Effect of intermediate plastic deformation on the high-temperature creep and lifetime of aluminum

The effect of various types of intermediate plastic deformation on the high-temperature creep of polycrystalline aluminum is studied. Intermediate deformation is performed after testing for 0.44 of the time to failure t _f via the single or multiple action of a hydrostatic pressure of 1000 MPa on porosity or via tension or compression at atmospheric pressure. Intermediate deformation is shown to decrease the creep rate, to increase the time to failure, and to increase the grain size. The change in the creep rate is maximal upon the cyclic (in the same test time intervals) action of pressure. A relation between the creep rate and the grain size has been reveled. The detected decrease in the creep rate is assumed to be caused by a decrease in the density of mobile dislocations (due to recrystallization).     

Macrolocalization of plastic strain in creep of fine-grain aluminum

The evolution of the plastic strain macrolocalization pattern in low-temperature creep of commercial purity aluminum is studied. The localization pattern depends on a stage in the creep curve. At the stage of steady-state creep, localization zones propagate in the form of a wave traveling with a velocity proportional to the rate of buildup of the total strain. It is found that the volumes where the creep and strain localization wave propagation are activated equal each other. Based on estimates of the activation volumes, it is shown that the velocity of plastic strain localization waves is governed by thermally activated dislocation movement.     

Effect of the microstructural porosity parameters on the fracture and deformation of copper during creep at 773 K

The parameters of intergranular fracture of copper during creep under tension at T = 773 K and σ = 12.5 MPa are determined, and the contribution of grain-boundary porosity to the increase in the creep rate at stage III is estimated. The increase in the creep rate is shown to occur due to the pore-induced decrease in the grain boundary area, an increase in the mobile-dislocation density, and the deformation of the material because of the formation of pores and cracks.     

Activation energy jump in the force dependence of the steady-state creep rate during tension of aluminum and lead

The activation parameters are estimated at the steady stage of creep during tension of aluminum and lead in the range of the exponential and power stress dependences of the steady-state creep rate. A jump of the effective activation energy is shown to occur in the stress dependence of the creep rate at T ? 0.5T _m . This jump is approximately equal to the difference between the activation energies of self-diffusion and pipe diffusion.     

Grain size effects on microstructural stability and creep behaviour of nanotwinned Ni free-standing foils at room temperature

Creep tests were performed on the high stacking fault energy (SFE) nanotwinned (NT) Ni free-standing foils with nearly the same twin thickness at room temperature (RT) to investigate the effects of grain size and loading rate on their microstructural stability and creep behaviour. The grain growth mediated by the twinning/detwinning mechanism at low applied stresses (<800 MPa) and grain refinement via the detwinning mechanism at high applied stresses (>800 MPa) were uncovered in the present NT-Ni foils during RT creep, both of which are attributed to the interactions between dislocations and boundaries. It appears that a higher initial dislocation density leads to a faster primary creep strain rate and a slower steady-state creep strain rate. Unlike the non-twinned metals in which grain growth often enhances the creep strain rate, the twinning/detwinning-mediated grain growth process unexpectedly lowers the steady-state creep strain rate, whereas the detwinning-mediated grain refinement process accelerates the creep strain rate in the studied NT-Ni foils. A modified phase-mixture model combined with Arrhenius laws is put forward to predict the scaling behaviour between the creep strain rate and the applied stress, which also predicts the transition from grain growth-reduced to grain refinement-enhanced steady-state creep strain rate at a critical applied stress. Our findings not only provide deeper insights into the grain size effect on the mechanical behaviour of nanostructured metals with high SFE, but also benefit the microstructure sensitive design of NT metallic materials.     

