Characterization of high-quality MBE-grown GaN films on intermediate-temperature buffer layers

High-quality GaN thin films are grown by rf-plasma assisted molecular beam epitaxy. The quality of the GaN epitaxial layer is significantly improved by using an intermediate-temperature GaN buffer layer (ITBL) in addition to a conventional 20-nm-thick low-temperature buffer layer. The GaN epitaxial layers demonstrate systematic improvements in the electron mobility increasing from 82 cm² V^-1 s^-1, for films grown with just the low-temperature buffer layer, to about 380 cm² V^-1 s^-1 for films grown with an ITBL of thickness 800 nm. The photoluminescence also indicates systematic improvements in the intensity and the full-width-half-maximum with the use of ITBL. Photoreflectance spectra are measured from the GaN films. Detailed analyses of the excitonic transition energy demonstrate that the residual strain relaxes rapidly with the use of ITBL, which is attributed to the observed improvements in the mobility and the PL spectra. Received: 30 November 2000 / Accepted: 4 December 2000 / Published online: 9 February 2001     

GaP layers grown on GaN with and without buffer layers

The growth of GaP layer on GaN with and without buffer layers by metal-organic chemical vapour deposition (MOCVD) has been studied. Results indicate that the GaP low temperature buffer layer can provide a high density of nucleation sites for high temperature (HT) GaP growth. These sites can promote the two-dimensional (2D) growth of HT GaP and reduce the surface roughness. A GaP single crystal layer grown at 680°C is obtained using a 40-nm thick GaP buffer layer. The full-width at half-maximum (FWHM) of the (111) plane of GaP layer, measured by DCXRD, is 560 arcsec. The GaP layer grown on GaN without low temperature GaP buffer layer shows a rougher surface. However, the FWHM of the (111) plane is 408 arcsec, which is the indication of better crystal quality for the GaP layer grown on GaN without a low temperature buffer layer. Because it provides less nucleation sites grown at high growth temperature, the three-dimensional (3D) growth is prolonged. The crystalline quality of GaP is lightly improved when the surface of GaN substrate is pretreated by PH3 , while it turned to be polycrystalline when the substrate is pretreated by TEGa.     

Luminescent properties of GaN films grown on porous silicon substrate

GaN films have been grown on porous silicon at high temperatures (800-1050 °C) by metal organic vapor phase epitaxy. The optical properties of GaN layers were investigated by photoluminescence (PL) and cathodoluminescence (CL) spectroscopy. PL spectra recorded at 5 K exhibit excitonic emissions around 3.36-3.501 eV and a broad yellow luminescence at 2.2 eV. CL analysis at different electron excitation conditions shows spatial non-uniformity in-depth of the yellow and the band-edge emissions. These bands of luminescence are broadened and red- or blue-shifted as the electron beam penetrates in the sample. These behaviors are explained by a change of the fundamental band gap due to residual strain and the local thermal effect. It was found that the use of AlN buffer layer improves the crystalline quality and the luminescence property of GaN.     

High resolution X-ray studies of porous PbTe layers on silicon substrates

The structure of PbTe films after anodic electrochemical etching in Norr electrolyte is studied by high resolution X-ray diffractometry and reflectometry. Lattice defects before and after etching are estimated. The quantitative parameters of the pores are determined. The advantage of the complex application of high resolution X-ray methods for the determination of the real structure of lead-telluride porous films is shown.     

Structure and properties of ZnO films grown on Si substrates with low temperature buffer layers

Zinc oxide (ZnO) thin films were grown on Si (1 0 0) substrates by pulsed laser deposition (PLD) using two-step epitaxial growth method. Low temperature buffer layer (LTBL) was initially deposited in order to obtain high quality ZnO thin film; the as-deposited films were then annealed in air at 700 °C. The effects of LTBL and annealing treatment on the structural and luminescent properties of ZnO thin film were investigated. It was found that tensile strain was remarkably relaxed by employing LTBL and the band-gap redshifted, correspondingly. The shift value was larger than that calculated from band-gap theories. After annealing treatment, it was found that the annealing temperature with 700 °C has little influence on strains of ZnO films with LTBLs other than directly deposited film in our experiments. Interestingly, the different behaviors in terms of the shift of ultraviolet (UV) emission after annealing between films with and without buffer were observed, and a tentative explanation was given in this paper.     

