Sub-micron ablation of metallic thin film by femtosecond pulse laser

The ability to machine very small features in a material has a wide range of applications in industry. We ablated holes into thin film of 100 nm thickness made from various metals by femtosecond pulsed laser ablation. Using a Ti:Sapphire laser which supplies a laser pulse of 150 fs duration at central spectrum wavelength of 400 nm, we have produced a series sub-micron holes, whose diameters are less than 200 nm with a focused laser spot of 1.7 μm. We found that the material damage threshold has a great influence on the quality of the produced features. Experimental results shows that the heat-affected zone and the degree of being affected reduce with the increase of threshold value.     

Alcohol-assisted photoetching of silicon carbide with a femtosecond laser

Femtosecond lasers have proved to be effective tools for micromachining silicon carbide material. In the drilling process, however, when the debris around the hole was not removed efficiently, the depth of hole would not increase further. In this paper, alcohol-assisted photoetching of 6H silicon carbide was investigated using a femtosecond laser. Machining in the presence of alcohol was beneficial to the debris ejection from the hole. The alcohol flow and volatilization was also helpful to further carry away the ablation debris and reduce the ablated material redeposition. The experiment showed that photoetching assisted by alcohol produced cleaner ablation effect and deeper hole than in ambient air. Moreover, alcohol assistance would not produce additional thermal damage around the hole. Vias were formed in a 250 μm thick wafer with alcohol-assisted photoetching technique using a femtosecond laser, which demonstrated the potential for this processing technique.     

Fast femtosecond laser ablation for efficient cutting of sintered alumina substrates

Fast, accurate cutting of technical ceramics is a significant technological challenge because of these materials' typical high mechanical strength and thermal resistance. Femtosecond pulsed lasers offer significant promise for meeting this challenge. Femtosecond pulses can machine nearly any material with small kerf and little to no collateral damage to the surrounding material. The main drawback to femtosecond laser machining of ceramics is slow processing speed. In this work we report on the improvement of femtosecond laser cutting of sintered alumina substrates through optimisation of laser processing parameters. The femtosecond laser ablation thresholds for sintered alumina were measured using the diagonal scan method. Incubation effects were found to fit a defect accumulation model, with F_th,1=6.0 J/cm² (±0.3) and F_th,∞=2.5 J/cm² (±0.2). The focal length and depth, laser power, number of passes, and material translation speed were optimised for ablation speed and high quality. Optimal conditions of 500 mW power, 100 mm focal length, 2000 µm/s material translation speed, with 14 passes, produced complete cutting of the alumina substrate at an overall processing speed of 143 µm/s – more than 4 times faster than the maximum reported overall processing speed previously achieved by Wang et al. [1]. This process significantly increases processing speeds of alumina substrates, thereby reducing costs, making femtosecond laser machining a more viable option for industrial users.     

Titanium micromachining by femtosecond laser

The ultimate goal of this research was to characterize the ablation depth with respect to pulse energy, translation speed, and consecutive passes in order to obtain the parameters to have smooth microchannel surfaces. A logarithmic dependence of the channel depth on the laser pulse energy was observed with two different distinct ablation regimes. Although the same fluence values were used with two different lens sizes, the slopes of these ablation regimes were quite different. 100 mm lens has a small optical penetration length with steeper ablation slope in the first regime, whereas the 15 mm lens has the opposite. In the second part of the ablation regime, the slope was lower for 100 mm lens as compared to 15 mm lens. Furthermore, spike formation has been seen in 100 mm lens study at 0.308, 0.370, 0.431, and 0.493 J/cm² fluence values yet no spike formations have been seen in 15 mm lens study.     

Silicon substrate temperature effects on surface roughness induced by ultrafast laser processing

We report the effect of substrate temperature (T_sub) in the range 300-900 K on the surface roughness of silicon wafer resulted from femtosecond laser ablation. The surface roughness observed at the laser fluences less then 0.3 J/cm² increases with increasing T_sub. However, the surface roughness decreases with increasing T_sub for the laser fluences between 0.5 and 1.0 J/cm². If the laser fluence is higher than 2.0 J/cm², the surface roughness is independent of T_sub. The effect of T_sub on the surface roughness can be understood in terms of the temperature dependence of optical absorption coefficient of silicon substrate, which eventually alters a mechanism underlying the fs-laser-material ablation process between optical penetration and thermal diffusion processes.     

