基于LabVIEW的短波红外焦平面相对响应光谱测试系统

搭建了一套适用于短波红外焦平面的相对响应光谱自动测试系统。系统测试程序在LabVIEW虚拟仪器开发环境下完成,具备光栅单色仪的控制、数据采集处理与存储等功能。系统采用单光路标准代替法实现了相对响应光谱的校准。测试了InGaAs短波红外线列焦平面,得到了每个像元校准后的相对响应光谱,提取了峰值波长、截止波长等参数在线列上的分布情况,实现了对焦平面全像元的相对响应光谱测试。     

光谱重构油菜叶绿素含量快速检测方法及设备研制

为了实现油菜叶片中叶绿素含量的快速无损检测,开发了手持式多光谱成像系统用于采集油菜叶片在460,520,660,740,840和940 nm 六个波段的光谱图像。将一台能够采集可见光/近红外（380～1 023 nm）512个波段光谱图像但是价格高昂且体积大的室内高光谱成像系统作为参考仪器,将手持式多光谱成像系统作为目标仪器后,采用伪逆法（pseudo-inverse method）求得高光谱成像系统和多光谱成像系统两台仪器之间的转换矩阵F,从而实现6个波段的多光谱图像向512个波段的高光谱图像的重构,提高了手持式设备的光谱分辨率。运用偏最小二乘回归算法（PLSR）建立了重构的光谱与油菜叶片的叶绿素含量之间的关系模型。结果表明,重构的可见光范围内的光谱反射率与叶绿素浓度之间具有很强的相关性,PLSR回归模型建模集的决定系数R2_c为0.82,建模集均方根误差RMESC为1.98,预测集的决定系数R2_p为0.78,预测集均方根误差RMESP为1.50,RPD为2.14。虽然应用本文开发的手持式成像系统结合PLSR模型实现油菜叶绿素含量快速无损预测的精度低于基于室内高光谱成像系统获得的高光谱图像建立的PLSR模型（R2_c,RMESC,R2_p,RMESP和RPD分别为0.90,1.41,0.82,1.36和2.37）,但是明显优于基于原始多光谱成像系统4个波段（460,520,660和740 nm）反射率建立的PLSR模型得到的结果（R2_c,RMESC,R2_p,RMESP和RPD分别为0.78,2.06,0.72,1.85和1.88）。表明光谱重构技术可提高多光谱成像预测油菜叶绿素含量的精度,并且与室内高光谱成像系统相比,开发的手持式设备具有体积小、成本低廉和操作简便等优点,可为田间油菜叶片的生理状态和养分检测及可视化表达提供技术支持。     

高光谱成像技术无损检测赣南脐橙表面农药残留研究

高光谱成像技术具备图像和光谱的双重优势,作为一种快速无损检测分析技术,检测过程无损、无污染和无接触。高光谱成像数据包括样本的图像信息和光谱信息,采集样本高光谱成像数据时,样本的每个像素点都有一条光谱与之对应,样本的每个波长都有一幅灰度图像与之对应。研究采用高光谱成像技术无损检测不同稀释浓度的农药在赣南脐橙样品表面残留随时间变化的关系。用蒸馏水把农药分别配置成1∶20, 1∶100和1∶1 000倍的溶液。然后把不同浓度的溶液滴到30个洗净的脐橙表面, 将涂有农药的脐橙分别放置0,4和20 d,然后采集在900～1 700 nm波长范围的高光谱成像原始数据。通过主成分分析获取930,980,1 100,1 210,1 300,1 400,1 620和1 680 nm共8个特征波长,基于这些特征波长做第二次主成分分析,应用PC-2图像并经过适当的图像处理方法对不同浓度及放置不同天数的农药残留进行无损检测。采用高光谱成像技术检测三个时间段较高稀释浓度的果面农药残留都比较明显。高光谱成像技术作为一种检测方法,可用于评价各个时间段较高浓度的农药残留。     

