Material processing of dielectrics with temporally asymmetric shaped femtosecond laser pulses on the nanometer scale

Laser material processing of dielectrics with temporally asymmetric femtosecond laser pulses of identical fluence, spectrum, and statistical pulse duration is investigated experimentally. To that end single shot structures at the surface of fused silica as a function of fluence and pulse shape are analyzed with the help of scanning electron microscopy. Structures for the bandwidth limited pulses show the known expansion in structure size with increasing laser fluence approaching the diffraction limit, which is 1.4 μm for the 0.5NA microscope objective used. In contrast, structures from the asymmetric pulses are remarkably stable with respect to variations in laser fluence and stay below 300 nm despite doubling the fluence. Different thresholds for surface material modification with respect to an asymmetric pulse and its time reversed counterpart are attributed to control of different ionization processes.     

Infrared steam laser cleaning

Steam Laser Cleaning with a pulsed infrared laser source is investigated. The infrared light is tuned to the absorption maximum of water (λ=2.94 μm, 10 ns), whereas the substrates used are transparent (glass, silicon). Thus a thin liquid water layer condensed on top of the contaminated substrate is rapidly heated. The pressure generated during the subsequent phase explosion generates a cleaning force which exceeds the adhesion of the particles. We examine the cleaning threshold in single shot experiments for particles sized from 1 μm down to 300 nm.     

Investigations on ultrafast welding of glass–glass and glass–silicon

Using ultrafast laser radiation glass substrates are welded with glass and silicon plates. The pump beam is focused by a microscope objective with large NA=0.4 (beam diameter 4 μm) into the glass. After partial absorption of the optical energy, the glass is heated and melted. Procedures for high-quality welding of glass–glass and glass–silicon substrates with high-repetition ultra-fast laser radiation have been derived at the repetition rate 700 kHz. The dependencies of the dimension and geometry of the welding seam on scan velocity, repetition rate and pulse energy have been investigated defining a process window. Adding a noninterferometric technique for quantitative phase detection with the welding setup, the interaction zone of the welding seam for the welding partners glass–glass is detected. A change in refractive index is induced by heating and compression of the glass and has been detected by phase detection up to 2 μs after irradiation with 100 fs time resolution.     

Delayed pulse referencing for cancellation of polychromatic beating noise in grating spectrometry

We use a grating spectrometer with a time resolution of 17.4 μs and a spectral resolution of 5 GHz to analyze a superluminescent source operating near 1350 nm. Polychromatic beating noise is shown to dominate single-shot measurements of the source spectrum; the observed noise level is within 19% of the theoretical beating noise level. By adopting a delayed pulse referencing scheme used previously with wavelength-swept sources, the beating noise is virtually eliminated, allowing spectral measurements limited only by shot noise and camera read noise.     

Characterization of a high efficiency, ultrashort pulse shaper incorporating a reflective 4096-element spatial light modulator

We demonstrate pulse shaping via arbitrary phase modulation with a reflective, 1 × 4096 element, liquid crystal spatial light modulator (SLM). The unique construction of this device provides a very high efficiency when the device is used for phase modulation only in a prism based pulse shaper, namely 85%. We also present a single shot characterization of the SLM in the spatial domain and a single shot characterization of the pulse shaper in the spectral domain. These characterization methods provide a detailed picture of how the SLM modifies the spectral phase of an ultrashort pulse.     

Aluminum thin film enhanced IR nanosecond laser-induced frontside etching of transparent materials

Laser processing of glass is of significant commercial interest for microfabrication of precision optical engineering devices. In this work, a laser ablation enhancement mechanism for microstructuring of glass materials is presented. The method consists of depositing a thin film of aluminum on the front surface of the glass material to be etched. The laser beam modifies the glass material by being incident on this front-side. The influence of ablation fluence in the nanosecond regime, in combination with the deposition of the aluminum layer of various thicknesses, is investigated by determining the ablation threshold for different glass materials including soda-lime, borosilicate, fused silica and sapphire. Experiments are performed using single laser pulse per shot in an air environment. The best enhancement in terms of threshold fluence reduction is obtained for a 16 nm thick aluminum layer where a reduction of two orders of magnitude in the ablation threshold fluence is observed for all the glass samples investigated in this work.     

AlGaInAs/InP eye-safe laser pumped by a Q-switched Nd:GdVO<Subscript>4</Subscript> laser

An AlGaInAs quantum-well structure grown on a Fe-doped InP transparent substrate is developed to be a gain medium in a high-peak-power nanosecond laser at 1570 nm. Using an actively Q-witched 1064 nm laser to pump the gain chip, an average output power of 135 mW is generated at a pulse repetition rate of 30 kHz and an average pump power of 1.25 W. At a pulse repetition rate of 20 kHz, the peak output power is up to 290 W at a peak pump power of 2.3 kW.     

