升温热冲击环境下超高温陶瓷材料抗热震性能的热-损伤模型

在现有的抗热震理论基础上考虑到超高温陶瓷材料热物理性能对温度的敏感性及损伤在其使役历程中随温度的演化,建立了适用于升温服役环境下表征超高温陶瓷材料抗热震性能的热-损伤模型。该模型考虑了微裂纹尺寸、密度、热冲击环境温度等因素对材料抗热震性能的影响。利用此模型研究了超高温陶瓷材料在升温服役环境下损伤以微裂纹形核规律演化时对其抗热震性能的影响。从理论上验证了基于材料微结构设计思想在制备超高温陶瓷材料时,引进一定密度一定尺寸的微裂纹并控制其随温度演化规律以形核方式进行,既可以使材料保持较高的强度又能大幅度提升材料的抗热震性能。     

热环境对超高温陶瓷材料抗热震性能的影响

基于超高温陶瓷材料相关材料参数对温度的敏感性,以现有的抗热震断裂评价理论为基础,通过考虑温度对超高温陶瓷材料物理性能的影响,探讨了热震温度范围内热应力衰减系数、表面热传递系数、热冲击初始环境温度等热环境参数对抗热冲击阻力参数、断裂临界温差和断裂临界温度的影响.      

Properties and appropriate conditions of stress reduction factor and thermal shock resistance parameters for ceramics

Through introducing the analytical solution of the transient heat conduction problem of the plate with convection into the thermal stress field model of the elastic plate, the stress reduction factor is presented explicitly in its dimensionless form. A new stress reduction factor is introduced for the purpose of comparison. The properties and appropriate conditions of the stress reduction factor, the first and second thermal shock resistance (TSR) parameters for the high and low Biot numbers, respectively, and the approximation formulas for the intermediate Biot number-interval are discussed. To investigate the TSR of ceramics more accurately, it is recommended to combine the heat transfer theory with the theory of thermoelasticity or fracture mechanics or use a numerical method. The critical rupture temperature difference and the critical rup- ture dimensionless time can be used to characterize the TSR of ceramics intuitively and legibly.     

Optimum material design for functionally gradient material plate

Summary Steady thermal stresses in a plate made of a functionally gradient material (FGM) are analyzed theoretically and calculated numerically. An FGM plate composed of PSZ and Ti-6Al-4V is examined, and the temperature dependence of the material properties is considered. A local safety factor is used for evaluation of the FGM's strength. It is assumed that top and bottom surfaces of the plate are heated and kept at constant thermal boundary conditions. The pairs of the surface temperatures, for which the minimum local safety factor can be of more than one, are obtained as available temperature regions. The temperature dependence of the material properties diminishes, available temperature region as compared with that for an FGM plate without it. The available temperature region of the FGM plate is wider than that of the two-layered plate, especially for the surface temperatures which are high at the ceramic surface and low at the metal side. The influence of different mechanical boundary conditions is examined, and available temperature regions are found to be different, depending on the mechanical boundary conditions. The influence of the intermediate composition on the thermal stress reduction is also investigated in detail for the surface temperatures which are kept at 1300 K at the ceramic surface and 300K at the metal side. Appropriate intermediate composition of the FGM plate can yield the local safety factor of one or more for the four mechanical boundary conditions at once. For the two-layered plate there does not exist, however, any appropriate pair of metal and ceramic thicknesses which would yield the local safety factor of one or more for the four mechanical boundary conditions at once. The influence of the intermediate composition on the maximization of the minimum stress ratio depends on the mechanical boundary conditions. Finally, the optimal FGM plates are determined.     

THERMAL SHOCK PROTECTION BASED ON MICROTUBE AND MICROPOST ARRAY SURFACE

针对核电站核泵主轴、管道系统等高温环境下工作的部件受冷却水热冲击而容易出现裂纹的问题,提出通过表面微结构设计,利用水低热扩散率的特性,在被热冲击表面产生隔热水膜,从而降低瞬态热冲击过程中表层结构的热应力,防止结构热疲劳损伤. 针对这一设想,采用有限元与无限元相结合的办法,解决热应力分析的多尺度问题. 利用COMSOL多场耦合分析软件,对瞬态热冲击条件下,表面微结构的温度场与热应力分布进行分析,研究了冲击时间、微结构几何参数和流体黏性底层厚度等对微结构表面热冲击防护能力的影响. 研究发现,表面微柱或微管结构对降低短时间冷水冲击产生的表面热应力具有显著效果,同时在微结构与基底之间存在最优过渡曲面使表面热应力最小化.     

