Thermal properties and fracture toughness of a liquid‐crystalline epoxy resin cured with an aromatic diamine crosslinker having a mesogenic group

A mesogenic‐type curing agent was synthesized to introduce a mesogenic group not only into epoxy resin backbones but also into the crosslink units. In the mesogenic curing agent system, the domain size became larger, and the network arrangement in each domain existed to a greater extent than that in a system cured with the ordinary diamine curing system according to the evidence from polarized optical micrographs and polarized Fourier transform infrared mapping measurements. Moreover, the fracture toughness of the system was considerably improved. © 2006 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 44: 2486–2494, 2006     

Influence of the initiating mechanism on the cationic photopolymerization of a cycloaliphatic epoxy resin with arylsulfonium salts

The photocuring process of widely used 3,4‐epoxycyclohexylmethyl 3′,4′‐epoxycyclohexane carboxylate has been investigated with differential scanning photocalorimetry and attenuated total reflection/Fourier transform infrared. Mixed salts of triarylsulfonium hexafluoroantimonate have been employed as the photoinitiator. The photocuring of the biscycloaliphatic resins exhibits a complex behavior: the overall heat of reaction (including dynamic thermal postcuring) depends on the photocuring temperature, surprisingly high reaction rates are observed at lower photocuring temperatures, and the range of the glass transition of the fully cured material broadens and shifts to higher temperatures as the photocuring temperature increases. It is assumed that the balance between the initiation step and the propagation step is responsible for the changes in the reaction mechanism that produce the observed experimental results. This balance may depend on the amount of the photoinitiator, the irradiation intensity, and the photocuring temperature. The structure and final properties of the material may therefore depend on the adjustment of these parameters. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 45: 16–25, 2007     

Influence of the loading rate on liquid‐crystalline epoxy resin systems

The fracture toughness of liquid‐crystalline epoxy systems, which had a nematic polydomain structure (domain size about 40 μm), with an increasing loading rate was evaluated. In this system, the fracture toughness dramatically decreased from 1.96 to 0.22 MN/m^3/2 with an increasing loading rate (0.1–5 mm/min). The network orientation near the fracture surface of different loading rate systems was investigated with polarized optical microscopy and polarized infrared spectroscopy. As a result, a large oriented region of mesogenic groups was observed near the fracture surface in the relatively low loading rate (0.1 and 0.5 mm/min) systems, but such a phenomenon was not observed in the high loading rate (2 and 5 mm/min) systems. These results showed that the high fracture toughness of the system at the low loading rate was due to the magnitude and region of the reorientation of the mesogenic groups in the fracture process and that high toughness could not be achieved at a high loading rate because the loading rate was too fast to allow orientation of the networks containing the mesogenic groups. © 2005 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 43: 1296–1302, 2005     

Molecular structure and thickness dependence of chain orientation in aromatic polyimide films

Degrees of orientation of main chains and imide rings were quantitatively estimated for spin‐coated films of six kinds of aromatic polyimides (PIs) using polarized attenuated total reflection (ATR)/Fourier transform infrared (FT‐IR) spectroscopy. The degrees of chain orientation parallel to the film planes are significantly larger for the PIs having rigid structures than those having flexible structures, and the introduction of side groups decrease the degrees of chain orientation. In contrast, the rotational orientations of imide rings are almost isotropic for all PI films. Moreover, the film thickness dependences of the degrees of orientation were investigated for two kinds of rigid‐rod PIs having bulky trifluoromethyl ( CF₃) side groups in their diamine moieties. The degrees of chain orientation slightly decrease as the film thickness increases, whereas the rotational orientation of imide rings is independent of the film thickness. The degrees of chain orientation on the substrate sides significantly differ from the atmospheric sides of PI films. This difference was generated during thermal imidization because of tensile stress originated from the mismatch in thermal expansion coefficients between the substrates and the PI films. © 2005 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 43: 2109–2120, 2005     

Effect of the network structure on thermal and mechanical properties of mesogenic epoxy resin cured with aromatic amine