Alloying Effect on the Creep Mechanism and Creep Resistance of Polycrystals in the Concepts of Physical Mesomechanics

The effect of different slightly soluble alloy additions on the creep and individual creep-component behavior of lead at T = 0.5 T _cr under controlled conditions (high-purity polycrystals, the same grain size) is investigated on the basis of the concepts of physical mesomechanics. The additions used are shown to reduce the creep rate under these conditions. The effect of the slightly soluble alloy additions to the polycrystal on the steady-state creep rate is produced through grain-boundary sliding and localized-deformation banding near grain boundaries.     

Rate of creep due to grain-boundary diffusion in polycrystalline solids with grain-size distribution

For steady-state deformation caused by grain-boundary diffusion, the macroscopic creep rate is analysed for a three-dimensional polycrystal consisting of space-filling grains, by taking into account the effects of diffusional interaction between grains, viscous grain-boundary sliding and grain-size distributions. For regular polyhedral grains, the grain–grain interactions increase the degree of symmetry of diffusional field, resulting in a decrease of the effective diffusion distance. Meanwhile, both the viscous grain-boundary sliding and the grain-size distribution are found to decrease the creep rate. At decreasing grain sizes, the influence of the viscous grain-boundary sliding becomes increasingly important, which explains the recent experimental observations that the creep rates of nanosized grains are much lower than those predicted by grain-boundary diffusion. On the effect of the grain-size distribution, the upper-bound and lower-bound creep rates are estimated.     

4.0 GPa压力下纯橄岩弹性纵波速度和衰减的实验研究

 应用超声波透射法和超声波频谱振幅比法、在4.0 GPa压力条件下、测量了弹性纵波通过纯橄岩的波速（v_P）和品质因子值（Q_P，用于表征衰减）随压力的变化，并分析了纯橄岩内部结构的变化对波速和衰减的影响。在实验压力范围内（≤4.0 GPa），随压力升高，纯橄岩的纵波速度逐渐增大：从7.6 km/s（0.4 GPa）逐渐增大至8.5 km/s（4.0 GPa），升高了11.8%，低压时的增大幅度大于高压时的增大幅度。纯橄岩的品质因子值呈两段式线性变化：从低压区间到高压区间品质因子值的增大幅度明显变小（0.4~2.4 GPa压力范围内Q_P增大了358.5%，2.4~4.0 GPa压力范围内Q_P仅升高了7.6%）。纯橄岩的品质因子从54（0.4 GPa）升高至266.4（4.0 GPa），增大幅度达393.3%。在相对低压（0.4~2.4 GPa）条件下，纵波通过纯橄岩的速度增大、衰减降低主要是由于样品内的孔隙和微裂纹大量闭合，岩石密度增大，纵波在通过样品内孔隙和裂缝时损失的机械能降低，因此纵波通过纯橄岩的能量增大（即衰减降低），波速升高；当围压较高（2.4~4.0 GPa）时，纯橄岩内大部分裂纹已经闭合，而且矿物颗粒边界接触紧密。岩石内部的裂纹和颗粒之间由于摩擦滑动而损失的能量也变少，所以在高压时纯橄岩的波速和衰减的变化幅度变缓，但波速仍呈线性增大，而品质因子值（衰减）随压力升高几乎趋于不变。     

Specifics of the combustion of aluminum-water mixtures

Experimental studies of the combustion of mixtures of micron-sized flaky aluminum powder with unthickened water in different conditions at atmospheric and high pressure in nitrogen and argon are performed. The density and composition of the mixture are varied. The regularities of the combustion have been established. A filtration wave of hot hydrogen ahead of the combustion front in samples with high porosity has been revealed. For the combustion under a nitrogen atmosphere, the pressure exponent in the burning rate law is close to 0.47 in a wide range of pressures. For the combustion under an argon atmosphere at pressures above 50 atm, the pressure exponent becomes zero or negative. Aluminum powder is demonstrated to be able to burn under conditions of a separated charge, where the fuel (aluminum) and oxidizer (water) are separated by a thin partition or brought in direct contact. The fast convective burning of aluminum-water mixtures in a semiclosed volume is discovered.     