Practical comparison of sensitivity and resolution between STMAS and MQMAS for Al

An experimental comparison of sensitivity and resolution of satellite transition (ST) MAS and multiple quantum (MQ) MAS was performed for ²⁷Al (I = 5/2) using several pulse sequences with a z-filter and SPAM, and two inorganic samples of kaolin (Al₂Si₂O₅(OH)₄) and glass (43.1CaO–12.5Al₂O₃–44.4SiO₂). Six pulse sequences of STMAS (double-quantum filter-soft pulse added mixing = DQF-SPAM, double-quantum filter = DQF, double-quantum = DQ) and MQMAS (3QMAS-z-filter = 3Qz, 3QMAS-SPAM = 3Q-SPAM, 5QMAS-z-filter = 5Qz) are employed. All experiments have been conducted utilizing a static field of 16.4 T (700 MHz for ¹H) and a rotor spinning frequency of 20 kHz. Dependence of S/N ratios as a function of radio frequency (r.f.) field strengths indicates that strong r.f. fields are essential to obtain a better S/N ratio in all experiments. High sensitivity is obtained in the following order: DQF-SPAM, DQF, DQ, 3QSPAM, and 3Qz, although the degree of sensitivity enhancement given by STMAS for glass is slightly smaller than that for kaolin. This might be due to the different excitation and conversion efficiencies of ST and MQ coherences as a function C_q values because quadrupolar interaction of the glass are widely distributed, or to motional broadening caused by framework flexibility in the structure of glass. With respect to resolution, the full widths at half maximum (FWHM) of F₁ projections of DQF-STMAS and 3QMAS spectra for kaolin are found to be comparable, which agrees with a simulated result reported in a literature. For glass, the STMAS possess slightly wider line widths than 3QMAS. However, because such a difference in line widths of STMAS and 3QMAS spectra is substantially small, we have concluded that STMAS and 3QMAS have comparable resolution for crystalline and non-crystalline materials.     

Micro-hole processing of polyimide film by ultra-short laser pulses and its applications

Micro machining of a polyimide film with ultra-short pulsed laser was demonstrated. A through-hole with a diameter of less than 10 μm could be produced by optimizing the pulse duration, repetition rate, and number of shots. Thermal damage around the through-hole can be made negligibly small when the pulse duration was shorter than 140 fs. We also found that the minimum shot number needed for the creation of a through-hole becomes smaller as the repetition rate of laser shot increases. On the basis of the optimum irradiation condition, we demonstrated laser cutting of a polyimide film without thermal damage and copper filling in through-holes with diameters of 9 μm by a plating process.     

Nonlinear photoionization and laser-induced damage in silicate glasses by infrared ultrashort laser pulses

We show that photoionization of wide band gap silicate glasses by infrared ultrashort laser pulses can occur without laser-induced damage. Two glasses are studied, fused silica and a multi-component silicate photo-thermo-refractive (PTR) glass. Experiments are performed by low numerical aperture focusing of ultrashort laser pulses (100 fsec<τ<1.5 psec) at the wavelengths 780 nm, 1430 nm, and 1550 nm. Filaments form inside both glasses and are visibly observable due to intrinsic luminescence. Keldysh’s theory of nonlinear photoionization is used to model the formation of filaments and values of about 10¹³ W cm⁻² for the laser intensity and 10¹⁹ cm⁻³ for the free electron density are estimated for stable filaments to arise. Laser-induced damage is studied by the generation of a third harmonic from an interface created between a damage site and the surrounding glass matrix. It is found that third harmonic generation occurs only after several thousands of laser shots indicating that damage is not a single-shot phenomena. The ability to photoionize PTR glass without damage by ultrashort laser pulses offers a new approach for fabricating diffractive optical elements in photosensitive glass.     

