Nature of chemical states of sulfur embedded in atomic‐layer‐deposited HfO2 film on Ge substrate for interface passivation

Sulfur was embedded in atomic‐layer‐deposited (ALD) HfO₂ films grown on Ge substrate by annealing under H₂S gas before and after HfO₂ ALD. The chemical states of sulfur in the film were examined by S K‐edge X‐ray absorption spectroscopy. It was revealed that the valences of S‐ions were mostly –2 at Ge/HfO₂ interface (GeS_x or HfO_2–yS_y to passivate the interface), while they were mostly +6 in HfO₂ layers (sulfates; HfO_2–z(SO₄)_z). The leakage current density in post‐deposi‐tion‐treated film was lower than that in pre‐deposition‐treated one. This suggests that the passivation of defects in oxide layer by sulfate ions is more effective to lower the leakage current rather than the interface defect passivation by S^2– ions. (© 2015 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

Nondestructive investigation of interface states in high‐k oxide films on Ge substrate using X‐ray absorption spectroscopy

The unoccupied electronic structures of 5 nm thick high permittivity (k) oxides (HfO₂, ZrO₂, and Al₂O₃) and SiO₂ films on Ge substrates were examined using O K‐edge X‐ray absorption spectroscopy. Comparative studies with those on Si substrates showed contrasts in the conduction bands, which should be due to the formation of interface states. In the Al₂O₃ and SiO₂ films, GeO₂ layers are formed at the interface and they suppress in part the formation of detrimental germanate phases. In contrast, in the HfO₂ and ZrO₂ films, no signature of the Ge‐oxide phase is observed but some germanate phases are expected to prevail, suggesting a degradation of the gate oxide characteristics. (© 2012 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Effect of modification of S-terminated Ge(1 0 0) surface on ALD HfO2 gate stack

When S-termination on a Ge(1 0 0) surface was desorbed at an elevated temperature and an atomic layer deposition (ALD) HfO₂ film was deposited, interfacial thickness was less than 1 nm. As a result, the equivalent oxide thickness (EOT) of the stack on the initially S-terminated surface was thinner than that deposited on the O₃-oxidized surface, while HfO₂ film thickness was almost identical on both surfaces. Nevertheless, the HfO₂ stack on the initially S-terminated surface exhibited improved leakage current characteristics due to an increase in barrier height. Its thinner but robust interface will contribute to the scaling down of gate oxide integrity.     

Theoretical analysis of fluorine-passivated germanium surface for high-k/Ge gate stack by molecular orbital method

Energy state and coordination of fluorine (F)-passivated Ge surface have been theoretically analyzed by semi-empirical molecular orbital method in comparison with hydrogen-passivated Ge surface to predict usefulness of F for passivation element and surface stabilization. Heat of formation for the reaction of F atoms and Ge layer system decreased simultaneously without energy barrier. Resultantly, F-Ge bonds were formed on Ge layer system and Ge surface dangling bonds were passivated by F dissimilar to the reaction of H atoms and Ge layer system. Furthermore, it was confirmed experimentally that the electrical properties of HfO₂/Ge gate stack were improved by F₂-ambient treatment of Ge substrate prior to HfO₂ deposition. It is concluded that F-passivation of Ge surface is useful in making stable and low-defective Ge substrate for high-k dielectric layer deposition.     

Characteristics improvement of HfO2/Ge gate stack structure by fluorine treatment of germanium surface

Chemical reactivity of fluorine molecule (F₂)-germanium (Ge) surface and dissociation of fluorine (F)-Ge bonding have been simulated by semi-empirical molecular orbital method theoretically, which shows that F on Ge surface is more stable compared to hydrogen. Ge MIS (metal insulator semiconductor) capacitor has been fabricated by using F₂-treated Ge(1 0 0) substrate and HfO₂ film deposited by photo-assisted MOCVD. Interface state density observed as a hump in the C-V curve of HfO₂/Ge gate stack and its C-V hysteresis were decreased by F₂-treatment of Ge surface. XPS (X-ray photoelectron spectroscopy) depth profiling reveals that interfacial layer between HfO₂ and Ge is sub-oxide layer (GeO_x or HfGeO_x), which is believed to be origin of interface state density.F was incorporated into interfacial layer easily by using F₂-treated Ge substrate. These results suggest that interface defect of HfO₂/Ge gate stack structure could be passivated by F effectively.     