Fabrication of microchannels in single-crystal GaN by wet-chemical-assisted femtosecond-laser ablation

We investigated micro- and nano-fabrication of wide band-gap semiconductor gallium nitride (GaN) using a femtosecond (fs) laser. Nanoscale craters were successfully formed by wet-chemical-assisted fs-laser ablation, in which the laser beam is focused onto a single-crystal GaN substrate in a hydrochloric acid (HCl) solution. This allows efficient removal of ablation debris produced by chemical reactions during ablation, resulting in high-quality ablation. However, a two-step processing method involving irradiation by a fs-laser beam in air followed by wet etching, distorts the shape of the crater because of residual debris. The threshold fluence for wet-chemical-assisted fs-laser ablation is lower than that for fs-laser ablation in air, which is advantageous for improving fabrication resolution since it reduces thermal effects. We have fabricated craters as small as 510 nm by using a high numerical aperture (NA) objective lens with an NA of 0.73. Furthermore, we have formed three-dimensional hollow microchannels in GaN by fs-laser direct-writing in HCl solution.     

Formation of periodic surface nanostructures on Ti:Al2O3 crystals using femtosecond laser pulses

Periodic surface nanostructures are observed on Ti³⁺:Al₂O₃ single crystals that have been irradiated by a single focused beam from a femtosecond pulsed laser (wavelength: 800 nm; pulse duration: 130 and 152 fs). Atomic force microscopy images of single-ablated zones and modified structures created by fixing and translating samples through the focal region of a linearly polarized laser beam reveal self-organized periodic surface nanostructures (ripples) with a subwavelength spacing, which are oriented perpendicular to the electric-field vector of the laser beam. The period of the subwavelength ripples obtained by linearly polarized laser irradiation varies from ∼λ/5 to 2λ/5 (λ: incident laser wavelength) depending on the laser pulse energy. This phenomenon can be explained by assuming that the incident light field interferes with the electric field of electron plasma waves propagating inside the material; this interference periodically modulates the electron plasma density and modifies the surface ablation. In addition, for the first time, we observe screw-shaped nanostructures in the focal spot of circularly polarized beam irradiation. The morphology of these nanostructures appears to reflect the circular polarization of the laser light.     

Modeling of femtosecond ablation of aluminum film with single laser pulses

Detailed investigation of pulsed laser ablation dynamics is performed for aluminum target under action of 100 fs pulses with peak intensity 3.95 × 10¹² W/cm² and wavelength 0.8 μm.Non-equilibrium two-temperature model with hydrodynamic Stephan problem was used for modeling. Explicit tracking of moving interphase boundaries permits exact determination of their velocity and amount of removed and evaporated material. Detailed ablation process is analyzed using the study of temperature, pressure and density evolution in the target. High phase front velocities (melting up to 5 km/s and evaporation up to 350 m/s) are caused by strong overheating of solid and liquid phases.     

A simplified predictive model for high-fluence ultra-short pulsed laser ablation of semiconductors and dielectrics

Ultra-short pulsed laser ablation is a very complicated process and a predictive model is very desirable for process design and optimization in practical applications. However, the molecular dynamics or hydrodynamic models, although they are powerful and necessary tools for the study of the fundamental physics, are time-consuming and difficult to apply for practical applications. In this paper, a predictive, simplified and easy to apply model has been developed for high-fluence ultra-short laser ablation of semiconductors and dielectrics. Unlike many other simplified models, this model does not involve any free adjustable variables. The model predictions agree well with experimental measurements for femtosecond laser ablation, while the model is not very applicable for pulse durations more than ∼10 ps.     

