Alkoxysilane functionalized polycaprolactone/polysiloxane modified epoxy resin through sol-gel process

Incorporating elastic polysiloxane and/or an inorganic silica network in epoxy resin could result in the enhancement of physico-chemical properties due to the existence of Si-O bonds. To improve the compatibility between polysiloxane and epoxy matrices and intensively strengthen the properties of the modified system, here polysiloxane was introduced into epoxy resin through compatibilizing epoxy-immiscible polysiloxane with epoxy-miscible polycaprolactone segments via a sol-gel process. To fulfill the process, a blend containing alkoxysilane-functionalized polycaprolactone/polydimethylsiloxane (PCS-2Si) was firstly synthesized using direct nucleophilic addition between -OH groups of polydiol and -NCO of a silane. And then a series of modified epoxy resins were prepared in different epoxy/PCS-2Si weight ratios. All the modified composites were characterized by conventional methods, and their morphological, thermal degradation and surface properties were studied. The results showed that increasing the PCS-2Si content caused the changes of miscibility between epoxy and polysiloxane. Also, the thermal stability of the modified composites was greatly improved. As for the temperature value at 5% weight loss, it reached to 308.5 °C for the composite containing 50-60% (wt%) PCS-2Si, over 150 °C higher than that for neat amine-cured epoxy resin. Similarly, the modified composites showed good hydrophobicity. The improvement of these properties came from the improved interaction between PCS-2Si and epoxy, the forming of Si-O-Si network and the enrichment of siloxane chains on the surface of films. Therefore, it is believed that this modified epoxy appears promising as new high performance and highly functional materials.     

一种液晶环氧增韧环氧树脂的研究

环氧树脂具有优异的机械性能 ,耐高温以及良好的加工工艺性 .被广泛用于机械、航天、船舶等领域 .由于环氧树脂固化后断裂延伸率小 ,脆性大 ,使其应用受到了一定的限制 .为此 ,国内外学者对环氧树脂进行了大量的改性研究工作 .用含有“柔性链段”的固化剂固化环氧 ,在交联网络中引入柔性链段[1] ;在环氧基体中加入橡胶弹性体[2 ] 、热塑性树脂[3 ,4] 、液晶聚合物[5,6] 等分散相或用热固性树脂连续贯穿于环氧树脂网络中形成互穿、半互穿网络结构[7] ,以改善环氧树脂的韧性 .本文采用液晶环氧化合物原位复合增韧环氧树脂 ,考察了液晶环氧对环…     

Performance of methylphenyl hydrogen-containing silicone oils for LED encapsulation

Three-dimensional light-emitting diodes (LEDs) are the preferred light source for bulb lamps due to their 360° illumination. Addition curing silicone resins have usually been used to encapsulate LEDs. LED-filament encapsulation needs silicone resins having high thermal performance and thixotropy. Herein, a low refractive index and highly anti-thermal aging silicone oil was synthesized by hydrolysis and co-condensation method, and used to prepare an encapsulation material for high-power LED-filament. The cured silicone materials were characterized by thermogravimetric analysis (TGA) and thermal aging test under 180°C and 250°C. The results demonstrated that the thermal stability of the cured silicone resins with short-chain phenyl silicone as a crosslinker was higher than that with long-chain methyl silicone oil crosslinker. Owing to the excellent thermal stability, appropriate hardness, high transparency and photoelectric efficiency, this LED encapsulation material is a promising candidate for high-power LED package.     

High refractive index adamantane‐based silicone resins for the encapsulation of light‐emitting diodes

The encapsulation of high power light emitting diode (LED) needs the silicone resins to have relative high refractive index and thermal‐aging properties. Herein, high refractive index adamantane‐based phenyl epoxy‐silicone (APES) resins for LED encapsulation were synthesized by the sol‐gel condensation of 1‐adamantane methanol propyltrimethoxysilane‐3‐urethane, γ‐(2,3‐epoxypropoxy)propytrimethoxysilane and diphenylsilanediol. These adamantane‐based silicone resins have multifunctional groups including adamantyl group, phenyl group, and epoxy group in order to meet the various requirements for LED encapsulation. Importantly, the adamantane group in the silicone resins benefits for high refractive index and anti‐thermal properties. These APES resins were characterized by proton nuclear magnetic resonance and Fourier transform infrared spectroscopy. When APES resins were cured by methylhexahydrophthalic anhydride, they showed relatively high refractive index of 1.56, high hardness, and high thermal resistance. The encapsulated LED demonstrated high adhesion properties by red‐ink tests. These merits make adamantane‐based silicone resins promising candidates as LED encapsulation materials.     

