ion implantation of bismuth into GaP. I. photoluminescence

Photoluminescence from the bismuth isoelectronic trap implanted into GaP is investigated for various ion doses and annealing conditions. A thin coating of silicon oxide is found to be essential to prevent thermal decomposition of the implanted surface during annealing. In isochronal anneal studies the intensity of the Bi luminescence increases rapidly between 650 and 800°C. For 200 keV implants, the dose for maximum luminescence is ～3.5 × 10¹² ions/cm², corresponding to an average concentration of ～10¹⁸/cm³. However, for the optimum dose and anneal, one observes only ～10 per cent of the light intensity expected from the estimated number of substitutional ions, and the emitting ions are situated in lattice sites with strong local strain. This strain is evident in the photoluminescence spectrum by the appearance of a strong no-phonon line which results from an otherwise forbidden transition when strain or an external field are present. The luminescence data are correlated with channeling experiments reported in a companion paper.     

Lattice disorder produced in GaAs by 60 keV Cd ions and 70 keV Zn ions

Abstract

We have used the standard channeling technique with a 1.0 MeV He⁺ analyzing beam to investigate the lattice disorder produced in GaAs by 60 keV Cd and 70 keV Zn ion implantations made at room temperature. The amount of disorder produced increases linearly with dose and saturates at a dose of approximately 1–2 × 10¹³ Cd ions/cm². The disorder present in low dose implants (～5 × 10¹² Cd ions/cm²) anneals appreciably by 150 °C. With increasing doses of Cd or Zn the samples show a continuous increase in the anneal temperature required to remove a substantial amount of lattice disorder. There is no apparent difference between the anneal of Zn and Cd implants. The rate at which lattice disorder is produced in GaAs by heavy ion implantations and the doses of heavy ions required to saturate the lattice disorder observed are significantly different from the values of the corresponding quantities for Si and Ge.     

Nitrogen implantation in GaAs1−xPx (x=0.4; 0.65)

Nitrogen ions were implanted in GaAs_1−xP_x (x=0.4; 0.65) at room temperature at various doses from 5×10¹² cm⁻² to 5×10¹⁵ cm⁻² and annealed at temperatures from 600°C up to 950°C using a sputtered SiO₂ encapsulation to investigate the possibility of creating isoelectronic traps by ion implantation. Photoluminescence and channeling measurements were performed to characterize implanted layers. The effects of damage induced by optically inactive neon ion implantation on photoluminescence spectrum were also investigated. By channeling measurements it was found that damage induced by nitrogen implantation is removed by annealing at 800°C. A nitrogen induced emission intensity comparable to the intensity of band gap emission for unimplanted material was observed for implanted GaAs_0.6P_0.4 after annealing at 850°C, while an enhancement of the emission intensity by a factor of 180 as compared with an unimplanted material was observed for implanted GaAs_0.35P_0.65 after annealing at 950°C. An anomalous diffusion of nitrogen atoms was found for implanted GaAs_0.6P_0.4 after annealing at and above 900°C.     

Lattice site location and electronic structure of Te in GaAs

High purity <100> wafers of GaAs were implanted with radioactive^129mTe and stable¹²⁸Te at 110 keV to total doses of 2×10¹⁴ and 2×10¹⁵ Te/cm² respectively and studied with RBS/ channeling and Mössbauer spectroscopy on the 27.8 keV level of¹²⁹I. After implantation and/or annealing at temperatures between 200–300°C the Mössbauer spectra are dominated by a single line. Channeling reveals an appreciable residual damage in the host lattice, but also points to a substitutional position of the Te atoms. After annealing above ≌500°C, where nearly complete lattice damage recovery is obtained, the Te atoms become defect-associated. The results clearly point to the formation of Te_As?V_Ga complexes.     

Damage and lattice location studies in Hg implanted Hg1–xCdxTe

Abstract

Rutherford backscattering (RBS) and ion induced X-ray (PIXE) channeling experiments have been used to study the damage accompanying Hg and Al implantations into Hg_0.8Cd_0.2 Te and its annealing as well as to determine the location of Hg in the crystal.

The damage induced by the implantation of 300 keV Hg and 250 keV Al ions at room temperature was found from RBS channeling studies to reach a saturation level at doses of 1 × 10¹⁴ cm^?2 and 3 × 10¹⁴ cm^?2 respectively. The damage resembles that characteristic for extended defects and it anneals at ≈ 300°C.

