Resistive switching mechanism of Ag/ZrO2:Cu/Pt memory cell

Resistive switching mechanism of zirconium oxide-based resistive random access memory (RRAM) devices composed of Cu-doped ZrO₂ film sandwiched between an oxidizable electrode and an inert electrode was investigated. The Ag/ZrO₂:Cu/Pt RRAM devices with crosspoint structure fabricated by e-beam evaporation and e-beam lithography show reproducible bipolar resistive switching. The linear I?CV relationship of low resistance state (LRS) and the dependence of LRS resistance (R _ON) and reset current (I _reset) on the set current compliance (I _comp) indicate that the observed resistive switching characteristics of the Ag/ZrO₂:Cu/Pt device should be ascribed to the formation and annihilation of localized conductive filaments (CFs). The physical origin of CF was further analyzed by transmission electron microscopy (TEM) and energy dispersive X-ray spectroscopy (EDS). CFs were directly observed by cross-sectional TEM. According to EDS and elemental mapping analysis, the main chemical composition of CF is determined by Ag atoms, coming from the Ag top electrode. On the basis of these experiments, we propose that the set and reset process of the device stem from the electrochemical reactions in the zirconium oxide under different external electrical stimuli.     

Resistive switching effect in metal–oxide–metal structures with ZnO:Li oxide layer

The resistive switching effect in metal–oxide–metal (MOM) structures has been investigated, where the 10% Li-doped ZnO layer was used as an oxide layer, as well as Pt and 20% fluorine doped SnO₂ (SnO₂:F) were used as a bottom electrodes. The current–voltage (I–V) and switching (I–t) characteristics of Ag/ZnO:Li/Pt and Ag/ZnO:Li/SnO₂:F structures were investigated. The unipolar resistive switching is detected in the structures with the Pt, while the use of transparent conductive SnO₂:F electrode instead of Pt, results to the bipolar memory effect.     

Low power consumption bipolar resistive switching characteristics of ZnO-based memory devices

Ag/ZnO/Pt structure resistive switching devices are fabricated by radio frequency (RF) magnetron sputtering at room temperature. The memory devices exhibit stable and reversible resistive switching behavior. The ratio of high resistance state to low resistance state can reach as high as 10 2 . The retention measurement indicates that the memory property of these devices can be maintained for a long time (over 10 4 s under 0.1-V durable stress). Moreover, the operation voltages are very low, -0.4 V (OFF state) and 0.8 V (ON state). A high-voltage forming process is not required in the initial state, and multi-step reset process is demonstrated. Resistive switching device with the Ag/ZnO/ITO structure is constructed for comparison with the Ag/ZnO/Pt device.     

点接触金属/Pr$lt;sub$gt;0.7$lt;/sub$gt;Ca$lt;sub$gt;0.3$lt;/sub$gt;MnO$lt;sub$gt;3$lt;/sub$gt;/Pt结构稳定的低电流电阻开关特性

利用自主开发的导电原子力显微镜控制Pt,W探针构成点接触金属/Pr_0.7Ca_0.3MnO₃（PCMO）/Pt三明治结构,对其电流-电压（I-V）及脉冲诱导电阻开关（EPIR）特性进行了研究.研究发现,在10 nA限流下两种电极对应结构的I-V都表现出相当稳定的双极性电阻开关特性,以及大于100的电阻开关比.进一步测试发现,点接触W/PCMO/Pt器件具有在10 nA限流下稳定的EPIR特性以及100 pA限流下重复的双极性电阻开关特性.此电流比已报道的电流低3个数量级,表明此结构在低功耗存储器件方面的潜在应用.通过对比样品不同位置、不同限流、不同接触面积点接触Pt/PCMO/Pt的I-V回滞特性,把点接触器件在低电流下稳定、显著的电阻开关效应归结于小的器件面积导致强的局域电场加强了O离子迁移效应. 关键词： 脉冲诱导电阻开关 电场下氧离子迁移 电阻开关     

Study of the switching phenomena of TlGaS2 single crystals

Single crystals of TlGaS₂ were prepared by a special modified Bridgman technique and used to investigate the switching phenomena. The particular interest shown in switching studies of p-type TlGaS₂ compound is associated with the possibility of its uses as an effective switching and memory elements in electronic devices. The switching effect observed in such crystal shows a memory character. Using a crystal holder and cryostat we measured the switching phenomenon at different ambient conditions such as temperature, light illumination as well as sample thickness. Pronounced parameters for switching for sample of thickness 0.17 cm were determined from the experimental data such as threshold voltage V_th = 400 V, threshold current I_th = 37 μA, holding voltage V_h = 350 V, holding current I_h = 42.3 × 10⁻⁴ A, threshold power P_th = 1.48 × 10⁻² W, threshold field E_th = 196.429 V/cm as well as the ratio between the resistance in the off state R_OFF to the resistance in the conducting state R_ON as 130.253. The factors affecting these parameters have also been investigated.     