Detector and readout performance goals for quantum well and strained layer superlattice focal plane arrays imaging under tactical and strategic backgrounds

Advancements in III–V semiconductor based, Quantum-well infrared photodetector (QWIP) and Type-II Strained-Layer Superlattice detector (T2SLS) technologies have yielded highly uniform, large-format long-wavelength infrared (LWIR) QWIP FPAs and high quantum efficiency (QE), small format, LWIR T2SLS FPAs. In this article, we have analyzed the QWIP and T2SLS detector level performance requirements and readout integrated circuit (ROIC) noise levels for several staring array long-wavelength infrared (LWIR) imaging applications at various background levels. As a result of lower absorption QE and less than unity photoconductive gain, QWIP FPAs are appropriate for high background tactical applications. However, if the application restricts the integration time, QWIP FPA performance may be limited by the read noise of the ROIC. Rapid progress in T2SLS detector material has already demonstrated LWIR detectors with sufficient performance for tactical applications and potential for strategic applications. However, significant research is needed to suppress surface leakage currents in order to reproduce performances at pixel levels of T2SLS FPAs.     

Noise characteristics analysis of short wave infrared InGaAs focal plane arrays

The increasing application of InGaAs short wave infrared (SWIR) focal plane arrays (FPAs) in low light level imaging requires ultra-low noise FPAs. This paper presents the theoretical analysis of FPA noise, and point out that both dark current and detector capacitance strongly affect the FPA noise. The impact of dark current and detector capacitance on FPA noise is compared in different situations. In order to obtain low noise performance FPAs, the demand for reducing detector capacitance is higher especially when pixel pitch is smaller, integration time is shorter, and integration capacitance is larger. Several InGaAs FPAs were measured and analyzed, the experiments’ results could be well fitted to the calculated results. The study found that the major contributor of FPA noise is coupled noise with shorter integration time. The influence of detector capacitance on FPA noise is more significant than that of dark current. To investigate the effect of detector performance on FPA noise, two kinds of photodiodes with different concentration of the absorption layer were fabricated. The detectors’ performance and noise characteristics were measured and analyzed, the results are consistent with that of theoretical analysis.     

C-QWIP focal plane arrays

We have been developing corrugated quantum well infrared photodetector (C-QWIP) technology for long wavelength applications. A number of large format 1024 × 1024 C-QWIP focal plane arrays (FPAs) have been demonstrated. In this paper, we will provide a detailed analysis on the FPA performance in terms of quantum efficiency η and compare it with a detector model. We found excellent agreement between theory and experiment when both the material parameters and the pixel geometry were taken into account. By changing the number of quantum wells, doping density, spectral bandwidth and pixel size, a range of η from 13% to 37% was obtained. This range of η, combined with the wide spectral width, enables C-QWIPs to be operated at a high speed. For example, model analysis shows that a C-QWIP FPA with 10.7 μm cutoff and 25 μm pitch will have a thermal sensitivity of 16 mK at 2 ms integration time with f/2 optics in the presence of 900 readout noise electrons.     

Large format voltage tunable dual-band QWIP FPAs

Third generation thermal imagers with dual/multi-band operation capability are the prominent focus of the current research in the field of infrared detection. Dual band quantum-well infrared photodetector (QWIP) focal plane arrays (FPAs) based on various detection and fabrication approaches have been reported. One of these approaches is the three-contact design allowing simultaneous integration of the signals in both bands. However, this approach requires three In bumps on each pixel leading to a complicated fabrication process and lower fill factor.If the spectral response of a two-stack QWIP structure can effectively be shifted between two spectral bands with the applied bias, dual band sensors can be implemented with the conventional FPA fabrication process requiring only one In bump on each pixel making it possible to fabricate large format dual band FPAs at the cost and yield of single band detectors. While some disadvantages of this technique have been discussed in the literature, the detailed assessment of this approach has not been performed at the FPA level yet. We report the characteristics of a large format (640 × 512) voltage tunable dual-band QWIP FPA constructed through series connection of MWIR AlGaAs–InGaAs and LWIR AlGaAs–GaAs multi-quantum well stacks, and provide a detailed assessment of the potential of this approach at both pixel and FPA levels. The dual band FPA having MWIR and LWIR cut-off wavelengths of 5.1 and 8.9 μm provided noise equivalent temperature differences as low as 14 and 31 mK (f/1.5) with switching voltages within the limits applicable by commercial read-out integrated circuits. The results demonstrate the promise of the approach for achieving large format low cost dual band FPAs.     