含磷有机硅杂化环氧树脂固化体系性能研究

通过磷酸与γ-环氧丙氧基三甲氧基硅烷反应得到含磷有机硅氧烷,并加入到环氧树脂/4,4'-二氨基二苯基甲烷体系中混合,通过溶胶-凝胶的方法制备了含磷有机硅杂化环氧树脂固化物.对固化体系进行了玻璃化转变温度、热失重、阻燃、拉伸强度、冲击强度测试分析.结果表明,该固化体系的阻燃性得到提高,极限氧指数在25.8～29.3,玻璃化转变温度得到提高,在161～179℃;虽然初始分解温度比纯环氧树脂固化物低,但800℃残炭率可以达到26.5%,提高了36%;拉伸强度得到提高,在71～94 MPa,冲击强度可以达到14.36 kJ/m2,提高了14%.该固化体系具有较好的阻燃性能和热性能,同时具有较好的力学性能.     

Preparation, thermal properties and flame retardancy of phosphorus- and silicon-containing epoxy resins

Phosphorus- and silicon-containing epoxy resins were prepared from (2,5-dihydroxyphenyl)diphenyl phosphine oxide (Gly-HPO), diglycidyloxy methylphenyl silane (DGMPS) and 1,4-bis(glycidyloxydimethyl silyl)-benzene (BGDMSB) as epoxy monomers and diaminodiphenylmethane (DDM), bis(3-aminophenyl)methyl phosphine oxide (BAMPO) and bis(4-aminophenoxy)dimethyl silane (APDS) as curing agents. Epoxy resins with different phosphorus and silicon content were obtained. Their thermal, dynamic mechanical and flame retardant properties were evaluated. The high LOI values confirmed that epoxy resins containing hetero-atoms are effective flame retardants, but a synergistic efficiency of phosphorus and silicon on flame retardation was not observed.     

功率型LED封装用高分子材料的研究进展

随着发光二极管(LED)亮度和功率的不断提高,封装材料已成为制约LED进入照明领域的关键技术之一。对于功率型LED封装材料,要求具有高折射率、高透光率、高导热率、耐紫外、耐热老化、低应力、低吸水率等性能特点。目前LED封装用两大主要高分子材料是环氧树脂和有机硅复合材料。对这两种材料的改性主要集中在折射率、耐老化性、导热性、吸水性和力学性能等方面。脂环族环氧树脂及纳米有机硅复合材料作为高功率LED封装材料具有广阔的发展前景。     

Enhanced thermal properties and flame retardancy from a thermosetting blend of a phosphorus‐containing bismaleimide and epoxy resins

Epoxy resins modified by an organosoluble phosphorus‐containing bismaleimide (3,3′‐bis(maleimidophenyl) ­phenylphosphine oxide; BMPPPO) were prepared by simultaneously curing epoxy/diaminodiphenylmethane (DDM), and BMPPPO. The resulted epoxy resins were found to exhibit glass transition temperatures as high as 212 °C, thermal stability at temperatures over 350 °C, and excellent flame retardancy with Limited oxygen index (LOI) values around 40. Incorporation of BMPPPO into epoxy resins via the thermosetting blend was demonstrated to be an effective way to enhance the thermal properties and flame retardancy simultaneously. Copyright © 2003 John Wiley & Sons, Ltd.     

