CBE growth of high-quality AlGaAs/GaAs heterostructures for HEMT applications

AlGaAs/GaAs heterostructures were grown by chemical beam epitaxy using triethylgallium, triisobutylaluminium and pure arsine in flow control mode with hydrogen as carrier gas. For substrate temperatures of 580°C and V/III ratios of 10, high quality AlGaAs layers are obtained; heterostructures show abrupt and smooth interfaces. Modulation doping with silicon evaporated from a conventional effusion cell gives two-dimensional electron gases with carrier densities up to 1×10¹² cm^-2. Mobilities of 70000 cm²/V·s are obtained at 77 K for carrier densities of 4×10¹¹ cm^-2. The lateral homogeneity of the heterostructures in layer thickness, composition and doping level is excellent. Perfect morphology with defect densities of about 100 cm^-2 is observed. High electron mobility transistors (gate length 0.3 nm) fabricated from quantum well structures show a transconductance of about 380 mS/mm.     

Anisotropic lateral growth in GaAs MOCVD layers on (001) substrates

For metalorganic chemical vapor deposition, a fast lateral growth rate is observed for the first time on (001) GaAs having round mesas. The lateral growth rate is greater than the vertical growth rate by a factor of 3–5. The lateral growth rates have anisotropy with respect to the crystallographic directions on the (001) surfaces. The fastest growth direction is the [110] and the slowest one is the [ 10]. The [110] and [ 10] growth rates were found to be strongly dependent on growth conditions, though the vertical one is independent. The [110] growth rate decreases with decreasing As pressure, while the [ 10] remains constant. As growth temperature increases, both the [110] and the [ 10] growth rates decrease. A simple model for the lateral growth mechanism is proposed from the consideration of atomic arrangements and the number of dangling bonds at [110] and [ 10] step sites. According to the model, the lateral growth rate is proportional to the number of bonds available for binding Ga atoms at step sites. The model can explain well the anisotropy in the lateral growth rate and its dependence on the growth conditions.     

Liquid-phase epitaxy of AlGaAs heterostructures on profiled substrates

A method of fabrication of planar local structures using the selective epitaxial growth of GaAs and AIGaAs layers from liquid phase on profiled GaAs substrates was developed. The planar regrowth of the recesses formed in GaAs substrates by local etching was performed using the anisotropy of epitaxial growth rates and also by providing the uniformity of mass flow to the surface of local epilayer. The developed method of localized structures fabrication was used for improving the characteristics of discrete light emitting diodes — LED and for fabrication of DLE monolithic arrays.     

The heteroepitaxial growth of vacuum-deposited GaP thin films on Si substrates

Heteroepitaxial GaP thin films were grown on (100) and (111)Si substrates by vacuum evaporation of the compound GaP and their structural characteristics were compared with homoepitaxial GaP films grown by the same technique on (100)GaP substrates. Nearly monocrystalline GaP thin films were deposited reproducibly on (100)Si substrates at the optimum substrate temperature of about 680–700°C and the deposition rate of 0.1 nms⁻¹. The structure of such films was comparable in quality to homoepitaxial GaP/GaP films. No monocrystalline films could be deposited on (111)Si substrates.     

Measurement of nitrogen atomic flux for RF-MBE growth of GaN and AlN on Si substrates

Production and measurement of active nitrogen atoms (N+N*), which consist of ground state nitrogen atoms N and excited state nitrogen atoms N*, in an inductively coupled radio frequency discharge for the growth of group III nitrides and their alloys using a molecular beam epitaxy (MBE) were studied. Two discharge modes of the low brightness (LB) and the high brightness (HB) used in this study to produce excited nitrogen molecules (N₂*) and dissociated active nitrogen atoms (N+N*). The flux of (N+N*) was measured by a Langumuir-like electrode due to the self-ionization of adsorbed (N+N*) on a negatively biased electrode. The self-ionization, which emits electrons from (N+N*), forms an atom current and is confirmed using different electrodes such as Pt and CuBe and different electrode area. The atom current was calibrated by the grown GaN thickness in a VG80H MBE machine. The calibrated flux of (N+N*) per atom current in the VG80H machine is 5.5×10⁻⁴ ML/s/nA, where ML is monolayer. The atom current is useful to monitor the flux of chemically active nitrogen atoms N+N* for growth of group III nitrides and their alloys. Activity modulation migration enhanced epitaxial growth (AM-MEE) was demonstrated as an application of the measurement of atom current for the growth of the group III nitrides.     