The location of the constituents of Hg implanted Hg_0.8 Cd_0.2 Te was studied by PIXE channeling observing the characteristic X-rays for each element. Angular scans indicate that the channels are mostly blocked by Hg atoms for both unannealed and, to a lesser extent, annealed crystals. This observation supports the suggestion that interstitial Hg atoms may be responsible for the conductivity of Hg implanted Hg_1–x Cd_g Te.     

Simulation of diffusion instability of a mercury atomic distribution in the cadmium-mercury-tellurium alloy

The formation of inhomogeneities in Cd_xHg_1-x Te alloys upon post-growth cooling or upon low-temperature annealing is simulated numerically. The mechanism of the formation of inhomogeneities is based on the diffusion instability in a system involving mercury atoms located at lattice sites, interstitial mercury atoms, and cation vacancies. It is revealed that, upon prolonged annealing of the Cd_xHg_1-x Te alloys with a cadmium content x = 0.2 at a temperature of ∼200°C, the concentrations of mercury atoms at lattice sites, interstitial mercury atoms, and vacancies are characterized by an inhomogeneous nearly periodical distribution arising from a small fluctuation when the initial equilibrium concentration of interstitial mercury atoms exceeds a threshold value (∼3 × 10¹⁷ cm⁻³). The spatial and time scales of the concentration distribution are determined primarily by the equilibrium concentration of vacancies and do not depend on the type of fluctuation involved. The spatial period of the concentration distribution increases linearly from 0.01 to 3.00 μm as the equilibrium concentration of vacancies changes from 10¹⁹ to 10¹⁴ cm⁻³. At lower concentrations of vacancies, the periodic structure is formed for a considerably longer time.     

Beam transport

Abstract

Dopant distribution, electrical activity and damage annealing of high-dose (～5 × 10¹⁵ cm²) Ga-implanted silicon samples annealed by conventional thermal annealing have been studied by alpha particle back-scattering, differential Hall effect and ellipsometry measurements. Back-scattering spectra show that there is no long tail of Ga atoms in the as-implanted samples. Upon annealing these samples the damaged amorphous layer recrystallizes at about 570°C by solid phase epitaxy. During the epitaxial regrowth the dopant atom distribution seems to be modified. Further, very high levels of electrical activaton of Ga-atoms (～3 × 10²⁰ cm^?3), much higher than the maximum solubility limit of Ga in Si (4.5 × 10¹⁹ cm^?3), is achieved by thermal annealing of the sample at ～570°C. This is comparable to the doping achieved by laser annealing of the Ga implanted Si. All the above three measurements show that there is residual damage in the high dose (?10¹⁵cm^?2) implanted samples after the recrystallization at about 570°C. This may be related to strain in the lattice at the high concentrations of metastable substitutional Ga atoms. Annealing at higher temperature reduces the electrical activity of Ga atoms, possibly by driving out the metastably high substitutional concentrations of Ga-atoms into electrically inactive clusters or precipitates.     

Ionic conductivity of Li4−2xMgxSiO4

Solid solutions Li_4−2xMg_xSiO₄ in the system Li₄SiO₄Mg₂SiO₄ were prepared at 1000°C. The single phase region extended up to x=0.5. The conductivity is much higher than that of the end member Li₄SiO₄, and passes through a maximum at Li_3.2Mg_0.4SiO₄ with values of 2.3 × 10⁻⁵ S cm⁻¹ at 200°C, rising to 1.5 × 10⁻² S cm⁻¹ at 400°C. The solid solutions are easy to prepare, are stable in air, and retain their conductivity over a long period of time.     

CW CO2-laser annealing of arsenic implanted silicon

CW CO₂-laser annealing of arsenic implanted silicon was investigated in comparison with thermal annealing. Ion channeling, ellipsometry, and Hall effect measurements were performed to characterize the annealed layers and a correlation among the different methods was made. The laser annealing was done with power densities of 100 to 640 W cm⁻² for 1 to 20 s. It was found that the lattice disorder produced during implantation can be completely annealed out by laser annealing with a power density of 500 W cm⁻² and the arsenic atoms are brought on lattice sites up to 96±2%. The maximum sheet carrier concentration of 6×10¹⁵ cm⁻² was obtained for 1×10¹⁶ cm⁻² implantation after laser annealing, which was up to 33% higher than that after thermal annealing at 600 to 900°C for 30 min.     