Demonstration of large format mid-wavelength infrared focal plane arrays based on superlattice and BIRD detector structures

We have demonstrated the use of bulk antimonide based materials and type-II antimonide based superlattices in the development of large area mid-wavelength infrared (MWIR) focal plane arrays (FPAs). Barrier infrared photodetectors (BIRDs) and superlattice-based infrared photodetectors are expected to outperform traditional III–V MWIR and LWIR imaging technologies and are expected to offer significant advantages over II–VI material based FPAs. We have used molecular beam epitaxy (MBE) technology to grow InAs/GaSb superlattice pin photodiodes and bulk InAsSb structures on GaSb substrates. The coupled quantum well superlattice device offers additional control in wavelength tuning via quantum well sizes and interface composition, while the BIRD structure allows for device fabrication without additional passivation. As a demonstration of the large area imaging capabilities of this technology, we have fabricated mid-wavelength 1024 × 1024 pixels superlattice imaging FPAs and 640 × 512 MWIR arrays based on the BIRD concept. These initial FPA have produced excellent infrared imagery.     

Demonstration of 640 × 512 pixels long-wavelength infrared (LWIR) quantum dot infrared photodetector (QDIP) imaging focal plane array

We have exploited the artificial atom-like properties of epitaxially grown self-assembled quantum dots (QDs) for the development of high operating temperature long wavelength infrared (LWIR) focal plane arrays (FPAs). QD infrared photodetectors (QDIPs) are expected to outperform quantum well infrared detectors (QWIPs) and are expected to offer significant advantages over II–VI material based FPAs. We have used molecular beam epitaxy (MBE) technology to grow multi-layer LWIR dot-in-a-well (DWELL) structures based on the InAs/InGaAs/GaAs material system. This hybrid quantum dot/quantum well device offers additional control in wavelength tuning via control of dot-size and/or quantum well sizes. DWELL QDIPs were also experimentally shown to absorb both 45° and normally incident light. Thus we have employed a reflection grating structure to further enhance the quantum efficiency. The most recent devices exhibit peak responsivity out to 8.1 μm. Peak detectivity of the 8.1 μm devices has reached 1 × 10¹⁰ Jones at 77 K. Furthermore, we have fabricated the first long-wavelength 640 × 512 pixels QDIP imaging FPA. This QDIP FPA has produced excellent infrared imagery with noise equivalent temperature difference of 40 mK at 60 K operating temperature.     

无基底焦平面阵列的红外成像性能分析

利用提出的光学读出非制冷红外成像系统,先后制作了单元尺寸各不相同的单层膜无基底焦平面阵列(focal plane array,FPA),获得了室温物体的热图像.分析发现,当FPA的单元尺寸从200μm逐渐减小到60μm时,基于恒温基底模型的理论响应与实验结果的偏差逐渐增大.通过有限元分析方法,模拟分析了不同尺寸的微梁单元在无基底FPA中的热学行为,发现了当单元尺寸逐渐减小时恒温基底模型偏差逐渐增大的原因,即无基底FPA的支撑框架不满足恒温基底条件,受热辐射后支撑框架的温升从基底上抬高了单元的温升.论文还分 关键词： 光学读出 非制冷红外成像 焦平面阵列 无基底     