矫顽力可调的多孔硅基Fe膜

采用电化学腐蚀法制备了不同多孔度的多孔硅(PS),再通过磁控溅射法在该PS衬底上沉积了一定厚度的Fe膜;并对样品进行了X射线衍射的结构分析、扫描隧道显微技术的表面形貌观察和磁光克尔效应的测量.发现在同一Fe膜厚度下，相对于参考样品硅上的Fe膜，多孔硅上Fe膜的矫顽力更大;同时观察到多孔硅基Fe膜随着PS多孔度的增加，矫顽力相应变大;而对于多孔度相同的多孔硅基样品,随着Fe膜厚度的增加矫顽力却逐步减小.得出了多孔硅特有的海绵状疏松结构能有效调节Fe膜矫顽力大小的结论. 关键词： 多孔硅 海绵状结构 Fe薄膜 矫顽力     

Integration of GaN thin films with silicon substrates by fusion bonding and laser lift-off

GaN thin films grown on sapphire substrates by metalorganic chemical vapor deposition (MOCVD) are successfully bonded and transferred onto Si receptor substrates using fusion bonding and laser lift-off (LLO) technique. GaN/Al2O3 structures are joined to Si substrates by pressure bonding Ti/Au coated GaN surface onto Ti/Au coated Si receptor substrates at the temperature of 400 ℃. KrF excimer laser with 400-m J/cm2 energy density, 248-nm wavelength, and 30-ns pulse width is used to irradiate the wafer through the transparent sapphire substrates and separate GaN films from sapphire. Cross-section scanning electron microscopy (SEM) combined with energy dispersive X-ray spectrometer (EDS) measurements show that Au/Si solid solution is formed during bonding process. Atomic force microscopy (AFM) and photoluminescence (PL) measurements show that the qualities of GaN films on Si substrates degrade little after substrates transfer.     

Mechanism of silicon epitaxy on porous silicon layers

The mechanism of silicon epitaxy on porous Si(111) layers is investigated by the Monte Carlo method. The Gilmer model of adatom diffusion extended to the case of arbitrary surface morphology is used. Vacancies and pendants of atoms are allowed in the generalized model, the activation energy of a diffusion hop depends on the state of the neighboring positions in the first and second coordination spheres, and neighbors located outside the growing elementary layer are also taken into account. It is shown that in this model epitaxy occurs by the formation of metastable nucleation centers at the edges of pores, followed by growth of the nucleation centers along the perimeter and the formation of a thin, continuous pendant layer. Three-dimensional images of surface layers at different stages of epitaxy were obtained. The dependence of the kinetics of the epitaxy process on the amount of deposited silicon is determined for different substrate porosities. Pis’ma Zh. éksp. Teor. Fiz. 67, No. 7, 512–517 (10 April 1998)     

Characterization of GaN layers grown on silicon-on-insulator substrates

In this study, we report growth and characterization of GaN layers on (1 0 0)- and (1 1 1)-oriented silicon-on-insulator (SOI) substrates. Using metalorganic chemical vapor deposition (MOCVD) technique, GaN layers are grown on KOH treated Si (1 0 0) overlayers of thin SIMOX SOI substrates. Growth of GaN on such surface with an AlN buffer leads to c-axis orientated textured GaN. This is evident from high-resolution X-ray diffraction (HRXRD) measurement, which shows a much broader rocking curve linewidth. Significantly enhanced photoluminescence (PL) intensity and partial stress relaxation is observed in GaN layers grown on these SOI substrates. Furthermore, GaN grown on (1 1 1)-oriented bonded SOI substrates shows good surface morphology and improved optical quality. Micro-Raman, micro-PL, and HRXRD measurements reveal single crystalline hexagonal GaN oriented along (0 0 0 1) direction. We also report growth and characterization of InGaN/GaN multi-quantum well structures on (1 1 1)-oriented bonded SOI. Such an approach to realize nitride epilayers would be useful to fabricate GaN-based micro-opto-electromechanical systems (MOEMS) and sensors.     

