Residual Stress Determination Using Hole Drilling and 3D Image Correlation

In recent years, the hole drilling method for determining residual stresses has been implemented with optical methods such as holographic interferometry and ESPI to overcome certain limitations of the strain rosette version of hole drilling. Although offering advantages, the interferometric methods require vibration isolation, a significant drawback to their use outside of the laboratory. In this study, a 3D image correlation approach was used to measure micron-sized surface displacements caused by the localized stress relief associated with hole drilling. Residual stresses were then found from the displacements using non-dimensional relations previously derived by finite element analysis. A major advantage of image correlation is that it does not require interferometric vibration isolation. Experiments were performed to check the ability of this new approach for uniaxial and equi-biaxial states of stress. Stresses determined by the approach were in good agreement with computed values and those determined by hole drilling using holographic interferometry.     

Improvements in Residual Stress Measurement by the Incremental Centre Hole Drilling Technique

This paper presents results which advance and improve the usefulness, accuracy and efficiency of incremental centre hole drilling as a method of measuring near surface residual stress fields. Particular emphasis is placed on providing optimal values for the number of drilling step increments to be used and their corresponding size. Guidelines on the optimal values for the number and size of steps to use during measurements are presented for various ratios of hole radius to strain gauge rosette radius in the form of tabulated data. These guidelines are subsequently incorporated into a new data analysis program which permits very near surface residual stress fields to be accurately determined in real components. The benefits of the new approach are highlighted by reporting the results of measurements made on three industrial components, each of which has been subjected to a well-known engineering process. These components are a shot-peened spring-steel, a friction stir welded aluminium alloy, and a titanium alloy subjected to three different machining processes. The results reveal that the improvements to the incremental centre hole drilling technique can provide measured residual stresses from depths ranging from about 10 m to 1 mm.     

Residual Stress Measurement Using Hole Drilling and Integrated Digital Image Correlation Techniques

The effectiveness of optical (mostly interferometric) methods for the measurement of residual stresses is largely demonstrated in literature. Nevertheless, these techniques are still confined to optical laboratories due to their high sensitivity to vibrations which makes it very difficult to perform the measurement in an industrial environment. Digital Image Correlation (DIC) has recently been proposed as a possible solution to this problem: this non-interferometric technique is much less affected by vibrations, but its sensitivity is relatively low, thus negatively affecting the accuracy of results. This work proposes to use a variant of Digital Image Correlation, known as Integrated DIC (iDIC), in combination with the hole drilling technique. Since iDIC directly incorporates in its formulation the displacement field related to hole drilling, it overcomes most of the problems of standard DIC; in this way it is possible to obtain accurate results without using interferometric techniques.     

Incremental Hole Drilling for Residual Stress Analysis of Thin Walled Components with Regard to Plasticity Effects

The incremental hole-drilling method is widely used in residual stress depth distribution analysis. However, two specific difficulties with the generalization of the incremental method exist, including the consideration of the sample thickness and residual stress states close to the local material’s yield strength. The stress concentration effect of the hole can lead to plastic deformation in the vicinity of the hole, which results in an overestimation of residual stresses. Typically, the effect of the component’s thickness and the plasticity effects are analyzed separately and correction approaches are proposed. In the current paper, we analyze the combined effects of plasticity and thickness on residual stress analysis using the incremental hole-drilling method. A systematic study was performed on steel samples with (i) isotropic and (ii) anisotropic elastic and elasto-plastic material behavior with varying thicknesses ranging between 1 mm and 4 mm. Electronic speckle pattern interferometry (ESPI) hole-drilling experiments were conducted on beam samples loaded using a 4-point bending fixture. Finite element simulations were conducted to gain insight into the effects of incremental hole-drilling. The results indicate that reducing the component’s thickness increases the plastic deformation in the vicinity of the hole and results in significant stress deviations. Thin components bend during hole-drilling as a result of the loss of stiffness, which amplifies the plasticity effect.     

