文献   

13.
IntroductionAsakindofimportantthermalcharacteristicsofthematerial,thermalconductivitymustbedeterminedtomakequantificationalanalysisoftemperaturefield .Ithasbeentakendueattentiontoestimatethethermalconductivityfrominnerand/orboundarytemperaturemeasureme…  相似文献   

14.
《力学快报》2023,13(3):100432
Extensive improvements in small-scale thermal systems in electronic circuits, automotive industries, and microcomputers conduct the study of microsystems as essential. Flow and thermic field characteristics of the coherent nanofluid-guided microchannel heat sink are described in this perusal. The porous media approximate was used to search the heat distribution in the expanded sheet and Cu: γ - AlOOH/water. A hybrid blend of Boehme copper and aluminum nanoparticles is evaluated to have a cooling effect on the microchannel heat sink. By using Akbari Ganji and finite element methods, linear and non-linear differential equations as well as simple dimensionless equations have been analyzed. The purpose of this study is to investigate the fluid and thermal parameters of copper hybrid solution added to water, such as Nusselt number and Darcy number so that we can reach the best cooling of the fluid. Also, by installing a piece of fin on the wall of the heat sink, the coefficient of conductive heat transfer and displacement heat transfer with the surrounding air fluid increases, and the efficiency of the system increases. The overall results show that expanding values on the NP (series heat transfer fluid system maximizes performance with temperatures) volume division of copper, as well as boehmite alumina particles, lead to a decrease within the stream velocity of the Cu: AlOOH/water. Increasing the volume fraction of nanoparticles in the hybrid mixture decreases the temperature of the solid surface and the hybrid nanofluid. The Brownian movement improves as the volume percentage of nanoparticles in the hybrid mixture grows, spreading the heat across the environment. As a result, heat transmission rates rise. As the Darcy number increases, the thermal field for solid sections and Cu: AlOOH/water improves.  相似文献   

15.
In order to ensure the normal work of electronic product, the thermal management is of key importance. Miniature loop heat pipe (mLHP) is a promising device of heat transfer for electronic products. Cu-water nanofluid with different concentration is used as working material in mLHP. Experiments are conducted to investigate its heat transfer performance. The heat flux owing to thermal diffusion is calculated. It is found that this heat flux and the boiling temperature are non-monotonic function of concentration of nanoparticle. Turning concentration appears at about 1.5 wt%. Differential equation of thermal diffusion produced by micro movement of nanoparticle is established in this paper. Average speed formula for nanoparticles is derived and slope of the curve of phase equilibrium is obtained. Based on the theoretical research in this paper, enhanced heat transfer mechanism of nanofluid is analyzed. The facts that heat flux owing to thermal diffusion and boiling temperature are all associated with nanoparticle concentration are also well explained with the aid of the derived theory in this paper.  相似文献   

16.
In this study, a numerical simulation of copper microchannel heatsink (MCHS) using nanofluids as coolants is presented. The nanofluid is a mixture of pure water and nanoscale metallic or nonmetallic particles with various volume fractions. Also, the effects of various volume fractions, volumetric flow rate and various materials of nanoparticles on the performance of MCHS have been developed. A three-dimensional computational fluid dynamics model was developed using the commercial software package FLUENT, to investigate the conjugate fluid flow and heat transfer phenomena in micro channel heatsinks. The results show that the cooling performance of a microchannel heat sink with water based nanofluid containing Al2O3 (vol 8%) is enhanced by about 4.5% compared with micro channel heatsink with pure water. Nanofluids reduce both the thermal resistance and the temperature difference between the top (heated) surface of the MCHS and inlet nanofluid compared with that pure water. The cooling performance of a micro channel heat sink with metal nanofluids improves compared with that of a micro channel heat sink with oxide metal nanofluids because the thermal conductivity of metal nanofluid is higher than oxide metal nanofluids. Micro channel heat sinks with nanofluids are expected to be good candidates as the next generation cooling devices for removing ultra high heat flux.  相似文献   

17.
In order to study the heat transfer and pressure drop on four types of internal heat exchangers (IHXs) of a CO2 system, the experiment and numerical analysis were performed under a cooling condition. The configuration of the IHXs was a coaxial type and a micro-channel type. Two loops on the gas cooler part and the evaporator part were made, for experiment. And the section-by-section method and Hardy-Cross method were used for the numerical analysis. The capacity and pressure drop of the IHX are larger at the micro-channel type than at the coaxial type. When increasing the mass flow rate and the IHX length the capacity and pressure drop increase. The pressure drop of the evaporator loop is much larger than that of the gas cooler loop. The performance of the IHX was affected with operating condition of the gas-cooler and evaporator. The deviations between the experimental result and the numerical result are about ±20% for the micro-channel type and ±10% for the coaxial type. Thus, the new CO2 heat transfer correlation should be developed to precisely predict a CO2 heat transfer.  相似文献   

18.
In this paper, we present the numerical method for explaining the cooling performance of a microchannel heat sink with carbon nanotubes (CNTs)-fluid suspensions. Here we will show that with increase of nanolayer thickness of multiwalled carbon nanotubes (MWCNTs) the microchannel heat sink temperature gradient will be decreased. By using a theoretical model for explaining the enhancement in the effective thermal conductivity of nanotubes (cylindrical shape particles) for use in nanotube-in-fluid suspension, we investigate the temperature contours and thermal resistance of a microchannel heat sink with MWCNTs (with ~25 nm diameter) dispersed in water.  相似文献   

19.
20.
In the micro-molding of component with a micro-sized channel, the ability for polymer melt to flowing into the micro-channel in a macro-sized part is a big challenge. The multidimensional flow behaviors are included in the injection molding the macro-component with a micro-channel. In this case, a simplified model is used to analyze the flow behaviors of the macro-sized part within a micro-channel. The flow behaviors in the macro-cavity are estimated by using the finite element and finite difference methods. The influence of the injection rate, micro-channel size, heat transfer coefficient, and mold temperature on the flowing distance is investigated based on the non-isothermal analytic method. The results show that an increase in the radius of the micro-channel and mold temperature can improve effectively the flowing distance in the micro-channel.  相似文献   

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