Tilt of InGaN layers on miscut GaN substrates

We report on the crystallographic orientation of InGaN layers grown on GaN substrates with a miscut with respect to c ‐planes up to 2.5°. The samples were examined using high‐resolution X‐ray diffraction (HRXRD) and atomic force microscopy (AFM). Because of the large (up to about 2% in this study) lattice mismatch between InGaN and GaN, an additional tilt between the c lattice planes of InGaN and GaN was observed and explained by using the Nagai model [J. Appl. Phys. 45 , 3789 (1974)]. We observed that for part of the samples, this tilt is about 10% smaller compared to the one predicted by the model. The experimental data are important for understanding the microstructure of InGaN layers grown on substrates of non‐perfect morphology. (© 2010 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Microstructure of bulk GaN layer grown on sapphire substrates with amorphous buffer

The structure of bulk GaN layers grown on (0001) sapphire substrates by vapor-phase epitaxy has been studied by x-ray diffraction and transmission electron microscopy (TEM). It is found that these layers contain grown-in and screw dislocations. The dislocation density decreases away from the interface. The effect of an amorphous buffer layer on the formation of the initial GaN layer and, thus, on the degree of perfection of gallium nitride layers is elucidated. A model of generating grown-in dislocations and the relaxation mechanism of misfit stresses are proposed.     

SERS-active substrates based on n-type porous silicon

Porous silicon (PS) prepared from n-type Si crystal is proposed as a new material for the fabrication of sensitive substrates for surface-enhanced Raman scattering (SERS). The formation procedure for nanostructured silver films on the surface of PS was optimized. Maximum of SERS enhancement for rhodamine 6G probing molecule is observed for samples obtained by the immersion plating from the water solution of AgNO₃ with the 10 mM concentration during 5 min. The dependence of morphological parameters of PS and corresponding silvered surfaces on the anodization current density has been studied. It is shown that the most SERS activities possess substrates produced from PS with lower porosity. The optimum of the PS layer thickness for high Raman signal is about 5 μm. The detection limit for rhodamine 6G adsorbed on Ag-coated PS from the 100 pM solution is established to be comparable with that for p-type PS-based substrates. Thus, the n-type porous silicon is suitable material for the preparation of sensitive SERS-active substrates.     

Hydride vapor phase epitaxy growth of GaN on sapphire with ZnO buffer layers

The initial stages and subsequent growth of GaN on sapphire using ZnO buffer layers is reported for the hydride vapor phase epitaxy technique. A high gas-phase supersaturation in the growth ambient was used to favor a rapid initial growth on the substrate. A subsequent growth step was employed under conditions that favor a high lateral growth rate in order to promote the coalescence of the initial islands and provide optimal material properties. The specific gas-phase mole fractions of the GaCl and NH₃ at the growth front control both the vertical and lateral growth rates. The use of a two-step growth process in the GaN growth leads to a controlled morphology and improved material properties for GaN materials when grown with a ZnO buffer layer. An optimized set of growth conditions, utilizing this two-step process, was found to also improve the growth directly on sapphire without a ZnO buffer layer. Received: 8 November 2001 / Accepted: 14 November 2001 / Published online: 11 February 2002     

Heteroepitaxy of erbium-doped silicon layers on sapphire substrates

The possibility of using sublimation molecular-beam epitaxy as an efficient method for growing erbium-doped silicon layers on sapphire substrates for optoelectronic applications is analyzed. The advantage of this method is that the erbium-doped silicon layers can be grown at relatively low temperatures. The use of sublimation molecular-beam epitaxy makes it possible to grow silicon layers of good crystal quality. It is demonstrated that the growth temperature affects not only the structure of silicon-on-sapphire layers but also the crystallographic orientation of these layers. The electrical and luminescence properties of the erbium-doped silicon layers are discussed. It is revealed that structures of this type exhibit intense erbium photoluminescence at a wavelength of 1.54 μm.     

