Kinetics and thermal properties of epoxy resins based on bisphenol fluorene structure

The fluorene-containing epoxy, diglycidyl ether of 9,9-bis(4-hydroxyphenyl) fluorene (DGEBF) was synthesized by a two-step reaction procedure. In order to investigate the relationship between fluorene structure and material properties, DGEBF and a commonly used diglycidyl ether of bisphenol A (DGEBA) were cured with 4,4-diaminodiphenyl methane (DDM) and 4,4-(9-fluorenylidene)-dianiline (FDA). The curing kinetics, thermal properties and decomposition kinetics of these four systems (DGEBA/DDM, DGEBF/DDM, DGEBA/FDA, and DGEBF/FDA) were studied in detail. The curing reactivity of fluorene epoxy resins was lower, but the thermal stability was higher than bisphenol A resins. The onset decomposition temperature of cured epoxy resins was not significantly affected by fluorene structure, but the char yield and T_g value were increased with that of fluorene content. Our results indicated that the addition of fluorene structure to epoxy resin is an effective method to improve the thermal properties of resins, but excess fluorene ring in the chain backbone can depress the curing efficiency of the resin.     

Calorimetric studies on an anhydride‐cured epoxy resin from diglycidyl ether of bisphenol‐A and diglycidyl ether of poly(propylene glycol). I. Onset of diffusion control during isothermal polymerization

Calorimetric studies on a series of anhydride‐cured epoxy resins, in which the epoxy oligomer is a mixture of diglycidyl ether of bisphenol‐A (DGEBA) and diglycidyl ether of poly(propylene glycol) (DGEPPG) in different mole ratios, were carried out. DGEPPG is a flexible epoxy oligomer that was used to tune glass transition temperature for the fully reacted epoxy resin. Conversion versus time curves for the systems with different DGEBA/DGEPPG mole ratios (not including the neat DGEPPG system) were found to overlap with each other in mass‐controlled reaction regime, indicating similar reactivities of epoxy groups in both epoxy oligomers. Onset of diffusion‐controlled reaction regime for different systems was estimated by fitting the conversion versus time data using a phenomenological kinetic equation, as well as from direct comparison of the conversion versus time curves. For the systems (i.e., 0, 10, and 30% DGEPPG) that vitrify during reaction, the crossover from mass‐controlled to diffusion‐controlled reaction occurs close to the onset of the vitrification, where T_g is about 25–30 K below the reaction temperature. For the system (i.e., 50% DGEPPG system) that does not vitrify during the reaction, such crossover still occurs when the T_g of the mixture reaches a value about 25 K below the reaction temperature. © 2008 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 46: 2155–2165, 2008     

Evaluation of the performance of microcrystalline cellulose in retarding degradation of two epoxy resin systems

Accelerated weathering studies are necessary to determine future risks arising from the loss of durability of materials under environmental conditions (e.g. ultraviolet irradiation from the sun, moisture from rainfall, temperature cycling). The influence of different accelerated weathering conditions such as UV light and moisture on the properties of two epoxy resin systems incorporating microcrystalline cellulose (MCC) was evaluated. This study aimed to assess changes in chemical properties (FTIR), mechanical properties (tensile tests), thermal properties (TGA and DSC) and morphology (SEM) before and after accelerated weathering. The samples exposed to different accelerated weathering times (1, 2, 3, 4, and 6?months) were based on the diglycidyl ether of bisphenol A, DGEBA, or hydrogenated diglycidyl ether of bisphenol A, HDGEBA, with amine crosslinker (2,2,4-trimethyl-1,6-hexanediamine, TMDA) and 2% MCC. Incorporation of MCC improved thermal stability, reduced surface oxidation, and gave better retention of mechanical properties after accelerated weathering. Both epoxy resins and epoxy composites exhibited a reduction in the tensile strength upon accelerated weathering with the composites showing less reduction in the tensile strength after 6 months. The glass transition temperatures (T_g) before and after accelerated weathering were also measured. DGEBA-TMDA/2%MCC and HDGEBA-TMDA/2% MCC composites reduced the decrease in the T_g after accelerated weathering, compared to that of DGEBA-TMDA and HDGEBA-TMDA samples. Degradation primarily decreased the mechanical properties of the composites, with some damaged specimens showing on the surfaces of DGEBA-TMDA/2% epoxy composites and HGEBA-TMDA/2%MCC composites. Fewer morphological changes with limited voids were seen on the DGEBA epoxy interface for HDGEBA compared to DGEBA composite samples. Incorporation of 2%MCC in DGEBA-TMDA and HDGEBA-TMDA increased resistance to thermal degradation after accelerated weathering.     