Current controlled negative resistance phenomenon in SbPbSe system

Thin film Al/Sb₂Pb₁Se₇/Al metal-glass-metal sandwiched structures prepared using thermal evaporation technique have been studied. The I–V measurements showed that the devices switched from high resistance OFF state to a low resistance ON state when a particular voltage appeared across it. The OFF state I–V characteristics showed non-ohmic behaviour while in the ON state the devices displayed purely linear characteristics. The switching voltage (V _th) was found to depend on film thickness and temperature of the device. A linear relation between V_th and temperature was observed.     

Engineering performance of barristors by varying the thickness of WS2

We have investigated the performances of barristors with a graphene-tungsten disulfide (WS₂) junction by varying the thickness of WS₂ and gate oxide. On-current density (J_ON) and on- and off-current ratio (J_ON/J_OFF) increases, and sub-threshold swing (V_SS) decreases with the WS₂ thickness. Also, barristors with thicker WS₂ required less workfunction shift, to switch the barristors. Therefore, unlike the traditional devices, V_SS of barristor with gate dielectric 300 nm was smaller than that of 90 nm, when the former is fabricated with thicker WS₂ than the latter. Since materials properties of 2-dimensional semiconductors generally vary with their thickness, the thickness of 2D semiconductors could become a key parameter to engineer the performance of barristors with graphene and the 2D semiconductors.     

Memristive Effect in Two-Layered Structures Based on Lithium Doped ZnO Films

The structure of Au/Li10ZnO/Li1ZnO/LaB₆ consisting of upper Au and lower LaB₆ ohmic electrodes and a p-n junction p-Li10ZnO/n-Li1ZnO, which has the resistive memory where two functions are simultaneously combined, that is, an address access and the process of reading and storing of information is investigated. The resistance ratio (R_reset/R_set = 10), the data storage time (> 3 hours) and the number of switching cycles (> 350) are improved as compared to the corresponding single-layer structures. The resistive memory is explained by the modulation effect of the Li10ZnO layer, the ferroelectric polarization of which, depending on the orientation, changes the width and height of the barrier of the p-n junction formed at the p-Li10ZnO/n-Li1ZnO contact.     

Effect of defect content on the unipolar resistive switching characteristics of ZnO thin film memory devices

In this study, unipolar resistive switching (URS) characteristics in ZnO thin film memory devices were systematically investigated with variable defect content. ZnO films displayed typically URS behavior while oxygen-deficient ZnO_1?x films did not show resistive switching effects. The devices with two intentional Ohmic interfaces still show URS. These results show that appearance of URS behavior can be dominated by initial oxygen vacancy content in ZnO thin films. Modest increase in oxygen vacancy content in ZnO films will lead to forming-free and narrower distributions of switching parameters (set and reset voltage, high and low resistance states). It indicates that controlling the initial oxygen vacancy content was an effective method to enhance the URS performance.     

Electrical properties and carrier transport mechanisms of nonvolatile memory devices based on randomly oriented ZnO nanowire networks

We report reproducible bipolar resistive memory devices based on Au/ZnO nanowire networks (ZnO NWNs)/ITO, which show a high R_on/R_off ratio (～10⁴) and narrow dispersion of set and reset threshold voltages. The dominant conduction mechanisms of low resistance state and high resistance state were verified by Ohmic behavior and space charge limited current, respectively. The switching mechanism is confirmed in terms of the formation and rupture of conductive filaments, with oxygen vacancies localized on the ZnO NWNs surface involved in. The Au/ZnO NWNs/ITO devices presented in our work show potential applications in the next generation nonvolatile memory field. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Improved Resistive Switching Characteristics of Ag-Doped ZrO2 Films Fabricated by Sol-Gel Process

Ag-doped and pure ZrO₂ thin films are prepared on Pt/Ti/SiO₂/Si substrates by sol-gel process for resistive random access memory application. The highly reproducible resistive switching is achieved in the 10% Ag-doped ZrO₂ devices. The improved resistive switching behaviour in the Ag doped ZrO₂ devices could be attributed to Ag doping effect on the formation of the stablefilamentary conducting paths. In addition, dual-step reset processes corresponding to three stable resistance states are observed in the 10% Ag doped ZrO₂ devices, which may be implemented for the application of multi-bit storage.     