Ionized-cluster beam epitaxial growth of GaP films on GaP and Si substrates

Epitaxial films of GaP on GaP and Si substrates are grown by the Ionized-Cluster Beam Technology. The doping of Zn and N during the growth of the film are also discussed. A p-type epitaxial film doped by Zn and N shows an absorption spectrum similar to that of a direct transition type semiconductor. P-n junction LEDs are fabricated by depositing p-type GaP on n-type substrate. The luminescence from the device was observed.     

Epitaxial growth of ZnO thin films on Si substrates by PLD technique

Epitaxial ZnO thin films have been grown on Si(1 1 1) substrates at temperatures between 550 and 700 °C with an oxygen pressure of 60 Pa by pulsed laser deposition (PLD). A ZnO thin film deposited at 500 °C in no-oxygen ambient was used as a buffer layer for the ZnO growth. In situ reflection high-energy electron diffraction (RHEED) observations show that ZnO thin films directly deposited on Si are of a polycrystalline structure, and the crystallinity is deteriorated with an increase of substrate temperature as reflected by the evolution of RHEED patterns from the mixture of spots and rings to single rings. In contrast, the ZnO films grown on a homo-buffer layer exhibit aligned spotty patterns indicating an epitaxial growth. Among the ZnO thin films with a buffer layer, the film grown at 650 °C shows the best structural quality and the strongest ultraviolet (UV) emission with a full-width at half-maximum (FWHM) of 86 meV. It is found that the ZnO film with a buffer layer has better crystallinity than the film without the buffer layer at the same substrate temperature, while the film without the buffer layer shows a more intense UV emission. Possible reasons and preventive methods are suggested to obtain highly optical quality films.     

Study of Ge epitaxial growth on Si substrates by cluster beam deposition

Ge epitaxial layers with reasonable quality were grown on Si (1 1 1) substrates by cluster beam deposition (CBD) process. Molecular dynamics study of the low energy Ge clusters deposition process utilizing the Stillinger–Weber two- and three-body interaction potentials was carried out to compare the experimental results. Both experimental and simulation results prove that the substrate temperature plays a dominant role in the epitaxial growth of Ge films in CBD process. The influence mechanisms of temperature are discussed.     

The effect of tourmaline additives in TiO2 photoanode for high-efficiency dye sensitized solar cells

Tourmaline is a kind of borosilicatemineral and has spontaneous polarization property. Due to this property, it can generate a feeble current around 0.06 mA[1 O'Regan, B., &; Grätzel, M. (1991). Nature 353, 737.[Crossref], [Web of Science ®] , [Google Scholar]]. We fabricated the TiO₂ photoanode with different wt.% ratio of tourmaline and investigated the effect of tourmaline additive on dye sensitized solar cells (DSSCs). We carried out electrochemical impedance spectroscopy (EIS) and current density-voltage (J-V) measurement. The results showed that the electron lifetime and the power conversion efficiency of the DSSCs with TiO₂ photoanode containing 3wt% tourmaline were enhanced by about 42% and 20%, respectively, as compared to the DSSCs using pristine TiO₂ photoanode.     

The effect of different oriented sapphire substrates on the growth of polar and non-polar ZnMgO by MOCVD

Polar and non-polar ZnMgO were synthesized on different crystallographic planes (C-, R- and M-planes) of sapphire (Al₂O₃) substrates by metal organic chemical vapor deposition, respectively. Under the same experimental condition, polar ZnMgO nanorods were obtained on C-Al₂O₃ substrate whereas non-polar ZnMgO thin films were obtained on R- and M-Al₂O₃ substrates. The surface morphology was significantly influenced by the competition of the preferable growth directions on different sapphire substrates. On C-Al₂O₃ substrate, ZnMgO nanorods were vertically well-aligned with typical lengths in the range 330–360 nm. On R- and M-Al₂O₃ substrates, however, ZnMgO thin films with flat surfaces were obtained, whose thickness were 150 and 20 nm, respectively. Under the same condition, the C-ZnMgO deposited on C-Al₂O₃ substrate has the maximum growth velocity (11 nm/nim), followed by A-ZnMgO deposited on R-Al₂O₃ substrate (5 nm/min), and the M-ZnMgO deposited on M-Al₂O₃ substrate has the minimum one (0.67 nm/min). The Near-Band-Edge (NBE) emission in Photoluminescence (PL) spectra shows a clear blueshift and a slight broadening compared with that of pure ZnO samples, which suggest that the Mg content has successfully incorporated into ZnO. The different energy blueshifts (67 meV and 98 meV) of the NBE emission demonstrate that A-ZnMgO deposited on R-Al₂O₃ substrate has higher Mg incorporation efficiency than C-ZnMgO on C-Al₂O₃ substrate.     