Thermal properties and toughness performance of hyperbranched‐polyimide‐modified epoxy resins

An amine‐terminated hyperbranched polyimide (HBPI) was prepared by the condensation polymerization of a commercially available triamine monomer with a dianhydride monomer. The effects of the HBPI content on the thermal and mechanical interfacial properties of diglycidyl ether of bisphenol A (DGEBA) epoxy resins were investigated with several techniques. The thermogravimetric analysis results showed that the thermal stability of the DGEBA/HBPI blends did not obviously change as the HBPI content increased. The glass‐transition temperature (T_g) of the DGEBA/HBPI blends increased with the addition of HBPI. Improvements in the critical stress intensity factor (K_IC) and impact strength of the blends were observed with the addition of HBPI. The K_IC value and impact strength were 2.5 and 2 times the values of the neat epoxy resins with only 4 wt % HBPI. The fractured surfaces were studied with scanning electron microscopy to investigate the morphology of the blends, and they showed that shear deformation occurred to prevent the propagation of cracks in the DGEBA/HBPI blends. These results indicated that a toughness improvement was achieved without a decrease in the thermal stability or T_g. © 2006 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 44: 3348–3356, 2006     

Mechanical and Thermal Properties and Morphology of Epoxy Resins Modified by a Silicon Compound

A silicon compound (GAPSO) was synthesized to modify the diglycidyl ether of bisphenol-A (DGEBA). The chemical structure of GAPSO was confirmed using FT-IR, ²⁹Si NMR and GPC. The mechanical and thermal properties and morphologies of the cured epoxy resins were investigated by impact testing, tensile testing, differential scanning calorimetry and environmental scanning electron microscopy. The impact strength and tensile strength were both increased by introducing GAPSO, meanwhile the glass transition temperature (T_g ) was not decreased and the morphologies of the fracture surfaces show that the compatibility of GAPSO with epoxy resin was very good and the toughening follows the pinning and crack tip bifurcation mechanism. The high functional groups in GAPSO can react during the curing process, and chemically participate in the crosslinking network. GAPSO is thus expected to improve the toughness of epoxy resin, meanwhile maintain the glass transition temperature.     

Facile preparation of novel epoxy curing agents and their high‐performance thermosets

Two flame‐retardant epoxy curing agents, 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐yl‐tris(4‐hydroxyphenyl)methane (1) and 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐yl‐ (4‐aminophenyl)‐bis(4‐hydroxyphenyl)methane (2), were prepared by a facile, economic, one‐pot procedure. The structures of the curing agents were confirmed by IR, high‐resolution mass, 1‐D, and 2‐D NMR spectra. A reaction mechanism was proposed for the preparation, and the effect of electron withdrawing/donating effects on the stabilization of the carbocation was discussed. (1‐2) served as curing agents for diglycidyl ether of bisphenol A (DGEBA), dicyclopentadiene epoxy (HP‐7200), and cresol novolac epoxy (CNE). Properties such as glass transition temperature, coefficient of thermal expansion, thermal decomposition temperature, and flame retardancy of the resulting epoxy thermosets were evaluated. The resulting epoxy thermosets show high T_g, low thermal expansion, moderate thermostability, and excellent flame retardancy. The bulky biphenylene phosphinate pendant makes polymer chains difficult to rotate, explaining the high T_g and low thermal expansion characteristic. © 2008 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 46: 7898–7912, 2008     

Facile, one-pot synthesis of phosphinate-substituted bisphenol A and its alkaline-stable diglycidyl ether derivative