Study of anti-clockwise bipolar resistive switching in Ag/NiO/ITO heterojunction assembly

The anti-clockwise bipolar resistive switching in Ag/NiO/ITO (Indium–Tin–Oxide) heterojunctional thin film assembly is investigated. A sequential voltage sweep in 0 → V _max → 0 → ?V _min → 0 order shows intrinsic hysteresis behaviour and resistive switching in current density (J)–voltage (V) measurements at room temperature. Switching is induced by possible rupture and recovery of the conducting filaments in NiO layer mediated by oxygen ion migration and interfacial effects at NiO/ITO junction. In the high-resistance OFF-state space charge limited current passes through the filamentary path created by oxygen ion vacancies. In OFF-state, the resistive switching behaviour is attributed to trapping and detrapping processes in shallow trap states mostly consisting of oxygen vacancies. The slope of Log I vs Log V plots, in shallow trap region of space charge limited conduction is ~2 (I ∝ V ²) followed by trap-filled and trap-free conduction. In the low-resistance ON-state, the observed electrical features are governed by the ohmic conduction.     

Characterization of magnesium oxide gate insulators grown using RF sputtering for ZnO thin-film transistors

A ZnO thin-film transistor (TFT) with an MgO insulator was fabricated on a silicon (100) substrate using a radiofrequency magnetron sputtering system. The MgO insulator was deposited using the same deposition system; the total pressure during the deposition process was maintained at 5 mTorr, and the oxygen percentage of O₂/(Ar + O₂) was set at 30%, 50%, or 70%. The process temperature was maintained at below 300 °C. The dielectric constant of the MgO thin layer was approximately 11.35 with an oxygen percentage of 70%. This ZnO TFT displayed enhanced transistor properties, with a field-effect mobility of 0.0235 cm² V⁻¹ s⁻¹, an I_ON/I_OFF ratio of ∼10⁵, and an SS value of 1.18 V decade⁻¹; these properties were superior to those measured for the MgO insulators synthesized using oxygen percentages of 30% and 50%.     

The effects of substrate temperature on ZnO-based resistive random access memory devices

Ag/ZnO/Zn/Pt structure resistive switching devices are prepared by radio frequency magnetron sputtering.The ZnO thin films are grown at room temperature and 400 C substrate temperature,respectively.By comparing the data,we find that the latter device displayed better stability in the repetitive switching cycle test,and the resistance ratio between a high resistance state and a low resistance state is correspondingly increased.After 104-s storage time measurement,this device exhibits a good retention property.Moreover,the operation voltages are very low:-0.3 V/-0.7 V(OFF state) and 0.3 V(ON state).A high-voltage forming process in the initial state is not required,and a multistep reset process is demonstrated.     

Materials,technologies, and circuit concepts for nanocrossbar-based bipolar RRAM

The paper reports on the characterization of bipolar resistive switching materials and their integration into nanocrossbar structures, as well as on different memory operation schemes in terms of memory density and the challenging problem of sneak paths. TiO₂, WO₃, GeSe, SiO₂ and MSQ thin films were integrated into nanojunctions of 100×100 nm². The variation between inert Pt and Cu or Ag top electrodes leads to valence change (VCM) switching or electrochemical metallization (ECM) switching and has significant impact on the resistive properties. All materials showed promising characteristics with switching speeds down to 10 ns, multilevel switching, good endurance and retention. Nanoimprint lithography was found to be a suitable tool for processing crossbar arrays down to a feature size of 50 nm and 3D stacking was demonstrated. The inherent occurrence of current sneak paths in passive crossbar arrays can be circumvented by the implementation of complementary resistive switching (CRS) cells. The comparison with other operation schemes shows that the CRS concept dramatically increases the addressable memory size to about 10¹⁰ bit.     

