Formation of periodic structures by laser ablation of metals in liquids

Experimental results are presented on ablation of metals (W, Cu, brass and bronze) in a liquid environment (e.g., ethanol or water) by irradiation with either a pulsed copper vapor laser (0.51 μm) or a pulsed Nd:YAG laser (1.06 μm). The target material is ejected into surrounding liquid in the form of nanoparticles. In a certain range of laser parameters (fluence and number of laser shots) the surface of the solid target is composed of micro-cones having a regular structure. The distance between neighboring micro-cones in the structure depends on the laser spot size. The structures allow the observation of up-conversion of the laser frequency due to generation of the second harmonics in the eye retina.     

飞秒激光烧蚀硅表面产生微纳结构过程中激光脉冲数目的影响

为了研究飞秒激光脉冲数目与硅表面形貌之间的关系,在相同的SF6气体氛围下,改变照射硅表面的飞秒激光脉冲数,发现在飞秒激光照射下由硅表面形成的微型锥状尖峰的高度与飞秒激光脉冲数呈现一种非线性关系.通过对该关系的研究有利于找出在制造具有较高吸收效率的高微型锥状尖峰的"黑硅"的实验条件,有利于基于"黑硅"材料的光电器件转化效...     

Pulsed laser ablation deposition of thin films on large substrates

We have designed and built an ultra-high vacuum chamber which allows thin film deposition on large area (up to 100 mm diameter) flat substrates and on three-dimensional substrates (e.g. 100 mm long, 50 mm diameter cylinders) by the pulsed laser deposition and reactive pulsed laser deposition techniques. Heating of substrates during and after film deposition is possible using either resistive heaters or a lamp array. Metal (Cu) and metal nitride (TiN) and carbide (TiC) films were deposited on Si wafers (60 and 100 mm diameter), three-dimensional steel substrates (steel cylinders and screws), Teflon plates, and paper sheets.     

Nanosecond laser ablation and deposition of silicon

Nanosecond-pulsed KrF (248 nm, 25 ns) and Nd:YAG (1064 nm, 532 nm, 355 nm, 5 ns) lasers were used to ablate a polycrystalline Si target in a background pressure of <10⁻⁴ Pa. Si films were deposited on Si and GaAs substrates at room temperature. The surface morphology of the films was characterized using scanning electron microscopy (SEM) and atomic force microscopy (AFM). Round droplets from 20 nm to 5 μm were detected on the deposited films. Raman Spectroscopy indicated that the micron-sized droplets were crystalline and the films were amorphous. The dependence of the properties of the films on laser wavelengths and fluence is discussed.     

脉冲激光烧蚀制备纳米Si晶粒成核区位置的确定

为了确定纳米Si晶粒气相成核的位置，采用XeCl准分子激光器，在10Pa氩气环境下，烧蚀高阻抗单晶Si靶，在距离等离子羽正下方2.0cm处、与其轴线平行放置一系列单晶Si或玻璃衬底，沉积制备了纳米Si薄膜. X射线衍射、Raman散射、扫描电子显微镜和原子力显微镜结果均显示，纳米Si晶粒只在距靶约0.5—2.8cm平行距离范围内的样品上形成，在此范围内，随着离靶平行距离的增大，所形成的纳米Si晶粒的平均尺寸逐渐减小，并且晶粒尺寸的分布也发生变化. 根据成核区起始和终止的突变特征，结合晶粒形成后的平抛运动规律，对晶粒气相成核的位置进行了估算. 关键词： 纳米Si晶粒 脉冲激光烧蚀 成核区     

Growth of atomically flat ultra-thin Ag films on Si surfaces

A two-step growth with deposition at low temperature and subsequent slow annealing to room temperature (RT) has been widely used to obtain atomically flat metal thin films on semiconductor substrates. In the case of Ag films, almost atomically flat films were obtained at a thickness of six monolayers (ML) on Si and GaAs. The flatness then gradually degraded with an increase in thickness. The existence of the critical thickness has been well explained by the “electronic growth theory”, which considers thickness-dependent change of vertically quantized electrons and their spilling out at the interfaces. However, several questions remain unanswered. How does the electronically grown Ag flat film accommodate the large misfit energy between the film and substrate? Up to what deposition temperature is the two-step growth effective to obtain atomically flat films? In this article, we review previous studies on the electronic growth of Ag films on Si(1 1 1) substrates, paying special attention to these two points. In addition, we also discuss the possibility of engineering electronic growth for artificial control of the critical thickness.     