A new phosphinate-substituted bisphenol A, 1,1-bis(4-hydroxyphenyl)-1-(6-oxido-6H-dibenz <c,e> <1,2> oxaphosphorin-6-yl)ethane (1), was prepared by a facile, one-pot procedure. In addition, a reaction mechanism for the preparation of (1) was proposed. Based on (1), a diglycidyl ether derivative (2) was prepared and cured by commercially-available curing agents. The structures of (1-2) were confirmed by IR, high-resolution mass, 1-D and 2-D NMR spectra. Properties such as glass transition temperature, coefficient of thermal expansion, thermal decomposition temperature, and flame retardancy of the resulting thermosets were evaluated and compared with those of the thermosets of diglycidyl ether of bisphenol A. The resulting epoxy thermosets show high T_g, low thermal expansion, good thermostability and excellent flame retardancy.     

Effect of a reactive diluent on the curing and dynamomechanical properties of an epoxy-diamine system

Differential scanning calorimetry was used to study the influence of an epoxy reactive diluent, vinylcyclohexane dioxide, on the curing reaction of a polymeric system composed of diglycidyl ether of bisphenol A (n=0) and 1,2-diaminecyclohexane (DCH). Heat evolution and glass transition temperature, were measured in terms of the added diluent percentage. Experimental results show that both the curing degree and the glass transition temperature of the polymeric system decrease with an increase in the diluent percentage. Dynamic mechanical analysis of several samples also showed that T _g decreases with the increase of diluent percentage, thus corroborating DSC measurements.     

Synthesis and properties of novel fluorinated epoxy resins based on 1,1-bis(4-glycidylesterphenyl)-1-(3′-trifluoromethylphenyl)-2,2,2-trifluoroethane

A novel fluorinated epoxy resin, 1,1-bis(4-glycidylesterphenyl)-1-(3′-trifluoromethylphenyl)-2,2,2-trifluoroethane (BGTF), was synthesized through a four-step procedure, which was then cured with hexahydro-4-methylphthalic anhydride (HMPA) and 4,4′-diaminodiphenyl-methane (DDM). As comparison, a commercial available epoxy resin, bisphenol A diglycidyl ether (BADGE), cured with the same curing agents was also investigated. We found that the BGTF gave the exothermic starting temperature lower than BADGE no mater what kind of curing agents applied, implying the reactivity of the former is higher than the latter. The fully cured fluorinated BGTF epoxy resins have good thermal stability with glass transition temperature of 170-175 °C and thermal decomposition temperature at 5% weight loss of 370-382 °C in nitrogen. The fluorinated BGTF epoxy resins also showed the mechanical properties as good as the commercial BADGE epoxy resins. The cured BGTF epoxy resins exhibited improved dielectric properties as compared with the BADGE epoxy resins with the dielectric constants and the dissipation factors lower than 3.3 and dissipation 2.8 × 10⁻³, respectively, which is related to the low polarizability of the C-F bond and the large free volume of CF₃ groups in the polymer. The BGTF epoxy resins also gave low water absorption because of the existence of hydrophobic fluorine atom.     

Synthesis and thermal characterization of phosphorus containing siliconized epoxy resins

Siliconized epoxy matrix resin was developed by reacting diglycidyl ethers of bisphenol A (DGEBA) type epoxy resin with hydroxyl terminated polydimethylsiloxane (silicone) modifier, using γ-aminopropyltriethoxysilane crosslinker and dibutyltindilaurate catalyst. The siliconized epoxy resin was cured with 4, 4-diaminodiphenylmethane (DDM), 1,6-hexanediamine (HDA), and bis (4-aminophenyl) phenylphosphate (BAPP). The BAPP cured epoxy and siliconized epoxy resins exhibit better flame-retardant behaviour than DDM and HDA cured resins. The thermal stability and flame-retardant property of the cured epoxy resins were studied by thermal gravimetric analysis (TGA) and limiting oxygen index (LOI). The glass transition temperatures (T_g) were measured by differential scanning calorimetry (DSC) and the surface morphology was studied by scanning electron microscopy (SEM). The heat deflection temperature (HDT) and moisture absorption studies were carried out as per standard testing procedure. The thermal stability and flame-retardant properties of the cured epoxy resins were improved by the incorporation of both silicone and phosphorus moieties. The synergistic effect of silicone and phosphorus enhanced the limiting oxygen index values, which was observed for siliconized epoxy resins cured with phosphorus containing diamine compound.     