Thermal conductivity epoxy resin composites filled with boron nitride

Boron nitride (BN) micro particles modified by silane coupling agent, γ‐aminopropyl triethoxy silane (KH550), are employed to prepare BN/epoxy resin (EP) thermal conductivity composites. The thermal conductivity coefficient of the composites with 60% mass fraction of modified BN is 1.052 W/mK, five times higher than that of native EP (0.202 W/mK). The mechanical properties of the composites are optimal with 10 wt% BN. The thermal decomposition temperature, dielectric constant, and dielectric loss increase with the addition of BN. For a given BN loading, the surface modification of BN by KH550 exhibits a positive effect on the thermal conductivity and mechanical properties of the BN/EP composites. Copyright © 2011 John Wiley & Sons, Ltd.     

Synthesis and Properties of Silphenylene-containing Epoxy Resins with High UV-stability

Two novel silphenylene-containing cycloaliphatic epoxy resins, 1,4-di [2-(3, 4-epoxycyclohexylethyl) dimethylsilyl] benzene (DEDSB) and 1,3,5-tri [2-(3, 4-epoxycyclohexylethyl) dimethylsilyl] benzene (TEDSB) were synthesized through in situ Grignard reaction and hydrosilylation, and characterized by FT-IR and ¹H-NMR. They were colorless transparent viscous liquids. Methyhexahydrophthalic anhydride (MeHHPA) was used to cure the epoxy resins to give glassy solids with high optical clarity. Differential scanning calorimetry (DSC) results indicated that DEDSB and TEDSB showed similar curing reactivity. The cured TEDSB had a higher glass transition temperature, a higher storage modulus and a lower coefficient of linear thermal expansion than the cured DEDSB due to a higher crosslink density. The cured silphenylene-containing epoxy resins exhibited a much higher resistance to discoloration under UV irradiation than the commonly used epoxy resins diglycidyl ether of bisphenol-A (DGEBA). XPS analysis revealed that they were much less susceptible to photo-oxidation than DGEBA.     

Nano- and micro-structured random copolymer modified cycloaliphatic epoxy resins for use as light-emitting diode encapsulation

Poly(2,2,3,4,4,4-Hexafluorobutylmethacrylate–random–glycidolmethacrylate) random copolymer (P(HFBMA-r-GMA)) was synthesized via free radical polymerization. The novel reactive random copolymer was incorporated to modify cycloaliphatic epoxy resins and obtain the nano- or micro- structured composites. The chemical structures of P(HFBMA-r-GMA) were confirmed by Fourier transform infrared spectroscopy (FTIR) and nuclear magnetic resonance (NMR). The morphology and light transmittance of the cured epoxy resins were observed by scanning electron microscopy (SEM), transmission electron microscope (TEM) and ultraviolet-visible spectrophotometry (UV-vis), respectively. It is indicated that the optical transmittance of composites were basically kept although the microphase separation occurred in the curing process, which has a profound influence on the mechanical properties and refractive indexes. The thermal properties, surface dewettability and water absorbency of the cured epoxy resins were examined by differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), contact angle measurement and immersion test respectively. The experimental results revealed that the values of glass transition temperatures (Tg), surface dewettability and water resistance were effectively improved by the high cross-linking density and the enrichment of the fluorinated random copolymer dispersing in the composites. With respect to the corresponding properties of the neat epoxy resin, P (HFBMA-r-GMA)-0.25 hybrimer embraced the relatively good comprehensive properties, making the modified epoxy resins as good candidates for LED encapsulation.     

有机硅改性UV固化水性环氧树脂的研究

以环氧树脂E-51、甲基三乙氧基硅烷为原料,用接枝共聚的方法合成了有机硅改性水溶性UV固化环氧树脂,该方法有效地改善了环氧树脂的柔韧性、水溶解性,提高了成膜物的机械性能,其拉伸强度达到53.5 MPa,断裂伸长率为46.5%,耐冲击性大于50 kg/cm。通过红外光谱、热重分析表征产物的结构和性能,结果表明,有机硅已经成功接枝到环氧树脂的分子上。有机硅改性后环氧树脂在400℃的分解率由之前的60%降至40%。文章同时讨论了有机硅改性水性UV固化环氧树脂合成中反应温度、有机硅种类以及加入量等对UV固化水性环氧树脂成膜物的附着力、耐水性及耐碱性的影响,以此获得最佳反应条件:质量分数为14.4%的甲基三乙氧基硅烷与羧酸改性的环氧树脂在90℃下反应5～6 h。     