植物叶片可见与近红外光谱反射率数据库的建立与主成分分析

可见与近红外波段光谱反射率数据库是颜色科学与技术和遥感目标地物分类识别领域等研究与应用的基础数据。主成分分析(PCA)在光谱数据分析、光谱重建、高光谱数据降维以及遥感图像分类等方面有广泛应用。测量并建立了云南公园常见绿化植物柳树、樟、红花檵木、蓝花楹等48种植物150条叶片从可见光到近红外波段光谱反射率数据库,波长范围400～1 000 nm、间隔4 nm。并且分别对可见与可见到近红外两种波段范围进行PCA研究。结果表明：不同植物叶片按照红、绿、黄相同色相的光谱反射率曲线基本相似;但对于同一种植物,在可见光波段400～700 nm,因为体内叶绿素、叶黄素、叶红素和花青苷含量的不同,光谱反射率曲线有较大的差异;在近红外波段700～1 000 nm,所有植物叶片光谱反射率仅仅是大小不同,而同一植物光谱反射率基本不随波长变化。PCA分析表明：在可见光和可见与近红外波段前三个主成分的累积贡献率分别达到98.62%和94.97%。数据库及其PCA分析结果将为自然物体光谱重建、多光谱成像技术和遥感目标地物分类识别等领域应用提供支撑。     

Optimization of corrugated-QWIPs for large format, high quantum efficiency, and multi-color FPAs

Previously, we demonstrated a large format 1024 × 1024 corrugated quantum well infrared photodetector focal plane array (C-QWIP FPA). The FPA has a cutoff at 8.6 μm and is BLIP at 76 K with f/1.8 optics. The pixel had a shallow trapezoidal geometry that simplified processing but limited the quantum efficiency QE. In this paper, we will present two approaches to achieve a larger QE for the C-QWIPs. The first approach increases the size of the corrugations for more active volume and adopts a nearly triangular pixel geometry for larger light reflecting surfaces. With these improvements, QE is predicted to be about 35% for a pair of inclined sidewalls, which is more than twice the previous value. The second approach is to use Fabry–Perot resonant oscillations inside the corrugated cavities to enhance the vertical electric field strength. With this approach, a larger QE of 50% can be achieved within certain spectral regions without using either very thick active layers or anti-reflection coatings. The former approach has been adopted to produce two FPAs, and the preliminary experimental results will be discussed. In this paper, we also describe using voltage tunable detector materials to achieve multi-color capability for these FPAs.     

Modeling and compensating non-uniformity in push-broom NIR hyperspectral imaging system

In this paper, a novel pixel-based model for the response of push-broom near infrared (NIR) hyperspectral cameras based on focal-plane array (FPA) photo-detectors is proposed. The model focuses on practical issues affecting the system response, such as the spatial and spectral non-uniformity (NU) observed in NIR hyperspectral imaging systems, and its novelty relies on considering the operating temperature of the FPA as a signal perturbing the response of the entire system. These effects have been estimated by experimental procedures. The applicability and accuracy of the proposed model has been assessed by mitigating for the spatial and spectral non-uniform responses of a real NIR hyperspectral imaging sequence.     

超光谱成像探测系统的图谱标定和评估

超光谱成像是一种场景图谱合一的技术,在战场侦察中得到了迅速应用。超光谱成像系统的标定是确定其输出准确数值的过程。分析了一种基于背照减薄CCD和凹面光栅成像光谱部件的UV/Vis/NIR超光谱军用探测系统,其光谱分辨力为3.3 nm;探讨了0.25～1.1μm工作波段内超光谱成像系统的标定和评估方法,详细介绍了以带有测试靶均匀辐射源为对象的空间成像质量评估、以激光和Hg灯为基础的光谱质量评估以及利用高精度标准辐射源的辐射性能标定。在经过多步辐射校正和光谱真实性检测验证后,最终获得的景物反射率光谱曲线真实反映了光谱特性,满足了0.2mrad的空间分辨力和±0.5％色散线性率的精度要求并在军用探测系统中进行了反伪装的成功应用。     