XRD studies on the femtosecond laser ablated single-crystal germanium in air

Ultrashort laser ablation of single-crystal germanium has been performed in air with femtosecond laser pulses (150 fs, 1 kHz) of 810 nm in the laser fluence range of 0.7–35.4 J/cm². Ablation depth dependence on the laser fluence shows that there are two different processes, which are explained in terms of electronic heating process and the optical penetration one. Structure of ablated region is characterized by means of two different XRD techniques. With increasing the laser fluence higher than 10.2 J/cm², the laser-processed region of germanium exhibits poly-crystalline diffraction peaks in a wide-angle (θ/2θ) scan and a split of diffraction peak of (4 0 0) plane in the rocking curve, which are absent in the lower laser fluence. These observations could be explained in terms of structural changes induced by ultrashort laser irradiation at the higher laser fluence.     

Mathematical modeling of laser ablation in liquids with application to laser ultrasonics

The use of laser ablation as a means of generating ultrasonic waves in liquid metals is studied in this paper. A mathematical model for predicting the onset of ablation is developed, as is a model of the ablation process based on steady state, one-dimensional gas dynamics in which the vapor phase is treated as an ideal gas. The results of this model are then used in a quasi-two-dimensional model of laser ablation that accounts for the spatial distribution of intensity in the laser beam. Model predictions are compared with experiments conducted on liquid mercury and excellent agreement is obtained. Based on these results, a simplified model is developed that shows excellent agreement with both the theory and the experiments.     

A detailed study through the focal region of near-threshold single-shot femtosecond laser ablation nano-holes in borosilicate glass

A detailed study of the morphology of nano-craters drilled in borosilicate glass by single shot femtosecond laser ablation near the ablation threshold has been performed by scanning electron microscopy, atomic force microscopy and scanning electron microscopy imaging after focused ion beam sectioning. The influence of the numerical aperture (NA = 0.4 and 0.8), the pulse energy (16 nJ < E_p < 600 nJ) and the position of the specimen surface into the focal region were systematically investigated, leading to nanometric or micrometric scales in every spatial dimension. The nanocrater’s size is not restricted by the diffraction limit but determined by the laser pulse stability and the material properties. If the beam is focused inside the glass, two craters are drilled, shaping very distinct morphologies. Their dimensions have been studied in details and different relationships have been proposed for the evolutions of the depths and of the various diameters of these craters as functions of the pulse energy, the numerical aperture and the position of specimen surface in the beam-material interaction region. It is suggested that the long, thin conical profile with very high aspect ratio of the secondary craters is due to a spontaneous reshaping of the beam which transforms the incoming Gaussian pulse into a Gaussian-Bessel pulse. As proposed in the developed model the geometry of the second craters seems to be connected with the one of the main craters.     

Projection ablation of glass-based single and arrayed microstructures using excimer laser

Ablation of single and arrayed microstructures using an excimer laser is studied. The single feature microstructures are fabricated for evaluating the ablation mechanism, threshold fluence, and associated material removing (ablation) rate. The morphology changes during ablation are investigated with the focus on the formation of the ablation defects, debris or recast. The possibility of removing these defects is also evaluated and demonstrated. The present study concentrates on the borosilicate glass, although ablation of polyimide and silicon are performed and discussed for comparison. Polyimide and silicon are the most popular polymer or semiconductor material used in the electronics industry. The arrayed microstructures are ablated to demonstrate the fact that, by repetition of a simple-patterned mask associated with synchronized laser pulses and substrate movement, arrayed and more complex structures can be cost-effectively manufactured. The potential applications of these arrayed microstructures are discussed and illustrated. A low-cost replication technique that uses the arrayed microstructure presently machined as the forming mold for making electroforming nickel microneedles is specifically presented. Finally, the potential areas of using excimer laser in micromachining of glass-based structures for future research are also briefly covered.     

Femtosecond laser ablation of DAST

High rate femtosecond (fs) laser ablation of the organic salt 4-N,N-dimethylamino-4-N-methyl-stilbazolium tosylate (DAST), an organic crystal with very high optical nonlinearities has been demonstrated. The threshold fluence and the ideal fluence range for damage free ablation for the wavelengths 550, 600, and 775 nm have been determined and the quality of the produced grooves has been investigated. The threshold fluences are in the order of 10–70 mJ/cm² and the ideal fluence range for damage free ablation is ranging from 30 to 300 mJ/cm², depending on the wavelength. The optimal focussing for ablation has been investigated and first results towards the structuring of a ridge waveguide are presented. We conclude that this method is most promising for waveguide patterning of DAST surfaces for integrated optics applications.     

