Modification of Ti foils irradiated by intense heavy ion beams

ABSTRACT

Modification of Ti foils irradiated by intense energetic heavy ion (HI) beams in long-term experiments has been considered. The experiments on the synthesis of superheavy nuclei, which are carried out in Dubna with a gas-filled recoil separator (DGFRS), determine the conditions of such experiments. High intensities of HIs passing through a relatively small area and thickness of the foils, as well as their heating by a beam, are inherent in such experiments. The ability of the foils to withstand radiation damages, sputtering, and evaporation of atoms becomes questionable. All the processes seem to be dependent on temperature, and none of them is independent of the others, but they can be considered separately. In this work, sputtering yields are estimated on the grounds of available models and experimental data and compared with the results of measurements carried out to verify the estimates. The foil temperature, in turn, can be estimated in the conditions of pulse heating followed by subsequent cooling with radiation emitted from their surfaces. These conditions correspond to the rotating Ti entrance window irradiated by a continuous HI beam in the DGFRS experiments.     

FeCl+轰击Ag靶的溅射产额非线性增强效应

报道了用FeCl⁺、⁵⁶Fe⁺和³⁵Cl⁺轰击Ag靶的溅射原子角分布和产额测量结果.发现FeCl⁺轰击Ag的原子溅射产额与⁵⁶Fe⁺和³⁵Cl⁺轰击的溅射产额之和相比有大的增强.这种溅射产额增强现象可以用热峰蒸发(thermal spike-evaporation)加上表面拓扑效应(surface topography effect)的理论模型进行解释.     

Preferential sputtering of oxides: A comparison of model predictions with experimental data

Experimental data on the composition of the altered layer of some oxides bombarded with noble gas ions are compared with different model predictions based on Sigmund's sputtering theory. It is shown that although the difference in mass of the metal atoms is the dominant factor in the preferential sputtering of oxygen, the additional consideration of the surface binding energies yields an improved agreement between theory and experiment.     

Extremely low-energy projectiles for SIMS using size-selected gas cluster ions

A new cluster time-of-flight secondary ion mass spectrometry (TOF-SIMS) was developed using a size-selected gas cluster ion as a projectile. Since a large gas cluster ion can generate many low-energy constituent atoms in a collision with the surface, it causes multiple and ultra low-energy sputtering. The mean kinetic energy of constituent atoms is provided by dividing the acceleration energy of the gas cluster ion by the number of constituent atoms. Therefore, the sputtering can be controlled to minimize the decomposition of sample molecules and substrate material by precisely adjusting the number of constituent atoms (the cluster size) and/or acceleration energy of the gas cluster ion. The cluster size was selected on the basis of the time-of-flight method using two ion deflectors attached along the ion-beam line. A high resolution of 11.7 was achieved for the cluster size/size width (M/ΔM) of Ar-cluster ions.     

连续碳纤维增强碳化硅的辐照效应

连续碳纤维增强碳化硅材料除了具有碳化硅材料固有的低中子活化性能,低衰变热性能和低氚渗透性能等优点以外,还具有密度低、线性膨胀系数小、高比强度、高比模量、耐高温、抗氧化、抗蠕变、抗热震、耐化学腐蚀、耐盐雾、优良的电磁波吸收特性等一系列优异性能,是各类核工程重要的潜在候选材料。在核聚变工程应用领域,连续碳纤维增强碳化硅材料作为第一壁材料不可避免地会受到各种辐射粒子的影响。研究清楚这些辐射粒子对它的辐照效应对其在核工程领域的安全使用至关重要。采用蒙特卡罗方法与分子动力学方法进行模拟计算,研究了氕、氘、氚和氦四种粒子对连续碳纤维增强碳化硅的辐照效应。SRIM和LAMMPS计算结果表明:当入射原子能量为100 eV,连续碳纤维增强碳化硅中碳的浓度在80%~85%时,氕、氘、氚和氦原子的溅射率存在最小值;入射粒子的种类对溅射率的影响显著,氦原子的溅射率大于氘原子和氚原子,而氘原子和氚原子的溅射率相差不大但均显著大于氕原子;溅射率随入射能量的增加先迅速增加后逐渐减小,氕、氘、氚和氦原子入射能量分别在200,400,600和800 eV时存在溅射率最大值;当氦原子入射能量为100 eV时,溅射率随入射角度的增加而逐渐减少。这些结果对连续碳纤维增强碳化硅材料在核工程上的应用具有一定的参考意义。Continuous carbon fiber reinforced silicon carbide material has the low neutron activation, low decay heat performance and tritium permeability, which are inherent performance of silicon carbide materials. It also has other advantages such as low density, small linear expansion coefficient, specific strength and specific modulus, high temperature resistance, oxidation resistance, creep resistance, thermal shock, resistance to chemical corrosion, salt fog resistance, excellent electromagnetic wave absorption properties, etc. It is an important potential candidate material in various field of nuclear engineering. In the field of nuclear fusion engineering applications, continuous carbon fiber reinforced silicon carbide as the first wall material will inevitably be bombarded by a variety of radiation particles. The radiation effect is critical to its safe use in nuclear engineering. The Monte Carlo method and the molecular dynamics method were used to study the radiation effect of protium, deuterium, tritium and helium on continuous carbon fiber reinforced silicon carbide. The SRIM and LAMMPS simulation results show that when the incident energy is 100 eV and the concentration of carbon in the continuous carbon fiber reinforced silicon carbide is about 80% ~ 85%, the sputtering yield of protium, deuterium, tritium and helium atoms have the minimum values. The kind of incident particle has a significant effect on the sputtering yield. The sputtering yield of helium atoms is larger than that of tritium atoms and deuterium atoms. There is not much difference between the sputtering yield of deuterium atoms and tritium atoms, and both the sputtering yield of deuterium atoms and tritium atoms are larger than that of protium atoms. The sputtering yield initially increases rapidly with the increase of the incident energy and then decreases gradually. The incident energy of the protium, deuterium, tritium and helium atoms has the maximum value of the sputtering yield at 200, 400, 600 and 800 eV, respectively. When the incident energy of helium atoms is 100 eV, the sputtering yield decreases while the increase of the incident angle. These results can provide a certain reference for the application of continuous carbon fiber reinforced silicon carbide materials in nuclear engineering.     