ANALYTICAL SOLUTION FOR ROTATIONAL RUBBING PLATE UNDER THERMAL SHOCK

提出了热冲击和碰摩故障共同作用下的旋转悬臂板系统动力特性解析解法. 基于变分原理,推导出考虑碰摩力沿宽度方向差异性的薄板系统运动微分方程,将该方程的解分解为热冲击悬臂板准静态解和碰摩薄板热冲击动力解. 通过计算旋转悬臂板的模态特性和温度分布函数,获得了碰摩叶片旋转悬臂板模型的热冲击振动解析解,讨论分析得出热冲击和碰摩故障对薄板振动的影响规律. 研究表明:碰摩振动表现为复杂的多频率耦合振动,高频振动较为显著;热冲击振动表现为简单的低频振动形式,强烈的热冲击导致碰摩薄板趋于低频振动. 碰摩引起的振动形式较热冲击故障更加复杂,更容易引起叶片的破坏. 增大的摩擦系数加剧了碰摩引起的振动,利用减小表面粗糙程度等方法降低摩擦系数,可以达到减小碰摩破坏程度的目的.     

High order behavior of sandwich plates with free edges––edge effects

The edge effects of a sandwich plate with a “soft” core and free edges, i.e. the plate is supported only at the lower face-sheet, and the upper face-sheet and the core are free of stresses at their edges, using the high order approach (HSAPT), are presented. The two-dimensional analysis consists of a mathematical formulation that uses the classical thin plate theory for the face-sheets and a three-dimensional elasticity theory for the core. The governing equations and the required boundary conditions are derived explicitly through variational principals, yielding a system of eight partial differential equations. The non-homogeneous differential equations system is numerically solved using a modification of the extended Kantorovich method (MEKM). The model presented enables a two-dimensional solution of the stress and displacement fields when subjected to a general scheme of loads. It is applicable to any type of boundary conditions that can be applied separately on each face-sheet and on the core. A numerical study is presented, and it examines the behavior and the two-dimensional stress field of a sandwich plate with free edges, at the upper face-sheet and core, subjected to thermal and uniformly distributed loads, for various boundary conditions at the lower face-sheet. For completeness, the MEKM solution of the two-dimensional high order model is verified through comparison with a three-dimensional Finite Element model revealing good correlation. Furthermore, the problems involved in the construction of an appropriate three-dimensional FE model of a full scale sandwich plate that require large computer resources are discussed.The numerical study yields that the peeling (normal) stresses, which reach their maximum values at the edges of the sandwich plate, using a one-dimensional analysis, varies also in the transverse direction from a maximum value in the middle of the edge, descending towards the corners. Moreover, the nature of variation along the boundaries strongly depends on the type of loading and the transverse boundary conditions. The substantial variation of the stress field in the transverse direction clearly shows the necessity of a two-dimensional analysis and the inefficiencies of the one-dimensional model.     

含半椭圆型表面缺陷陶瓷材料的热冲击阻力分析

本文研究一个有半椭圆型表面缺陷的陶瓷材料板的热冲击阻力问题.通过多项式形式的应力和几何形状因子得到半椭圆型表面裂纹尖端的热应力强度因子.以蓝宝石陶瓷板为例,基于最大应力准则和断裂韧性准则分析其热冲击阻力行为,并由这两个准则得到其强度计算中真实的热冲击阻力曲线.     

Three-dimensional analysis of transient thermal stresses in functionally graded plates

An analytical solution is presented for three-dimensional thermomechanical deformations of a simply supported functionally graded (FG) rectangular plate subjected to time-dependent thermal loads on its top and/or bottom surfaces. Material properties are taken to be analytical functions of the thickness coordinate. The uncoupled quasi-static linear thermoelasticity theory is adopted in which the change in temperature, if any, due to deformations is neglected. A temperature function that identically satisfies thermal boundary conditions at the edges and the Laplace transformation technique are used to reduce equations governing the transient heat conduction to an ordinary differential equation (ODE) in the thickness coordinate which is solved by the power series method. Next, the elasticity problem for the simply supported plate for each instantaneous temperature distribution is analyzed by using displacement functions that identically satisfy boundary conditions at the edges. The resulting coupled ODEs with variable coefficients are also solved by the power series method. The analytical solution is applicable to a plate of arbitrary thickness. Results are given for two-constituent metal-ceramic FG rectangular plates with a power-law through-the-thickness variation of the volume fraction of the constituents. The effective elastic moduli at a point are determined by either the Mori–Tanaka or the self-consistent scheme. The transient temperature, displacements, and thermal stresses at several critical locations are presented for plates subjected to either time-dependent temperature or heat flux prescribed on the top surface. Results are also given for various volume fractions of the two constituents, volume fraction profiles and the two homogenization schemes.     

