Scalable synthesis of palladium nanoparticle catalysts by atomic layer deposition

Potential applications in drug delivery from nanostructures composed of two oppositely charged polymethacrylates, eudragit^? L100 (EL) and eudragit^? EPO (EE), loaded with three model basic drugs (D), atenolol, propranolol, and metroclopramide were evaluated. The self-organized nanoparticles based on drug-interpolyelectrolyte complexes (DIPEC), (EL-D₅₀)?CEE_X, were obtained by mixing the aqueous dispersions of both polyelectrolytes at room temperature in an ultrasound bath. Dispersions of (EL-D₅₀) neutralized with increasing proportions of EE exhibited a rise of turbidity, particle sizes in the range of 150?C400?nm, and high negative zeta potential. The sign of zeta potential was shifted from negative to positive by changes in composition of DIPEC. Freeze dried DIPEC were easily redispersed in water yielding nearly the same parameters of fresh dispersions. In vitro release experiments using Franz cells showed that DIPEC systems behave as a drug reservoir that slowly releases the drug as water is placed in the receptor compartment. The release rate was raised by ionic exchange with counterions present in simulated physiological fluids placed in the receptor media. Delivery of D from DIPEC exhibited a remarkable robustness toward simulated physiological media of different pH. The DIPEC systems exhibit interesting properties to design nanoparticulate drug delivery systems for oral and/or topical routes.     

等离子增强原子层沉积低温生长AlN薄膜

采用等离子增强原子层沉积技术在单晶硅基体上成功制备了AlN晶态薄膜, 利用椭圆偏振仪、原子力显微镜、小角掠射X射线衍射仪、高分辨透射电子显微镜、 X射线光电子能谱仪对样品的生长速率、表面形貌、晶体结构、薄膜成分进行了表征和分析, 结果表明, 采用等离子增强原子层沉积制备AlN晶态薄膜的最低温度为200 ℃, 薄膜表面平整光滑, 具有六方纤锌矿结构与(100)择优取向, Al_2p与N_1S的特征峰分别为74.1 eV与397.0 eV, 薄膜中Al元素与N元素以Al-N键相结合, 且成分均匀性良好. 关键词： 氮化铝 等离子增强原子层沉积 低温生长 晶态薄膜     

Patterned deposition by plasma enhanced spatial atomic layer deposition

An atmospheric pressure plasma enhanced atomic layer deposition reactor has been developed, to deposit Al₂O₃ films from trimethyl aluminum and an He/O₂ plasma. This technique can be used for 2D patterned deposition in a single in‐line process by making use of switched localized plasma sources. It was observed that the sharpness of the patterns is primarily influenced by the concentration of reactive plasma species and by the dimensions of the plasma source. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Controlled growth of rutile TiO2 by atomic layer deposition on oxidized ruthenium

Crystalline rutile TiO₂ films were grown by atomic layer deposition on oxidized Ru electrodes using a titanium methoxide as the metal precursor and O₃ as the oxidant. A protective layer of ～0.3 nm TiO₂ grown with H₂O as the oxidant was first deposited in order to avoid etching of the Ru bottom electrode by the O₃ used for the growth of the TiO₂ (bulk) layer. Electrical evaluation of the capacitor stacks with TiO₂ as dielectric, RuO₂/Ru and Pt as the bottom and top electrodes respectively, resulted in superior characteristics of the rutile phase as compared to the anatase. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Roughness simulation for thin films prepared by atomic layer deposition

The kinetic lattice Monte Carlo method for film growth simulation without taking crystallization into account was applied to study the roughness of the HfO₂ film grown by atomic layer deposition at 100–500°C from HfCl₄ and H₂O. The calculations were performed using a simplified kinetic mechanism of the growth of HfO₂ films obtained by reducing the detailed kinetic mechanism developed earlier. Ab initio quantum-chemical calculations were performed to determine the kinetic parameters of diffusion processes on the surface of hafnium oxide that could influence film roughness. Because of the special features of atomic layer deposition, the rate of film growth and film roughness were finite even if surface relaxation was ignored. It was found that, irrespective of the temperature, the diffusion of hydrogen and adsorbed HfCl₄ complexes did not change the profile of the growing film and only insignificantly increased the mean rate of growth. The results obtained were also qualitatively applicable to zirconium dioxide at fairly low (≤100°C) temperatures in the absence of crystallization.     

