Electrical properties of Cd,Zn and S ion-implanted layers in GaAs

The electrical properties of cadmium, zinc, and sulfur ion-implanted layers in gallium arsenide have been measured by the van der Pauw-Hall technique. Ion implantation was performed with the substrates held at room temperature. The dependence of sheet resistivity, surface carrier concentration, and mobility on ion dose and on post-implantation anneal temperature was determined. In the case of 60 keV Cd⁺ ions implanted into n-type substrates, a measurable p-type layer resulted when samples were annealed for 10 minutes at a temperature in the range 600—900°C. After annealing at 300—900°C for 10 minutes, 100 per cent electrical activity of the Cd ions resulted for ion doses ≤ 10¹⁴/cm².

The properties of p-type layers produced by implantation of 85 keV Zn⁺ ions were similar to those of the 60 keV cadmium-implanted layers, in that no measurable p-type behavior was observed in samples annealed below a relatively high temperature. However, in samples implanted with 20 keV Zn⁺ ions a p-type layer was observed after annealing for 10 minutes at temperatures as low as 300°C.

Implantation of sulfur ions into p-type GaAs substrates at room temperature resulted in the formation of a high resistivity n-type layer, evcn before any annealing was performed. Annealing at temperatures up to 200°C or above 600°C lowered the resistivity of the layer, while annealing in the range 300—500°C eliminated the n-type layer.     

Electrically active defect annealing in neutron and in ion-damaged Si

Hall effect and electrical conductivity measurements of defect annealing in 1 ohm-cm n-type and 2 ohm-cm p-type silicon were made following neutron irradiation at ～50°C. Measurements were also made following 400-keV B¹¹ ion implantation into a 100 ohm-cm n-type Si substrate. As the neutron fluence is increased the electrical effects of the damage eventually outweigh those of the chemical dopants, and further changes in the electrical properties become small. Conversely, significant electrical recovery upon annealing begins only when the electrical effects of the remaining damage become comparable to those of the chemical dopants. This condition will occur at higher anneal temperatures for higher fluence irradiations. The neutron fluence dependence of the damage and the annealing is interpreted in terms of the neutron energy per cm³. E, spent in atomic processes divided by the number/cm³, N, of electrically active dopants. When E/N ≤ 0.5 keV the electrical measurements show that the predominant defect annealing occurs below 400°C. However, when E/N > 0.5 keV electrical measurements emphasize the annealing at temperatures > 400°C. After 500°C annealing, energy levels in neutron damaged Si are observed at E_v +0.1 and E_v +0.15 eV in p-type and at E_c -0.33 eV in n-type Si. Application of the E/N criteria to room temperature implant-doped Si predicts that the electrical effects will be dominated by lattice damage even if all the implanted ions are substitutional.     

The 220°K defect in electron irradiated p-Type Germanium

Lattice defects introduced in p-type nondegenerate germanium by 1.5 MeV electron irradiation at liquid nitrogen temperature was investigated by means of electrical resistivity and Hall coefficient measurements. The annealing behavior of two kinds of defects, which anneal at about 220 °K, was investigated in detail. Each of them has an electron trap. Making use of trap-filling and emptying processes, the 220 °K defects are separated from other defects.     

Ion implantation of zinc sulphide

The passivation of argon sputter-etch induced electrically active defects on Ge, Si, and GaAs surfaces by reaction with atomic hydrogen has been observed using deep level transient spectroscopy. A broad band of defect states, giving rise to non-linear Arrhenius plots, appears to be associated with the induced damage centres. For n-type Ge and p-type Si, a 20-min exposure to atomic hydrogen at 180°C is shown to neutralize the damage created by a 5-min, 6 kV (DC), Ar gas sputter-etch. For n-type GaAs a 1-h exposure at 250°C was sufficient, whilst n-type Si required a 1-h exposure to the hydrogen plasma at 300°C to passivate the damage. In each case, to remove the sputter-etch damage by thermal annealing required temperatures approximately 100°C higher, for periods of approximately 2 h.     

Radiation hardening in Zircaloy-2

Annealed Zircaloy-2 was exposed to fast neutron fluences in the range 0.46 to 6.71 × 10¹⁹ nvt, E > 1 MeV, at temperatures of up to 450°C. The level of radiation hardening, as measured by the change in yield stress after irradiation, increased with irradiation temperature at least up to 380°C.

Post-irradiation annealing treatments showed that radiation anneal hardening occurred after irradiation at temperatures up to 325°C. After irradiation at 375°C, annealing treatments did not produce a further increase in the yield stress above that produced by the irradiation, however the radiation hardening persisted to 450°C. The uniform strain tended to decrease as the amount of radiation anneal hardening increased and as the fast neutron fluence increased above ～5 × 10¹⁸ nvt, E > 1 MeV.

