Current and efficiency improvement for a GaAsP/SiGe on Si tandem solar cell device achieved by light trapping techniques

A GaAsP/SiGe tandem solar cell on Si substrate has been further fabricated using light trapping techniques, such as texturing and adding a back surface reflector, and thinning the Si substrate. This is of importance to increase the J_sc of the Si_0.18Ge_0.82 bottom cell in this tandem system since bottom cell is current limiting. The J_sc of the bottom cell has been increased by relative 7.4%. This current improvement leads to a predicted efficiency of near 21% for this tandem device, with an absolute efficiency improvement of 0.3% over previous results without light trapping processes. The current of the bottom cell can be further improved by optimizing the bottom cell structure and texturing process, further thinning the Si substrate and increasing Ge concentration. (© 2016 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

Optical management in high‐efficiency thin‐film silicon micromorph solar cells with a silicon oxide based intermediate reflector

In the effort to increase the stable efficiency of thin film silicon micromorph solar cells, a silicon oxide based intermediate reflector (SOIR) layer is deposited in situ between the component cells of the tandem device. The effectiveness of the SOIR layer in increasing the photo‐carrier generation in the a‐Si:H top absorber is compared for p–i–n devices deposited on different rough, highly transparent, front ZnO layers. High haze and low doping level for the front ZnO strongly enhance the current density (J_sc) in the μc‐Si:H bottom cell whereas J_sc in the top cell is influenced by the angular distribution of the transmitted light and by the reflectivity of the SOIR related to different surface roughness. A total J_sc of 26.8 mA/cm² and an initial conversion efficiency of 12.6% are achieved for 1.2 cm² cells with top and bottom cell thicknesses of 300 nm and 3 μm, and without any anti‐reflective coating on the glass. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Multi‐crystalline silicon solar cells with metal‐assisted nano‐texturing using HNO3 as hole injection agent

In this study, metal‐assisted etching (MAE) with nitric acid (HNO₃) as a hole injecting agent has been employed to texture multi‐crystalline silicon wafers. It was previously proven that addition of HNO₃ enabled control of surface texturing so as to form nano‐cone shaped structures rather than nanowires. The process parameters optimized for optically efficient texturing have been applied to multi‐crystalline wafers. Fabrication of p‐type Al:BSF cells have been carried out on textured samples with thermal SiO₂/PECVD‐SiN_x stack passivation and screen printed metallization. Firing process has been optimized in order to obtain the best contact formation. Finally, j_sc enhancement of 0.9 mA/cm² and 0.6% absolute increase in the efficiency have been achieved. This proves that the optimized MAE texture process can be successfully used in multi‐crystalline wafer texturing with standard passivation methods.

J –V curves and SEM images of the nano and iso‐textured samples. j_sc enhancement of 0.9 mA/cm² together with 0.6% absolute efficiency gain was observed on nano‐textured samples.     

Compatibility of glass textures with E-beam evaporated polycrystalline silicon thin-film solar cells

For polycrystalline silicon thin films on glass, E-beam evaporation capable of high-rate deposition of amorphous silicon (a-Si) film precursor up to 1 μm/minute is a potentially low-cost solution to replace the main stream a-Si deposition method—plasma enhanced chemical vapour deposition (PECVD). Due to weak absorption of near infrared light and a target of 2 μm Si absorber thickness, glass substrate texturing as a general way of light trapping is vital to make E-beam evaporation commercially viable. As a result, the compatibility of e-beam evaporation with glass textures becomes essential. In this paper, glass textures with feature size ranging from ～200 nm to ～1.5 micron and root-mean-square roughness (Rms) ranging from ～10 nm to 200 nm are prepared and their compatibility with e-beam evaporation is investigated. This work indicates that e-beam evaporation is only compatible with small smooth submicron sized textures, which enhances J _sc by 21 % without degrading V _oc of the cells. Such textures improve absorption-based J _sc up to 45 % with only 90 nm SiN _x as the antireflection and barrier layer; however, the enhancement degrades to ～10 % with 100 nm SiO _x +90 nm SiN _x as the barrier layer. The absorption-based J _sc is abbreviated by J _sc(A), which is deduced by integrating the multiplication product of the measured absorption and the AM1.5G spectrum in the wavelength range 300–1050 nm assuming unity internal quantum efficiency at each wavelength. This investigation is also relevant to other thin-film solar cell technologies which require evaporating the absorber onto textured substrate/superstrate.     