Numerical modeling of laser matter interaction in the presence of an ambient gas

A one dimensional numerical model to simulate the laser matter interaction in the presence of an ambient gas is presented. The model is developed by making appropriate modifications in MEDUSA, a one dimensional Lagrangian computer code, which simulates laser plasma interaction in vacuum. Various parameters of the plasma such as velocity, electron temperature, ion temperature, density, pressure, shock wave intensity of the plasma as it expands into a background gas are simulated. The results are compared with the experimental observations.     

Femtosecond pulsed laser ablation of thin gold film

Laser micromachining on 1000 nm-thick gold film using femtosecond laser has been studied. The laser pulses that are used for this study are 400 nm in central wavelength, 150 fs in pulse duration, and the repetition rate is 1 kHz. Plano-concave lens with a focal length of 19 mm focuses the laser beam into a spot of 3 μm (1/e² diameter). The sample was translated at a linear speed of 400 μm/s during machining. Grooves were cut on gold thin film with laser pulses of various energies. The ablation depths were measured and plotted. There are two ablation regimes. In the first regime, the cutting is very shallow and the edges are free of molten material. While in the second regime, molten material appears and the cutting edges are contaminated. The results suggest that clean and precise microstructuring can be achieved with femtosecond pulsed laser by controlling the pulse energy in the first ablation regime.     

Surface ablation of lithium tantalate by femtosecond laser

We report measurements of the laser induced breakdown threshold in lithium tantalate with different number of pulses delivered from a chirped pulse amplification Ti: sapphire system. The threshold fluences were determined from the relation between the diameter D² of the ablated area and the laser fluence F₀. The threshold of lithium tantalite under single-shot is found to be 1.84 J/cm², and the avalanche rate was determined to be 1.01 cm²/J by calculation. We found that avalanche dominates the ablation process, while photoionization serves as a free electron provider.     

Ultrafast laser machining of tapered microchannels in glass and PDMS

The ability to fabricate tapered microchannels with customizable cross sections in a variety of materials is highly desirable for microfluidic applications. This article examines ultrafast laser machining of tapered microchannel trenches in both hard (soda-lime and borosilicate glasses) and soft (PDMS elastomer) transparent solids. A simple model for channel width and depth as a function of processing parameters and threshold fluence is presented. Estimated channel sizes from the model are in good agreement with experimental results. We also show that the channel depth is a linear function of the number of laser pulses per channel width. All measurement data are found to collapse onto a single curve, which can serve as a useful guide for micromachining of tapered channels in transparent materials.     

Femtosecond pulsed laser ablation with spatial filtering

With the rise in demand for miniaturized features with better acute edge acuity and negligible thermal damage zone, one of the key vital areas lies in the refinement of the quality of the laser beam itself. Spatial filter is routinely used in optical micromachining systems to smoothen the Gaussian profile of the machining spot in order to obtain a feature of the desired quality. However, its profile smoothening effect has never been investigated for femtosecond pulsed laser micromachining process since the extremely high peak power of femtosecond pulses will cause damage on the filtering aperture of spatial filter. During the development of an acousto-optical micromachining system using femtosecond pulses, we found that if the damage of the filtering aperture can be circumvented, spatial filter can improve the machining quality of femtosecond pulse ablation, especially when ablation is conducted at low-fluency range (just above the ablation threshold fluency). In this paper, we investigate and demonstrate both the improvement and potential that beam refinement can bring about. In our experiment, a series of test patterns were ablated with a 400 nm second-harmonic Ti:Sapphire femtosecond laser of 150 fs duration at varying pulse energy ranging from 31 to 39 nJ. The specimen used in the experiment is a platinum- (Pt) sputtered coating of 100 nm thickness on a quartz substrate. The results show a significant improvement in the constancy of the shape as well as the size of ablated feature, revealing an improved beam profile and beam energy distribution due to spatial filtering.