The effects of irradiation temperature and post-irradiation annealing on the yield stress and on uniform strain are explained in terms of the strengthening of radiation damage defect clusters and their increased effectiveness to impede dislocation movement.     

Ion implantation of Zn,Se and Cd in BP crystals

Ion implantation of 70 keV Zn, Se and Cd has been done in n-type BP as a function of dose and implantation temperature, and defects and lattice locations have been measured by means of channeling techniques. Crystals used were grown on Si substrates by vapor phase epitaxy. It was observed that epitaxial layers thicker than 6μm have no defects due to a lattice mismatch between Si and BP. High temperature implantation above 500°C gave high substitutional fraction of ～ 70% and low residual defects. Reordering of an amorphous layer formed by implantation below 400°C was not observed even after annealing at 900°C. The present results indicate that the effect of implantation temperature is the same with other III-V compounds such as GaAs and Gap.     

The vacancy-interstitial pair in electron irradiated germanium

We have studied the influence of the nature and concentration of donor impurity on the 65°K and 35°K stages in electron irradiated n-type germanium. Because the nature of the impurity does not influence the 65°K stage and because this stage is present alone in lightly doped samples, we confirm that it is associated with the annihilation of a vacancy-interstitial pair. Because the 35°K stage is directly connected to the impurity concentration, and not to the free electron concentration, we conclude that it is associated with the annihilation of a vacancy and interstitial-impurity pair. We have shown that the annihilation of the vacancy-interstitial pair occurs through the interstitial mobility at 65°K, 27°K and 4.5°K depending on its charge state, and that the interstitial-impurity mobility occurs at 35°K.

Our model explains easily the radiation annealing, the behavior of irradiated p-type germanium and can be extended to the case of indium antimonide and perhaps of silicon.     

Defects with deep levels induced by plastic deformation and electron irradiation in El2-free GaAs

Abstract

Defects with deep electronic energy levels induced by electron irradiation at room temperature or plastic deformation at 450°C in GaAs in which grown-in EL2 defects are previously eliminated by heat-treatment are investigated by means of measurements of the optical absorption and the Hall effect. Thermal stabilities of the induced defects are studied by tracing the changes mainly in the absorption specturm due to isochronal annealing. The absorptions both in deformed and irradiated specimens are mostly photo-unquenchable. Therefore, the defects induced by above two procedures are identified not to be EL2. Semi-insulating or n-type specimens convert to p-type by plastic deformation or electron irradiation, showing that high densities of acceptors are generated by the above two procedures.     

Low temperature photoconductivity in electron - irradiated p-type Si

The photoconductivity spectra of p-type silicon irradiated at ～15 °K with 1.2 MeV electrons were studied in the wavelength range from 1.2 to 5.5 μ at temperatures from 23 to 80 °K. The 3.9 μ photoconductivity band appears immediately after irradiation in all crystals already at low temperatures, giving further evidence that it is due to the divacancy formed directly during irradiation by electrons. Three main annealing stages of the photoconductivity have been observed; (a) below 160 °K, (b) 160–250 °K, and (c) 280–360 °K. A radiation-induced deep level at E_v , +(0.12±0.02 eV disappears upon annealing at stage b. The annealing behavior of the spectra depends strongly on the measuring temperature. The dependence of the spectra on chopper speed was also investigated.     

The Effects of Thermal Treatments on Microstructure Phosphorus-Doped ZnO Layers Grown by Thermal Evaporation

The ZnO films doped with 3 wt% phosphorus (P) were produced by activating phosphorus doped ZnO (ZnO:P) thin films in oxygen (O₂) ambient at 600°C for 30, 60, 90 and 120 min, respectively. As-deposited films doped with phosphorus are highly conductive and n type. All the films showed p-type conduction after annealing, in an O₂ ambient atmosphere. The activation energies of the phosphorus dopant in the p-type ZnO under O₂ ambient gases indicate that phosphorus substitution on the O site yielded a deep level in the gap. With a further increase of the annealed durations, the crystalline quality of the ZnO:P sample is degraded. The best p-type ZnO:P film deposited at 600°C for 30 min shows a resistivity of 1.85 Ω cm and a relatively high hole concentration of 5.1 × 10¹⁷cm^–3 at room temperature. The films exhibit a polycrystalline hexagonal wurtzite structure without preferred orientation. The mean grain sizes are calculated to be about 60, 72, 78, 85 and 90 nm for the p-type ZnO films prepared at 600°C for 30, 60, 90 and 120 min, respectively. Room temperature photoluminescence (PL) spectra of the ZnO film exhibit two emission bands — paramount excitonic ultraviolet (UV) emission and weak deep level visible emission. The excellent emission from the film annealed at 600°C for 30 min is attributed to the good crystalline quality of the p-type ZnO film and the low rate of formation of intrinsic defects at such short duration. The visible emission consists of two components in the green range.     