Protective silicon coating for nanodiamonds using atomic layer deposition

Ultrathin silicon coating was deposited on nanodiamonds using atomic layer deposition (ALD) from gaseous monosilane (SiH₄). The coating was performed by sequential reaction of SiH₄ saturated adsorption and in situ decomposition. X-ray diffraction (XRD) and transmission electron microscopy (TEM) were utilized to investigate the structural and morphological properties of the coating. Thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC) were used to compare the thermal stability of nanodiamonds before and after silicon coating. The results confirmed that the deposited cubic phase silicon coating was even and continuous. The protective silicon coating could effectively improve the oxidation resistance of nanodiamonds in air flow, which facilitates the applications of nanodiamonds that are commonly hampered by their poor thermal stability.     

Properties of AlN grown by plasma enhanced atomic layer deposition

The influence of growth parameters on the properties of AlN films fabricated by plasma-enhanced atomic layer deposition using trimethylaluminum and ammonia precursors was investigated. The atomic concentrations, refractive index, mass density, crystallinity and surface roughness were studied from the films grown in the temperature range of 100-300 °C with plasma discharge times between 2.5 and 30 s. The AlN films were shown to be hydrogen rich having H concentrations in the range of 13-27 at.% with inverse dependence on the growth temperature. The carbon and oxygen concentrations in the films were less than 2.6% and 0.2%, respectively. The refractive index and mass density of the films correlated with the hydrogen concentration so that higher concentrations (lower growth temperatures) resulted in smaller refractive index and mass density. The film grown at 300 °C was found to be crystalline whereas lower growth temperature produced amorphous films.     

AlGaN/GaN MIS-HEMT using NbAlO dielectric layer grown by atomic layer deposition

We present an AlGaN/GaN metal-insulator-semiconductor high electron mobility transistor (MIS-HEMT) with an NbAlO high-k dielectric deposited by atomic layer deposition (ALD).Surface morphology of samples are observed by atomic force microscopy (AFM),indicating that the ALD NbAlO has an excellent-property surface.Moreover,the sharp transition from depletion to accumulation in capacitance-voltage (C-V)curse of MIS-HEMT demonstrates the high quality bulk and interface properties of NbAlO on AlGaN.The fabricated MIS-HEMT with a gate length of 0.5 μm exhibits a maximum drain current of 960 mA/mm,and the reverse gate leakage current is almost 3 orders of magnitude lower than that of reference HEMT.Based on the improved direct-current operation,the NbAlO can be considered to be a potential gate oxide comparable to other dielectric insulators.     

Nanotribological behavior of ZnO films prepared by atomic layer deposition

We used atomic layer deposition to form ZnO thin-film coatings on Si substrates and then evaluate the effect of pile-up using the nanoscratch technique under a ramped mode. The wear volume decreased with increasing annealing temperature from room temperature to 400 °C for a given load. Elastic-to-plastic deformation occurred during sliding scratch processing between the groove and film for loading penetration of 30 nm. The onset of non-elastic behavior and greater contact pressure were evident for loading penetration of 150 nm; thus, full plastic deformation occurred as a result of a substrate effect. We suspect that elastic–plastic failure events were related to edge bulging between the groove and film, with elastic–plastic deformation attributable to adhesion discontinuities and/or cohesion failure of the ZnO films.     

Anti-reflection coating at 550 nm fabricated by atomic layer deposition

Trimethylamine （TMA）, TIC14, and water are applied as the precursors to deposit Al2O3 and TiO2. With different substrate temperatures, the optical properties and surface morphologies of the two oxides TiO2 and SiO2 are studied, respectively. With substrate temperature of 120 ℃, amorphous TiO2 can be obtained, and the surface roughness （RMS） is only 0.928 nm. Applying Al2O3 and TiO2 deposited in 120 ℃ as low and high refractive index materials, anti-reflection （AR） coating at single point （550 nm） is designed. Furthermore, with the calibrated growth rates, this AR coating is fabricated, and its ultimate reflectance for the AR coating at 550 nm is less than 0.2%, which can meet the requirement for most applications.     

