Localization of the Fe°-level in silicon

Silicon samples were quenched from 1250°C – 1300°C and the 95K Fermi level was calculated from Hall effect data. The same samples were used to determine the intensity of the EPR spectrum at 95K associated with the iron interstitial (Fe°). In carefully selected samples, complete or partial overlapping of temperature dependent Hall measurements and EPR spectra could be accomplished. By relating Fermi levels to the corresponding EPR signals it was found that the transition Fe° → Fe⁺ in silicon introduces a level located at E_v+0, 375eV.     

Annealing of point defects in p-type germanium after electron irradiation at liquid nitrogen temperature

Annealing of radiation induced defects in p-type germanium was studied by measuring Hall coefficient and conductivity. The dopant was gallium or indium. It was concluded that the annealing stage between 80° and 140°K is caused by migration of the vacancy to the sink of an impurity atom. In this stage the vacancy migrates to a substitutional impurity atom and makes an association. The activation energy of the stage was found tO be 0.1 ev ad it is regarded to be that of the vacancy migration. The model for the annealing stage which occurs in the range 220 to 270°K is proposed as follows: An interstitial impurity atom migrates to a substitutional impurity atom and makes an association. From the activation energy of the stage, the migration energy of the interstitial impurity atom was concluded to be about 0.4 eV for gallium and 0.7 eV for indium atoms.     

Annealing characteristics of highly doped ion implanted phosphorus layers in silicon

A combination of sheet resistance, stripping and Hall effect measurements have been made on phosphorus layers implanted into silicon at 40 and 100 keV with doses between 1 × 10¹⁵ and 5 × 10¹⁶ atoms/cm². The implants were made at room temperature and 450°C. After annealing at 650°C, the profile of electrically active phosphorus following a high dose room temperature implant, was found to be flat topped with a concentration of approximately 5 × 10²⁰/cm³. Very little diffusion occurred when annealing to 850°C where the free electron concentration increased to approximately 1.5 × 10²¹/cm³. Highly doped channeled tails were found when implanting at 450°C along the 〈110〉 direction and damage was being continuously annealed out preventing the formation of an amorphous phase. The rapid diffusion of the profile into the bulk found when annealing between 650°C and 850°C was speculated to be due to the presence of a dense dislocation entanglement in these layers following a hot implant.     

Properties of ion implanted silicon,sulfur, and carbon in gallium arsenide

Work is described in which chromium-doped semi-insulating gallium arsenide has been successfully doped n-type with ion implanted silicon and sulfur, and p-type with ion implanted carbon. A dilute chemical etch has been employed in conjunction with differential Hall effect measurements to obtain accurate profiles of carrier concentration and mobility vs. depth in conductive implanted layers. This method has so far been applied to silicon-and sulfur-implanted layers in both Cr-doped semi-insulating GaAs and high purity vapor grown GaAs. In the case of sulfur implants, a strong diffusion enhancement has been observed during the annealing, presumably due to fast-diffusing, implantation-produced damage. Peak doping levels so far obtained are about 8 × 10¹⁷ electrons/cm³ for silicon implants and 2 × 10¹⁷ electrons/cm³ for sulfur implants. Mobility recovery has been observed to be complete except in regions near the surface which are heavily damaged by the implantation.     

硅的低温电学性质

本文在20°—300°K研究了室温载流子浓度2×10¹²—1×10²⁰cm^-3含硼或磷(砷)Si的电学性质。对一些p-Si样品用弱场横向磁阻法及杂质激活能法进行了补偿度的测定,并进行了比较。从霍尔系数与温度关系的分析指出,对于较纯样品,硼受主能级的电离能为0.045eV,磷施主能级为0.045eV,在载流子浓度为10¹⁸—10¹⁹cm^-3时发现了费米简并,对载流子浓度为2×10¹⁷—1×10¹⁸cm^-3的p-Si及5×10¹⁷—4×10¹⁸cm^-3的n-Si观察到了杂质电导行为。从霍尔系数与电导率计算了非本征的霍尔迁移率。在100°—300°K间,晶格散射迁移率μ满足关系式AT^-a,其中A=2.1×10⁹,α=2.7(对空穴);或A=1.2×10⁸,α=2.0(对电子)。另外,根据我们的材料(载流子浓度在5×10¹¹—5×10²⁰cm^-3间),分别建立了一条电阻率与载流子浓度及电阻率与迁移率的关系曲线,以提供制备材料时参考之用。     