Annealing characteristics of highly doped ion implanted phosphorus layers in silicon

A combination of sheet resistance, stripping and Hall effect measurements have been made on phosphorus layers implanted into silicon at 40 and 100 keV with doses between 1 × 10¹⁵ and 5 × 10¹⁶ atoms/cm². The implants were made at room temperature and 450°C. After annealing at 650°C, the profile of electrically active phosphorus following a high dose room temperature implant, was found to be flat topped with a concentration of approximately 5 × 10²⁰/cm³. Very little diffusion occurred when annealing to 850°C where the free electron concentration increased to approximately 1.5 × 10²¹/cm³. Highly doped channeled tails were found when implanting at 450°C along the 〈110〉 direction and damage was being continuously annealed out preventing the formation of an amorphous phase. The rapid diffusion of the profile into the bulk found when annealing between 650°C and 850°C was speculated to be due to the presence of a dense dislocation entanglement in these layers following a hot implant.     

Hot electron studies of lattice damage created in silicon by implantation of 2.8 MeV protons

Abstract

In this paper we report the results of a study of the annealing properties of the ionized defect density associated with the damage created in the silicon lattice by implantation of 2.8 MeV protons at room temperature. In particular, the annealing of damage created by implanting to a level of 4.43 × 10¹² protons/cm² is reported. The resulting isochronal annealing curve covered the temperature range from 70°C to 460°C. Two major annealing stages are discussed, one a broad stage between 70°C to 200°C and the other an abrupt annealing stage between 440°C to 460°C. Between the temperature range 200°C to 440°C the number of ionized defects remained relatively constant. Above 460°C no detectable effects of the proton implantation remained.     

Low energy boron and phosphorus implants in silicon (a) electrical sheet measurements

Silicon wafers were implanted in 〈111〉-direction with boron and phosphorus ions of 7 keV at room temperature. Doses between 10¹² and 10¹⁸ ions/cm² were applied. After successive annealing steps the electrical properties of the implanted layers have been determined by Hall effect and sheet resistivity measurements. The annealing characteristics of the implants depend on ion dose and species. Three annealing stages can be distinguished: (I) the temperature range below 500°C, (II) 500—700°C, (III) 700—900°C.

After annealing at 90°C the apparent electrical yield is proportional to dose for all implants and amounts to approx. 80 per cent for boron and 40 per cent for phosphorus.

Sheet resistivity vs. dose curves were derived for the annealing temperature of 400°C and used for the fabrication of position sensitive detectors. The position characteristics were found to be linear within ～1 per cent for resistive layers as long as 20 cm.     

Annealing of γ-ray irradiated lithium compensated p-type silicon

Abstract

Annealing behavior of electrical properties and photoluminescence spectra both at 77 °K in electron-irradiated melt-grown n-GaAs were investigated. Defects electrically active in the Hall mobility and carrier removal anneal through two stages centered at 250° and 460 °K. From the temperature dependence of carrier concentration the existence of a defect level located near 0.15 eV below the conduction band is supposed. Several emission bands are resolved at 1.51, 1.47, 1.415, 1.305 and ～1.2 eV in photoluminescence experiments. Electron irradiation (1.5–2.0 MeV) causes a remarkable decrease in emission intensity of 1.51 and ～1.2 eV bands. Recovery of emission intensity occurs remarkably when samples are annealed to 520 °K which would correspond to the 460 °K annealing stage for carrier concentration and Hall mobility. The 250 °K annealing stage is not observed in photoluminescence experiments. The 1.415 eV peak appears clearly after irradiation and grows remarkably with the 520 °K annealing, especially in Si-doped samples, resulting in large reverse annealing. This band is tentatively speculated to be a complex of Si on As site with As vacancy. Moreover, in samples doped with Te a new emission band at 1.305 eV (9500 Å) is observed after 470°–620 °K annealing.     

Preferential etching of ion bombarded GaAs

Abrupt changes in the near-band-edge luminescence of n-type undoped GaAs after implantation with 400 keV Zn ions and vacuum annealing at 580°C are reported. The good agreement of the spectral position, half-width and temperature dependence of the emission obtained after implantation and annealing with that of melt-doped GaAs: Zn indicates that implanted Zn ions have been incorporated at Ga lattice sites. The larger number of Zn substitutions obtained when bombardment is made on the Ga face than for an equivalent fluence on the As face demonstrates the existence of a polar implant effect.     