低温冷冻和机械损伤条件下马铃薯高光谱图像特征响应特性研究

开展了低温冷冻和机械损伤条件下马铃薯高光谱图像特征响应特性研究。采用卓立汉光公司Image~λ“谱像”系列高光谱相机获取完好的、低温冷冻和机械损伤条件下的光谱波段范围为387～1 035 nm的马铃薯高光谱图像;截取校正后的像素尺寸大小为60×60的马铃薯高光谱中部完好的图像并计算该区域平均反射率值;冻伤的马铃薯样本的反射光谱曲线在440,560和680 nm附近有明显吸收峰;机械损伤样本在560和680 nm附近有明显吸收峰,在680 nm附近吸收峰谷值明显低于冻伤样本;完好的马铃薯样本反射光谱曲线相对较为平滑,在560和680 nm附近未见明显吸收峰;撞伤样本在440,560和680 nm附近存在吸收峰,而在410 nm附近有一个明显的反射峰。四类马铃薯样本的反射光谱曲线特征峰值表现出一定的指纹特性,因而可以被用于后续品质特征检测分析使用。由于仪器或检测环境、光照强弱等因素影响,光谱数据中掺杂噪声,因此采用化学计量学预处理方法消除噪声的影响;随机选取70%的马铃薯四类样本的反射光谱作为训练数据,剩余的30%作为测试集;接着,利用极端梯度提升算法、类型提升算法和轻量梯度提升机算法来获取马铃薯高光谱图像的有效特征波谱,减少高维海量高光谱数据对后续品质分类模型的影响;最后,将提取到的有效特征波长构建马铃薯品质判别模型。在建立的分类模型中,使用的轻量梯度提升机+逻辑斯蒂回归达到最高的判别精度98.86%。该研究为将来高光谱图像成像技术在现代农业生产加工过程中马铃薯品质有效监测与控制提供理论基础和技术支撑。     

高光谱成像技术对鲜枣内外部品质检测的研究

外部缺陷以及内部可溶性固形物的含量对提升鲜枣的采后附加值和鲜枣后续生产加工具有重要的意义,因此,为了实现同时对鲜枣内外部品质进行快速、准确识别,利用高光谱成像技术(450-1,000 nm)对壶瓶枣的“自然损伤”和可溶性固形物含量同时进行检测研究。首先,对光谱数据进行主成分分析(PCA)得到前7个主成分光谱值,对图像数据采用灰度共生矩阵(GLCM)提取到7项图像纹理指标(对比度、相关性、能量、同质性、方差、均值、熵)。然后,分别使用光谱主成分值、图像纹理特征值、以及主成分与纹理特征融合值建立偏最小二乘支持向量机(LS-SVM)模型对壶瓶枣的外部缺陷(“自然损伤”)和内部品质(可溶性固形物含量)进行检测研究。结果表明：使用主成分与纹理特征融合值建立的LS-SVM模型可作为通用模型同时对壶瓶枣内外部品质进行检测研究,其“自然损伤”判别正确率为92.5%,可溶性固形物预测集的预测相关系数(R_p)和预测均方根误差(RMSEP)分别达到了0.944和0.495。表明,采用高光谱成像技术可以建立通用模型同时对壶瓶枣的内外部品质进行检测,该研究为壶瓶枣的无损检测提供了理论参考。     

Assessment of HgCdTe photodiodes and quantum well infrared photoconductors for long wavelength focal plane arrays