The epoxy resin containing a typical mesogenic group such as biphenol was cured with catechol novolak and aromatic diamines which have neighboring active hydrogens. In the biphenol-type epoxy resin cured with catechol novolak, 4,4′ diaminodiphenylmethane, and p-phenylenediamine (PPD), the glass-rubber transition almost disappeared, and thus a very high elastic modulus was obtained in the high temperature region. It is clear that the thermal motion of the network chains is significantly suppressed in these cured systems. In addition, in the PPD-cured system, a characteristic pattern like a schlieren texture was clearly observed under the crossed polarized optical microscope. Thus we conclude that the mesogenic group contained in the epoxy molecule is oriented in the networks when the mesogenic epoxy resin is cured with phenols and diamines which have neighboring active hydrogens. On the other hand, the biphenol-type resin cured with 3,3′,5,5′-tetraethyl-4,4′-diamino diphenylmethane (TEDDM) showed a well-defined glass-rubber transition and, thus, a low rubbery modulus. In this cured system, no characteristic pattern was observed under the crossed polarized light. These results show that the large branches, such as ethyl groups on the network chains, prevent the orientation of network chains which contain the mesogenic group. © 1997 John Wiley & Sons, Inc.     

Engineering superior toughness in commercially viable block copolymer modified epoxy resin

The microstructure and mechanical properties of a block copolymer modified commercial thermoset plastic formed from a bisphenol-A based epoxy and a bio-derived amine hardener (Cardolite^® NC-541LV) were investigated. A series of poly(ethylene oxide)-b-poly(butylene oxide) (PEO-PBO) diblock copolymers was synthesized at fixed composition (31 ± 1% by volume PEO) and varying molecular weight expanding on a commercially available PEO-PBO compound marketed by the Dow Chemical Company under the trade name FORTEGRA™ 100; direct application of any of these block copolymers resulted in little improvement of the poor fracture toughness of the cured material. Modification of the resin formulation and curing protocol led to the development of well-defined spherical and branched worm-like micelles containing a PBO core and PEO corona in the cross-linked products as evidenced by transmission electron microscopy (TEM) and small angle X-ray scattering (SAXS) measurements. Maximum fracture toughness (K_1c) and a ninefold increase in the critical strain energy release rate (G_1c) over the unmodified neat epoxy was achieved at 5 wt % loading of intermediate molecular weight PEO-PBO, without measureable reductions in modulus, glass transition temperature or transparency. This study provides new strategies for engineering improved performance in thermoset materials using block copolymer additives that exhibit challenging mixing thermodynamic characteristics with the component monomers. © 2015 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2016, 54, 189–204     

Fracture toughness and fracture mechanism of liquid‐crystalline epoxy resins with different polydomain structures

Liquid‐crystalline (LC) epoxy resins were cured at different temperatures to obtain polydomain LC phase–cured resins. The cured resins had polydomain structures with a nematic LC phase and their domain diameters differed depending on the curing temperatures. The relationship between the domain diameter and fracture toughness of the diglycidyl ether of terephthalylidene‐bis‐(4‐amino‐3‐methylphenol) (DGETAM)/m‐phenylenediamine (m‐PDA) systems with the nematic phase and the previously reported smectic LC phase structures was investigated. It was clarified that the highly ordered LC structure (smectic phase) in each domain could improve the fracture toughness. In addition, the changes in the network orientation of the DGETAM/m‐PDA systems were evaluated by a mapping of the microscopic infrared dichroism in the fracture process and their toughening mechanism was suggested. © 2010 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys, 2010     

Relationship between fracture toughness and domain size of liquid‐crystalline epoxy resins having polydomain structure

A liquid‐crystalline (LC) epoxy resin was cured at different temperatures and some types of curing systems having different phase structures (isotropic or polydomain, which have a microscopically ordered LC network structure) were obtained. The diameters of each domain in the polydomain system changed from the small to the larger size. The diameters of the LC domains were evaluated using a polarized optical microscope and the polarized microscopy FTIR mapping method. These systems were used to investigate the relationship between the network arrangement and mechanical properties. The fracture toughness of the cured systems was related to the enlargement of the ordered area in the network structures. With the toughness improvement, the meandering cracks were observed at the fracture surfaces. © 2008 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 47: 156–165, 2009     

Fracture mechanism of liquid‐crystalline epoxy resin systems with different phase structures

A liquid‐crystalline epoxy resin was cured at two different temperatures. The phases of the cured systems clearly showed isotropic and nematic polydomain structures, which depended on the curing temperature. The fracture toughness of the systems was measured, and the fracture mechanism was investigated with polarized IR measurements. The nematic polydomain structure system showed considerably higher fracture toughness than the isotropic structure. Moreover, both systems exhibited a reorientation of the network chains near the fracture surface during the fracture process, and the region of the network reorientation in the nematic polydomain structure system was larger than that in the isotropic structure system. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 4044–4052, 2004     