Properties of erbium silicate doped with chromium in porous silicon

The possible formation of chromium-doped erbium silicate Er₂SiO₅: Cr in thin layers of porous silicon is demonstrated. This paper reports on studies of the photoluminescence, electron paramagnetic resonance, and transverse current transport in porous silicon layers (with different chromium and erbium contents) grown on n-and p-silicon single crystals heavily doped with shallow impurities. The Er₂SiO₅: Cr phase with the photoluminescence maxima at approximately 1.3 and 1.5 μm manifests itself after high-temperature annealing at 1000°C. The introduction of erbium and annealing at 700°C increase the intensity of the red photoluminescence of porous silicon by several factors. The decrease in the electrical conductivity of porous silicon suggests the onset of the formation of erbium silicate. The current-voltage characteristics exhibit a nonlinear behavior with an exponential dependence of the current on the voltage due to the discrete electron tunneling. An electron paramagnetic resonance spectrum of P _b centers in p-type heavily doped silicon is observed for the first time.     

Kinetics of ß-phase transformation in the heat treatment of FeSi2- and Fe2Si5-based thermoelectric alloys

FeSi₂- and Fe₂Si₅-based thermoelectric alloys have been fabricated by melt spinning and levitation melting. It was found that the levitation-melted FeSi₂-based alloy must be annealed at 800°C for 10 h to complete transformation of the β phase, while an anneal for only 6 h was needed for the melt-spun alloy. On the other hand, annealing the levitation-melted Fe₂Si₅-based alloy for 4 h was enough to complete β-phase formation, whereas 14 h was required for the melt-spun alloy. Annealing temperature dependence of the Seebeck coefficient showed that the maximum rate of transformation to β phase occurred at about 800°C for all samples. Application of the Johnson-Mehl-Avrami equation revealed that grain-boundary nucleation was predominant in the levitation-melted FeSi₂-based alloy (time exponent n = 1.1), while the zero nucleation mechanism was operative in the melt-spun alloy (n = 3.1). For the eutectoid reactions in the Fe₂Si₅-based alloys, several kinds of nucleation site were active. However, nuclei formed at grain edges were dominant in the melt-spun alloy since n = 1.6.     

Gettering of implanted Au in MeV?C implanted Si

The gettering behavior of 1 MeV?C implantation induced defects for Au (1.5 MeV, 2.2×10¹⁵ cm^-2), implanted into FZ Si(111), has been investigated using Rutherford backscattering spectrometry and cross-sectional transmission electron microscopy. The gettering efficiency of the C implanted layer has been studied as a function of C dose, annealing temperature and time. For a C dose of 2×10¹⁶ cm^-2, a 2 h anneal at 950 °C has been found to result in a gettering efficiency going beyond ?90%. Thermal stability of the gettered Au in the C implanted layer has subsequently been investigated over a temperature range of 950–1150 °C using isochronal annealing. The gettered amount has been found to be stable up to 1050 °C beyond which there is a release. We have observed nanovoids in the C implanted layer surrounded by ?-SiC precipitates along with patches of a-SiC. Up to about 1050 °C, these nanovoids act as efficient gettering centers beyond which they seem to release the trapped Au. Four distinct regimes in annealing temperature with different mechanisms for Au gettering have been observed.     

Ultrasonic investigations of N- (p-n-pentyloxybenzylidene) p-n-butylaniline

The ultrasonic velocity in N-(p-n-pentyloxybenzylidene) p-n-butylaniline is measured as a function of temperature from the isotropic liquid phase to the smectic G phase. A mixed smectic phase (S_AG) for a temperature interval of 2°C is reported. The derived parameters such as adiabatic compressibility (β_ad). Rao number (R_n) and molar compressibility (B) are also reported.     

Defect and photoluminescence profiles from thermally converted Cr-doped GaAs

Specimens of Cr-doped semi-insulating (SI) GaAs have been annealed in quartz ampoules under vacuum at elevated temperatures. Some samples, depending on temperature and time of anneal, were partially or wholly converted to p-type. In these cases CV measurements have been combined with serial sectioning to produce carrier concentration profiles. The As overpressure dependencies indicate acceptors to be associated with Ga vacancies. The diffusion coefficient of the Ga vacancies was estimated to be about 3.35 × 10^-14cm²sec^-1 at 950°C. Low temperature photoluminescence on the converted samples show a reasonably good correspondence between carrier distribution profile and the intensity of copper luminescence peak on photoluminescence spectra taken at various depth in the crystals.