Effect of fluorine functional groups on surface and mechanical interfacial properties of epoxy resins

To improve the surface and mechanical interfacial properties of epoxy resins, fluorine-containing epoxy resin (FEP) was prepared and blended with a commercially available tetrafunctional epoxy resin (TGDDM). As a result, when the fluorine content increased, the total surface energy of TGDDM/FEP blends was gradually decreased, while the water repellency of the blends was increased. The glass transition temperature and thermal stability factors of the blends showed maximum values at 20-40 wt% FEP compared with neat TGDDM epoxy resins. And the mechanical interfacial properties of the blend specimens were significantly increased with increasing the FEP content, which could be attributed to the intermacromolecular interactions in the cured TGDDM/FEP blends. These results indicate that the water repellency and toughness improvements have been achieved without significantly deterioration of the thermal properties in the TGDDM/FEP blends.     

高性能可回收环氧树脂及其复合材料的制备与性能研究

采用戊二酸酐为固化剂,乙酰丙酮锌为催化剂制备了一种综合性能优异的高性能可回收环氧树脂.系统研究了固化剂及催化剂含量对树脂结构、热学及动态性能的影响,实现了树脂组成的优化设计.基于酯交换反应的热可逆性,制备的vitrimer树脂通过物理热压方法可实现良好回收,力学强度保持率可达80%.采用RTM工艺制备的碳纤维织物增强vitrimer树脂复合材料表现出与传统热固性树脂基复合材料相当的力学性能,并且通过醇类溶剂热降解树脂的方法,可实现复合材料中碳纤维的高效无损回收,回收率近100%.     

Self‐adhesive epoxy modified silicone materials for light emitting diode encapsulation

In this paper, we prepared the light emitting diode (LED) encapsulant with self‐adhesion and high refractive index. In order to improve adhesion properties, we synthesized a series of multifunctional polysiloxanes with different contents of epoxy groups via the sol–gel condensation of methylvinyldimethoxysilane, diphenylsilanediol and 3‐glycidoxypropyldimethoxymethylsilane. The structures of epoxyphenylvinyl silicone (EPVS) resins were confirmed by proton nuclear magnetic resonance and Fourier‐transform infrared. The effect of epoxy group content on the adhesion property of EPVS resins was fully studied. The performances of the LED encapsulation materials based on EPVS resins were investigated in detail. These self‐adhesive encapsulating materials showed excellent thermal stability, a high refractive index of 1.55 and good adhesive property. These EPVSs can be used as an adhesion promoter for LED encapsulation materials. Copyright © 2017 John Wiley & Sons, Ltd.     

聚醚链段长度对氨基聚醚-环氧树脂力学性能的影响

以柔性端氨基聚醚(BATPE)和双酚A环氧树脂(DGEBA)为原料, 制备了无微相分离结构的无定型AB交联热固性树脂. 测试了3种不同聚乙二醇(PEG)链段长度(M_PE)的BATPE-DGEBA环氧树脂固化产物的应力-应变曲线、动态力学温度谱和冲击断面形貌. 结果表明, 在环氧树脂交联网络中引入两端与DGEBA化学连接的PEG链段能避免微相分离结构的生成, 有利于提高DGEBA链段的应变松弛速率. 增加M_PE, 一方面能降低环氧树脂固化产物的玻璃化转变温度和室温下的刚度和拉伸强度, 增加韧性(包括冲击强度和拉伸韧性)、断裂应变和模量损耗因子; 另一方面也能提高固化产物在低温下的储存模量. 优化M_PE可制备出在中低温下同时具有优异的拉伸强度、模量、断裂应变和冲击性能的BATPE-DGEBA环氧树脂.     