一种预测材料蠕变速率的新模型

长期以来,由于对材料蠕变过程缺乏清晰的微观物理描述,人们均使用经验公式预测稳态蠕变速率,这导致预测结果的不可靠.将单原子统计模型拓展到该领域,在原子扩散水平上建立了一个预测材料稳态蠕变速率的模型.为了检验该模型的可靠性,实验测量了42CrMoA,2Cr12Ni,1Cr12Mo三种材料的稳态蠕变速率.所获得的实验结果以及其他文献的实验测试结果均与新模型的计算结果相符合.     

Estimation of copper activation parameters upon a transition from the exponential to power stress dependence of the creep rate

The results of estimation of activation parameters in the region of exponential (I) and power (II) dependences of the steady-state creep rate of polycrystalline copper on stress were represented. It is shown that the elastic long-range stress produced by dislocations in region I can be determined directly from the dependence of the creep rate on the stress. An energy criterion of the transition from creep region I to region II is proposed.     

Constitutive description of primary and steady-state creep deformation behaviour of tempered martensitic 9Cr–1Mo steel

The model based on the coupled sine hyperbolic creep rate relation with the evolution of internal stress as a function of strain provides better understanding of primary and secondary creep behaviour of tempered martensitic 9Cr–1Mo steel. The predicted evolution of internal stress as an increase in the internal stress value (or, decrease in effective stress) with strain/time appropriately described the observed decrease in creep rate during primary creep in the steel. The applicability of the model has been demonstrated by comparing experimental and predicted creep strain–time and creep rate–strain/time data of 9Cr–1Mo steel at 793 and 873 K for quenched and tempered and simulated post-weld heat treatment conditions. Irrespective of prior heat treatment and test temperature, the optimised parameters associated with the internal stress values exhibited linear variations with applied stress. The influence of prior heat treatment on primary and secondary creep characteristics of the steel is reflected on the rate constant values associated with the model. At all temperatures and heat treatment conditions, good agreement between the experimental and predicted steady-state creep rates demonstrate the further applicability of the model.     

Universal scaling in transient creep

We present experimental evidence that pressure solution creep does not establish a steady-state interface microstructure as previously thought. Conversely, pressure solution controlled strain and the characteristic length scale of interface microstructures grow as the cubic root of time. Transient creep with the same scaling is known in metallurgy (Andrade creep). The apparent universal scaling of pressure solution transient creep is explained using an analogy with spinodal dewetting.     

纳米压痕法测量Cu的室温蠕变速率敏感指数

把恒加载速率/载荷法（const.P·/P）和恒载荷法（const.P）相结合，提出了一个稳态加载和长时间保载的纳米压痕蠕变试验新方法.该方法不仅适用于高蠕变能力的低熔点材料，也适用于低蠕变能力和存在压痕尺寸效应的高熔点材料.用该方法确定Cu的室温蠕变速率敏感指数m为0.01，并发现其值不受加载段所用的P·/P值和达到的最大压入位移h-max的影响. 关键词： 纳米压痕 铜 蠕变 蠕变速率敏感指数     

Energy transport in plasma etching of nanoporous dielectric materials

A Monte Carlo routine was developed to simulate the motion and energetics of ions in the pores of a xerogel material under plasma etching conditions. The simulation included the effects of an applied electric field and input conditions for the pore as a function of pressure and applied voltage in the plasma reactor. We were interested in the ion energy in a pore, the ion penetration depth and the effect of ion energy on etching.At low pressures the nanoporous material etches faster than dense silicon dioxide. This is to be expected given the decrease in density and increase in surface area that arises due to the porosity. However, as the pressure is increased, the etch rate decreases dramatically and, eventually, the dense oxide may etch faster than the porous material. CHF₃ was used as the etchant gas and, for this gas, we believe this behavior to be controlled by the ion energy and energy transport in the pores of the xerogel material. As the pressure in the plasma reactor is increased, the incoming ions switch over from etching activation to polymerisation activation. This agrees with the observed crossover in etch rate seen experimentally and with the cessation in etching as pressure is increased. The switch is affected by pore roughness and correlates with the average ion energy in the pore.     