Growth of Cu Films on Si(111)-7×7 Surfaces at Low Temperature: A Scanning Tunnelling Microscopy Study

Morphologies of Cu(111) films on Si(111)-7×7 surfaces prepared at lowtemperature are investigated by scanning tunnelling microscopy (STM) andreflection high-energy electron diffraction (RHEED). At the initial growth stage, Cu films are flat due to the formation of silicide at the interface that decreases the mismatch between Cu films and the Si substrate. Different from the usual multilayer growth of Cu/Cu(111), on the silicide layer a layer-by-layer growth is observed. The two dimensional (2D) growth is explained by the enhanced high island density at low deposition temperature. Increasing deposition rateproduces films with different morphologies, which is the result of Ostwald ripening.     

Photoemission electron microscopy study of anthracene growth on Si(1 1 1)

The thin film growth of anthracene films on Si(1 1 1) surfaces is studied by photoemission electron microscopy (PEEM). The thin film growth of anthracene on Si(1 1 1) is similar to the growth of pentacene on silicon. Initially a layer of flat lying molecules chemisorbs on the surface. Subsequent growth of fractal islands with standing up molecules proceeds on top of this flat layer.     

外加气流对脉冲激光烧蚀制备纳米Si晶粒尺寸分布的影响

提出一种控制脉冲激光烧蚀制备纳米Si晶粒尺寸分布的新方法。在10Pa的Ar环境中,采用脉冲激光烧蚀高阻抗单晶硅靶沉积制备了纳米Si晶薄膜。在羽辉正上方2.0cm,距靶0.3～3.0cm范围内的不同位置引入氩气流,在烧蚀点正下方2.0cm处水平放置单晶Si(111)衬底来收集制备的纳米Si晶粒。利用扫描电子显微镜观察样品表面形貌,并对衬底不同位置上纳米Si晶粒进行统计。结果表明:在不引入气流时,晶粒的尺寸随靶衬间距的增加先增大后减小,晶粒尺寸峰值出现在距靶1.7cm处;引入气流后,晶粒尺寸分布发生变化,在距靶1.7cm引入气流时晶粒尺寸峰值最大,在距靶3.0cm引入气流时晶粒尺寸峰值最小,且出现晶粒尺寸峰值的位置随着引入气流位置的增加而增大。     

同质与异质外延掺杂CVD金刚石薄膜的结构与性能

采用化学气相沉积(CVD)技术,以高温高压(HTHP)合成的(100)金刚石和p型(100)Si为衬底制备了硫掺杂和硼-硫共掺杂金刚石薄膜,利用原子力显微镜(AFM)、扫描隧道显微镜(STM)及隧道电流谱(CITS)等手段分析同质和异质外延CVD掺杂金刚石薄膜的结构和性能.结果表明:异Si衬底上CVD金刚石的形核密度低,薄膜表面比较粗糙,粗糙度达到18.5nm;同质HTHP金刚石衬底上CVD金刚石薄膜晶粒尺寸约为10—50nm,表面平整,表面粗糙度为1.8nm.拉曼测试和电阻测量的结果显示,在HTHP金刚 关键词： 金刚石 掺杂 外延     

Ag growth on Si(111) with an Sb surfactant investigated by scanning tunneling microscopy

We have investigated a room-temperature growth mode of ultrathin Ag films on a Si(111) surface with an Sb surfactant using STM in a UHV system. On the Sb-passivated Si surface, small sized islands were formed up to 1.1 ML. Flat Ag islands were dominant at 2.1 ML, coalescing into larger islands at 3.2 ML. Although the initial growth mode of Ag films on the Sb-terminated Si(111) surface was Volmer-Weber (island growth), the films were much more uniform than Ag growth on clean (Si(111) at the higher coverages. From the analysis of STM images of Ag films grown with and without an Sb surfactant, the uniform growth of Ag films using an Sb surfactant appears to be caused by the kinetic effects of Ag on the preadsorbed Sb layer. Our STM results indicated that Sb suppresses the surface diffusion of Ag atoms and increases the Ag-island density. The increased island density is believed to cause coalescence of Ag islands at higher coverages of Ag, resulting in the growth of atomically flat and uniform Ag islands on the Sb surfactant layer.     

