CW CO2-laser annealing of arsenic implanted silicon

CW CO₂-laser annealing of arsenic implanted silicon was investigated in comparison with thermal annealing. Ion channeling, ellipsometry, and Hall effect measurements were performed to characterize the annealed layers and a correlation among the different methods was made. The laser annealing was done with power densities of 100 to 640 W cm⁻² for 1 to 20 s. It was found that the lattice disorder produced during implantation can be completely annealed out by laser annealing with a power density of 500 W cm⁻² and the arsenic atoms are brought on lattice sites up to 96±2%. The maximum sheet carrier concentration of 6×10¹⁵ cm⁻² was obtained for 1×10¹⁶ cm⁻² implantation after laser annealing, which was up to 33% higher than that after thermal annealing at 600 to 900°C for 30 min.     

Boron neutralization and hydrogen diffusion in silicon subjected to low-energy hydrogen implantation

Using the hydrogen neutralization of the boron acceptor, the diffusion of hydrogen is investigated in the temperature range 20 °–160 °C. The hydrogenation is performed by low-energy implantation. We observe a fast initial hydrogen migration, followed by a long-time diffusion phase that is described by an effective diffusion coefficientD _eff=D _{0 eff} exp(–E _a/kT) withD _{0 eff}–cm²s^–1 andE _a=(0.83±0.05) eV. No deeper hydrogen migration is detected for implantation times longer than – 30 min. Our data are explained by the build-up of a large amount of molecular hydrogen beneath the surface, which strongly hinders the transfer of the implanted hydrogen to the bulk. The thermal reactivation kinetics of the neutralized boron show a rapid initial step followed by a longtime thermally activated second order phase, which is limited by the recombination of hydrogen into molecules.     

Saturation and isotope mixing during low-temperature implantations of hydrogen into metals

Deuterons of 10 keV energy and protons with the same mean projected range have been implanted into several metals at a temperature of approximately 35 K and at dose rates of approximately 2 × 10¹⁴ cm^–2 s^–1. The amount of retained deuterium saturates at fluences larger than roughly 2 × 10¹⁸ cm^–2. After implantation of deuterons and subsequent bombardment with protons, the deuteron depth profiles show characteristic double peak structures, which indicate a replacement process. The experimental data are in good agreement with a simple model of local saturation and mixing. The possible implications of this model are discussed.     

Thermal redistribution of boron implants in bulk silicon and SOS type structures

The redistribution of boron profiles in bulk silicon and SOS (silicon-on-sapphire) type structures is investigated in this paper. Experimental data on thermally redistributed profiles are correlated with predictions based on a computer program whose numerical algorithm was described in an earlier paper. Three cases were considered which involved the thermal redistribution of 1) a high dose (2×10¹⁵ and 5×10¹⁴ cm^–2) 80keV boron implant in (111) bulk silicon, in an oxidizing ambient of steam at 1000°, 1100°, and 1200°C, respectively; 2) a high dose (2.3×10¹⁵ cm^–2) 25 keV boron implant in (100) silicon-on-sapphire, in a nonoxidizing ambient of nitrogen at 1000 °C; and 3) a low dose (3.2×10¹² cm^–2) 150 keV boron implant in (100) bulk silicon, in oxidizing and nonoxidizing ambients that make up the fabrication schedule of an-channel enhancement mode device. For all three cases the overall correlation of computer predictions with experimental data was excellent. Correlations with experimental data based on SUPREM predictions are also included.     

High concentration effects of ion implanted boron in silicon

The diffusion behaviour of implanted boron in silicon was investigated using the¹⁰B(n,α)⁷ Li nuclear reaction. An anomalous behavior with a strong reduction of the diffusivity above an effective solubility limit at 1.5×10¹⁹, 6×10¹⁹, and 1.1×10²⁰ cm⁻³ was found for annealing temperatures of 800, 900, and 1,000°C, respectively.     

Damage anneal of antimony/phosphorus double implants in silicon

A method is presented for avoiding the dislocation generation in (100) silicon implanted with phosphorus doses up to 5×10¹⁵ ions/cm² at 50 keV. The residual defects after the damage anneal are considerably reduced if the phosphorus implant is combined with a low dose, e.g. 1×10¹⁴ ions/cm², antimony implant which produces a deeper surface layer of amorphous silicon. It is essential that the phosphorus ions are implanted shallower than the antimony ions, and come to rest within the amorphous layer. Subsequent thermal annealing proceeds by a solid phase epitaxial regrowth mechanism.     