Extrinsic silicon detectors for 3–5 and 8–14 μm

In support of system applications which operate in the 3–5 and 8–14 μm spectral ranges, high performance doped silicon detectors are desired to allow for the integration of detectors and silicon electronics on the same substrate. For the 8–14 μm range, detectors were prepared using aluminum, gallium, bismuth and magnesium as dopants which operate in the liquid neon temperature (27°K) range. For the 3–5μm range, detectors were prepared using indium, sulphur and thallium as dopants which operate in the liquid nitrogen temperature (78° K) range. The spectral and temperature characteristics of these detectors are presented. Background limited performance (∼30° FOV) is demonstrated for Si:Al. Si:Ga. and Si:Bi up to temperatures of about 30°K. Background limited performance (∼30° FOV) is demonstrated for Si:In and Si:S up to temperatures of approximately 60 and 75°K respectively. The data gives a good fit with theory based on background and temperature limitations. The performance of the Si:Mg detector is limited by a shallow unidentified energy level while that of the Si:TI detector is limited, at present, by low responsivity.     

Transport properties of silicon doped n-indium selenide

Hall effect and resistivity measurements in silicon doped indium selenide (InSe), from 7K to 500K, are reported. Results are interpreted through a model, previously proposed for tin doped InSe, that takes into account the contribution of both three- and two-dimensional electrons to charge transport along the layers in InSe.     

Low energy boron and phosphorus implants in silicon (a) electrical sheet measurements

Silicon wafers were implanted in 〈111〉-direction with boron and phosphorus ions of 7 keV at room temperature. Doses between 10¹² and 10¹⁸ ions/cm² were applied. After successive annealing steps the electrical properties of the implanted layers have been determined by Hall effect and sheet resistivity measurements. The annealing characteristics of the implants depend on ion dose and species. Three annealing stages can be distinguished: (I) the temperature range below 500°C, (II) 500—700°C, (III) 700—900°C.

After annealing at 90°C the apparent electrical yield is proportional to dose for all implants and amounts to approx. 80 per cent for boron and 40 per cent for phosphorus.

Sheet resistivity vs. dose curves were derived for the annealing temperature of 400°C and used for the fabrication of position sensitive detectors. The position characteristics were found to be linear within ～1 per cent for resistive layers as long as 20 cm.     

Diffusion,solubility, and electrical properties of scandium and praseodymium in silicon

An integrated study of diffusion, solubility, and electrical properties of scandium and praseodymium in silicon annealed in various media and temperature ranges (1100–1280 °C) was performed for the first time. The tracer technique, autoradiography, measurements of isothermic capacity and current relaxation, conductivity, and the Hall effect were used for the investigations. The diffusion parameters, solubility, and an acceptor character of scandium and praseodymium impurities in silicon were determined. __________ Translated from Izvestiya Vysshikh Uchebnykh Zavedenii, Fizika, No. 1, pp. 75–77, January, 2007.     

Size-effect parameters for thin films of the aluminium group metals

Measurements were made of the sheet resistivity and Hall voltage of vacuum-deposited polycrystalline aluminium, gallium, indium, and thallium films 500–5000 Å thick, cooled to 4.2°K. The results fit a low-temperature form of the Sondheimer size-effect relations, and may then be used to determine the electron-transport parameters.     

