X荧光能谱法测定合金结构钢标样中五个元素

本文提出Ｘ荧光能谱法测定合金结构钢中５个元素含量的方法。本方法采用能说仪中定量分析软件，选择适当工作条件，测定合金结构钢中５个元素。其准确度精确度均能满足分析要求。     

古代青铜兵器中主要元素的X射线荧光光谱分析

我们用Ｘ射线荧光光谱滤纸片法分析了四个古代青铜兵器中的Ｃｕ、Ｐｂ、Ｓｎ含量，铜的测量结果与化学法一致。此法手续简单、方便，检出限低，灵敏度高，测量结果正确可靠，是分析古代青铜器一种行之有效的方法。     

X射线荧光基本参数法测定焊锡中的锡和铅

本文在无标样的情况下,用X射线荧光基本参数法测定了焊锡中的锡和铅的含量。     

X-射线荧光光谱法测定溶样后熔融制样金属硅中铁、铝、钙、钛、磷、铜

本文提出了溶解、蒸干然后用熔剂熔融残渣的样品制备方法,解决了金属硅不易直接熔融制样的难题,可以同时测定金属硅中多种杂质元素,消除了基体效应的影响,克服了标准样品对测定的限制,测定范围广,准确度高,通过安排正交试验确定了样品制备条件。     

X射线荧光能谱法测定贵金属含量的测量不确定度分析

研究了 X射线荧光能谱法测定贵金属含量的不确定度来源 ,通过 A类评定和 B类评定方法建立了测量结果不确定度的评定程序 ,使测量结果更具有科学性 ,从而能够规范地、定量地进行产品合格判定     

ICP—AES法测定钢铁中磷、镍、硅、锰、铬、铜

本文介绍在标准溶液与样品溶液中基体匹配的情况下进行测定,样品用H_2SO_4-H_2O_2分解,试液中加入酒石酸防止Si析出,并对各元素进行适当的背景校正,得到令人满意的测试结果。     

直接标准加入法测定血清中锌、铜含量

本文介绍一种测定血清中锌、铜含量的AAS直接标准加入法，无需对血清预处理，以去离子水做稀释剂，控制积分时间以控制进样量。本法检出限Zn为0.0086微克／毫升，Cu为0.0259微克／毫升，相对标准偏差（Zn）3.6%，（Cu）2.2%。回收率（Zn)98.8-110%，（Cu)98.8-108%),测定精确灵敏，简单快速。     

X射线荧光光谱法测定增产丙烯助剂中磷和铁的研究

使用X射线荧光光谱仪,采用人工合成标样,设计合成了一套标准样品,采用数学校正法中的经验系数法校正元素间的互相干扰,样品不经任何处理,粉末直接压片,经验系数法校正基体效应,建立了分析测定增产丙烯助剂中磷和铁含量的方法。讨论了样品制作方法,合适的测量条件,探讨了试样中元素间的相互影响。实验结果表明,该方法重现性好,准确度和精密度较高,测定磷和铁的相对标准偏差为：0.34%和0.59%;测定范围磷为0.01%～2.5%,铁为0.01%～2.5%。分析结果与化学法、等离子发射光谱法测定结果吻合。该方法快速、简便,样品处理简单,可以不分解;分析速度远快于其他分析方法,结果准确,单次测量一个样品只需要5 min,适用范围广,满足了科研和工业生产的需要。     

XRF法测定铂制品中的Pt、Au、Pd、Ag、Cu和Ni

本文利用XRF金标样的多元素回归方程，对Pt、Pd的荧光强度进行修正，修正后的荧光强度当作Au、Ag的荧光强度代入回归方程中，利用计算机编程计算铂制品中的Pt、Au、Pd、Ag、Cu、Ni等6种元素的含量。PT的测定范围为85%-99.92%时，该法测定的准确度优于0.5%，具有无损、快速、准确、可靠等优点。     

用标准加入电感耦合等离子体质谱(ICP-MS)法测定白酒中的锰、铅、铜

在ＩＣＰ－ＭＳ基础上用标准加入法对白酒中的锰、同、铜进行了定量测定。与常见的分析方法相比,这种方法具有方便、准确、快速的优点,与等离子光谱相比,ＩＣＰ－ＭＳ的检出限要低３个数量级。由于果酒,黄酒和饮料的成分与白酒相似,因此这种方法不仅可以用来测定白酒中的微量元素,而且还可以用来测定果酒、黄酒及饮料中的微量元素。     

Sn3.0Ag0.5Cu倒装焊点中的电迁移

采用10⁴ A/cm²数量级的电流密度对Sn30Ag05Cu倒装焊点中的电迁移机理作了研究.电迁移引起的原子（或空位）的迁移以及在此过程中形成的焦耳热,使Sn30Ag05Cu倒装焊点的显微形貌发生变化.电迁移作用下,由于空位的定向迁移和局部的电流聚集效应使阴极芯片端焊料与金属间化合物界面形成薄层状空洞.处于阴极的Cu焊盘的Ni（P）镀层与焊料间也产生了连续性空洞,但空洞面积明显小于处于阴极的芯片端焊料与金属间化合物界面.焊盘中的Cu原子在电迁移作用下形成与电子流方向一致的通量,最终导致焊点高电流密度区域出现连续性的金属间化合物且金属间化合物量由阴极向阳极逐渐增多. 关键词： Sn30Ag05Cu 倒装 焊点 电迁移     