High-precision measurements of the compressibility of chalcogenide glasses at a hydrostatic pressure up to 9 GPa

The volumes of glassy germanium chalcogenides GeSe₂, GeS₂, Ge₁₇Se₈₃, and Ge₈Se₉₂ are precisely measured at a hydrostatic pressure up to 8.5 GPa. The stoichiometric GeSe₂ and GeS₂ glasses exhibit elastic behavior in the pressure range up to 3 GPa, and their bulk modulus decreases at pressures higher than 2–2.5 GPa. At higher pressures, inelastic relaxation processes begin and their intensity is proportional to the logarithm of time. The relaxation rate for the GeSe₂ glasses has a pronounced maximum at 3.5–4.5 GPa, which indicates the existence of several parallel structural transformation mechanisms. The nonstoichiometric glasses exhibit a diffuse transformation and inelastic behavior at pressures above 1–2 GPa. The maximum relaxation rate in these glasses is significantly lower than that in the stoichiometric GeSe₂ glasses. All glasses are characterized by the “loss of memory” of history: after relaxation at a fixed pressure, the further increase in the pressure returns the volume to the compression curve obtained without a stop for relaxation. After pressure release, the residual densification in the stoichiometric glasses is about 7% and that in the Ge₁₇Se₈₃ glasses is 1.5%. The volume of the Ge₈Se₉₂ glass returns to its initial value within the limits of experimental error. As the pressure decreases, the effective bulk moduli of the Ge₁₇Se₈₃ and Ge₈Se₉₂ glasses coincide with the moduli after isobaric relaxation at the stage of increasing pressure, and the bulk modulus of the stoichiometric GeSe₂ glass upon decreasing pressure noticeably exceeds the bulk modulus after isobaric relaxation at the stage of increasing pressure. Along with the reported data, our results can be used to draw conclusions regarding the diffuse transformations in glassy germanium chalcogenides during compression.     

Pressure dependence of photoconductivity for hydrogenated amorphous silicon

Abstract

Measurements of steady-state photoconductivity for hydrogenated amorphous silicon (a-Si:H) have been carried out at pressures up to 14 GPa and at room temperature. The ratio of photoconductivity to darkconductivity [sgrave]p/[sgrave]D decreases with increasing pressure. The activation energy for photoconductivity Ep, which is 0.25 eV at ambient pressure, decreases with increasing pressure at the rate -7 meV/GPa. These resultls are discussed with change in density of states.     

New phenomena in high-temperature plasticity

A thorough understanding of recovery phenomena in high-temperature plasticity requires information on both creep (constant stress) and constant strain-rate deformation in the corresponding steady-state regimes. This is demonstrated for the diamond cubic structure elements Si and Ge, where dynamical recovery is characterized by two independent mechanisms, crossing in the range accessible to measurements, which have been identified to obey self-diffusion or cross-slip. In consequence, the stress-strain curves of single crystals show two recovery stages, while in steady-state creep only one (the second) recovery stage can be observed. From deformation experiments on fcc metals published in the literature it is concluded, that the stress-strain curves of at least Au and Al single crystals are also characterized by two recovery stages at high temperatures; it will be shown, however, that the situation is different from that of the semiconductors to some extent. Finally, some preliminary comments concerning dynamical recovery of hexagonal metals are given.     

Influence of omnidirectional pressure on the development of porosity during necking under stretching of metals and alloys

The influence of omnidirectional pressure on microporosity developing in the neck of 45-μm-thick copper sheets tested for creep is considered. Comparing these data with a porosity measured in cylindrical specimens leads us to conclude that the transition from cleavage failure to shear fracture observed in copper under pressure is related to a decrease in the mean hydrostatic tension in the neck.