Preparation of tantalum oxide thin films by photo-assisted atomic layer deposition

Tantalum oxide thin films were prepared by photo-assisted atomic layer deposition (Photo-ALD) in the substrate temperature range of 170–400 °C using Ta(OC₂H₅)₅ and H₂O as precursors. The constant growth rates of 0.42 and 0.47 Å per cycle were achieved for the films grown by normal ALD and Photo-ALD, respectively. The increased growth rate in Photo-ALD is probably due to the reactive surface by photon energy and faster surface reaction. In Photo-ALD, however, the constant growth rate started at lower temperature of 30 °C and one cycle time shortened up to 5.7 s than that of normal ALD. The films grown by normal ALD and Photo-ALD were amorphous and very smooth (0.21–0.35 nm) as examined by X-ray diffractometer and atomic force microscopy, respectively. Also, the refractive index was found to be 2.12–2.16 at the substrate temperature of 190–300 °C, similar to that of the film grown by normal ALD. However, the remarkably low leakage current density of 0.6×10⁻⁶ A/cm² to 1×10⁻⁶ A/cm² at applied field of 1 MV/cm is several order of magnitude smaller than that of normal ALD, probably due to the presence of reactive atom species.     

Epitaxial growth of zinc oxide by the method of atomic layer deposition on SiC/Si substrates

For the first time, zinc oxide epitaxial films on silicon were grown by the method of atomic layer deposition at a temperature T = 250°C. In order to avoid a chemical reaction between silicon and zinc oxide (at the growth temperature, the rate constant of the reaction is of the order of 10²²), a high-quality silicon carbide buffer layer with a thickness of ~50 nm was preliminarily synthesized by the chemical substitution of atoms on the silicon surface. The zinc oxide films were grown on n- and p-type Si(100) wafers. The ellipsometric, Raman, electron diffraction, and trace element analyses showed that the ZnO films are epitaxial.     

原子层沉积HfO_2薄膜的激光损伤特性分析

以目前激光惯性约束聚变中应用最广泛的高折射率材料二氧化铪(HfO2)为研究对象,在熔石英基底上分别采用TEMAH和HfCl4前驱体制备了HfO2薄膜,沉积温度分别为100,200和300℃。采用椭偏仪和激光量热计对薄膜的光学性能进行了测量分析,采用X射线衍射仪(XRD)对薄膜的微结构进行了测量。最后在小口径激光阈值测量平台上按照1-on-1测量模式对薄膜的损伤阈值进行了测试,并采用扫描电子显微镜(SEM)对损伤形貌进行了分析。研究表明,用同一种前驱体源时,随着沉积温度升高,薄膜折射率增加,吸收增多,损伤阈值降低。在相同温度下,采用有机源制备的薄膜更容易在薄膜内部形成有机残留,导致薄膜吸收增加,损伤阈值降低。采用HfCl4作为前驱体源在100℃制备氧化铪薄膜时,损伤阈值能够达到31.8J/cm2(1064nm,3ns)。     

Transmission electron microscopy studies of HfO2 thin films grown by chloride-based atomic layer deposition

Detailed transmission electron microscopy characterization of HfO₂ films deposited on Si(1 0 0) using atomic layer deposition has been carried out. The influence of deposition temperature has been investigated. At 226 °C, a predominantly quasi-amorphous film containing large grains of cubic HfO₂ (a₀ = 5.08 Å) was formed. Grain morphology enabled the nucleation sites to be determined. Hot stage microscopy showed that both the cubic phase and the quasi-amorphous phase were very resistant to thermal modification up to 500 °C. These observations suggest that nucleation sites for the growth of the crystalline cubic phase form at the growing surface of the film, rather homogeneously within the film. The films grown at higher temperatures (300-750 °C) are crystalline and monoclinic. The principal effects of deposition temperature were on: grain size, which coarsens at the highest temperature; roughness with increases at the higher temperatures due to the prismatic faceting, and texture, with texturing being strongest at intermediate temperatures. Detailed interfacial characterization shows that interfacial layers of SiO₂ form at low and high temperatures. However, at intermediate temperatures, interfaces devoid of SiO₂ were formed.     