Wetting process of electrolyte in high density Cu/Sn micro-bumps electrodepositing

Wetting process of electrolyte in high density Cu/Sn micro-bumps electrodepositing is reported in this paper. Three methods were adopted to enable electrolyte to permeate photo-etching micro-holes with high aspect ratio, including plasma treatment, adding wetting additive in electrolyte and mechanical action. Wettability of the samples with electrolyte was improved by the first two methods, according to contact angle and surface tension measurement. However, electrolyte still cannot reach up to the bottom of micro-hole. And then, electrolyte was subjected to mechanical action, including agitation and ultrasonic vibration. Under mechanical action, void free Cu/Sn micro-bumps fabrication was achieved in photo-etching micro-holes with depth of 60 μm and radius of 30 μm. At last, we proposed a model to show wetting process of electrolyte in photo-etching micro-holes.     

ZnO: Cu,Sn electroluminescent phosphor

The a.c. electroluminescent characteristics of ZnO:Cu, Sn powder phosphor have been investigated in audio frequency range. A simple preparative method for this phosphor has been described. The detailed variation of light output during one cycle of the applied sinusoidal voltage has been studied and discussed. In addition to the two primary peaks, the two secondary peaks have also been observed in each cycle of the applied field. The voltage and frequency dependence of the time-averaged electroluminescent brightness have been found to follow the Alfrey-Taylor relation over a wide range of frequencies. The constants of this relation have been determined. The spectral energy distribution of this phosphor shows that the peak-shift depends upon the a.c. frequency and is independent of the magnitude of applied field.     

Study of the effects of an adatom Sn on the Cu surface electromigration using a first principles method

It is well known that the doped Sn can effectively suppress the electromigration of Cu thin-film interconnects in integrated circuits. In this paper, the first-principles method was introduced to investigate the suppression mechanism. All the calculations were performed on Sn or Cu adatom/Cu (0 0 1), (1 1 0) and (1 1 1) surface systems within local density approximation. As a Sn adatom was attached to the Cu surface, stable CuSn bonds were formed. The energy calculations show that the Sn/Cu system was more stable than Cu/Cu system with the same structure. Analysis of density of states shows that the nearest neighbor Cu atoms were stabilized by CuSn bond relative to the Cu atoms which are far away from the adatom. The diffusion barrier energies were calculated and found to be consistent with the experimental results. Also, bond population analysis shows that stronger covalent bonds were formed between Sn and Cu relative to that between Cu and Cu. All the results indicate that the CuSn bond plays an important role in the suppression of Cu electromigration.     

Segregation of Sn and Sb in a ternary Cu(1 0 0)SnSb alloy

Surface segregation studies of Sn and Sb in Cu(1 0 0)-0.14 at.% Sn-0.12 at.% Sb ternary alloy, have been done by making use of Auger Electron Spectroscopy. The method of Linear Temperature Ramp (LTR) was employed, whereby the sample was heated and cooled linearly at a constant rate. The positive heating rate showed both a kinetic segregation profile, as well as a narrow equilibrium segregation region, at higher temperatures. The equilibrium segregation profile was extended by cooling the sample. Sn was first to segregate to the surface due to its higher diffusion coefficient, mainly from a smaller activation energy E_Sn. Sb, due to its higher segregation energy, eventually replaced Sn from the surface. The modified Darken model was used to simulate the profile yielding the following segregation parameters: D_o(Sn) = 6.3 × 10⁻⁶ m²/s, D_o(Sb) = 2.8 × 10⁻⁵ m²/s; E_Sn = 175.4 kJ/mol, E_Sb = 186.3 kJ/mol; , ; Ω_Cu-Sn = 3.4 kJ/mol, Ω_Cu-Sb = 15.9 kJ/mol and Ω_Sn-Sb = −5.4 kJ/mol.     

微波消化-FAAS法测定防污漆中的铜和锡

本文利用高压微波溶样技术对７１－３３型防污漆成功地进行了预处理，并利用火焰原子吸收光谱法（ＦＡＡＳ）对漆样中的铜和锡进行了测定。方法简便快速，准确度符合要求。加标回收率在９３％－１０２％之间，相对标准偏差不超过５．７％。     

电感耦合等离子体原子发射光谱法测定防污漆中的铜和锡

本文用电感耦合等离子体原子发射光谱法同时测定防污漆中的铜和锡。对样品的前处理方法进行了探讨，并研究了仪器工作参数、酸度、共存金属元素锌对被测元素的影响，确定了最佳分析条件。     

用FAAS法测定铅电解液中的铜和银

本文采用原子吸收法测定铅电争液中的Ｃｕ和Ａｇ。Ｃｕ的相对标准偏差为５．１％,Ａｇ的相对标准偏差为４．２％,方法简单,回收率在９６．７％－１０６．７％之间。