Phosphonyl/hydroxyl hydrogen bonding–induced miscibility of poly(arylene ether phosphine oxide/sulfone) statistical copolymers with poly(hydroxy ether) (phenoxy resin): Synthesis and characterization

High molecular weight bisphenol A or hydroquinone‐based poly(arylene ether phosphine oxide/sulfone) homopolymer or statistical copolymers were synthesized and characterized by thermal analysis, gel permeation chromatography, and intrinsic viscosity. Miscibility studies of blends of these copolymers with a (bisphenol A)‐epichlorohydrin based poly(hydroxy ether), termed phenoxy resin, were conducted by infrared spectroscopy, dynamic mechanical analysis, and differential scanning calorimetry. All of the data are consistent with strong hydrogen bonding between the phosphonyl groups of the copolymers and the pendent hydroxyl groups of the phenoxy resin as the miscibility‐inducing mechanism. Complete miscibility at all blend compositions was achieved with as little as 20 mol % of phosphine oxide units in the bisphenol A poly(arylene ether phosphine oxide/sulfone) copolymer. Single glass transition temperatures (T_g) from about 100 to 200°C were achieved. Replacement of bisphenol A by hydroquinone in the copolymer synthesis did not significantly affect blend miscibilities. Examination of the data within the framework of four existing blend T_g composition equations revealed T_g elevation attributable to phosphonyl/hydroxyl hydrogen bonding interactions. Because of the structural similarities of phenoxy, epoxy, and vinylester resins, the new poly(arylene ether phosphine oxide/sulfone) copolymers should find many applications as impact‐improving and interphase materials in thermoplastics and thermoset composite blend compositions. © 1999 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 37: 1849–1862, 1999     

Dynamic mechanical analysis

Using dynamic mechanical analysis (DMA) we have studied thermal degradation for a system containing a diglycidyl ether of bisphenol A (DGEBA) and 1,3-bisaminomethylcylohexane (1,3-BAC). The changes of dynamic mechanical properties during thermal degradation indicated a shift of the glass transition temperature (T _g) to higher temperatures and a decrease in the peak value of the dynamic loss factor (tan δ) with an increasing of aging time. The value of dynamic storage modulus (E′) at the rubbery state showed an increase with aging time, whiteE′ at the glassy state only underwent a moderate change with increased thermal degradation. From these results it can be argued that thermal degradation during the stage prior to the onset of the severe degradation involves structural changes in the epoxy system, as further crosslinking and loss of dangling chains in the crosslinked network.     

Liquid crystalline epoxies bearing biphenyl ether and aromatic ester mesogenic units: Synthesis and thermal properties

Two liquid crystalline epoxies containing biphenyl ether and aromatic ester mesogenic units, oxybis(4,1-phenylene)bis(4-(oxiran-2-ylmethoxy)benzoate)(LCE1) and oxybis(4,1-phenylene) bis(4-(4-(oxiran-2-yl)butoxy)benzoate)(LCE2), were synthesized and characterized. Subsequently, the epoxy monomers were cured with diaminodiphenylsulfone (DDS). From DSC, XRD and POM results, monomers did not show liquid crystalline phase while the cured samples exhibited nematic phase. The cured samples showed good mechanical properties with strength of 99.1MPa and excellent thermal stabilities with high glass transition temperature up to 168.0?°C, 5% weight loss temperature at 343?°C and high char yield of 24.5% at 800?°C. The relationship between thermal conductivity and network structure was discussed in this work. Due to the introduction of mesogenic units into epoxy networks, the cured resins showed high thermal conductivity as high as 0.292?W/(m*K), more than 1.5times higher than conventional epoxy resins. By introducing alumina (Al₂O₃) into LCE1/DDS cured system, composites of LCE1/DDS/Al₂O₃ with the highest thermal conductivity of 1.61?W/(m*K) was obtained with the content of 80?wt% while that of diglycidyl ether of bisphenol A (DGEBA, E51) epoxy resin/DDS/Al₂O₃ was 1.10?W/(m*K). The as-prepared epoxy resins showed high glass transition temperature and excellent thermal stabilities, indicating the potential of application in microelectronics.     