Investigation of fracture mechanism on liquid crystalline epoxy networks arranged by a magnetic field

A liquid crystalline epoxy resin was cured under non‐ and 10T‐magnetic fields, and polydomain and monodomain networks were obtained, respectively. The fracture toughness of these systems was evaluated and it was clarified that the toughness of the magnetic field system showed a higher value. To investigate the toughening mechanism, polarized micro FTIR measurements were carried out. As a result, it was clarified that their mechanisms were quiet different. © 2006 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 44: 1406–1412, 2006     

Enhanced fracture toughness and mechanical properties of epoxy resin with rice husk-based nano-silica

This paper reports a novel approach to toughen epoxy resin with nano-silica fabricated from rice husk using a thermal treatment method with a particle size distribution in range of 40–80 nm. The nano-silica content was in the range, 0.03–0.10 phr, with respect to epoxy. The mechanical test showed that with the addition of 0.07 phr of rice husk based nano-silica, the fracture toughness of the neat epoxy resin increased 16.3% from 0.61 to 0.71 MPa m^1/2. The dynamic mechanical analysis test results showed that the glass transition temperature (T _g) of a 0.07 phr nano-silica dispersion in epoxy resin shifted to a higher temperature from 140 to 147°C compared to neat epoxy resin. SEM further showed that the nano-silica particles dispersed throughout the epoxy resin prevented and altered the path of crack growth along with a change in the fracture surface morphology of cured epoxy resin.     

Influence of morphology on the fracture toughness of isotactic polypropylene

An adaptation of the fracture toughness test method, the J-integral technique, is described within the general framework of polymer fracture behavior. It is shown that there is a strong interaction between different morphological parameters in the way they affect the fracture behavior of isotactic polypropylene (iPP). The fracture toughness decreases with increasing crystallinity at a fixed spherulite size. The fracture toughness also decreases slightly with increasing spherulite size at a constant crystallinity, but this may not be a pure spherulite size effect. The use of a nucleating agent results in a very fine spherulitic structure but facilitates crack growth and reduces the material toughness beyond the crack initiation stage. This suggests that the material behavior is dictated by the increase in crystallization temperature caused by the presence of the nucleating agent and not by the change in spherulite size. © 1995 John Wiley & Sons, Inc.     

Real‐time orientation and crystallinity measurements during the isotactic polypropylene film‐casting process

A method based on Fourier transform infrared (FTIR) transmission spectra is proposed to measure the crystallinity of isotactic polypropylene (iPP) samples. The method parameters were tuned as compared with wide‐angle X‐ray scattering measurements performed on test samples characterized by different crystallinity values obtained by solidification of thin iPP films under several cooling rates in a homemade device. The FTIR dichroic ratio measurements were adopted to measure crystalline and average Hermans' orientation factors of iPP samples obtained by film casting. The crystalline orientation measurement method was validated as compared with the birefringence measurement. The techniques were successfully used in real time during some film‐casting runs with a suitably modified FTIR system made of a spectrometer equipped with two optical guidelines and an external detector. Real‐time measurements are reported and discussed. © 2003 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 41: 998–1008, 2003     

Effect of CTBN rubber inclusions on the curing kinetic of DGEBA-DGEBF epoxy resin

The curing kinetics of an epoxy resin matrix, based on diglycil ether of bisphenol A and F (DGEBA-DGEBF), associated with an anhydride hardener, at different carboxyl-terminated copolymer of butadiene and acrylonitrile liquid rubber (CTBN) concentration (0-10 phr) are studied using a differential scanning calorimetry (DSC) and a stress-controlled rheometer in isothermal and dynamic conditions. The aim of this work is to correlate the presence of the rubber phase with the transition phenomena that occur during the curing process. The CTBN rubber induces a catalytic effect on the polymerization of the pure resin clearly observed by a significant enhancement of the curing rate. Calorimetric and rheological analysis also evidences that gelation and vitrification times take place not punctually but in a wide range of time. Rheological data show that the presence of rubbery phase induces a higher rate of gel formation during the early stages of the reactions, confirming the calorimetric results. Finally the results are compared with theoretical models evidencing a good fitting between experimental and predictive data.     