Oligo-fluoropolymer Modified Cycloaliphatic Epoxy Resins with Excellent Compatibility,Waterproof and Mechanical Properties for LED Encapsulation

An oligo-fluoropolymer(PFM) with functional cycloaliphatic epoxy and fluorinated groups was obtained via free radical polymerization and applied to the modification of cycloaliphatic epoxy resins(CE). The chemical structure of PFM was characterized by Fourier transform infrared(FTIR) spectroscopy, gel permeation chromatography(GPC) and nuclear magnetic resonance(NMR) spectroscopy, and the effects of different PFM concentrations(0.5%—6%, mass fraction) on the thermal resistance, mechanical properties, surface dewettability, light transmission, refractive index and various cured polymer properties were studied in detail. The DSC and TGA results demonstrate that the modified epoxy resins possess a higher thermal resistance than the neat epoxy resin. The improvements in the surface dewettability and water resistance are caused by the high crosslinking density and the enrichment of the oligo-fluorinated random copolymers dispersed in the matrix. The fracture surface morphologies of the thermosets were investigated by scanning electron microscopy(SEM) and transmission electron microscopy(TEM). It was observed that the optical transmittance of the composites was maintained even though microphase separation occurred during the curing process. With respect to the corresponding properties of the neat epoxy resins, the 2 phr(parts per hundreds of resin) PFM thermoset exhibited relatively better comprehensive properties, making the cured material a good candidate for light-emitting diode(LED) encapsulation.     

基于可逆动态共价化学的新型可修复、可回收、可加工环氧树脂

利用生物来源的二聚脂肪酸为原料,合成了二聚酸酰肼和二聚酸酰腙两种衍生物,并进一步以其作为环氧E-44树脂固化剂,得到了新型的含动态共价连接的热固性环氧树脂。采用傅里叶红外光谱(FT-IR)、差式扫描量热(DSC)、扫描电子显微镜(SEM)、热重(TG)和动态力学分析(DMA)等多种测试手段对环氧树脂固化过程以及固化后材料的结构与性能关系进行了详细表征,特别研究了动态亚胺键对热固性环氧树脂性能的独特影响。结果表明:与传统环氧树脂相比,改性后的环氧树脂有更好的韧性,且其玻璃化转变温度及热稳定性没有明显下降。在升温和加压的条件下,酸可催化亚胺键的动态交换反应,赋予传统环氧树脂以全新的可修复、可回收与可多次加工性能。     

Organic/inorganic hybrid epoxy nanocomposites based on octa(aminophenyl)silsesquioxane

Octa(aminophenyl)silsesquioxane (OAPS) was used as the curing agent of diglycidyl ether of bisphenol-A (DGEBA) epoxy resin. A study on comparison of DGEBA/OAPS with DGEBA/4,4′-diaminodiphenyl sulfone (DDS) epoxy resins was achieved. Differential scanning calorimetry was used to investigate the curing reaction and its kinetics, and the glass transition of DGEBA/OAPS. Thermogravimetric analysis was used to investigate thermal decomposition of the two kinds of epoxy resins. The reactions between amino groups and epoxy groups were investigated using Fourier transform infrared spectroscopy. Scanning electron microscopy was used to observe morphology of the two epoxy resins. The results indicated that OAPS had very good compatibility with DGEBA in molecular level, and could form a transparent DGEBA/OAPS resin. The curing reaction of the DGEBA/OAPS prepolymer could occur under low temperatures compared with DGEBA/DDS. The DGEBA/OAPS resin didn’t exhibit glass transition, but the DGEBA/DDS did, which meant that the large cage structure of OAPS limited the motion of chains between the cross-linking points. Measurements of the contact angle indicated that the DGEBA/OAPS showed larger angles with water than the DGEBA/DDS resin. Thermogravimetric analysis indicated that the incorporation of OAPS into epoxy system resulted in low mass loss rate and high char yield, but its initial decomposition temperature seemed to be lowered.     

高性能脂环族环氧树脂分子设计与合成研究进展

脂环族环氧树脂具有优异的加工性、热稳定性、电绝缘性和耐紫外辐射等综合性能,已经广泛应用于航空航天、微电子封装和电机绝缘等重要工业领域。针对现代工业对高分子材料日益提高的性能和功能化要求,近年来脂环族环氧树脂的合成与性能研究非常活跃。本文综述了新型脂环族环氧树脂的分子设计与合成进展,包括环氧官能度、交联密度和玻璃化温度可...