Anisotropic angular distribution of sputtered atoms

The sputtering yield angular distributions have been calculated on the basis of the ion energy dependence of total sputtering yields for Ni and Mo targets bombarded by low-energy Hg⁺ ions. The calculated curves show excellent agreement with the corresponding Wehner's experimental results of sputtering yield angular distributions. This fact clearly demonstrates the intrinsic relation between the ion energy dependence of total sputtering yields and the sputtering yield angular distribution. This intrinsic relation had been ignored in Yamamura's papers [Yamamura, Y. (1982). Theory of sputtering and comparison to experimental data, Nucl. Instr. and Meth., 194, 515–522; Yamamura, Y. (1981). Contribution of anisotropic velocity distribution of recoil atoms to sputtering yields and angular distributions of sputtered atoms, Rad. Eff., 55, 49–55.] due to some obvious mistakes.     

Low energy sputtering of neutral Cu2 molecules

The ratios of relative yields of neutral sputtered Cu₂ molecules to neutral sputtered Cu atoms were found to be linearly proportional to the sputtering yield of Cu, from a Cu target under bombardment by Ar⁺ ions (energy 50–90 eV), as determined by secondary neutral mass spectrometry.     

Sputtering yields of PMMA films bombarded by keV C60 ions

A quartz crystal microbalance (QCM) has been used to determine total-mass sputtering yields of PMMA films by 1-16 keV C₆₀^+,2+ ion beams. Quantitative sputtering yields for PMMA are presented as mass loss per incident ion Y_m. Mass-lost rate QCM data show that a 13 keV C₆₀ cluster leads to emission equivalent to 800 PMMA molecules per ion. The power law obtained for the increase in sputtering yield with primary ion energy is in good agreement those predicted by “thermal spike” regime and MD models, when crater sizes are used to estimate sputtering.     

Probability of ionization of sputtered particles as a function of their energy: Part I: Negative Si ions

In this study we have investigated how the probability of ionization of sputtered Si atoms to form negative ions depends on the energy of the atoms. We have determined the ionization probability from experimental SIMS energy distributions using a special experimental technique, which included de-convolution of the energy distribution with an instrumental transmission function, found by separate measurements.We found that the ionization probability increases as a power law ∼E^0.677 for particles sputtered with energies of 0-10 eV, then becomes a constant value (within the limits of experimental error) for particles sputtered with energies of 30-100 eV. The energy distributions of Si⁻ ions, measured under argon and cesium ion sputtering, confirmed this radical difference between the yields from low and high-energy ions.To explain these results we have considered ionization mechanisms that are different for the low energy atoms (<10 eV) and for the atoms emitted with higher energy (>30 eV).     