Ion channeling in natural and synthetic beryl crystals

The transmission of ions by channeling through natural beryl and synthetic emerald has been studied extensively. The transmission ratios depend upon the angle of incidence with a full half width of less than 0.32°. While the maximum ratio obtained up to now is only 4×10⁻⁴ for 350 keV protons through a crystal of 21 μm thickness, the energy of the transmitted ions is high, the loss being in the order of a few keV/μm. About 60–80% of the particles emerging from the rear surface are ionized. By varying the ion species transmission could be observed up to atomic number 9. It is assumed that the transmission is facilitated by the existence of an electron free channel core. Higher transmission ratios can be expected for sufficiently perfect crystals.     

Iron contamination in ion implanted silicon,as revealed by x-ray and electron diffraction

A surface contamination effect was detected by double-crystal x-ray diffraction analysis of silicon wafers implanted with silicon ions at different doses and energies after annealing at 700 °C.The hypothesis of recoiled oxygen from the native oxide, as the impurity responsible for surface strain, was excluded by x-ray characterization of a series of samples implanted through thermally grown silicon oxides. The surface positions of the strain, resulting from x-ray analysis after 700 °C annealing and the analysis of the electron diffraction patterns, taken on particles originated from precipitation of the impurity by 1000 °C heating, allowed to conclude that the contamination phenomenon is due to iron atoms coming from the ion implanter.     

Determination of the copper diffusion coefficient in silicon from transient ion-drift

We use the transient ion drift in a depletion region of a Schottky barrier to determine ion diffusivities at moderate temperatures. The pulsed reverse bias leads to temperature dependent capacitance transients similar to deep level carrier emission transients. A simple theoretical model together with classical transient signal analysis provide the means to extract the ion diffusion constant. When applied to copper in silicon, diffusion data are obtained in a not yet investigated temperature range (280–400 K) which agree well with both low and high temperature diffusion data.     

Pulsed electron-beam annealing of high-dose arsenic implanted silicon

The effects of pulsed electron-beam annealing of high-dose As implanted {111} Si single crystals has been studied. The depth distributions and lattice location of the As atoms were obtained using MeV⁴He⁺ backscattering and channeling technique. The implantation energy was 100 keV with a total dose of 3.5·10¹⁶/cm². Above the threshold energy of 0.9 J/cm² the single-crystal transition was observed with about 95% of the As atoms on substitutional lattice sites. This leads to an As concentration of 2·10²¹/cm³ which was demonstrated to be a metastable one.     

Approximation to the two-step diffusion profile by a series of gaussian functions

The two-step diffusion profile is approximated by a series of gaussian functions. Its accuracy is dependent upon the number of terms used in the series, but independent of the number and the spacing of exact data points.     

Diffusion and solubility of zinc in dislocation-free and plastically deformed silicon crystals

Floating-zone Si crystals enclosed in quartz ampoules were exposed to Zn vapour released by an elemental diffusion source. Penetration profiles of Zn in Si were recorded using the spreading-resistance technique or neutron activation analysis. Both the erfc-type distributions observed in plastically deformed specimens and the non-erfc profiles determined on dislocationfree wafers are consistently interpreted within the framework of the kick-out model. As an implication, Si self-interstitials generated in excess by interstitial-to-substitutional transitions of in-diffusing Zn atoms annihilate not only at the surface but also at dislocations. On the other hand, dislocation-induced segregation of Zn appears to be rather minor, as revealed by transition electron microscopy. Combining the Zn incorporation rate in dislocation-free Si with solubility data from saturated specimens yields the self-interstitial contribution to the Si self-diffusion coefficient.Dedicated to H.J. Queisser on the occasion of his 60th birthday     

Nondestructive topographic evaluation of ion implanted layers on GaAs substrates by optical absorption

It is demonstrated that ion implanted layers can be analysed prior to annealing by measuring the sub-bandgap optical absorption of the damaged lattice. The absolute value and lateral homogeneity of the implantation dose can be measured. The method is fast, nondestructive and compares favorably with existing measurement techniques.     