Degradable and chemically recyclable epoxy resins containing acetal linkages: Synthesis,properties, and application for carbon fiber‐reinforced plastics

Four sorts of epoxy resins containing degradable acetal linkages were synthesized by the reaction of bisphenol A (BA) or cresol novolak (CN) resin with vinyl ethers containing a glycidyl group [4‐vinlyoxybutyl glycidyl ether (VBGE) and cyclohexane dimethanol vinyl glycidyl ether (CHDMVG)] and cured with known typical amine‐curing agents. The thermal and mechanical properties of the cured resins were investigated. Among the four cured epoxy resins, the CN‐CHDMVG resin (derived from CN and CHDMVE) exhibited relatively high glass transition temperature (T_g = ca. 110 °C). The treatment of these cured epoxy resins with aqueous HCl in tetrahydrofuran (THF) at room temperature for 12 h generated BA and CN as degradation main products in high yield. Carbon fiber‐reinforced plastics (CFRPs) were prepared by heating the laminated prepreg sheets with BA‐CHDMVG (derived from BA and CHDMVE) and CN‐CHDMVG, in which strands of carbon fibers are impregnated with the epoxy resins containing conventional curing agents and curing accelerators. The obtained CFRPs showed good appearance and underwent smooth breakdown with the aqueous acid treatment in THF at room temperature for 24 h to produce strands of carbon fiber without damaging their surface conditions and tensile strength. © 2012 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2012     

Synthesis and properties of phosphorus-containing bio-based epoxy resin from itaconic acid

A phosphorus-containing bio-based epoxy resin (EADI) was synthesized from itaconic acid (IA) and 9,10-dihydro-9-oxa-10-phosphaphenanthrene 10-oxide (DOPO). As a matrix, its cured epoxy network with methyl hexahydrophthalic anhydride (MHHPA) as the curing agent showed comparable glass-transition temperature and mechanical properties to diglycidyl ether in a bisphenol A (DGEBA) system as well as good flame retardancy with UL94 V-0 grade during a vertical burning test. As a reactive flame retardant, its flame-resistant effect on DGEBA/MHHPA system as well as its influence on the curing behavior and the thermal and mechanical properties of the modified epoxy resin were investigated. Results showed that after the introduction of EADI, not only were the flame retardancy determined by vertical burning test, LOI measurement, and thermogravimetric analysis significantly improved, but also the curing reactivity, glass transition temperature (T _g), initial degradation temperature for 5% weight loss (T _d(5%)), and flexural modulus of the cured system improved as well. EADI has great potential to be used as a green flame retardant in epoxy resin systems.     

Preparation and Properties of Epoxy Resins Containing Quinazolone Rings

Epoxy resins containing quinazolone rings were synthesized and characterized. Epoxy resins were made by reacting bisquinazolone phenol or bisquinazoline with epichlorohydrin or the diglycidyl ether of Bisphenol A. These resins were analyzed by DSC, GPC, IR, and NMR. The electrical and mechanical properties of the cured resins were evaluated. They have glass transition temperature above 200°C and excellent thermal stability, and T_g increases in the order of o-, m-, p-substituted phenol groups.     