Lattice location and dopant behavior of group II and VI elements implanted in silicon

Outdiffusion, lattice location and electrical behavior of Zn, Cd, Hg and Se, Te implanted into silicon at 50 keV were investigated by backscattering and channeling effect of 1 MeV He⁺ ions and by Hall effect and sheet resistivity measurements. All the species exhibited outdiffusion with thermal processing. A significant fraction of Zn, Cd and Hg, when implanted into a substrate of 350°C, occupied regular interstitial lattice sites, while 50–60 per cent of the Se and Te atoms were on substitutional lattice sites. Selenium implanted at room temperature and mercury implanted into a substrate of 350°C exhibited depth dependent lattice location. The implanted layers showed n-type behavior: the maximum value of number of carriers/cm² was less than the number of implanted ions/cm² in all cases. The highest electrical activity was observed for Se corresponding to 25 per cent of the substitutional component.     

Mg+注入对GaN晶体辐射损伤的研究

在蓝宝石衬底上通过金属有机物化学气相沉积(metal-organic chemical vapor deposition，MOCVD)方法外延生长的GaN薄膜具有良好的结晶品质，χ_min达到2.00%. 结合卢瑟福背散射/沟道(Rutherford backscattering/channeling，RBS/C)和高分辨X射线衍射(high-resolution X-ray diffraction，HXRD)的实验测量，研究了不同剂量和不同角度Mg⁺注入GaN所造成的辐射损伤. 实验结果表明，随注入剂量的增大，晶体的辐射损伤也增大，注入剂量在1×10¹⁵atom/cm²以下，χ_min小于4.78%，1×10¹⁶atom/cm²是Mg⁺注入GaN的剂量阈值，超过这个阈值，结晶品质急剧变差，χ_min达到29.5%；随机注入比沟道注入的辐射损伤大，且在一定范围内随注入角度的增大，损伤也增大，在4×10¹⁵atom/cm²剂量下偏离〈0001〉沟道0°，4°，6°，9°时的χ_min(%)分别为6.28，8.46，10.06，10.85；经过700℃/10min+1050℃/20s两步退火和1000℃/30s高温快速退火后，晶体的辐射损伤都有一定程度的恢复，而且1000℃/30s高温快速退火的效果更好，晶体的辐射损伤可以得到更好的恢复. 关键词： GaN 卢瑟福被散射/沟道 高分辨X射线衍射 辐射损伤     

Radiation enhanced diffusion in UO2 and (U,Pu)O2

Abstract

The radiation enhanced diffusion (coefficient D*) of U-233 and Pu-238 in UO₂ and (U, Pu)O₂ with 2.5 and 15% Pu was measured during fission in a nuclear reactor. Normal diffusion sandwiches with a thin tracer layer were used. A radio-frequency furnace allowed the temperatures to be varied between 130 and 1400°. Neutron fluxes (7 × 10¹² to 1.2 × 10¹⁴ n cm^?2 s^?1) and irradiation times (56 to 334 h) were also varied to cover ranges of fission rates [Fdot] between 7× 10¹¹ and 6.4 × 10¹³ f cm^?3 s^?1 and of doses F between 4.2 × 10¹⁷ and 3.1 × 10¹⁹ f cm³. Below ～1000°, D* was completely athermal and increased linearly with [Fdot]. It was described by D* = A[Fdot] with A = 1.2× 10^?29cm⁵. A possible temperature dependence was indicated between ～1000and 1200°. The results are explained in terms of thermal and pressure effects of fission spikes and are related with other studies of radiation damage as well as with technologically interesting processes occurring in UO₂ during irradiation.     

Absolute cross sections for collision-induced depolarized scattering of light in krypton and xenon

Depolarized Raman spectra of binary collisional pairs of atoms in krypton and xenon are obtained at gas densities of 1–10 amagat. Absolute intensities relative to a known rotational transition of nitrogen are determined. For light of 4880 Å wavelength incident in the x-direction, polarized in the z-direction and scattered in the y-direction of a cartesian frame x, y, z, at a frequency shift of -12 cm^-1, the differential scattering cross section per unit wavenumber band times volume, is found to be 1·10 × 10^-52 cm⁶ ± 10 per cent for krypton, and 4·76 × 10^-52 cm⁶ ± 10 per cent for xenon, if the sum of both polarizations is considered. Wave-mechanical and classical computations reproduce both the shape and the intensity of the experimental spectra if the so-called point-dipole model of the anisotropy of the polarizability of collisional pairs of atoms is used. Other models of the anisotropy are seen to be overcorrected by these criteria.     