Thermal shock resistance behavior of a functionally graded ceramic: Effects of finite cooling rate

This work presents a semi-analytical model to explore the effects of cooling rate on the thermal shock resistance behavior of a functionally graded ceramic (FGC) plate with a periodic array of edge cracks. The FGC is assumed to be a thermally heterogeneous material with constant elastic modulus and Poisson's ratio. The cooling rate applied at the FGC surface is modeled using a linear ramp function. An integral equation method and a closed form asymptotic temperature solution are employed to compute the thermal stress intensity factor (TSIF). The thermal shock residual strength and critical thermal shock of the FGC plate are obtained using the SIF criterion. Thermal shock simulations for an Al₂O₃/Si₃N₄ FGC indicate that a finite cooling rate leads to a significantly higher critical thermal shock than that under the sudden cooling condition. The residual strength, however, is relatively insensitive to the cooling rate.     

Transient analysis on surface heated piezoelectric semiconductor plate lying on rigid substrate

Based on the thermo-electro-elastic coupling theory, the mathematical model for a surface heated piezoelectric semiconductor (PS) plate is developed in the time domain. Applying the direct and inverse Laplace transformations to the established model, the mechanical and electrical responses are investigated. The comparison between the analytical solution and the finite element method (FEM) is conducted, which illustrates the validity of the derivation. The calculated results show that the maximum values of the mechanical and electrical fields appear at the heating surface. Importantly, the perturbation carriers tend to concentrate in the zone near the heating surface under the given boundary conditions. It can also be observed that the heating induced elastic wave leads to jumps for the electric potential and perturbation carrier density at the wavefront. When the thermal relaxation time is introduced, all the field quantities become smaller because of the thermal lagging effect. Meanwhile, it can be found that the thermal relaxation time can describe the smooth variation at the jump position. Besides, for a plate with P-N junction, the effect of the interface position on the electrical response is studied. The effects of the initial carrier density on the electrical properties are discussed in detail. The conclusions in this article can be the guidance for the design of PS devices serving in thermal environment.     

Photoelastic modeling of stresses caused by thermal shock

The paper describes and evaluates an easy experimental method for subjecting the edges of photoelastic plate models to severe and repeatable thermal shock. It presents the development, with time, of the photoelasticfringe pattern at the edge of a plate and shows that this method simulates thermal-shock conditions in metallic materials of an intensity that is exceeded only under the most severe practical conditions. The resultant edge stresses are shown to increase to maximum values and then decrease with time as conditions shift from essentially plane strain to plane stress.     

Thermoelastic buckling behavior of thick functionally graded rectangular plates

Thermoelastic buckling behavior of thick rectangular plate made of functionally graded materials is investigated in this article. The material properties of the plate are assumed to vary continuously through the thickness of the plate according to a power-law distribution. Three types of thermal loading as uniform temperature raise, nonlinear and linear temperature distribution through the thickness of plate are considered. The coupled governing stability equations are derived based on the Reddy’s higher-order shear deformation plate theory using the energy method. The resulted stability equations are decoupled and solved analytically for the functionally graded rectangular plates with two opposite edges simply supported subjected to different types of thermal loading. A comparison of the present results with those available in the literature is carried out to establish the accuracy of the presented analytical method. The influences of power of functionally graded material, plate thickness, aspect ratio, thermal loading conditions and boundary conditions on the critical buckling temperature of aluminum/alumina functionally graded rectangular plates are investigated and discussed in detail. The critical buckling temperatures of thick functionally graded rectangular plates with various boundary conditions are reported for the first time and can be served as benchmark results for researchers to validate their numerical and analytical methods in the future.     