High sputtering yields of organic compounds by large gas cluster ions

We measured the sputtering yield, surface roughness and surface damage of thin leucine films bombarded with Ar cluster ions and examined the usefulness of large gas cluster ions for the depth profiling of organic compounds. Ar cluster ion beams with a mean size of 2000 atoms/cluster and energies from 5 to 30 keV were used. Sputtering yields increased linearly with incident ion energy and were extremely high compared to inorganic materials. Surface damage was investigated by measuring positive secondary ions emitted from the leucine film before and after cluster ion irradiation. After irradiation the leucine surface became smoother. The yield ratio of protonated leucine ions to other fragment ions kept constant before and after Ar cluster ion irradiation. These results indicate that large gas cluster ions are useful for depth profiling of organic compounds.     

AFM observations of latent fission tracks on surfaces: amorphous SiO2 and quartz

Preliminary results of a systematic AFM experimental investigation of the surface ‘track’ effects produced by the passage of fission fragments from a californium (²⁵²Cf) source into amorphous SiO₂ and quartz are described. Fission fragments from the source were collimated using a 10 μm thick aluminum foil and comprised fragments with the usual binary distribution of energies—light and heavy—79.4 and 103.8 MeV. Irradiations and AFM measurements were carried out in air at normal room temperature and pressure. Remarkably high sputtering yields/fragment were discovered, and in the case of crystalline quartz the ejecta was found to be arranged in an ordered manner. A brief discussion is given of a part likely to be played by electronic energy loss induced Coulomb explosion of target atoms for each point of fragment entry.     

The sputtering mechanism for low-energy light ions

The computer simulation program MARLOWE which follows the trajectories of energetic ions and recoiling target atoms in solids has been used to calculate sputtering yields for low energy (0.1–10keV) light ions (H, D, T,⁴He). Recoil energy densities were calculated for comparison with analytical theories. The sputtering yields obtained for amorphous Fe agree within a factor of two with experimentally measured values for polycrystalline stainless steel, while the calculated yields for protons on amorphous molybdenum are more than twice the experimental values on polycrystalline material. The calculations show that in the parameter range investigated, ions backscattered in the solid contribute a major part to sputtering. This result confirms earlier calculations of the threshold energy for sputtering which are in agreement with recent measurements. Operated for the United States Department of Energy by the Union Carbide Corporation.     

ADATOM, VACANCY AND SPUTTERING YIELDS OF ENERGETIC Pt ATOMS IMPACTING ON Pt(100) BY MOLECULAR DYNAMICS SIMULATION

We have studied the influence of incident atoms with low energy on the Pt(100) surface by molecular dynamics simulation. The interaction potential obtained by the embedded atom method (EAM) was used in the simulation. The incident energy changes from 0.1eV to 200eV, and the target temperature ranges from 100 to 500 K. The target scales are 6×6×4 and 8×8×4 fcc cells for lower and higher incident energies, respectively. The adatom, sputtering, vacancy and backscattering yields are calculated. It was found that there is a sputtering threshold for the incident energy. When the incident energy is higher than the sputtering threshold, the sputtering yield increases with the increase of incident energy, and the sputtering shows a symmetrical pattern. We found that the adatom and vacancy yields increase as the incident energy increases. The vacancy yields are much higher than those obtained by Monte Carlo simulation. The dependence of the adatom and sputtering yields on the incident energy and the relative atomistic mechanisms are discussed.     

Temperature dependence of the sputtering yield of surface metal clusters

The method of molecular dynamics has been used to investigate the influence of thermal oscillations of atoms on the sputtering of surface metal nanoclusters. The sputtering of a copper cluster consisting of 75 atoms from the (100) surface of a copper substrate by 200-eV argon ions for the target being at an equilibrium temperature of 0 and 300 K has been simulated. For each temperature, the sputtering yields have been predicted for both the substrate and the cluster and the polar and azimuthal angular distributions of sputtered atoms have been obtained. The procedure of simulation of two-object cluster-substrate systems at equilibrium temperatures other than 0 K is discussed. __________ Translated from Izvestiya Vysshikh Uchebnykh Zavedenii, Fizika, No. 7, pp. 20–25, July, 2007.     

Computer simulation of low-energy sputtering in the binary collision approximation

The sputtering of amorphous Cu targets by low-energy atoms has been investigated in the binary collision approximation using the computer program MARLOWE. Particular attention was given to the influence of the surface binding model on the results. Calculations were made of the dependence of the sputtering yield on the incident particle direction, energy, and mass. Angular-, energy-, and yield-distributions of the ejected atoms were evaluated. Comparisons with experimental results on polycrystalline targets show that the planar surface binding model is to be preferred over the isotropic surface binding model, especially with regard to the angular- and energy-distributions. Calculated yields are in reasonable agreement with experiment at energies below about 1 keV, but deviate at higher energies, apparently because of crystal correlation effects that are neglected in the amorphous model. Operated by Union Corporation under contract W-7405-eng-26 with the U.S. Department of Energy.     