Electrical measurements of boron implanted silicon on sapphire and bulk silicon

Hall effect and sheet resistivity measurements have been performed on boron implantations in 1μm silicon layers on sapphire (SOS), and in bulk silicon. The doses used were 10¹⁴, 10¹⁵ and 10¹⁶ ions/cm², and implantation energies were 150 and 300 keV. The samples were annealed at temperatures between 300 and 800°C. As a rule the effective number of carriers in SOS was found to be about twice the number of carriers in bulk silicon. However, the mobility is lower in bulk silicon, resulting in a sheet resistivity almost the same in boron implanted SOS and bulk silicon.     

Highly transparent and conductive indium tin oxide thin films for solar cells grown by reactive thermal evaporation at low temperature

Transparent conductive tin-doped indium oxide (In₂O₃:Sn, ITO) thin films with various Sn-doping concentrations have been prepared using the low cost reactive thermal evaporation (RTE) technique at a low growth temperature of ~160 °C. The structural characteristics, optical and electrical properties of the ITO thin films were investigated. These polycrystalline ITO films exhibited preferential orientation along (222) plane and possessed low resistivities ranging from 3.51 to 5.71 × 10^?4 Ω cm. The decreased mobility was attributed to the scattering by ionized and neutral impurities at high doping concentrations. The optimized ITO thin film deposited with 6.0 wt% Sn-doping concentration exhibited a high average transparency of 87 % in the wavelength range of 380–900 nm and a low resistivity of 3.74 × 10^?4 Ω cm with a high Hall mobility of 47 cm² V^?1s^?1. A hydrogenated amorphous silicon and silicon–germanium (a-Si:H/a-SiGe:H) double-junction solar cell fabricated with the RTE-grown ITO electrodes presented a conversion efficiency of 10.51 %.     

Analysis of arsenic range distributions in silicon

MeV⁴He ion backscattering and differential sheet resistivity measurements were made on As implants into silicon at room temperature. Analysis of backscattering measurements yields the projected rangeR _p and projected standard deviation ΔR _p . Over the energy range of 50 to 250 keV, the values ofR _p are found to agree well with LSS theoretical predictions; however, values of ΔR _p are systematically higher than theoretical calculations. Backscattering and differential sheet resistivity measurements on samples annealed at 950°C are in general agreement and indicate diffusional broadening of the profile.     

Extended defect removal in silicon by rapid thermal annealing

Summary Germanium, arsenic and krypton ions of 600 keV energy were implanted in <100> silicon substrate at 250°C. The hot implantation results in the formation of extended defects (dislocation loops and cluster of point defects) as residual damage. Rapid thermal annealing process at a temperature above 1000°C was used to remove the damage. Rutherford-backscattering channelling technique was used to measure the amount of defects and their annealing. In some cases the channelling results were correlated to transmission electron microscopy (TEM) analysis. The annealing process of the damage is governed by an activation energy of (4.4±0.2) eV for both germanium and arsenic implants. During RTA processes broadening of the As and Ge distributions is quite negligible. The Kr atoms interact instead with defects and the annealing even after a prolonged time at 1100°C is not complete, bubbles surrounded by extended defects are left The authors of this paper have agreed to not receive the proofs for correction.     

Band bending effect on the thermal dependence of photoemission from Li activated Si

The photoemissive properties of lithium activated silicon are studied in the temperature range 25°C to 500°C. The Li activation is obtained by surface segregation of bulk dissolved Li. The Li layer seems to be highly stable when Si is heated up to 500°C. On the other hand, the photoemission quantum yield changes with temperature. In order to get complementary information, work function measurements are performed on the same samples. Both photoemission and work function measurements allow us to describe the whole energy picture at the surface of n and p type samples and lead to the conclusion that band bending effect is responsible for the thermal dependence of the yield.     