Evidence of GeO volatilization and its effect on the characteristics of HfO2 grown on Ge substrate

HfO₂ films are deposited by atomic layer deposition (ALD) using tetrakis ethylmethylamino hafnium (TEMAH) as the hafnium precursor, while O₃ or H₂O is used as the oxygen precursor. After annealing at 500℃ in nitrogen, the thickness of Ge oxide's interfacial layer decreases, and the presence of GeO is observed at the H₂O-based HfO₂ interface due to GeO volatilization, while it is not observed for the O₃-based HfO₂. The difference is attributed to the residue hydroxyl groups or H₂O molecules in H₂O-based HfO₂ hydrolyzing GeO₂ and forming GeO, whereas GeO is only formed by the typical reaction mechanism between GeO₂ and the Ge substrate for O₃-based HfO₂ after annealing. The volatilization of GeO deteriorates the characteristics of the high-κ films after annealing, which has effects on the variation of valence band offset and the C–V characteristics of HfO₂/Ge after annealing. The results are confirmed by X-ray photoelectron spectroscopy (XPS) and electrical measurements.     

HfO2/AlGaN/GaN structures with HfO2 deposited at ultra low pressure using an e‐beam

We show that HfO₂/AlGaN/GaN structures with HfO₂ layer deposited using an e‐beam in ultra high vacuum are suitable for field effect transistors. The dielectric constant of the HfO₂ was found ε_HfO > 23–24, which is close to the highest re‐ ported values for this material. The leakage current did not exceed 10^–4 A/cm² at the threshold voltage. The comparison of the losses in the samples with and without HfO₂ indicates low concentration of the interface traps. (© 2007 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Germanium nanowires: from synthesis, surface chemistry, and assembly to devices

A low temperature synthesis of single crystalline Ge nanowires via chemical vapor deposition is enabled by balancing the feedstock and its diffusion in growth seeds. Understanding and optimizing the synthetic chemistry leads to deterministic nanowire growth at well-defined locations and bulk quantity production of homogeneous nanowires, both of which greatly facilitate the assembly toward parallel nanowire arrays. Surface chemistry studies reveal that p- and n-type Ge nanowires undergo different oxidation routes and the surface oxide induced states cause opposite band bending for nanowires with different doping. Furthermore, long chain alkanethiols form a dense and uniform protection layer on Ge nanowire surfaces and therefore afford excellent oxidation resistance. Finally, high performance field effect transistors are constructed on Ge nanowires with both thermally grown SiO₂ and atomic layer deposited HfO₂ as gate dielectrics. PACS 73.63.-b; 73.63.B6; 73.22.-f; 73.20.At; 73.90.+f     

Interfaces analysis of the HfO2/SiO2/Si structure

The physical and chemical properties of the HfO₂/SiO₂/Si stack have been analyzed using cross-section HR TEM, XPS, IR-spectroscopy and ellipsometry. HfO₂ films were deposited by the MO CVD method using as precursors the tetrakis 2,2,6,6 tetramethyl-3,5 heptanedionate hafnium—Hf(dpm)₄ and dicyclopentadienil-hafnium-bis-diethylamide—Сp₂Hf(N(C₂H₅)₂)₂.The amorphous interface layer (IL) between HfO₂ and silicon native oxide has been observed by the HRTEM method. The interface layer comprises hafnium silicate with a smooth varying of chemical composition through the IL thickness. The interface layer formation occurs both during HfO₂ synthesis, and at the annealing of the HfO₂/SiO₂/Si stack. It was concluded from the XPS, and the IR-spectroscopy that the hafnium silicate formation occurs via a solid-state reaction at the HfO₂/SiO₂ interface, and its chemical structure depends on the thickness of the SiO₂ underlayer.     

Investigation of HfO<Subscript>2</Subscript>/SiO<Subscript>2</Subscript>/<Emphasis Type="Italic">n</Emphasis>-Si(001)-based MOS structures via ballistic electron emission microscopy

(Au, Pt)/HfO₂/SiO₂/n-Si(001) metal-oxide-semiconductor structures with a thin (≈0.5 nm) SiO₂ layer, which is formed between HfO₂ and Si during atomic layer deposition of oxide layers, have been investigated via ballistic electron emission spectroscopy. The potential barrier heights at the (Au, Pt)/HfO₂ interfaces have been determined experimentally. The peculiarities observed in the curves of dependence of the collector current on the voltage between a scanning tunneling microscope probe and a metallic electrode are related to electron transport through the vacancy defect region of HfO₂ and the quantum-mechanical interference of electron waves arising from multiple reflections at the interfaces of the two-layer dielectric and at the interfaces of dielectric with a substrate and a metallic electrode.     