Nanosecond pulsed laser ablation of silicon in liquids

Laser fluence and laser shot number are important parameters for pulse laser based micromachining of silicon in liquids. This paper presents laser-induced ablation of silicon in liquids of the dimethyl sulfoxide (DMSO) and the water at different applied laser fluence levels and laser shot numbers. The experimental results are conducted using 15 ns pulsed laser irradiation at 532 nm. The silicon surface morphology of the irradiated spots has an appearance as one can see in porous formation. The surface morphology exhibits a large number of cavities which indicates as bubble nucleation sites. The observed surface morphology shows that the explosive melt expulsion could be a dominant process for the laser ablation of silicon in liquids using nanosecond pulsed laser irradiation at 532 nm. Silicon surface’s ablated diameter growth was measured at different applied laser fluences and shot numbers in both liquid interfaces. A theoretical analysis suggested investigating silicon surface etching in liquid by intense multiple nanosecond laser pulses. It has been assumed that the nanosecond pulsed laser-induced silicon surface modification is due to the process of explosive melt expulsion under the action of the confined plasma-induced pressure or shock wave trapped between the silicon target and the overlying liquid. This analysis allows us to determine the effective lateral interaction zone of ablated solid target related to nanosecond pulsed laser illumination. The theoretical analysis is found in excellent agreement with the experimental measurements of silicon ablated diameter growth in the DMSO and the water interfaces. Multiple-shot laser ablation threshold of silicon is determined. Pulsed energy accumulation model is used to obtain the single-shot ablation threshold of silicon. The smaller ablation threshold value is found in the DMSO, and the incubation effect is also found to be absent.     

Design and construction of Q-switched Nd:YAG laser system for LIBS measurements

A passive, Q-switched pulsed, Nd:YAG laser system was designed and built, which can provide a potential compact robust laser source for portable laser induced breakdown spectroscopy systems.The developed laser system operates at 1064 nm. Each laser shot contains a train of pulses having maximum total output energy of 170 mJ. The number of pulses varies from 1–6 pulses in each laser shot depending on the pump energy. The pulse width of each pulse ranges from 20 to 30 ns. The total duration of the output pulse train is within 300 μs. The multi-pulse nature of the laser shots was employed to enhance the LIBS signal. To validate the system, LIBS measurements and analysis were performed on ancient ceramic samples collected from Al-Fustat excavation in Old Cairo. The samples belong to different Islamic periods in Egypt history. The results obtained are highly indicative that useful information can be provided to archeologists for use in restoring and repairing of precious archeological objects.     

超强激光与Ar团簇相互作用中X射线的研究

本文主要研究了超强超短激光与Ar团簇相互作用过程中X射线能谱、K壳层光子产额、能量转换效率以及激光对比度对X射线光子产额的影响.实验中得到K壳层的光子产额约为1× 10¹¹/发,能量转换效率约为2.8× 10^-5．同时观测到较强预脉冲离化团簇会导致预电离,产生膨胀等离子体,然而主脉冲与膨胀的等离子体相互作用的强度较未膨胀时降低了,从而导致K壳层光子产额降低,而使用高对比度的激光能增加X射线光子产额.     

Effect of the ceramic grain size and concentration on the dynamical mechanical and dielectric behavior of poly(vinilidene fluoride)/Pb(Zr<Subscript>0.53</Subscript>Ti<Subscript>0.47</Subscript>)O<Subscript>3</Subscript> composites

Laser-induced backside wet and dry etching (LIBWE and LIBDE) methods were developed for micromachining of transparent materials. Comparison of these techniques is helpful in understanding the etching mechanism but was not realized due to complications in setting up comparable experimental conditions. In our comparative investigations we used a solid tin film for dry and molten tin droplets for wet etching of fused-silica plates. A tin–fused-silica interface was irradiated through the sample by a KrF excimer laser beam (λ=248 nm, FWHM=25 ns); the fluence was varied between 400 and 2100 mJ/cm². A significant difference between the etch depths of the two investigated methods was not found. The slopes of the lines fitted to the measured data (sl_LIBDE=0.111 nm/mJ cm⁻², sl_LIBDE=0.127 nm/mJ cm⁻²) were almost similar. Etching thresholds for LIBDE and LIBWE were approximately 650 and 520 mJ/cm², respectively. To compare the dependence of etch rates on the pulse number, target areas were irradiated at different laser fluences and pulse numbers. With increasing pulse number a linear rise of depth was found for wet etching while for dry etching the etch depth increase was nonlinear. Secondary ion mass spectroscopic investigations proved that this can be due to the reconstruction of a new thinner tin-containing surface layer after the first pulse.     

Ultra-narrow-band tunable laserline notch filter

We report on an angularly tunable laserline notch filter from 760 to 785 nm with optical density of 5.7, 3 dB bandwidth of 9 cm⁻¹ (0.55 nm) and greater than 80% transmission. The notch filter is a single element composed of six bonded slanted reflective holographic gratings in glass.     