球面各向同性球体内的动态热应力集中

利用有限克尔变换得到了求面各向同笥球体的热冲击作用下的动态热应力解析表达式。从表达式中,可以看出球中向同性球体的动态热应力集中现象明显不同于各向同性球体。另外,所描述的动态热应力集中现象与文献「１,３」也有一定的区别。     

THERMAL FRACTURE OF FUNCTIONALLY GRADED PLATE WITH PARALLEL SURFACE CRACKS

This work examines the fracture behavior of a functionally graded material （FGM） plate containing parallel surface cracks with alternating lengths subjected to a thermal shock. The thermal stress intensity factors （TSIFs） at the tips of long and short cracks are calculated using a singular integral equation technique. The critical thermal shock △Tc that causes crack initiation is calculated using a stress intensity factor criterion. Numerical examples of TSIFs and △Tc for an Al2O3/Si3N4 FGM plate are presented to illustrate the effects of thermal property gradation, crack spacing and crack length ratio on the TSIFs and △Tc. It is found that for a given crack length ratio, the TSIFs at the tips of both long and short cracks can be reduced significantly and △Tc can be enhanced by introducing appropriate material gradation. The TSIFs also decrease dramatically with a decrease in crack spacing. The TSIF at the tips of short cracks may be higher than that for the long cracks under certain crack geometry conditions. Hence, the short cracks instead of long cracks may first start to grow under the thermal shock loading.     

矩形夹层板稳定性分析

本文在Reissner理论基础上,应用功的互等定理推导了夹层矩形板稳定问题的基本解,在已推导出的夹层板基本解的基础上,利用功的互等法求解了两对边固定一边简支一边自由、两邻边简支另两邻边自由且角点支承、两邻边简支另两邻边自由且角点悬空三种不同边界条件下夹层板的稳定问题,给出了挠曲面方程及其对应的执行方程;进行了数值计算,并与有限元结果进行对照分析.结果表明:本文方法求解过程更简单,提供了一种求解夹层板稳定问题的新方法,计算结果对解决工程实际问题具有一定的参考价值.     

任意厚度层合开口柱壳的温度应力

基于层合柱壳混合状态方程和边界条件的弱形式,建立了具有固支边的层合开口柱壳的温度应力混合方程,给出了任意厚度层合开口柱壳在温度荷载和机械荷载共同作用下的解析解。     

Locally similar solutions for hydromagnetic and thermal slip flow boundary layers over a flat plate with variable fluid properties and convective surface boundary condition

This paper presents heat transfer process in a two-dimensional steady hydromagnetic convective flow of an electrically conducting fluid over a flat plate with partial slip at the surface of the boundary subjected to the convective surface heat flux at the boundary. The analysis accounts for both temperature-dependent viscosity and temperature dependent thermal conductivity. The local similarity equations are derived and solved numerically using the Nachtsheim-Swigert iteration procedure. Results for the dimensionless velocity, temperature and ambient Prandtl number within the boundary layer are displayed graphically delineating the effect of various parameters characterizing the flow. The results show that momentum boundary layer thickness significantly depends on the surface convection parameter, Hartmann number and on the sign of the variable viscosity parameter. The results also show that plate surface temperature is higher when there is no slip at the plate compared to its presence. For both slip and no-slip cases surface temperature of the plate can be controlled by controlling the strength of the applied magnetic field. In modelling the thermal boundary layer flow with variable viscosity and variable thermal conductivity, the Prandtl number must be treated as a variable irrespective of flow conditions whether there is slip or no-slip at the boundary to obtain realistic results.     

????-FGM-???EFBF?????????????

为研究金属-FGM-陶瓷 EFBF 复合板的稳态热应力,从热传导规律出发,结合热应力计算公式,建立了该复合板稳态热应 力的研究模型,用有限元和辛普生法分析了T_a=500K和T_b=1800K时,该 复合板的稳态热应力分布并与无梯度两层复合板的结果进行了比较. 结果表明：FGM梯度层的厚度、组分和孔隙率对该EFBF复合板的热应力有不同程度的影响, 此外,有梯度三层复合板的热应力比较缓和,最大拉应力减小29.18%. 此结果为该复合板的设计和应用提供了准确的计算依据.     

任意厚度层合闭口柱壳的轴对称温度应力

基于层合柱壳混合状态方程和边界条件的弱形式，在轴对称情况下，建立了两端固支层合闭口柱壳的温度应力混合方程，给出了任意厚层合柱壳在温度荷载和机械荷载共同作用下的解析解。