Microstructural,chemical bonding,stress development and charge storage characteristics of Ge nanocrystals embedded in hafnium oxide

We have grown Ge nanocrystals (NCs) (4.0–9.0 nm in diameter) embedded in high-k HfO₂ matrix for applications in floating gate memory devices. X-ray photoelectron spectroscopy has been used to probe the local chemical bonding of Ge NCs. The analysis of Ge–Ge phonon vibration using Raman spectroscopy has shown the formation of compressively stressed Ge NCs in HfO₂ matrix. Frequency dependent electrical properties of HfO₂/Ge-NCs in HfO₂/HfO₂ sandwich structures have been studied. An anticlockwise hysteresis in the capacitance–voltage characteristics suggests electron injection and trapping in embedded Ge NCs. The role of interface states and deep traps in the devices has been thoroughly examined and has been shown to be negligible on the overall device performance.     

First‐principles study on the concentrations of native point defects in high‐dielectric‐constant binary oxide materials

The intrinsic concentrations of point defects in high‐k binary oxide materials of HfO₂, ZrO₂, Y₂O₃ and La₂O₃ are evaluated on the basis of first‐principles calculations. Oxygen defects are found to dominate over a wide range of the oxygen chemical potential. Neutral oxygen vacancies are likely to be responsible for electron trapping in the investigated materials. In HfO₂ and ZrO₂, oxygen Frenkel pairs are likely to form. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Influences of different oxidants on the characteristics of HfAlOx films deposited by atomic layer deposition

A comparative study of two kinds of oxidants(H2O and O3) with the combinations of two metal precursors [trimethylaluminum(TMA) and tetrakis(ethylmethylamino) hafnium(TEMAH)] for atomic layer deposition(ALD) hafnium aluminum oxide(HfAlOx) films is carried out.The effects of different oxidants on the physical properties and electrical characteristics of HfAlOx films are studied.The preliminary testing results indicate that the impurity level of HfAlOx films grown with both H2O and O3 used as oxidants can be well controlled,which has significant effects on the dielectric constant,valence band,electrical properties,and stability of HfAlOx film.Additional thermal annealing effects on the properties of HfAlOx films grown with different oxidants are also investigated.     

Low‐temperature photoluminescence of oxide‐covered single‐layer MoS2

We present a photoluminescence study of single‐layer MoS₂ flakes on SiO₂ surfaces. We demonstrate that the luminescence peak position of flakes prepared from natural MoS₂, which varies by up to 25 meV between individual flakes, can be homogenized by annealing in vacuum. We use HfO₂ and Al₂O₃ layers prepared by atomic layer deposition to cover some of our flakes. In these flakes, we observe a suppression of the low‐energy luminescence peak which appears in asprepared flakes at low temperatures. We infer that this peak originates from excitons bound to surface adsorbates. We also observe different temperature‐induced shifts of the luminescence peaks for the oxide‐covered flakes. This effect stems from the different thermal expansion coefficients of the oxide layers and the MoS₂ flakes. It indicates that the single‐layer MoS₂ flakes strongly adhere to the oxide layers and are therefore strained. (© 2012 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Effects of N2 and NH3 remote plasma nitridation on the structural and electrical characteristics of the HfO2 gate dielectrics

The remote plasma nitridation (RPN) of an HfO₂ film using N₂ and NH₃ has been investigated comparatively. X-ray photoelectron spectroscopy and Auger electron spectroscopy analyses after post-deposition annealing (PDA) at 700 °C show that a large amount of nitrogen is present in the bulk film as well as in the interfacial layer for the HfO₂ film nitrided with NH₃-RPN. It is also shown that the interfacial layer formed during RPN and PDA is a nitrogen-rich Hf-silicate. The C-V characteristics of an HfO_xN_y gate dielectric nitrided with NH₃-RPN have a smaller equivalent oxide thickness than that nitrided with N₂-RPN in spite of its thicker interfacial layer.     

Formation of W/HfO2/Si gate structures using in situ magnetron sputtering and rapid thermal annealing

The W(150 nm)/HfO₂(5 nm)/Si(100) structures prepared in a single vacuum cycle by rf magnetron sputtering were subjected to rapid thermal annealing in argon. It is found that at an annealing temperature of 950°C, the tungsten oxide WO _x phase and the hafnium silicate HfSi _x O _y phase grow at the W/HfO₂ and HfO₂/Si(100) interfaces, respectively. Herewith, the total thickness of the oxide layeris 30% larger than that of the initial HfO₂ film. In addition, a decrease in the specific capacitance in accumulation C _max and in the dielectric constant k (from 27 to 23) is observed. At an annealing temperature of 980°C, intensive interaction between tungsten and HfO₂ takes place, causing the formation of a compositionally inhomogeneous Hf _x Si _y W _z O oxide layer and further decrease in C _max. It is shown that a considerable reduction in the leakage currents occurs in the W/HfO₂/X/Si(100) structures, where X is a nitride barrier layer.     