Photoluminescence properties of size-selected Si nanocluster films prepared by laser ablation

Size-dispersed Si nanocluster films have been synthesized by a method of crossing an Ar gas beam perpendicularly to a silicon cluster beam that is produced by a laser ablation technique. Flight directions of the nanoclusters are changed due to Ar gas collisions, and smaller nanoclusters are deflected further from the axis of the primary cluster beam. The size-dispersed nanocluster films exhibit strong red photoluminescence (PL) after exposure to the air. The PL peak energy changes between 1.42 and 1.72 eV depending on the sample position. The average diameter of the oxidized nanoclusters characterized by transmission electron microscopy is 10 nm at the position of the primary cluster beam axis and becomes smaller as deviated from the axis. The relation between the PL peak energy and the size of the oxidized Si nanoclusters is discussed. Received: 4 May 2000 / Accepted: 9 May 2000 / Published online: 13 July 2000     

Defect studies of hydrogen-loaded thin Nb films

Hydrogen interaction with defects in thin niobium (Nb) films was investigated using slow positron implantation spectroscopy (SPIS) combined with X-ray diffraction (XRD) and transmission electron microscopy (TEM). Thin Nb films on Si substrates were prepared using cathode beam sputtering at room temperature. Initially, the microstructure of the virgin (hydrogen-free) films was characterized. Subsequently, the films were step-by-step electrochemically charged with hydrogen and the evolution of the microstructure with increasing hydrogen concentration was monitored. Hydrogen loading leads to a significant lattice expansion which was measured by XRD. Contrary to free-standing bulk metals, thin films are highly anisotropic. The in-plane expansion is prevented because the films are clamped on the elastically hard substrate. On the other hand, the out-of-plane expansion is substantially higher than in the bulk samples. Moreover, an enhanced hydrogen solubility in the α-phase was found in nanocrystalline Nb films. It was found that most of positrons in the films are trapped at open-volume defects at grain boundaries (GBs). These defects represent trapping sites also for hydrogen atoms. Hydrogen trapping at vacancy-like defects like GBs leads to a local increase of the electron density and is reflected by a pronounced decrease of the S parameter in the hydrogen-loaded samples. In addition, it was found that new defects are introduced at higher concentrations of hydrogen due to the formation of NbH (β-phase) particles.     

Formation of high quality gallium nitride thin films on Ga-diffused Si(1 1 1) substrate

High quality gallium nitride thin films have been successfully grown on the Ga-diffused Si(1 1 1) substrates through ammoniating Ga₂O₃ thin films deposited by r.f. magnetron sputtering. X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), transmission electron microscopy (TEM), atomic force microscope (AFM) and photoluminescence (PL) were used to characterize the synthesized samples. The analyses reveal that the formed films are high quality polycrystalline hexagonal gallium nitride. The as-formed GaN films show a flat surface topography with RMS roughness varied from 29 to 48 Å. The strong near-band-edge-emission peak around 368 nm was observed at room temperature. This is a novel method to fabricate GaN thin films based on the direct reaction between Ga₂O₃ and NH₃ on the Ga-diffused Si(1 1 1) substrates.     

电子束蒸发制备HfO_2高k薄膜的结构特性

使用高真空电子束蒸发在p型Si(1 0 0 )衬底上制备了高kHfO2 薄膜 .俄歇电子能谱证实薄膜组分符合化学配比 ;x射线衍射测量表明刚沉积的薄膜是近非晶的 ,高温退火后发生部分晶化 ;原子力显微镜和扫描电子显微镜检测显示在高温退火前后薄膜均具有相当平整的表面 ,表明薄膜具有优良的热稳定性 ;椭偏测得在 6 0 0nm处薄膜折射率为 2 0 9;电容 电压测试得到的薄膜介电常数为 1 9.这些特性表明高真空电子束蒸发是一种很有希望的制备作为栅介质的HfO2 薄膜的方法     

Low temperature synthesis of SiC films by vacuum laser ablation and their characterization

Thin films of silicon carbide were grown on Si(100) substrate by pulsed laser ablation of powder-pressed target. The influence of substrate temperature on both structure and surface morphology of SiC films was studied by scanning electron microscopy, X-ray diffraction, and IR spectroscopy.     