Quantitative auger electron analysis of homogeneous binary alloys: Chromium in gold

Quantitative Auger electron analysis of Cr/Au alloys with up to 20% Cr has been accomplished. The surface composition of scribed areas were compared to bulk compositions and it was shown that corrections for variation of density, escape depth, and electron backscattering must be included; these corrections change the measured surface Cr concentrations by approximately 15%. Alloy sputter yield ratios have been calculated from surface concentrations after sputtering with Ar or Ne (0.5, 1.0, 1.5, and 2.0 keV). The sputter yield ratio of Cr to Au was 0.5 at 1% Cr (significant preferred sputtering) but was near unity at 20% Cr (no preferred sputtering). The sputter yield ratio was nearly independent of ion species and ion energy. The 2 keV argon ion sputter yields for pure Cr and Au were determined to be 2.0 and 7.9 atoms/ion, respectively. However, the 2 keV argon ion sputter yield for Au in the alloys drops rapidly from 7.9 atoms/ion for pure Au, to 5 atoms/ion at 10–20% Cr. The sputter yield for Cr in alloys (5 atoms/ion) is relatively independent of composition and is 2.5 times higher than the yield of pure Cr. No simple model is known by which pure elements sputter yields could be used to predict alloy sputtering behavior.     

Spike effects in heavy-ion sputtering of Ag,Au and Pt thin films

Sputtering yields of Ag, Au and Pt have been measured for monatomic and polyatomic ions of P, As, Sb and Bi over the energy range 10–250 keV. Large enhancements of the measured sputtering yields over those predicted by cascade theory occur for the very heavy ion bombardments. These enhancements become much larger for polyatomic ion bombardment and are strongly non-linear with the number of atoms comprising the molecule. The high sputtering yields are consistent with a major contribution due to a highly disrupted surface region and an associated reduction in the surface binding energy. They cannot be explained using a thermal spike model in which the enhancement results from a localized evaporation.     

Bombardment induced surface chemistry on Si under keV C60 impact

Molecular dynamics simulations of the sputtering of Si by C₆₀ keV bombardment are performed in order to understand the importance of chemical reactions between C atoms from the projectile and Si atoms in the target crystal. The simulations predict the formation of strong covalent bonds between the C and Si atoms, which result in nearly all of the C atoms remaining embedded in the surface after bombardment. At low incident kinetic energies, little sputtering of Si atoms is observed and there is a net deposition of solid material. As the incident kinetic energy is increased, the sputtering yield of Si atoms increases. At 15 keV, the yield of sputtered Si atoms is more than twice the number of C atoms deposited, and there is a net erosion of the solid material.     

Study of the interaction of argon and nitrogen ions with the silicon dioxide surface

Angular dependences of the sputtering yield, surface layer composition, and changes in the mass spectra of residual atmosphere upon irradiation of silicon dioxide with argon and nitrogen ions are measured. It is found that the sputtering yield of SiO₂ bombarded by N ₂ ⁺ ions is almost two times higher than for Si. The sputtering yields of SiO₂ and Si irradiated with Ar ions are identical, although the binding energy of atoms in SiO₂ is almost two times higher than in Si. An analysis of the surface composition and residual atmosphere near the sample during its irradiation suggests that a chemical reaction is involved in SiO₂ sputtering. Molecules of SiO and NO gases form in the surface layer, whose subsequent desorption increases the SiO₂ sputtering rate.     

Pt(111)表面低能溅射现象的分子动力学模拟

利用嵌入原子方法的原子间相互作用势，通过分子动力学模拟，详细研究了贵金属原子在Pt (111)表面的低能溅射现象.模拟结果显示：对于垂直入射情况，入射原子的质量对Pt (11 1)表面的溅射阈值影响不大.当入射原子的能量小于溅射阈值时，入射原子基本以沉积为主 ；当入射原子的能量大于溅射阈值时，溅射产额随入射原子能量的增加而线性增大；当入射 原子能量达到200 eV时，各种入射原子的溅射产额都达到或接近1，此时入射原子主要起溅 射作用.溅射原子发射的角分布概率和溅射花样与高能溅射相类似.研究表明：与基于二体碰 撞近似的线性级联溅射理论不同，当入射原子能量大于溅射阈值时，低能入射原子的溅射产 额正比于入射原子的约化能量和入射原子与基体原子的质量比.通过对低能入射原子的钉扎 能力分析，提出了支配低能溅射的入射原子反射物理机理. 关键词： 分子动力学模拟、低能溅射