Passivation of laser induced defects in silicon by low energy hydrogen ion implantation

It is well established that the pulsed-laser annealing of as-implanted Si introduces electrically active defects. The aim of this paper is to show that these defects can be neutralized by low-energy hydrogen ion implantation. The techniques used for the sample characterization are current-voltage measurements and capacitance transient spectroscopy.     

Laser annealing of Bi implanted <111> and <100> silicon

The influence of surface orientation in Bi implanted silicon, annealed by Q-switched ruby laser pulse irradiation was investigated. Depth distributions and lattice location of the Bi atoms were obtained using⁴He backscattering and channeling techniques and the electrical behavior studied by sheet resistance measurements. The dopant profiles show partial surface accumulation and in-depth broadening without influence of the substrate orientation. These profiles can be fitted by a numerical calculation based on the normal freezing model with an interfacial segregation coefficient much higher than the equilibrium one. The impurity atoms located in the in-depth profile are shown to be electrically active when their maximum concentration does not exceed 10²⁰ atoms/cm³.     

Lattice defects of V3Si single crystals studied by positron annihilation

The sensitivity of positrons to point defects created by the irradiation of V₃Si with neutrons is demonstrated. We found no indication of thermal vacancies by thermal equilibrium measurement up to 1273 K which indicates that the monovacancy formation enthalpy for V₃Si isH _1V ^F ≧(1.84±0.14) eV. Investigations within the range of homogeneity for excess vanadium suppot the idea that substitutional defects are the dominating defect type, whereas for excess silicon a direct confirmation of existing structural vacancies as the dominating defect type is given.     

A model of strain relaxation in hetero-epitaxial films on compliant substrates

0 these maximum relieved strains are φ₀/2, φ₀, 3φ₀/2 and 2φ₀ respectively, at the end of each of stages I–IV. Films relaxed in each stage are characterized by a specific set of macroscopic crystallographic features that can be observed experimentally, including lattice rotation, lattice tilt, and the presence of more than one variant in some cases. For example, complete untwisting is predicted for stage IV relaxation, resulting in the disappearance of the initial twist angle between the two lattices. To relax the elastic misfit strain, extensive plastic deformation of the substrate film is involved, thus making it compliant to the hetero-epitaxial film. This thin film substrate may be called the plastically compliant substrate (PCS). Received: 18 June 1997/Accepted: 27 June 1997     

Defects in pulsed laser and thermal processed ion implanted silicon

The evolution of the nature and concentration of the defects produced by 100 or 300 keV As ions at fluences 1 to 4×10^–12 cm^–2 inn-type, Fz Silicon doped with 10¹⁵ to 10¹⁶ cm^–3 has been studied as function of thermal treatments (in the range 500°–900 °C) and of the energy density (in the range 0.3–0.6 J cm^–2) of a light pulse from a ruby laser (15 ns, 0.69 m). Deep-level transient spectroscopy (DLTS) combined with capacitance — voltage (C-V) measurements were used to get the characteristics (energy level, crosssection for the capture of majority carriers) of the defects and theirs profiles. The difficulties encountered in the analysis of the results, due to the large compensation of free carriers in the implanted region and to the abrupt defect and free carrier profiles, are discussed in detail and the corrections to apply on the C-V characteristics and the DLTS spectra are described. The defects resulting from the two types of treatments are found to be essentially the same. Only, for laser energies higher than 0.5 J cm^–2, the laser treatment appears to introduced new defects (atE0.32 eV) which should result from a quenching process. The fact that a laser energy smaller than the threshold energy for melting and recrystallization is able to anneal, at least partially, the defects produced by the implantation, demonstrates that the annealing process induced by the laser pulse is not a purely thermal process but is enhanced by a mechanism involving ionization.     

Front and back surface cw CO2-laser annealing of arsenic ion-implanted silicon

The annealing behavior of arsenic-implanted silicon under scanned cw CO₂-laser irradiation from front and back surfaces is investigated. Ellipsometry, Hall effect, Rutherford backscattering measurements and neutron activation analysis indicate an enhancement of annealing efficiency by laser irradiation from the back surface, which provides complete recovery of crystal damage, high substitutionality and electrical activation of implanted arsenic atoms without redistribution of concentration profile. The enhancement of annealing efficiency under back-surface irradiation is explained by the difference in laser reflection from the front and back surface of silicon wafers. No differences in the results are found for scanned and static annealing.