Nanotextured multicrystalline Al‐BSF solar cells reaching 18% conversion efficiency using industrially viable solar cell processes

We report recent achievements in adapting industrially used solar cell processes on nanotextured surfaces. Nanostructures were etched into c‐Si surfaces by dry exothermic plasma‐less reaction of F species with Si in atmospheric pressure conditions and then modified using a short post‐etching process. Nanotextured multicrystalline wafers are used to prepare Al‐BSF solar cells using industrially feasible solar cell proc‐ essing steps. In comparison to the reference acidic textured solar cells, the nanostructured cells showed gain in short circuit current (J_sc) of up to 0.8 mA/cm² and absolute gain in conversion efficiency of up to 0.3%. The best nanotextured solar cell was independently certified to reach the conversion efficiency of 18.0%. (© 2015 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

Black multi‐crystalline silicon solar cells

A simple method for nano‐scale texturing of silicon surfaces based on local metal‐catalyzed wet chemical etching, which results in an almost complete suppression of reflectivity in a broad spectral range, has been successfully applied to produce black multi‐crystalline silicon solar cells. The performance of the cells is compared to that of reference cells without surface nano‐texturing. A considerable increase of the short circuit current (by 36–42% with respect to the reference cells) without deterioration of other performance parameters is observed under natural sun illumination. Means of further optimization of such black solar cells are discussed. (© 2007 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Effects of preannealing temperature of ZnO thin films on the performance of dye-sensitized solar cells

The preferred (002) orientation zinc oxide (ZnO) nanocrystalline thin films have been deposited on FTO-coated glass substrates by sol–gel spin-coating technology and rapid thermal annealing for use in dye-sensitized solar cells (DSSC). The effects of preannealing temperature (100 and 300°C) on the microstructure, morphology and optical properties of ZnO thin films were studied. The ZnO thin films were characterized by X-ray diffraction (XRD), scanning electron microscopic (SEM) and Brunauer–Emmett–Teller (BET) analysis. The photoelectric performance of DSSC was studied by I–V curve and the incident photon-to-current conversion efficiency (IPCE), respectively. From the results, the intensities of (002) peaks of ZnO thin films increases with increasing preannealing temperature from 100°C to 300°C. The increase in pore size and surface area of ZnO films crystallized at the increased preannealing temperature contributed to the improvement on the absorption of N3 dye onto the films, the short-circuit photocurrent (J _sc) and open-circuit voltage (V _oc) of DSSC. The higher efficiency (η) of 2.5% with J _sc and V _oc of 8.2 mA/cm² and 0.64 V, respectively, was obtained by the ZnO film preannealed at 300°C.     

Excellent passivation of thin silicon wafers by HF‐free hydrogen plasma etching using an industrial ICPECVD tool

In this work, hydrogen plasma etching of surface oxides was successfully accomplished on thin (～100 µm) planar n‐type Czochralski silicon wafers prior to intrinsic hydrogenated amorphous silicon [a‐Si:H(i)] deposition for heterojunction solar cells, using an industrial inductively coupled plasma‐enhanced chemical vapour deposition (ICPECVD) platform. The plasma etching process is intended as a dry alternative to the conventional wet‐chemical hydrofluoric acid (HF) dip for solar cell processing. After symmetrical deposition of an a‐Si:H(i) passivation layer, high effective carrier lifetimes of up to 3.7 ms are obtained, which are equivalent to effective surface recombination velocities of 1.3 cm s^–1 and an implied open‐circuit voltage (V_oc) of 741 mV. The passivation quality is excellent and comparable to other high quality a‐Si:H(i) passivation. High‐resolution transmission electron microscopy shows evidence of plasma‐silicon interactions and a sub‐nanometre interfacial layer. Using electron energy‐loss spectroscopy, this layer is further investigated and confirmed to be hydrogenated suboxide layers. (© 2015 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