The study of damage and optical properties in LiNbO3 implanted by MeV Er and He ions

Abstract

Two LiNbO₃ (X and Y cut) crystals from different companies were implanted by 3.0 MeV Er ions to a dose of 7.5 × 10¹⁴ ions/cm² and 3.5 × 10¹⁴ ions/cm² with different beam current densities, respectively. After annealing at 1060°C in air for 2 hours, one LiNbO₃ sample was implanted by 1.5 MeV He ions to a dose of 1.5 × 10¹⁶ ions/cm². The Rutherford backscattering/channeling and prism coupling method have been used to study the damage and optical properties in implanted LiNbO₃. The results show: (1) the damage in LiNbO₃ created by 3.0 MeV Er ions depends strongly on the beam current density; (2) after annealing at 1060°C in air for 2 hours, a good Er doped LiNbO₃ crystal was obtained; (3) there is waveguide formation possible in this Er-doped annealed LiNbO₃ after 1.5 MeV He ion implantation. It is suggested that annealing is needed to remove the damage created by MeV Er ions before the MeV He ion implantation takes place, to realize the waveguide laser for Er doped LiNbO₃.     

Ionic conductivity of Zr1−xIn2xO2−x

As x in Zr(In)O_2?x is increased from 0.08 to 0.16 (9–19 mole per cent In₂O₃) the activation energy E(x) for ionic conduction increases from 1.05 to 1.51 eV; the concuctivity decreases from 2 × 10^?5 to 3 × 10^?6Ω^?1cm^?1at 400°C, is composition-independent at about 580°C, and increases from 1 × 10^?2 to 4 × 10^?2Ω^?1cm^?1 at 800°C. The pre-exponential term of the Boltzmann-type conductivity equation depends exponentially on E(x), a much stronger dependence on x than theoretically expected with a model for ionic conductivity that includes nearest-neighbor defect interactions. Analysis of reported conductivity data for Zr(M)O_2?x (M = Sc, Y, Ca and rare earth metals) and other doped oxide electrolytes with fluorite-type structure reveals that the same relationship is observed with these materials when x γ0.08. It is shown that ionic conduction in these oxides is consistent with nearest neighbor vacancy-cation defect interaction forx < 0.08 but that an additional complex interaction with composition-dependent free energy ΔG(x) occurs when xγ 0.08.The lattice constant of Zr(In)O_2?x with the cubic fluorite-type structure is independent of composition, 5.114 ± 0.002 Å, in agreement with ionic size considerations.     

Ion bombardment induced phase transformations and inert gas mobility in the semiconductors Ge,Si, and GaAs

Abstract

The present study contributes some new aspects to the general understanding of the ion implantation behaviour of 3 common semiconductor materials, and of diffusion processes in these materials. Single crystals of Si, Ge, and GaAs were bombarded with Kr- or Xe-ions at energies of 40 or 500 keV and doses between 10¹¹ and 2 × 10¹⁶ ions/cm². Gas release measurements and Rutherford scattering of 1 MeV He⁺-ions combined with channeling were used to study bombardment damage (amorphization) and inert gas diffusion. At low bombardment doses (10¹¹ ions/cm²) and energy (40 keV), no damage was observed and the gas release was compatible with volume diffusion resembling Group I and VIII behaviour. Hence, the pre-exponential terms, D ₀, were low (range 10-^5±1 cm² sec^?1) and the activation enthalpies, Δ H, were much lower than those of self-diffusion or of diffusion of Group III and V elements. The Δ H's for gas diffusion followed the relation Δ H = (1.05±0.1) × 10^?3 T_m eV with the melting point, T_m , in °K. The mechanism of gas mobility might be the Turnbull dissociative mechanism. Rutherford scattering and channeling data indicated that part of the gas occupied lattice sites.

At higher doses, the bombarded layers turned amorphous. Channeling experiments showed a coincidence in temperatures for a gas release process different from the above one of volume diffusion, and recrystallization of the disordered layer to the single crystalline state. Both processes occurred in the temperature range 0.60 to 0.65 T_m . The gas release indicated a (partial) single jump character with implied Δ H's following the relation Δ H = (2.1±0.1) × 10^?3 T_m eV. Contrary to previous results on oxides, this new gas release occurred at temperatures near to those or even above those of volume diffusion of the gas.

Due to the easy formation of an amorphous layer it was difficult to observe the retarded release (trapping of gas) that has been found in many materials at high gas and damage concentrations. However, in a separate series of experiments with 500 keV Kr-ions, a release retarded with respect to volume diffusion of the gas was observed in Si and Ge.     