Role of an oxide interface in a resistive switch

In the present era of data-driven architectures like 5G, Internet of things (IoT), Artificial Intelligence (AI), etc, the requirement of fast-switchable memory storage is more than ever. Oxide resistive switches are considered to be a primary choice in the non-volatile memory design. In this work, we have engineered the conventional metal-insulator-metal (MIM) structure of an oxide memristor (Ag/ZnO/ITO) by inducing an additional oxide layer La_0.7Sr_0.3MnO₃ (LSMO) at the interface between the active layer (ZnO) and Ag electrode. The presence of LSMO acts as a reservoir for the oxygen vacancies, easing the conducting filament formation process in ZnO, thereby enabling drastic improvement of the switching performance and offering reliable endurance over multiple switching cycles. First-principles-based calculations suggested the role of oxygen vacancies in controlling the electronic state of ZnO and formation of vacancies in the resistive switching process, which is in agreement with the experimental observation. The current results pave ways for improving the switching performance of resistive memory circuits through simple structural engineering incorporation, which lies at the heart of oxide electronics.     

Coexistence of resistive switching and magnetism modulation in sol-gel derived nanocrystalline spinel Co3O4 thin films

We report the coexistence of resistive switching and magnetism modulation in the Pt/Co₃O₄/Pt devices, where the effects of thermal annealing and film thickness on the resistive and magnetization switching were investigated. The sol-gel derived nanocrystalline Co₃O₄ thin films obtained crack-free surface and crystallized cubic spinel structure. The 110 nm Co₃O₄ film based device annealed at 600 °C exhibited optimum resistive switching parameters. From I–V curves fitting and temperature dependent resistance, the conduction mechanism in the high-voltage region of high resistance state was dominated by Schottky emission. Magnetization-magnetic field loops demonstrated the ferromagnetic behaviors of the Co₃O₄ thin films. Multilevel saturation magnetization of the Co₃O₄ thin films can be easily realized by tuning the resistance states. Physical resistive switching mechanism can be attributed to the rejuvenation and annihilation of conductive filament consisting of oxygen vacancies. Results suggest that Pt/Co₃O₄/Pt device shows promising applications in the multifunctional electromagnetic integrated devices.     

Rectifying resistance switching behaviors of SnO2 microsphere films modulated by top electrodes

Based on the bipolar resistive switching (RS) characteristics of SnO₂ films, we have fabricated a new prototypical device with sandwiched structure of Metal/SnO₂/fluorine-doped tin oxide (FTO). The SnO₂ microspheres film was grown on FTO glass by template-free hydrothermal synthesis, which was evaporated with various commonly used electrodes such as aluminium (Al), silver (Ag), and gold (Au), respectively. Typical self-rectifying resistance switching behaviors were observed for the RS devices with Al and Au electrodes. However, no obvious rectifying resistance switching behavior was observed for the RS device with Ag electrode. Above results were interpreted by considering the different interface barriers between SnO₂ and top metal electrodes. Our current studies pave the ways for modulating the self-rectifying resistance switching properties of resistive memory devices by choosing suitable metal electrodes.     

Resistive switching functional quantum-dot light-emitting diodes

This study demonstrates quantum-dot light-emitting diodes (QD-LEDs) with a function of resistive switching memory, capable of on/off operation at the same driving current depending on reset/set state. The QD-LEDs were fabricated by spin-coating process and experienced two different annealing conditions, which yielded defective or less-defective V₂O_5–x layer. One of the annealing conditions produced QD-LEDs with the unusual electrical behaviors of negative differential resistance (NDR), capacitance oscillation, and voltage–current hysteresis curves, signifying so-called resistive switching characteristics. X-ray and ultraviolet photoelectron spectroscopies were used to examine the chemical state of the differently annealed V₂O_5–x layers. The less stoichiometric V₂O_5–x layer was found to be responsible for the resistive switching behaviors of the NDR and the low and high resistance states (LRS and HRS, respectively). We discuss the LRS/HRS of V₂O_5–x for resistive switching in terms of a conductive filament effect, induced by microstructural changes caused by oxygen drift and vacancy annihilation processes in the high defect density V₂O_5–x layer.     

Non-ohmic conduction and electrical switching under pressure of the charge transfer complexo-tolidine-iodine

The current voltage characteristics ofo-tolidine-iodine, with stoichiometry 1:1 grown from benzene, have been studied under high pressures upto 6 GPa atT=300 K andT=77 K. The characteristics show a pronounced deviation from ohmicity beyond a certain current for all pressures studied. At room temperature, beyond a threshold field the system switches from a low conductingOFF state to a high conductingON state with σ_ON/σ_OFF ∼ 10³. TheOFF state can be restored by the application of an a.c. pulse of low frequency. The temperature dependence of the two states studied indicates that theOFF state is semiconducting while theON state, beyond a certain applied pressure is metallic. The characteristics atT=77 K do not show any switching.