Fabrication of silicon microwire arrays for?photovoltaic?applications

A?novel method of combining photolithography, wet chemical etching and oxidation process was proposed to fabricate large area of silicon microwire (SiMW) arrays. The dimensions of the SiMWs can be easily controlled by photomask and etching conditions. Solar cells based on the heterojunction between SiMW and double-walled carbon nanotubes (DWNTs) were constructed. The initial test on the DWNT/SiMW shows efficiency (??) of?0.59%. By adding a few drops of HBr/B₂ electrolyte, the efficiency was improved to 1.96% with J _sc=19.2?mA/cm² and V _oc=0.35?V, FF=29.2%, showing the potential of SiMWs in photovoltaic applications.     

Wet‐Etching Induced Abnormal Phase Transition in Highly Strained VO2/TiO2 (001) Epitaxial Film

The metal–insulator transition (MIT) behavior in vanadium dioxide (VO₂) epitaxial film is known to be dramatically affected by interfacial stress due to lattice mismatching. For the VO₂/TiO₂ (001) system, there exists a considerable strain in ultra‐thin VO₂ thin film, which shows a lower T_c value close to room temperature. As the VO₂ epitaxial film grows thicker layer‐by‐layer along the “bottom‐up” route, the strain will be gradually relaxed and T_c will increase as well, until the MIT behavior becomes the same as that of bulk material with a T_c of about 68 °C. Whereas, in this study, we find that the VO₂/TiO₂ (001) film thinned by “top‐down” wet‐etching shows an abnormal variation in MIT, which accompanies the potential relaxation of film strain with thinning. It is observed that even when the strained VO₂ film is etched up to several nanometers, the MIT persists, and T_c will increase up to that of bulk material, showing the trend to a stress‐free ultra‐thin VO₂ film. The current findings demonstrate a facial chemical‐etching way to change interfacial strain and modulate the phase transition behavior of ultrathinVO₂ films, which can also be applied to other strained oxide films.     

The impacts of LPCVD wrap-around on the performance of n-type tunnel oxide passivated contact c-Si solar cell

In this paper, Tunnel Oxide Passivated Contact (TOPCon) silicon solar cells with the industrial area (244.32 cm²) are fabricated on N-type silicon substrates. Both the ultra-thin tunnel oxide layer and phosphorus doped polycrystalline silicon (polysilicon) thin film are prepared by the LPCVD system. The wrap-around of polysilicon is observed on the surface of borosilicate glass (BSG). The polysilicon wrap-around can form a leakage current path, thus degrades the shunt resistance of solar cells, and leads to the degradation of solar cell efficiency. Different methods are adopted to treat the polysilicon wrap-around and improve shunt resistance of solar cells. The experimental results indicate that a chemical etching method can effectively solve the problem of polysilicon wrap-around and improve the performance of solar cells. Finally, a conversion efficiency of 22.81% has been achieved by our bifacial TOPCon solar cells, with V_oc of 702.6 mV, J_sc of 39.78 mA/cm² and FF of 81.62%.     

Optical and phonon properties of Sm-doped α-Bi2O3 micro rods

A simple, low-cost, post-black etching process atop the random pyramidal emitter has been proposed and investigated. The multi-scale texture is achieved by combining nanoporous layer formed by the post-black etching with micron-scale pyramid texture. Compared to the pre-black etched Si solar cells, our experiments clearly show the advantage of post-black etched texturing: it enables high blue response and improved conversion efficiency. As a result, the enhancement of 7.1 mA/cm² on the short-circuit current density and improvement of 31 % in the conversion efficiency have been reached.     