Comparative Study of the Thermal Stability of the Epoxy Systems BADGE n=0/1, 2 DCH and BADGE n=0/1, 2 DCH/CaCO3

The thermal degradation of the epoxy systems diglycidyl ether of bisphenol A (BADGE n=0)/1, 2 diamine cyclohexane (DCH) and diglycidyl ether of bisphenol A (BADGE n=0)/1, 2 diaminecyclohexane (DCH) containing calcium carbonate filler immersed and not immersed in hydrochloric acid have been studied by thermogravimetric analysis in order to compare their decomposition processes and to determine the reaction mechanism of the degradation processes. The value of the activation energies, necessary for this study, were calculated using various integral and differential methods. Analysis of the results suggests that hydrochloric acid does not affect the decomposition of the epoxy network and that the reaction mechanisms produce sigmoidal-type curves for the systems not immersed in HCl and deceleration curves for the same systems immersed. This revised version was published online in July 2006 with corrections to the Cover Date.     

Synthesis of a novel DPPA‐containing benzoxazine to flame‐retard epoxy resin with maintained thermal properties

The flame‐retarded epoxy resin with improved thermal properties based on environmentally friendly flame retardants is vital for industrial application. Hereby, a novel reactive‐type halogen‐free flame retardant, 10‐(3‐(4‐hydroxy phenyl)‐3,4‐dihydro‐2H‐benzo[e] [1,3] oxazin‐4‐yl)‐5H‐phenophosphazinine 10‐oxide (DHA‐B) was synthesized via a two‐step reaction route. Its structure was characterized using ¹H, ¹³C, and ³¹P NMR and HRMS spectra. For 4,4′‐diaminodipheny ethane (DDM) and diglycidyl ether of bisphenol A (DGEBA)‐cured systems, the epoxy resin with only 2 wt% loading of DHA‐B passed V‐0 rating of UL‐94 test. Significantly, its glass transition temperature (T_g) and initial decomposition temperature (T_5%) were as high as 169.6°C and 359.6°C, respectively, which were even higher than those of the corresponding original epoxy resin. Besides, DHA‐B decreased the combustion intensity during combustion. The analysis of residues after combustion suggested that DHA‐B played an important role in the condensed phase.     

Miscibility and intermolecular specific interactions in thermosetting blends of bisphenol S epoxy resin with poly(ethylene oxide)

Thermosetting blends composed of phloroglucinol‐cured bisphenol S epoxy resin and poly(ethylene oxide) (PEO) were prepared via the in situ curing reaction of epoxy in the presence of PEO, which started from initially homogeneous mixtures of diglycidyl ether of bisphenol S, phloroglucinol, and PEO. The miscibility of the blends after and before the curing reaction was established on the basis of thermal analysis (differential scanning calorimetry). Single and composition‐dependent glass‐transition temperatures (T_g's) were observed for all the blend compositions after and before curing. The experimental T_g's could be explained well by the Gordon–Taylor equation. Fourier transform infrared spectroscopy indicated that there were competitive hydrogen‐bonding interactions in the binary thermosetting blends upon the addition of PEO to the system, which was involved with the intramolecular and intermolecular hydrogen‐bonding interactions, that is, OH···O?S, OH···OH, and OH, versus ether oxygen atoms of PEO between crosslinked epoxy and PEO. On the basis of infrared spectroscopy results, it was judged that from weak to strong the strength of the hydrogen‐bonding interactions was in the following order: OH···O?S, OH···OH, and OH versus ether oxygen atoms of PEO. © 2005 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 43: 359–367, 2005     

Miscibility in crystalline/amorphous blends of poly(3-hydroxybutyrate)/DGEBA

A differential scanning calorimetry (DSC) and small-angle X-ray scattering (SAXS) study of miscibility in blends of the semicrystalline polyester poly(3-hydroxybutyrate) (PHB) and amorphous monomer epoxy DGEBA (diglycidyl ether of bisphenol A) was performed. Evidence of the miscibility of PHB/DGEBA in the molten state was found from a DSC study of the dependence of glass transition temperature (T_g) as a function of the blend composition and isothermal crystallization, analyzing the melting point (T_m) as a function of blend composition. A negative value of Flory–Huggins interaction parameter χ_PD was obtained. Furthermore, the lamellar crystallinity in the blend was studied by SAXS as a function of the PHB content. Evidence of the segregation of the amorphous material out of the lamellar structure was obtained. © 2013 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys, 2013