Li掺杂ZnO纳米棒的导电和发光特性(英文)

利用气相输运方法,在(111)面硅衬底上制备了名义上原子数分数为2%的Li掺杂的ZnO纳米棒(样品A)。作为比较,我们在相同的生长条件下制备了没有任何掺杂的ZnO纳米棒(样品B)。XRD分析测试表明:样品A和样品B中的ZnO纳米棒具有纤锌矿六边形结构,没有其他氧化物,例如Li2O。Hall效应测量表明:样品A导电类型为p型,空穴载流子浓度为6.72×1016cm-3,空穴载流子迁移率为2.46 cm2.V-1.s-1。样品B为n型,电子载流子浓度为7.16×1018cm-3,电子载流子迁移率为4.73 cm2.V-1.s-1。低温光致发光光谱测试表明,样品A和样品B发光峰明显的区别是位于3.351 eV(样品B)和3.364 eV(样品A)处。根据文献报道,在没有掺杂的ZnO中,3.364 eV发光峰源于施主束缚激子发光。通过变温光致发光光谱的测试,证明了在样品A中,位于3.351 eV的发光峰源于受主束缚激子发光,其光学受主能级位于价带顶142meV处。     

Hall effect on the surface of ice

The Hall effect on the surface of ice has been detected using an ac technique. The measurements were carried out in the range -1.3 to -20°C. The Hall mobility shows a double Arrhenius dependence with slopes of 2.5 eV at high temperature and 0.3 eV at lower temperature being the transition between -5 and -8°C. The net carrier concentration varies three orders of magnitude in this temperature range.     

n型硅脉冲激光掺铟的物理过程与缺陷特性研究

用Nd-YAG脉冲激光对n型硅掺铟,形成外p⁺n结。利用二次离子质谱仪(SIMS)、卢瑟福背散射(RBS)等方法,研究了硅内铟的分布,并分析了用20ns脉冲激光硅掺铟的物理过程,发现当激光能量密度足够大时,在硅表面层存在硅-铟混合熔体和液态硅两部分。当激光能量密度较小时,硅表面层仅有液态硅层、用I-V,C-V和深能级瞬态谱(DLTS)等方法研究了p⁺n结的电学性质,发现在p⁺n结的n区存在两个缺陷。一个能通过快速热退火,在600℃,60s条件下消失,研究表明可能为空位与杂质的复合体。另一个通过快速热退火不能消失,可能与位错有关。 关键词：     

Phosphorus distribution profiles in 100-silicon using a spin-on source at low temperatures

 Incorporation of phosphorus into silicon from a spin-on dopant layer (SOD) at 400 ^°C is described. Annealing experiments were carried out with SOD films deposited on (100) silicon substrates by using the spin-on technique. Conventional heating on a hotplate in normal atmosphere and a temperature range up to 400 ^°C was used to study the dopant incorporation. After removing the SOD-films one part of the silicon substrates was annealed at higher temperatures. Investigations were carried out by SIMS, SAM, XPS, HTEM, stripping Hall and Van der Pauw measurements before and after the high temperature annealing. Chemical phosphorus concentration profiles obtained from low temperature annealed samples showed diffusion depths of 60–80 nm (extrapolated to a substrate doping level of 10¹⁶ cm^-3) and surface concentrations of 10¹⁹–10²⁰ cm^-3. Electron concentration profiles exhibiting maximum values around 2⋅10¹⁹ cm^-3 could be measured on high temperature annealed samples only. Received: 28 March 1996/Accepted: 19 August 1996     

Low temperature channeling measurements of ion implantation lattice disorder in single crystal silicon

Lattice disorder for 200-keV Sb implantations into silicon has been studied by channeling effect analysis using 400 keV proton backscattering. Implantation and analysis were performed at low temperatures in the same system without warmup. In the temperature region between 85°K and room temperature the disorder production per incident ion at low doses is implantation temperature dependent. Approximately 18,000 silicon scattering centers per incident 200-keV Sb ion are observed for 90°K implantations, and this value is nearly a factor of three greater than at room temperature. Isochronal anneal curves of low fluence, low temperature implantations show, significant annealing below room temperature. The observed disorder production per incident ion decreases with increasing implantation temperature at temperatures 50 to 100°K lower than annealing occurs following 85 or 90°K implants. Strong similarities of the implantation temperature dependence and anneal behavior of the disorder exist for Sb and B implantations into silicon and suggest that much of the lattice disorder produced by ion implantation can be understood in terms of the basic properties of the silicon target material.