Dielectric properties of anodic films on sputter-deposited Ti-Si porous columnar films

For electrolytic capacitor application of the single-phase Ti alloys containing supersaturated silicon, which form anodic oxide films with superior dielectric properties, porous Ti-7 at% Si columnar films, as well as Ti columnar films, have been prepared by oblique angle magnetron sputtering on to aluminum substrate with a concave cell structure to enhance the surface area and hence capacitance. The deposited films of both Ti and Ti-7 at% Si have isolated columnar morphology with each column revealing nanogranular texture. The distances between columns are ∼500 nm, corresponding to the cell size of the textured substrate and the gaps between columns are 100-200 nm. When the porous Ti-7 at% Si film is anodized at a constant current density in ammonium pentaborate electrolyte, the growth of a uniform amorphous oxide film continues to ∼35 V, while it is limited to less than 6 V on the porous Ti film. The maximum voltage of the growth of uniform amorphous oxide films on the Ti-7 at% Si films is similar for both the flat and porous columnar films, suggesting little influence of surface roughness on the amorphous-to-crystalline transition of growing anodic oxide under the high electric field. Due to the suppression of crystallization to sufficiently high voltages, the anodic oxide films formed on the porous Ti-7 at% Si film shows markedly improved dielectric properties, in comparison with those on the porous Ti film.     

电子束蒸发制备HfO2高k薄膜的结构特性

使用高真空电子束蒸发在p型Si（100）衬底上制备了高k HfO2薄膜.俄歇电子能谱证实薄膜组分符合化学配比；x射线衍射测量表明刚沉积的薄膜是近非晶的，高温退火后发生部分晶化；原子力显微镜和扫描电子显微镜检测显示在高温退火前后薄膜均具有相当平整的表面，表明薄膜具有优良的热稳定性；椭偏测得在600?nm处薄膜折射率为2.09；电容电压测试得到的薄膜介电常数为19.这些特性表明高真空电子束蒸发是一种很有希望的制备作为栅介质的HfO2薄膜的方法. 关键词： 高k薄膜 HfO2 电子束蒸发     

Infrared spectroscopy of intraband transitions in Ge/Si quantum dot superlattices

We report the study of infrared spectroscopy of intraband transitions in Ge/Si quantum dot superlattices. The superlattices, which were grown on (001) oriented Si substrates by a solid source molecular beam epitaxy system, are composed mainly of 20 or 30 periods of Ge dot layers and Si spacer films. The structural properties of them and of the uncapped Ge dots grown on the surfaces of some of them were tested by cross-sectional transmission electron and atomic force microscopes, respectively. It is found that the Ge quantum dots have flat lens-like shapes. Infrared absorption signals peaking in the mid-infrared range were observed using Fourier transform infrared and Raman scattering spectroscopy techniques. Experimental and theoretical analysis suggests that the mid-infrared response be attributed to intraband transitions within the valence band of the Ge quantum dots in the superlattices. The fact that the intraband absorption is strongly polarized along the growth axis of the superlattices signifies that the Ge quantum dots with flat lens-like shapes perform as Ge/Si-based quantum wells. This study demonstrates the application potential of these kinds of Ge/Si quantum dot superlattices for developing mid-infrared photodetectors.     

Characterization of Si-added aluminum oxide (AlSiO) films for power devices

Synthesis of Si-added aluminum oxide (AlSiO) films is attempted as an insulating film with both a wide bandgap and a high dielectric constant. Electrical characteristics of AlSiO films are investigated. Leakage current of the AlO film is suppressed by Si addition and is minimized with Si composition ratio of 12%. Capacitance versus voltage (C-V) measurements are carried out for Au/AlSiO/Si MIS structure. Both flat band shift and hysteresis of the C-V characteristics are suppressed by Si addition. A low leakage current is demonstrated for Au/AlSiO/n-SiC MIS structure.