Influence of Fe-doping on GaN grown on sapphire substrates by MOCVD

The influence of Fe-doping on GaN grown on sapphire substrates by MOCVD was investigated using microscopy, in situ optical monitoring, double-crystal X-ray, Hall and photoluminescence. The growth from 3-D mode to 2-D mode for undoped GaN, and the growth from 2-D mode to 3-D mode for Fe-doped GaN was observed, respectively. The 2-D mode during the initial stage of the Fe-doped GaN buffer growth suggests that Fe plays a role of surfactant. A slight Fe-doping did not significantly degrade the crystalline quality of GaN buffer, confirmed by the FWHM of X-ray rocking curves. More than 4 orders of magnitude increase in the resistivity of Fe-doped GaN was achieved as compared to the undoped GaN. As a deep energy level acceptor, the compensation of Fe atom at the vacancy of Ga atom can be explained as the results of increased resistivity and suppressed yellow luminescence.     

Self-formation of 100 nm scale wire structures during molecular beam epitaxial growth of AlGaAs on patterned substrates

A wire structure with 100 nm scale buried in AlGaAs is shown to be formed spontaneously during the molecular beam epitaxial (MBE) growth of AlGaAs on a pre-patterned substrate. Scanning electron microscope (SEM) and photoluminescence (PL) study revealed that a triangular-shaped wire region with Al content of 0.12 was embedded by Al_0.3Ga_0.7As with fairly sharp boundaries. The cross-sectional dimensions and the Al molar fraction of the wire are shown to be independent of the patterned mesa width on which the wire structure is grown.     

Characterization of thin‐film a‐Si:H/µc‐Si:H tandem solar cells on glass substrates

Techniques, such as photoluminescence (PL) and electron‐beam‐induced current (EBIC), have already proven their effectiveness and applicability for solar materials. Although, the methods are standard techniques for multicrystalline Si PV, their application to thin films is challenging and requires special adjustment and a careful selection of the measuring parameters. Here we report on the investigation of thin‐film tandem solar cells consisting of hydrogenated amorphous (a‐Si:H) and microcrystalline silicon (µc‐Si:H) on glass substrates. We observe a homogeneous spatial distribution of the PL signals caused by the dominance of the surface recombination. A typical PL spectrum exhibits sub‐band gap features of a‐Si:H. We relate the sub‐band‐gap spectral features mainly to transitions of carriers trapped in deep states. Observations on partially processed stacks support this supposition. PL is only detectable on the a‐Si:H layer, while EBIC signal is generated mainly in the µc‐Si:H layer. It is found out that the luminescence features of the thin a‐Si:H layer resemble those on bulk a‐Si:H.     

High quality amorphous Si solar cells for large area mass production Micromorph tandem cells

This paper reports on the development of an amorphous silicon cell used in the top cell of Micromorph® tandem solar modules produced in the pilot line of Oerlikon Solar in Trübbach — Switzerland. Tuning of the process parameters used for PECVD deposition of the absorber layers such as process pressure, RF power density, SiH₄/H₂ ratio, and substrate temperature can result in significant improvement in the material quality of the absorber layer and therefore in the performance and light induced degradation of the a-Si cell. We have measured the single layer properties of different absorber layers by infrared spectroscopy and have found a strong correlation between both the microstructure factor R and the H-content bonded to Si and the stabilized efficiency or relative degradation of the a-Si cells containing the corresponding absorber layers. A combination of absorber layers with superior material quality, adapted p-doped and buffer layers and ZnO front and back contacts with enhanced light trapping have achieved record values for the conversion efficiency of industrial thin a-Si single junction cells and modules. Our results show initial efficiencies on test cells prepared on 1.4 m² substrates of over 11%, an active area efficiency of 10.5% for a champion 1.4 m² a-Si single junction module and an 8.7% stabilized conversion efficiency for an industrial 1.4 m² a-Si single junction champion module.     

MOCVD growth of GaN on Si(1 1 1) substrates using an ALD-grown Al2O3 interlayer

GaN thin films have been grown on Si(1 1 1) substrates using an atomic layer deposition (ALD)-grown Al₂O₃ interlayer. This thin Al₂O₃ layer reduces strain in the subsequent GaN layer, leading to lower defect densities and improved material quality compared to GaN thin films grown by the same process on bare Si. XRD ω-scans showed a full width at half maximum (FWHM) of 549 arcsec for GaN grown on bare Si and a FWHM as low as 378 arcsec for GaN grown on Si using the ALD-grown Al₂O₃ interlayer. Raman spectroscopy was used to study the strain in these films in more detail, with the shift of the E₂(high) mode showing a clear dependence of strain on Al₂O₃ interlayer thickness. This dependence of strain on Al₂O₃ thickness was also observed via the redshift of the near bandedge emission in room temperature photoluminescence (RT-PL) spectroscopy. The reduction in strain results in a significant reduction in both crack density and screw dislocation density compared to similar films grown on bare Si. Screw dislocation density of the films grown on Al₂O₃/Si substrates approaches that of typical GaN layers on sapphire. This work shows great promise for the use of oxide interlayers for growth of GaN-based LEDs on Si.     