Effect of thermal annealing sequence on the crystal phase of HfO2 and charge trap property of Al2O3/HfO2/SiO2 stacks

In this study, we investigated the effect of a post annealing sequence on the HfO₂ crystal phase and the memory window of charge trap devices with TiN-Al₂O₃-HfO₂-SiO₂-Si stacks. The charge trap dielectrics of HfO₂ were deposited by atomic layer deposition and were annealed in an oxygen environment with or without Al₂O₃ blocking oxides. X-ray diffraction analysis showed that, after thermal annealing, the predominant crystal phase of HfO₂ is divided into tetragonal and monoclinic phase depending on the presence or absence of Al₂O₃ blocking oxide. In addition, deconvolution of X-ray diffraction spectra showed that, with increasing annealing temperature, the fraction of the tetragonal phase in the HfO₂ film was enhanced with the Al₂O₃ blocking oxide, while it was reduced without the Al₂O₃ blocking oxide. Finally, measurements of program/erase and increase-step-pulse programming showed that the charge trap efficiency and the memory window of the charge trap devices increased with decreasing fraction of tetragonal HfO₂.     

Latent Fingerprint Imaging Using Dy and Sm Codoped HfO2 Nanophosphors: Structure and Luminescence Properties

The development of latent fingerprints (LFPs) detected at the site of crime is considered as an imperative physical evidence in forensic investigations. Herein, a rapid and cost‐effective approach using nonhazardous Dy and Sm codoped HfO₂ nanophosphors is demonstrated to be utilized for LFP imaging. Sol–gel method can produce Dy and Sm codoped HfO₂ of monoclinic phase with crystallite size ranging from ≈10 to 25 nm. While selected area electron diffraction and lattice spacing calculated from high‐resolution transmission electron microscopy confirm monoclinic phase, Le‐Bail profile refinement of X‐ray diffraction (XRD) patterns demonstrate an exponential increase in lattice volume with incorporating various concentrations of Dy and Sm in HfO₂ lattice. Exciting Dy and Sm codoped HfO₂ with 393 nm photoluminescence spectra show emissions in blue, yellow, and near red regions emerging primarily due to energy transfer from Dy³⁺ to Sm³⁺ through multipolar interaction suggested by time resolved decay spectra. Combining excitation and emission spectra, an energy band diagram is proposed. Owing to excellent emissions, Dy and Sm codoped HfO₂ are explored for LFP imaging with good selectivity and resolution over multivariate surfaces like float glass and aluminum foil. The third‐level details like enclosure and termination–bifurcation are extracted due to nanosized nature of particles.     

Layer structure variations of ultra-thin HfO2 films induced by post-deposition annealing

To meet challenges for a smaller transistor feature size, ultra-thin HfO₂ high-k dielectric has been used to replace SiO₂ for the gate dielectric. In order to accurately analyze the ultra-thin HfO₂ films by grazing incidence X-ray reflectivity (GIXRR), an appropriate material model with a proper layer structure is required. However, the accurate model is difficult to obtain, since the interfaces between layers of the ultra-thin HfO₂ films are not easily identified, especially when post-deposition annealing process is applied. In this paper, 3.0 nm HfO₂ films were prepared by atomic layer deposition on p-type silicon wafer, and annealed in Ar environment with temperatures up to 1000 °C. The layer structures and the role of the interfacial layer of the films in the post-deposition annealing processes were evaluated by X-ray diffraction and X-ray photoelectron spectroscopy (XPS). The experimental results and analysis showed that layer thicknesses, crystal phases and chemical structures of the ultra-thin HfO₂ films were significantly dependent on annealing temperatures. The binding energy shifts of Hf 4f, O 1s, and Si 2p elements revealed the formation of Hf silicate (Hf-O-Si bonding) with increasing annealing temperatures. Due to the silicate formation and increasing silicon oxide formation, the interface broadening is highly expected. The structure analysis of the GIXRR spectra using the modified material structure model from the XPS analysis confirmed the interfacial broadening induced by the post-deposition annealing.     

Influence of different oxidants on band alignment of HfO2 films deposited by atomic layer deposition

Based on X-ray photoelectron spectroscopy (XPS), influences of different oxidants on band alignment of HfO₂ films deposited by atomic layer deposition (ALD) are investigated in this paper. The measured valence band offset (VBO) value for H₂O-based HfO₂ increases from 3.17 eV to 3.32 eV after annealing, whereas the VBO value for O₃-based HfO₂ decreases from 3.57 eV to 3.46 eV. The research results indicate that the silicate layer changes in different ways for H₂O-based and O₃-based HfO₂ films after annealing process, which plays a key role in generating the internal electric field formed by the dipoles. The variations of the dipoles at the interface between the HfO₂ and SiO₂ after annealing may lead the VBO values of H₂O-based and O₃-based HfO₂ to vary in different ways, which is in agreement with the varition of flat band (V_FB) voltage.