Recent trends in infrared detectors are towards large, electronically addressed two-dimensional arrays. In the long wavelength infrared (LWIR) spectral range HgCdTe focal plane arrays (FPAs) occupy a dominant position. However, the slow progress in the development of large LWIR photovoltaic HgCdTe infrared imaging arrays and the rapid achievements of novel semiconductor heterostructure systems have made it necessary to foresee the future development of different material technologies in fabrication large FPAs. Among the competing technologies in LWIR are the quantum well infrared photoconductors (QWIPs) based on lattice matched GaAs/AlGaAs and strained layer InGaAs/AlGaAs material systems. This paper compares the technical merits of two IR detector arrays technologies; photovoltaic HgCdTe and QWIPs. It is clearly shown that LWIR QWIP cannot compete with HgCdTe photodiode as the single device especially at higher temperature operation (>70 K) due to fundamental limitations associated with intersubband transitions. However, the advantage of HgCdTe is less distinct in temperature range below 50 K due to problems involved in HgCdTe material (p-type doping, Shockley–Read recombination, trap-assisted tunnelling, surface and interface instabilities). Even though the QWIP is a photoconductor, several of its properties such as high impedance, fast response time, long integration time, and low power consumption, well satisfy the requirements of fabrication of large FPAs. Due to the high material quality at low temperature, QWIP has potential advantages over HgCdTe for very LWIR (VLWIR) FPA applications in terms of the array size, uniformity, yield and cost of the systems.     

多色焦平面和图像融合SoC实现技术的研究

大规模、智能化的多色焦平面阵列探测器和高性能、高集成度的SoC技术是未来发展的方向。对多色焦平面的概况、发展和关键技术进行了分析。为了能够更有效的利用信息,把由多色焦平面探测器输出的,并经天然配准的各波段图像进行了融合处理。详细介绍了现有的多种图像融合算法、模型、SoC和高速处理硬件平台的研究情况以及若干新进展。     

基于Offner中继结构的机载棱镜色散成像光谱仪系统设计

考虑到机载遥感平台对成像光谱仪小型化、轻量化要求的逐渐提高,在分析了主要几种成像光谱仪特点的基础上,重点阐述了技术成熟度较高的光栅色散和棱镜色散型成像光谱仪,研究了基于Offner中继成像结构的紧凑型成像光谱系统。结合Offner同心光学系统成像特点,在给定系统指标的情况下,设计出了两种在发散和会聚光束中使用色散元件的全球面光谱系统,给出了系统的调制传递函数、点列图以及系统谱线弯曲、色畸变曲线。结果表明,两种结构的Offner成像光谱仪,实现了遥感仪器小型化的目的,具有接近衍射极限的优良成像性质。同时,很好地控制了系统的谱线弯曲和色畸变,保证了获取光谱数据的一致性。     

应用近红外高光谱成像技术检测面粉中偶氮甲酰胺

高光谱成像技术不仅可以获得样品的图像信息,每个像素点还包含了光谱信息,因其信息量丰富的特点已在食品安全检测方面得到了应用。该研究应用近红外高光谱成像技术检测面粉中偶氮甲酰胺。分别采集纯偶氮甲酰胺、纯面粉和面粉中10种不同浓度偶氮甲酰胺混合样品的高光谱图像。通过比较纯偶氮甲酰胺和纯面粉的平均漫发射光谱,找到两者区分度较大的4个吸收波段：1 574.38,2 038.55,2 166.88和2 269.91 nm。采用二阶导数对样品图像中的像素点光谱进行预处理,通过光谱角制图、光谱相关角和光谱相关性度量三种光谱相似性分析方法对混合样品中的偶氮甲酰胺像素和面粉像素进行检测。结果表明,预处理后的平均光谱不能有效检测面粉中偶氮甲酰胺;单像素点光谱结合光谱相似性分析实现了混合样品中偶氮甲酰胺像素和面粉像素的分类;分类结果的验证显示了偶氮甲酰胺像素和面粉像素的正确分类。研究结果为利用高光谱技术检测面粉中添加剂提供了方法支持,为食品中掺杂物的检测提供参考。