Advanced deposition phase diagrams for guiding Si:H-based multijunction solar cells

Phase diagrams have been established to describe very high frequency (vhf) plasma-enhanced chemical vapor deposition (PECVD) of intrinsic hydrogenated silicon (Si:H) and silicon–germanium alloy (Si_1?xGe_x:H) thin films on crystalline Si substrates that have been over-deposited with n-type amorphous Si:H (a-Si:H). The Si:H and Si_1?xGe_x:H films are prepared under conditions used for the top and middle i-layers of high efficiency triple-junction a-Si:H-based n–i–p solar cells. Identical n/i cell structures were co-deposited in this study on textured (stainless steel)/Ag/ZnO which serve as substrate/back-reflectors in order to relate the phase diagrams to the performance parameters of single-junction solar cells. This study has reaffirmed that the highest efficiencies for a-Si:H and a-Si_1?xGe_x:H solar cells are obtained when the i-layers are prepared under previously-described maximal H₂ dilution conditions.     

Growth and annealing effect of high-quality ZnSe:N/ZnSe by MOCVD

The ZnSe : N epitaxial layers were grown on (1 1 0) ZnSe substrates in a low-pressure metalorganic chemical vapor deposition (MOCVD) system using hydrogen as a carrier gas, and using ammonia as a dopant source. In order to obtain highly doped ZnSe : N epitaxial layers, the optimum growth and doping conditions were determined by studying the photoluminescence (PL) spectra from the ZnSe epitaxial layers grown at different ammonia flux and VI/II flux ratio. Furthermore, in order to enhance the concentration of active nitrogen in ZnSe epitaxial layer, a rapid thermal anneal technique was used for post-heat-treating. The results show that the annealing temperature of over 1023 K is necessary. Beside, a novel treatment method to obtain a smooth substrate surface for growing high quality ZnSe epitaxial layers is also described.     

Charge collection in amorphous silicon solar cells: Cell analysis and simulation of high-efficiency pin devices

The drift length L_drift = μτE within the i layer of a-Si:H solar cells is a crucial parameter for charge collection and efficiency. It is strongly reduced not only by light-induced reduction of μτ, but also by electric field deformation ΔE by charges near the p–i and i–n interfaces. Here, a simple model is presented to estimate contributions of free carriers, charges trapped in band tails and charged dangling bonds to ΔE. It is shown that the model reproduces correctly trends observed experimentally and by ASA simulations: charged dangling bonds contribute most to ΔE of meta-stable cells. Electrons trapped in the conduction band tail near the i–n interface lead to the strongest field deformation in the initial state, while positively charged dangling bonds near the p–i interface get more important with degradation under AM1.5g spectrum. The measurable parameter V_coll is proposed as an indirect parameter to estimate the electric field, and an experimental technique is presented that could enable the distinction of defects near the p–i and the i–n interfaces.     

High quality MOCVD GaN film grown on sapphire substrates using HT-AlN buffer layer

In this work we report on the growth and characterization of high quality MOCVD GaN film grown on Al₂O₃ substrates by using a HT (>1150 °C)-AlN buffer layer. We have investigated the most favorable growth conditions in terms of temperature, thickness and growth rate of AlN buffer layer in order to optimize the high temperature GaN layer. The improved morphological and structural properties of GaN layer were verified by AFM and XRD measurements. The optimized GaN layer presents a smooth surface with a rms value of 1.4 Å. The full width at half maximum (FWHM) for 800 nm thick GaN films is 144″. Furthermore PL measurements and C–V analysis confirm that in GaN layer grown on HT-AlN buffer layer defect density is drastically reduced.     

Lateral confined epitaxy of GaN layers on Si substrates

We developed a novel, simple procedure for achieving lateral confined epitaxy (LCE). This procedure enables the growth of uncracked GaN layers on a Si substrate, using a single, continuous metalorganic chemical vapor deposition (MOCVD) run. The epitaxial growth of GaN is confined to mesas, defined by etching into the Si substrate prior to the growth. The LCE-GaN layers exhibit improved morphological and optical properties compared to the plain GaN-on-Si layers grown in the same MOCVD system. By performing a set of LCE growth runs on mesas of varying lateral dimensions, we specified the crack-free range of GaN on Si as 14.0±0.3 μm.