云纹干涉与钻孔法测量残余应力的实验方法与系统

应变片钻孔法是工程中应用最广的残余应力测量方法之一，由于应变片只能得到其长度范围内的平均应变，测量误差比较大，本文提出用云纹干涉法测量的位移信息代替应变片测量的应变信息来确定残余应力，用有限元建立位移与残余应力之间的关系，基于以上理论，开发了一种可以进行现场残余应力测量的便携式云纹干涉钻孔系统，并用该仪器进行了铝合金激光焊接接头的残余应力测量，得到了焊缝中心残余应力值。     

钻孔法测量残余应力过程中钻孔附加应变的研究（Ⅱ）

本文应用弹塑性理论研究了被测试样的屈服强度、应力场对钻孔法测量残余应力过程中钻孔附加应变的影响,使用简化的理论模型推导了低速旋转钻头钻孔产生附加应变的一般表达式.结果表明钻孔引入的附加应变与被测试样的原始残余应力状态有关,随应力水平增加而增大,在压应力减小到某一临界值σ时,钻孔附加应变为零。在 Ly12铝合金上的实验测量结果与理论结果一致。     

钻孔法测量残余应力过程中钻孔附加应变

本文叙述了钻孔法测量残余应力过程中的附加应变.研究应力水平对附加应变的影响是在单向应力条件下进行的,结果表明,钻孔条件、材料状态以及残余应力达到一定值时,附加应变为零.     

相移云纹干涉法与盲孔法相结合检测复合材料的残余应力

本文应用相移云纹干涉法与盲孔法相结合检测纤维增强复合材料的残余应力。盲孔法是工程中被广泛应用的测定残余应力的方法之一,相移云纹干涉方法可得到孔边任意一点的位移信息。由于正交各向异性复合材料在弹性主方向不发生拉剪(或剪拉)耦合效应,所以通过适当读取孔边特殊点的位移,可方便地得到残余应力值。     

Incremental Hole Drilling Residual Stress Measurement in Thin Aluminum Alloy Plates Subjected to Laser Shock Peening

Experimental Mechanics - The American standard ASTM E837 presents a standard procedure to determine residual stresses in isotropic materials using the incremental hole drilling technique (IHD). The...     

钻孔法测量残余应力中几个问题的探讨

本文针对钻孔法测量残余应力中一些不能用“释放”理论解释的问题,通过对钻孔法基本测量原理的分析和与其它传统电测方法对比,认为常用于测量残余应力的电测方法中钻孔法应定义为“干扰法”,切条法和套孔法为“释放法”,Sach＇s镗削法则为“干扰-释放法”.根据实验结果推荐公式=(λ-1)~(1/2)为预测钻孔深度的经验公式.同时应用“干扰”理论分析了压痕法测量残余应力的基本特性,提出压痕法与电测法结合将发展成为一种近似无损的测量残余应力的新方法.     

Residual Stress Analysis of Orthotropic Materials by the Through-hole Drilling Method

The present study deals with the development and the application of the through-hole drilling method for the residual stress analysis in orthotropic materials. Through a systematic theoretical study of the stress field present on orthotropic plates with a circular hole, the relationships between the relaxed strains measured by a rectangular strain gauge rosette and the Cartesian components of the unknown residual stresses are obtained. The theoretical formulas of each influence coefficient allow the user an easy application of the method to the analysis of uniform-residual stresses on a generic homogeneous orthotropic material. Furthermore, to extend the method to the analysis of the residual stresses on orthotropic laminates, caused by initial in-plane loadings, an alternative formulation is implemented. The accuracy of the proposed method has been assessed through 3D numerical simulations and experimental tests carried out on unidirectional, cross-ply and angle-ply laminates.     

Micron-Scale Residual Stress Measurement by Micro-Hole Drilling and Digital Image Correlation

This paper reports a new technique, namely the incremental micro-hole-drilling method (IμHD) for mapping in-plane residual or applied stresses incrementally as a function of depth at the micron-scale laterally and the sub-micron scale depth-wise. Analogous to its macroscale counterpart, it is applicable either to crystalline or amorphous materials, but at the sub-micron scale. Our method involves micro-hole milling using the focused ion beam (FIB) of a dual beam FEGSEM/FIB microscope. The resulting surface displacements are recorded by digital image correlation of SEM images recorded during milling. The displacement fields recorded around the hole are used to reconstruct the stress profile as a function of depth. In this way residual stresses have been characterized around a drilled hole of 1.8microns. diameter, enabling the profiling of the stress variation at the sub-micron scale to a depth of 1.8 microns. The new method is used to determine the near surface stresses in a (peened) surface-severe-plastically-deformed (S²PD) Zr₅₀Cu₄₀Al₁₀ (in atomic percent, at.%) bulk metallic glass bar. In plane principal stresses of -800 MPa ± 90 MPa and −600 MPa ± 90 MPa were measured, the maximum compressive stress being oriented 15° to the axis of the bar.     