Crackless linear through-wafer etching of Pyrex glass using <Emphasis Type="Italic">liquid-assisted</Emphasis> CO<Subscript>2</Subscript> laser processing

Pyrex glass etching is an important technology for the microfluid application to lab-on-a-chip devices, but suffers from very low etching rate and mask-requiring process in conventional HF/BOE wet or plasma dry etching as well as thermal induced crack surface by CO₂ laser processing. In this paper, we applied the liquid-assisted laser processing (LALP) method for linear through-wafer deep etching of Pyrex glass without mask materials to obtain a crackless surface at very fast etching rates up to 25 μm/s for a 20 mm long trench. The effect of laser scanning rate and water depth on the etching of the 500 μm thick Pyrex glass immersed in liquid water was investigated. The smooth surface without cracks can be achieved together with the much reduced height of bulge via an appropriate parameter control. A mechanism of thermal stress reduction in water and shear-force-enhanced debris removal is discussed. The quality improvement of glass etching using LALP is due to the cooling effect of the water to reduce the temperature gradient for a crackless surface and natural convection during etching to carry away the debris for diminishing bulge formation. An erratum to this article can be found at     

Standing electron plasma wave mechanism of void array formation inside glass by femtosecond laser irradiation

We investigate the mechanism of formation of periodic void arrays inside fused silica and BK7 glass irradiated by a tightly focused femtosecond (fs) laser beam. Our results show that the period of each void array is not uniform along the laser propagation direction, and the average period of the void array decreases with increasing pulse number and pulse energy. We propose a mechanism in which a standing electron plasma wave created by the interference of a fs-laser-driven electron wave and its reflected wave is responsible for the formation of the periodic void arrays. PACS 61.80.Ba; 42.65.Re; 42.70.Ce; 61.72.Qq; 52.35.Mw     

Near-field modification of femtosecond laser beam to enhance single-shot pulse filamentation in glass medium

In this paper, a study of the effect of a transparent dielectric medium (soda-lime glass placed after an objective lens) on femtosecond pulse filamentation in Corning Eagle²⁰⁰⁰ glass is presented. The dielectric medium placed after the objective lens increases the effective numerical aperture of the focusing lens and tightly focuses the beam to elevate the power density in a tiny focal volume. A single-shot narrow filamentary void of diameter 3.8 μm is observed to propagate as long as 700 μm in Corning Eagle²⁰⁰⁰ glass. Elevated optical intensity confined in the small focal volume and low ionization losses per unit length in the narrow plasma column collectively enhance the filamentary propagation of the ultra-short pulse in bulk glass. The applied technique also offers an approach to control the length and width of a filamentary void structure in a transparent dielectric medium.     

Transversely pumped laser using F 3 + and F2 mixed color centers in a LiF crystal at room temperature

A stable laser with F₃⁺ and F₂ mixed color centers in LiF crystal is constructed using a transversely pumped cavity at room temperature. The mixed color center laser is pumped with a nitrogen-laser-pumped dye laser. A pulse output of the laser is 0.23 mJ. The pulse widths of the F₃⁺ and F₂ color center lasers are about 12 and 8.5 ns, respectively. The optical–optical conversion efficiency is about 5.0%. The divergence of the F₃⁺ color center laser beam is about 2.2 mrad and that of the F₂ color center laser beam about 3.5 mrad. The polarization of the mixed color center laser is about 0.97. The output of the F₃⁺ color center laser extends from 515 to 575 nm and peaks at 540 nm, while that of the F₂ color center laser extends from 633 to 705 nm and peaks at 667 nm.     

Transient reflectivity and transmission changes during plasma formation and ablation in fused silica induced by femtosecond laser pulses

We have studied the plasma formation and ablation dynamics in fused silica upon irradiation with a single 120 fs laser pulse at 800 nm by using fs-resolved pump-probe microscope. It allows recording images of the laser-excited surface at different time delays after the arrival of the pump pulse. This way, we can extract both the temporal evolution of the surface reflectivity and transmission, at 400 nm, for different spatial positions in the spots (and thus for different local fluences) from single series of images. At fluences well above the visible ablation threshold, a fast and large increase of the reflectivity is induced by the formation of a dense free-electron plasma. The maximum reflectivity value is reached within ≈1.5 ps, while the normalized transmission decreases within ≈400 fs. The subsequent temporal evolution of both transient reflectivity and transmission are consistent with the occurrence of surface ablation. In addition, the time-resolved images reveal the existence of a free-electron plasma distribution surrounding the visible ablation crater and thus formed at local fluences below the ablation threshold. The lifetime of this sub-ablation plasma is ≈50 ps, and its maximum electron density amounts to 5.5×10²² cm⁻³.