Annealing characteristics of highly doped ion implanted phosphorus layers in silicon

A combination of sheet resistance, stripping and Hall effect measurements have been made on phosphorus layers implanted into silicon at 40 and 100 keV with doses between 1 × 10¹⁵ and 5 × 10¹⁶ atoms/cm². The implants were made at room temperature and 450°C. After annealing at 650°C, the profile of electrically active phosphorus following a high dose room temperature implant, was found to be flat topped with a concentration of approximately 5 × 10²⁰/cm³. Very little diffusion occurred when annealing to 850°C where the free electron concentration increased to approximately 1.5 × 10²¹/cm³. Highly doped channeled tails were found when implanting at 450°C along the 〈110〉 direction and damage was being continuously annealed out preventing the formation of an amorphous phase. The rapid diffusion of the profile into the bulk found when annealing between 650°C and 850°C was speculated to be due to the presence of a dense dislocation entanglement in these layers following a hot implant.     

Analysis of ion implanted diamond

Ion implantation allows controlled introduction of impurities into diamond. A basic problem is to determine if the implanted layers are dominated by substitutional doping or radiation damage effects. Optical and electrical measurements on the implanted diamonds revealed (1) a degradation of the band-gap and sample coloration, (2) no optical absorption levels which would be characteristic of hydrogenic ionization levels, (3) resistivity activation energies of 0.2 to 0.3 eV independent of the ion specie, and (4) no measurable Hall Effect.

Phosphorous implanted layers in diamond were analyzed by means of the channeling technique. It was shown that (1) the diamond retained the implanted phosphorous atoms during a vacuum anneal at 950°C which restored crystalline order, (2) the implanted phosphorous atoms did not assume either substitutional or tetrahedral interstitial sites, (3) the measured projected range for 70 keV phosphorous in diamond of 450 ± 115 Å was consistent with theoretical range calculations and (4) a stable monolayer of oxygen atoms (5.5 × 10¹⁵/cm²) exists on the {111} surface of implanted and annealed diamond. The results of the crystal analysis show that these electrical and optical properties are dominated by radiation damage and not substitutional doping mechanisms.     

Implantation doping of germanium with Sb,As, and P

The ions of Sb, As, and P have been implanted into germanium at energies ranging from 200 keV to 700 keV. Annealing was performed at 400°C, 550°C, and 650°C. The doping profile was determined by differentialCV-measurements. Strong outdiffusion (80%) and diffusion into the bulk material was observed after annealing. The remaining doping concentration and the diffusion constants were determined by a computer fit at 650°C. We foundD _Sb=1.8×10⁻¹³ cm²/s,D _As=9×10⁻¹⁴ cm²/s andD _P=4×10⁻¹⁴ cm²/s. Lower values of the diffusion constant were determined when the samples were covered with a SiO₂ layer.     

The GaP(001) surface and the adsorption of Cs

GaP(001) cleaned by argon-ion bombardment and annealed at 500°C showed the Ga-stabilized GaP(001)(4 × 2) structure. Only treatment in 10^?5 Torr PH₃ at 500°C gave the P-stabilized GaP(001)(1 × 2) structure. The AES peak ratio $\text{P}\text{Ga}$ is 2 for the (4 × 2) and 3.5 for the (1 × 2) structure. Cs adsorbs with a sticking probability of unity up to 5 × 10¹⁴ Cs atoms cm^?2 and a lower one at higher coverages. The photoemission measured with uv light of 3660 Å showed a maximum at the coverage of 5 × 10¹⁴ atoms cm^?2. Cs adsorbs amorphously at room temperature, but heat treatment gives ordered structures, which are thought to be reconstructed GaP(001) structures induced by Cs. The LEED patterns showed the GaP(001)(1 × 2) Cs structure formed at 180°C for 10 h with a Cs coverage of 5 × 10¹⁴ atoms cm^?2, the GaP(001)(1 × 4) Cs formed at 210°C for 10 hours with a Cs coverage of 2.7 × 10¹⁴ atoms cm^?2, the GaP(001)(7 × 1) and the high temperature GaP(001)(1 × 4), the latter two with very low Cs content. Desorption measurements show three stability regions: (a) between 25–150°C for coverages greater than 5 × 10¹⁴ atoms cm^?2, and an activation energy of 1.2 eV; (b) between 180–200°C with a coverage of 5 × 10¹⁴ atoms cm^?2, and an activation energy of 1.8 eV; (c) between 210–400°C with a coverage of 2.7 × 10¹⁴ atoms cm^?2, and an activation energy of 2.5 eV.