Iron films deposited on porous alumina substrates

Iron films were deposited on porous alumina substrates using an arc plasma gun. The pore sizes (120 – 250 nm) of the substrates were controlled by changing the temperature during the anodic oxidation of aluminum plates. Iron atoms penetrated into pores with diameters of less than 160 nm, and were stabilized by forming γ-Fe, whereas α-Fe was produced as a flat plane covering the pores. For porous alumina substrates with pore sizes larger than 200 nm, the deposited iron films contained many defects and the resulting α-Fe had smaller hyperfine magnetic fields. In addition, only a very small amount of γ-Fe was obtained. It was demonstrated that the composition and structure of an iron film can be affected by the surface morphology of the porous alumina substrate on which the film is grown.     

Morphology and properties of ZnO films obtained by repeated spin coating on porous silicon substrates

Layers of porous silicon (PS), multilayered ZnO films, and heterostructures based on them are obtained. The surface morphology, chemical and phase composition of the PS layers and ZnO films, and the transverse cleavage of ZnO–PS nanocomposite, are investigated via energy-dispersive X-ray spectral analysis (EDX), X-ray diffraction (XRD), and scanning electron microscopy (SEM). The current–voltage characteristics of Al/Ag/p-Si(100)/PS/ZnO/Ag/Al and Al/Ag/p-Si(100)/PS/ZnO/SiC/Ag/Al heterostructures are studied.     

Model of silicon carbide formation on porous substrates

The formation of thin silicon carbide layers as a result of solid-phase processes is related to the evolution of nanoscale porosity and chemical reactions on pore surfaces. Numerical experiments, which simulate blistering under the action of Xe+ ions in the metal-insulator (Mo/Si) bilayer make it possible to establish the relationship between the porosity parameters and layer stresses and the irradiation conditions. Similar patterns in the formation of defects (pores and cracks) in crystalline silicon characterize its interaction with carbon dioxide when silicon carbide is formed. The calculated characteristics of the nucleation in the Mo/Si bilayers are analyzed to optimize the solid-phase epitaxy of silicon carbide.     

Epitaxial growth of cadmium telluride films on silicon with a buffer silicon carbide layer

An epitaxial 1–3-μm-thick cadmium telluride film has been grown on silicon with a buffer silicon carbide layer using the method of open thermal evaporation and condensation in vacuum for the first time. The optimum substrate temperature was 500°C at an evaporator temperature of 580°C, and the growth time was 4 s. In order to provide more qualitative growth of cadmium telluride, a high-quality ~100-nm-thick buffer silicon carbide layer was previously synthesized on the silicon surface using the method of topochemical substitution of atoms. The ellipsometric, Raman, X-ray diffraction, and electron-diffraction analyses showed a high structural perfection of the CdTe layer in the absence of a polycrystalline phase.

     

硅基锗薄膜的异质外延生长及其在光电子器件中的应用

准直接带隙的锗,其禁带宽度小,吸收系数大,迁移率高,更重要的是,它能与硅微电子工艺兼容,在硅基光电集成中得到了广泛的研究和应用.文章综述了硅基锗薄膜的异质外延生长及其在光电子器件（特别是长波长光电探测器和激光器）应用上的进展;介绍了在硅衬底上异质外延生长锗薄膜的缓冲层技术,如组分变化的SiGe缓冲层技术、选区外延技术和低温技术;讨论了硅基锗薄膜光电探测器的性能与结构的关系以及发展趋势;分析了张应变和n型掺杂对锗光电性质的影响;展望了硅基锗薄膜单片集成和电抽运激光器的前景.     

Comparison study of GaN films grown on porous and planar GaN templates

The GaN thick films have been grown on porous GaN template and planar metal-organic chemical vapor deposition(MOCVD)-GaN template by halide vapor phase epitaxy(HVPE). The analysis results indicated that the GaN films grown on porous and planar GaN templates under the same growth conditions have similar structural, optical, and electrical properties. But the porous GaN templates could significantly reduce the stress in the HVPE-GaN epilayer and enhance the photoluminescence(PL) intensity. The voids in the porous template were critical for the strain relaxation in the GaN films and the increase of the PL intensity. Thus, the porous GaN converted from β-Ga2O3 film as a novel promising template is suitable for the growth of stress-free GaN films.