Plasmonic tuning of aluminum doped zinc oxide nanostructures by atomic layer deposition

Currently there is a strong interest in plasmonic materials operating in the near‐infrared (NIR), however, conventional metals such as gold and silver possess high optical losses in this region. In this work we demonstrate localized surface plasmon resonances (LSPRs) with low loss in the NIR region by utilizing atomic layer deposition to deposit thin films of aluminium doped zinc oxide onto silicon nanopillars created via nanopshere lithography. The deposited films have excellent conformality and the LSPRs can be tuned from the mid‐infrared to the NIR by controlling the doping concentration, deposition temperature and nanostructure morphology. (© 2014 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

等离子增强原子层沉积低温生长GaN薄膜

采用等离子增强原子层沉积技术在低温下于单晶硅衬底上成功生长了Ga N多晶薄膜,利用椭圆偏振仪、低角度掠入射X射线衍射仪、X射线光电子能谱仪对薄膜样品的生长速率、晶体结构及薄膜成分进行了表征和分析.结果表明,等离子增强原子层沉积技术生长Ga N的温度窗口为210—270?C,薄膜在较高生长温度下呈多晶态,在较低温度下呈非晶态;薄膜中N元素与大部分Ga元素结合成N—Ga键生成Ga N,有少量的Ga元素以Ga—O键存在,多晶Ga N薄膜含有少量非晶态Ga_2O_3.     

Transparent conductive ZnO:Al films grown by atomic layer deposition for Si-wire-based solar cells

Structural, electrical, and optical properties of atomic layer-controlled Al-doped ZnO (ZnO:Al) films grown by atomic layer deposition (ALD) on glass substrates were characterized at various growth temperatures for use as transparent electrodes. The Al atomic content in ZnO:Al films increased due to the reduced ZnO film growth rate with increasing temperature. The preferred orientation of ZnO:Al films was changed, and the optimum condition for best crystallinity was identified by varying the growth temperature. Furthermore, the carrier concentration of free electron was increased by substituting the Zn sites with Al atoms in the crystal, resulting from monolayer growth based on alternate self-limiting surface chemical reactions. The electrical resistivity of ZnO:Al film grown by ALD at 225 °C reached the lowest value of 8.45 × 10⁻⁴ Ω cm, with a carrier mobility of 9.00 cm² V⁻¹ s⁻¹ and optical transmittance of ∼93%. This result demonstrates that ZnO:Al films grown by ALD possess excellent potential for applications in electronic devices and displays as transparent electrodes and surface passivation layers.     

Properties including step coverage of TiN thin films prepared by atomic layer deposition

The physical properties including the step coverage of the TiN films deposited by atomic layer deposition (ALD) technique, using TiCl₄ and NH₃ as the precursors have been investigated. The deposition rate of the TiN film is constant and moderately high (0.6 Å per cycle) under an optimum deposition condition. The film resistivity is appreciably low (200 μΩ cm). The XRD analysis results indicate polycrystalline nature of the TiN films with a (1 1 1) preferred orientation. The XPS and AES analysis results establish that the Cl impurity concentration in the TiN films is lower than 1 at.% and the ratio of Ti and N by atomic concentration in the TiN films is nearly equal to 1:1 AFM analysis reveals that the RMS surface roughness is low. Also it is found by SEM observation that the step coverage of the TiN films with trenches (the aspect ratio being 10:1) is excellent. One hundred percent conformality is observed for both the side/bottom and the side/top sections.     

Atomistics of Ge deposition on Si(100) by atomic layer epitaxy

Chlorine termination of mixed Ge/Si(100) surfaces substantially enhances the contrast between Ge and Si sites in scanning tunneling microscopy observations. This finding enables a detailed investigation of the spatial distribution of Ge atoms deposited on Si(100) by atomic layer epitaxy. The results are corroborated by photoemission measurements aided by an unusually large chemical shift between Cl adsorbed on Si and Ge. Adsorbate-substrate atomic exchange during growth is shown to be important. The resulting interface is thus graded, but characterized by a very short length scale of about one monolayer.     

Temperature dependence of the sticking coefficient in atomic layer deposition

The temperature dependence of the sticking coefficient (SC) of precursor molecules used in atomic layer deposition (ALD) was investigated. Tetrakis(ethylmethylamino)hafnium (TEMAHf) and Pentamethylcyclopentadienyltitan-trimethoxid (Cp*Ti(OMe)₃) were used in combination with ozone to deposit hafnium dioxide and titanium dioxide films at different substrate temperatures. The SC of TEMAHf was determined at 180, 230, and 270 °C. The SC of TEMAHf depends exponentially on the substrate temperature. The activation energy and the pre-exponential factor were obtained for this ALD process. The SC of Cp*Ti(OMe)₃ was determined at 270 °C. A possible explanation for the small SC of Cp*Ti(OMe)₃ could be the reduced symmetry of the precursor molecule. Therefore, symmetric precursor molecules and high process temperatures appear beneficial for efficient ALD processes.