Heavily doped Si:P emitters of crystalline Si solar cells: recombination due to phosphorus precipitation

The measured saturation current density J_0e of heavily phosphorus‐doped emitters of crystalline Si solar cells is analysed by means of sophisticated numerical device modelling. It is concluded that Shockley–Read–Hall (SRH) recombination exceeds Auger recombination significantly; it is caused by inactive phosphorus. This explains the large discrepancies between measured and simulated J_0e values, observed persist‐ently over the last two decades in industrially fabricated Si solar cells. As a consequence, the heavily phosphorus‐diffused emitters still bear a significant potential to contribute to higher Si solar cell efficiency levels, if the amount of inactive phosphorus can be reduced. (© 2014 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

Extremely low surface recombination in 1 Ω cm n‐type monocrystalline silicon

A key requirement in the recent development of highly efficient silicon solar cells is the outstanding passivation of their surfaces. In this work, plasma enhanced chemical vapour deposition of a triple layer dielectric consisting of amorphous silicon, silicon oxide and silicon nitride, charged extrinsically using corona, has been used to demonstrate extremely low surface recombination. Assuming Richter's parametrisation for bulk lifetime, an effective surface recombination velocity S_eff = 0.1 cm/s at Δn = 10¹⁵ cm^–3 has been obtained for planar, float zone, n ‐type, 1 Ω cm silicon. This equates to a saturation current density J_0s = 0.3 fA/cm², and a 1‐sun implied open‐circuit voltage of 738 mV. These surface recombination parameters are among the lowest reported for 1 Ω cm c‐Si. A combination of impedance spectroscopy and corona‐lifetime measurements shows that the outstanding chemical passivation is due to the small hole capture cross section for states at the interface between the Si and a‐Si layer which are hydrogenated during nitride deposition. (© 2016 The Authors. Phys. Status Solidi RRL published by WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Microcrystalline silicon‐carbon alloys as anti‐reflection window layers in high efficiency thin film silicon solar cells

Microcrystalline silicon‐carbide (μc‐SiC:H) films were prepared using hot wire chemical vapor deposition at low substrate temperature. The μc‐SiC:H films were employed as window layers in microcrystalline silicon (μc‐Si:H) solar cells. The short‐circuit current density (J_SC) in these n‐side illuminated n–i–p cells increases with increasing the deposition time t_W of the μc‐SiC:H window layer from 5 min to 60 min. The enhanced J_SC is attributed to both the high transparency and an anti‐reflection effect of the μc‐SiC:H window layer. Using these favourable optical properties of the μc‐SiC:H window layer in μc‐Si:H solar cells, a J_SC value of 23.8 mA/cm² and cell efficiencies above 8.0% were achieved with an absorber layer thickness of 1 μm and a Ag back reflector. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Hybrid process for texturization of diamond wire sawn multicrystalline silicon solar cell

Acid texture is difficult for diamond wire sawn (DWS) multicrystalline silicon (mc‐Si) wafer owing to the inhomogeneous distribution of damage layer on the surface. In this article, metal‐assisted chemical etching (MACE) has been selected for introducing a porous seeding layer to induce acid texturing etching. SEM results show that the oval pit structures coverage get obvious improvement even on the smooth areas. Owing to the further improved light absorption ability by second MACE and nanostructure rebuilding (NSR) process, nanostructured DWS mc‐Si solar cell has exhibited a conversion efficiency of 17.96%, which is 0.45% higher than that of DWS wafer with simple acid texture process. (© 2016 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

Low resistance dye-sensitized solar cells based on all-titanium substrates using wires and sheets

Low resistance dye-sensitized solar cells (DSSCs) based on all-titanium substrates were proposed in this paper. To minimize the internal resistance of DSSCs, the titanium wires and titanium sheets were used as the substrates of the photoanode and the counter electrode, respectively. Compared with the FTO substrate, titanium wires could absorb much diffused light by back reflection since the reflectivity in the titanium sheet was highly increased up to 53.12%. Furthermore, the transmittance of the front cover was increased by 13.2% using the super white glass instead of FTO substrate. The thickness of TiO₂ thin film coated on titanium wire was optimized to achieve a high cell performance. The efficiency of 5.6% for the cell was obtained with a J_sc of 15.41 mA cm⁻², V_oc of 0.59 V, and FF of 0.62. The results showed that the titanium-based DSSCs had superiority for producing the large-scale DSSCs without metal grid line.     