Approach to improving the toughness of TGMDA/DDS epoxy resin by blending with thermoplastic polymer powders

A series of hot-melt processable thermosetting compositions was prepared by blending N,N,N′,N′-tetraglycidyl-4,4′ -diaminodiphenyl-methane/4,4′-diaminodiphenylsulfone (TGMDA/DDS) epoxy resin and thermoplastic polymer powders with average particle size below 30 μm. The basic thermoplastic polymers were either a high T_g amorphous cardo polyimide (T_g=350°C) or commercial semicrystalline PA6 and PA12 polyamides. The resulting heterogeneous mixtures showed viscosity values below 5000 cps suitable for prepregging process. After cure, phase-separated morphologies were maintained with a rather limited interphase miscibility as demonstrated by thermomechanical analysis. Scanning electron microscope examination of fracture surfaces pointed out a strong adhesion between the powder particles and the surrounding polyepoxy network, particularly for the potentially reactive polyamide structures. Moreover, as shown by differential scanning calorimeter analysis, the crystallinity ratio of the PA6 and PA12 powders was lowered due to melting during thermal polymerization. The fracture toughness properties of the powder-containing materials were compared with those of a fully miscible cardo polyimide–TGMDA/DDS blend coming from an homogeneous resin composition. The best improvement in fracture energy was obtained for the powder-modified resins. The most effective composition filled with 16 wt% of powdered polyimide exhibited a fourfold increase in G_IC (388 J/m² versus 100 J/m²) without compromising the epoxy thermomechanical stability (T_g=227°C versus 223°C).     

Effect of molecular orientation on the fracture behavior of carbon black-filled natural rubber compounds

The fracture behavior of carbon black-filled natural rubber compounds, differing in filler content, was studied performing tensile tests in biaxial loading conditions, using a central notched cross-shaped specimen. The test consisted of two steps: a drawing step was initially performed loading the specimen in the direction parallel to the notch plane, up to different draw ratios, and then the specimen was loaded in the direction normal to the notch plane up to fracture. Using a fracture mechanics approach, the fracture toughness was evaluated as a function of the draw ratio applied in the drawing step. A correlation between the fracture phenomenology observed and molecular orientability and orientation was attempted. © 2010 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 48: 1509–1515, 2010     

Effect of organoclay on the curing reactions in bismaleimide/diallyl bisphenol a resin

4,4′‐Bismaleimidodiphenyl methane (BMPM)/2,2′‐diallyl bisphenol A (DBA)/organoclay nanocomposites were synthesized. The effects of organoclays on the curing reactions in the BMPM/DBA system at low temperatures (ene reaction) and high temperatures (Diels–Alder reaction, homopolymerization of BMPM, and alternative copolymerization) were investigated with differential scanning calorimetry and Fourier transform infrared techniques. The results showed that these reactions were affected to different extents in the presence of organoclays. The ene reaction was accelerated to different degrees depending on the acidity of the modifier and the accessibility of the organoclays used. The exfoliation degree of organoclays in the prepolymers showed great effects on the curing behavior of BMPM/DBA. When an organoclay was less intercalated, the curing behavior of the system was different from that of neat BMPM/DBA. On the other hand, when the organoclay was better exfoliated in prepolymers, the curing behavior of the system was similar to that of the neat BMPM/DBA system. However, even in this case, the reactions at high temperatures occurred in different ways in the presence of an organoclay. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 994–1006, 2005     

Improving the interlaminar fracture toughness of carbon fiber/epoxy composites using clustered microcapsules

The composite laminates are susceptible to delamination between reinforcing plies during their long-term service. In this paper, we propose a modified carbon fiber/epoxy composite laminate with embedded clustered dual-component microcapsules in order to increase the interlaminar fracture toughness of the lamina. The details of microcapsules were illustrated using scanning electron microscope (SEM). The modified CF/EP composite laminates were fabricated using hot-compaction technique. Mode I interlaminar fracture tests were conducted using double cantilever beam specimens, then the values of opening fracture toughness G_IC were calculated to evaluate the toughening effect of modified laminates. The toughening mechanism was revealed and discussed through micrographs of the fracture surfaces obtained by ultra-depth microscope and SEM. The results show that clustered microcapsules after polymerization are equal to special Z-pinning, significantly enhancing the ability of crack arrest, and largely and roundly improved the G_IC values of resultant composite laminates. Meanwhile, the clustered microcapsules and matrix resin formed a second-phase material layer, which also absorbed the fracture energy and suppressed the expansion of cracks.     

Effect of molecular weight on reaction-induced phase separation of epoxy resin modified with fluorocarbon chain terminated polyetherimide

Epoxy resins are currently used for many important applications such as adhesives, encapsulates and ad-vanced composite matrixes. However, the further use of epoxies is limited because of their inherent brittle-ness. Thus, the modifications of epoxy resin…