热障涂层氧化残余应力大小与演化过程测试

热障涂层是一种应用广泛的提高高温部件工作效率的技术,在通常的涂层中,粘结层起到过渡和保护基体氧化的作用,在高温环境下,粘结层会发生氧化,而氧化产生的残余应力将引起热障涂层的损伤,表现为涂层的屈曲、起裂和剥落,导致热障涂层失效。研究测试和检测涂层的残余应力,对于评估涂层的安全性和寿命是非常重要的。本文用应力引起光学频谱位移的方法测试了空气等离子喷涂热障涂层中残余应力的大小及分布,并测试了残余应力的大小随氧化时间的演化过程。     

循环载荷下冷挤压孔宏观残余应力的松弛效应

本文对应用云纹干涉法测量冷挤压孔周残余应力分布作了简要的论述，并应用该技术研究了冷挤压孔周残余应力在循环应力作用下的松弛问题，还探讨了残余应力的构件疲劳过程的相互作用，最后绘出不同循环应力次数作用后残余应力高周疲劳效应的几组实验结果。     

夹层全息干涉法的残余应力测试

本文用夹层全息干涉法做了模拟残余应力的标定实验,测试了焊缝、铸件的残余应力,并且利用数值方法进行了定量分析,实验结果与理论值比较吻合。     

Residual Stresses from Incremental Hole Drilling Using Directly Deposited Thin Film Strain Gauges

Experimental Mechanics - Commonly, polymer foil-based strain gauges are used for the incremental hole drilling method to obtain residual stress depth profiles. These polymer foil-based strain...     

Residual Stress Determination Using Cross-Slitting and Dual-Axis ESPI

Hole-drilling and Electronic Speckle Pattern Interferometry (ESPI) are used to measure residual stresses in metal specimens. The slitting method is chosen as an alternative to the more commonly used hole-drilling method because it involves less material removal and leaves large areas of highly deformed material available to be measured. However the conventional single-slitting method is sensitive only to the stress component perpendicular to the slit direction, and thus has a strong directional bias. Conventional ESPI has a similar bias because it responds to surface displacements in a specific sensitivity direction. In this paper, a novel cross-slitting method with dual-axis ESPI measurements is proposed to address both directional biases. Cross-slitting is introduced as a means of releasing all in-plane stress components. The dual-axis ESPI system uses diagonal-mirror and shutter devices to provide surface displacement measurements in orthogonal in-plane directions. The combination of the cross-slit and dual-axis measurement gives isotropic sensitivity to the in-plane residual stress components. Experimental measurements are described that illustrate the capability and effectiveness of the cross-slitting/ESPI technique.     

Displacement Determination by Holographic Interferometry for Residual Stress Analysis in Elastic Bodies

A method is developed for determining the three displacement components by the method of holographic interferometry from two interferograms used to measure residual stresses by hole drilling. The displacements are determined at the intersection points of the principal axes and the hole boundary. The method is experimentally validated by measuring the stress state of a plate under uniaxial tension __________ Translated from Prikladnaya Mekhanika, Vol. 41, No. 8, pp. 111–117, August 2005.     

Influence of Drilling Parameters on the Accuracy of Hole-drilling Residual Stress Measurements

Multiple measurements using the hole drilling method were made in samples with a “known” state of residual stress. Drilling parameters were independently varied (bit rotation speed, bit diameter, and hole depth) to determine the effect on accuracy and repeatability. The study showed that accurate results can be achieved without ultra-high drill rotation speeds and that, in aluminum and stainless steel, speeds over 5 krpm and 10 krpm (respectively) were sufficient. Inaccuracies were evident in the stainless steel at speeds below 10 krpm and were attributed to non-circular holes, which may have been the result of bit vibration. There were no significant trends associated with altering the hole depth and only a slight trend associated with bit diameter variation.