Optimum design of InGaP/GaAs dual-junction solar cells with different tunnel diodes

We design the InGaP/GaAs dual-junction (DJ) solar cells by optimizing short-circuit current matching between top and bottom cells using the Silvaco ATLAS. The relatively thicker base layer of top cell exhibits a larger short-circuit current density (J _sc) while the thicker base layer of bottom cell allows for a smaller J _sc. The matched J _sc of 10.61±0.05 and 13.25±0.06 mA/cm ² under AM1.5G and AM0 illuminations, respectively, are obtained, leading to the increased conversion efficiency. The base thicknesses of top InGaP cells are optimized at 0.8 and 0.65 μm for AM1.5G and AM0 illuminations, respectively, and the base thicknesses of bottom GaAs cells are optimized at 2 μm. For the optimized solar cell structure, the maximum J _sc = 10.66 mA/cm ² (13.31 mA/cm ²), V _oc =  2.34 V (2.35 V), and fill factor =  87.84% (88.1%) are obtained under AM1.5G (AM0) illumination, exhibiting a maximum conversion efficiency of 25.78% (23.96%). The effect of tunnel diode structure, i.e, GaAs/GaAs, AlGaAs/AlGaAs, and InGaP/InGaP, on the characteristics of solar cells is investigated. The photogeneration rate in the DJ solar cell structure is also obtained by incident light of different wavelengths.     

Solid state photoelectrochemical cells utilising graphite thin films counter electrode

This paper reports the use of graphite thin films as a counter electrode of a solid state photoelectrochemical cells of ITO/TiO₂/PVC-LiClO₄/graphite. The photoelectrochemical cells material was a screen-printed layer of titanium dioxide onto an ITO-covered glass substrate which was used as a working electrode of the device. The solid electrolyte used was PVC-LiClO₄ that was prepared by solution casting technique. The graphite films which serve as a counter electrode were prepared onto glass substrate by electron beam evaporation technique at substrate temperatures variation of 25, 50, 100, 150 and 200 °C. The dependence of sheet resistance and surface morphology of the graphite films on substrate temperature were studied. The films deposited at 25 °C shows the smoothest surface morphology and the smallest grain size. Bigger grain size, rougher surface morphology of graphite film counter electrode. The current-voltage characteristics of four devices utilising the graphite counter electrode with different substrate temperature in dark as well as under illumination of 100 mWcm⁻² light from a tungsten halogen lamp were recorded at room temperature and at 50 °C, respectively. It was found that the photovoltaic parameters of the device such as short-circuit current density, J_sc and open-circuit voltage, V_oc increases with the decreasing average grain size of the graphite counter electrode. The device whose graphite film counter electrode was deposited onto the glass substrate at 25 °C gave the highest J_sc of 0.32 μA/cm² and V_oc of 117 mV, respectively.     

Assessment of the illumination dependency of Al2O3 and SiO2 rear‐passivated p‐type silicon solar cells

This Letter discusses an important difference between positively charged SiO₂ and negatively charged Al₂O₃ rear‐passivated p‐type Si solar cells: their illumination level dependency. For positively charged SiO₂ rear‐passivated p‐type Si solar cells, a loss in short circuit current (J_SC) and open circuit voltage (V_OC) as a function of illumination level is mainly caused by parasitic shunting and a decrease in surface recombination, respectively. Hence, the relative loss in cell conversion efficiency, J_SC, and V_OC as a function of the illumination level for SiO₂ compared to Al₂O₃ rear‐passivated p‐type Si solar cells has been measured and discussed. Subsequently, an exponential decay fit of the loss in cell efficiency is applied in order to estimate the difference in the energy output for both cell types in three different territories: Belgium (EU), Seattle and Austin (US). The observed trends in the difference in energy output between both cells, as a function of time of the year and region, are as expected and discussed. (© 2012 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)