压电双材料界面钝裂纹附近螺型位错的屏蔽效应与发射条件

研究了压电双材料界面钝裂纹附近螺型位错的屏蔽效应与发射条件.应用保角变换技术,得到了复势函数与应力场的封闭形式解,讨论了位错方位、双材料电弹常数及裂纹钝化程度对位错屏蔽效应和发射条件的影响.结果表明,Burgers矢量为正的螺型位错可以降低界面钝裂纹尖端的应力强度因子(屏蔽效应),屏蔽效应随位错方位角及位错与裂纹尖端距...     

螺型位错偶极子与界面钝裂纹的干涉效应

研究了螺型位错偶极子与界面钝裂纹的干涉效应.应用保角变换技术,得到了复势函数与应力场的封闭解析解,讨论了位错偶极子方位、臂长及裂纹钝化程度对位错偶板子屏蔽效应和发射条件的影响.结果表明,与单个螺型位错不同,螺型位错偶极子与x轴夹角在一定范围内时才可以降低界面钝裂纹尖端的应力强度因子(屏蔽效应),屏蔽效应随偶板子臂长的增大而增强,随裂纹钝化程度的增大而增强,屏蔽区域也随裂纹钝化程度的增大而增大;位错偶极子发射所需的临界无穷远加载随偶极子臂长的增加而减小,随位错方位角及裂纹钝化程度的增加而增大;最可能的位错偶极子发射角度为0.螺型位错偶极子的发射比单个螺型位错的发射要困难.本文解答的特殊情况与相关文献给出的解答一致.     

位错偶极子和Ⅲ型界面裂纹的干涉效应

研究了多晶体材料中螺型位错偶极子和界面裂纹的弹性干涉作用.利用复变函数方法,得到了该问题复势函数的封闭形式解答.求出了由位错偶极子诱导的应力场和裂纹尖端应力强度应子,分析了偶极子的方向,偶臂和位置以及材料失配对应力强度因子的影响.推导了作用在螺型位错偶极子中心的像力和力偶矩,并讨论了界面裂纹几何条件和不同材料特征组合对位错偶极子平衡位置的影响规律.结果表明,裂纹尖端的螺型位错偶极子对应力强度因子会产生强烈的屏蔽或反屏蔽效应.同时,界面裂纹对螺型位错偶极子在材料中运动有很强的扰动作用.     

压电螺位错与含界面裂纹圆形涂层夹杂的干涉

研究位于基体或夹杂中任意点的压电螺型位错与含界面裂纹圆形涂层夹杂的电弹耦合干 涉问题. 运用复变函数方法,获得了基体,涂层和夹杂中复势函数的一般解答. 典型例 子给出了界面含有一条裂纹时,复势函数的精确级数形式解. 基于已获得的复势函数和广 义Peach-Koehler公式,计算了作用在位错上的像力. 讨论了裂纹几何条件,涂层厚度和材 料特性对位错平衡位置的影响规律. 结果表明,界面裂纹对涂层夹杂附近的位错运动有很大 的影响效应,含界面裂纹涂层夹杂对位错的捕获能力强于完整粘结情况;并发现界面裂纹长 度和涂层材料常数达到某一个临界值时可以改变像力的方向. 解答的特殊情形包含了以 往文献的几个结果.     

二维位错裂纹的稳定性分析

在已有的一维穿透位错裂纹模型及能量计算的基础上，将其推广为二维椭圆盘状裂纹模型，并计算了其能量．根据能量平衡原理，给出了位错裂纹模型的裂纹平衡尺寸、裂纹扩展临界应力．并与不考虑位错影响的宏观断裂力学中Ⅰ型穿透裂纹的Ｇｒｉｆｉｔｈ解及椭圆盘裂纹的Ｇｒｉｆｉｔｈ解加以比较．给出的位错裂纹模型解在位错数目ｎ＝０时与宏观断裂力学解一致     

增强相/夹杂内螺位错偶极子与含共焦钝裂纹椭圆夹杂的干涉效应

运用弹性力学的复势方法,研究了纵向剪切下增强相/夹杂内螺型位错偶极子与含共焦钝裂纹椭圆夹杂的干涉效应,得到了该问题复势函数的封闭形式解答,由此推导出了夹杂区域的应力场、作用在螺型位错偶极子中心的像力和像力偶矩以及裂纹尖端应力强度因子级数形式解。并分析了位错偶极子倾角 、钝裂纹尺寸和材料常数对位错像力、像力偶矩以及应力强度因子的影响。数值计算结果表明：位错像力、像力偶矩以及应力强度因子均随位错偶极子倾角做周期变化;夹杂内部的椭圆钝裂纹明显增强了硬基体对位错的排斥,减弱了软基体对位错的吸引,且对于硬夹杂,位错出现了一个不稳定平衡位置,该平衡位置随钝裂纹曲率的增大不断向界面靠近;变化 值将出现改变位错偶极子对应力强度因子作用方向的临界值。     

分子动力学方法在研究材料力学行为中的应用进展

报道近年来分子动力学方法应用于研究位错、裂纹、晶界及其相互作用方面的进展．主要包括:裂纹尖端的位错发射,位错发射的不稳定堆垛能,晶体与裂纹’几何关系对位错发射的影响,温度对位错发射的影响以及由裂纹尖端发射的位错列与不对称倾侧晶界的相互作用．报道主要以我们的工作为主,重点讨论裂纹尖端位错发射的研究结果      

单晶Ⅰ型弹塑性开裂取向效应的离散位错动力学-近场动力学研究

本文采用基于近场动力学框架的位错动力学叠加模型对FCC单晶在四种不同取向下的I型弹塑性开裂行为进行模拟研究.在模型中,无需预设裂纹扩展路径和内聚力区域,裂纹扩展路径由位错与裂纹的相互作用自动确定.数值计算了FCC单晶体在不同取向时的位错分布演化和裂纹扩展路径.分析表明取向会影响韧性和断裂行为,并证实了单晶体的单轴拉伸开裂行为遵循施密特因子关系,即位错更倾向于在施密特因子大的滑移面上形核并滑移.计算得到位错裂纹演化结果显示,不同取向时位错在滑移系上的分布和演化行为会导致不同晶体断裂模式.     

Peierls框架与裂纹尖端位错行为

本文在Ｐｅｉｅｒｌｓ框架下对裂纹尖端位错成核与发射问题进行了严格的数学分析，在修正Ｒｉｃｅ设相的基础上，建立了一组新的控制方程，应力场与位错密度场分别表示成第一类与第二类切比雪夫多项式的级数，相应的张开位移与滑错位移以用三角级数表示。通过离散的方法，控制方程转化为一组非线性代数方程。用Ｎｅｗｔｏｎ－Ｒａｐｈｓｏｎ方法求解这组方程，得到远场为纯剪，纯拉及两者复合情况下的解答。计算结果清楚地揭示了裂纹     

穿透夹杂界面的半无限楔形裂纹尖端螺型位错的发射研究

摘要：研究了穿透圆形夹杂界面的半无限楔形裂纹与裂纹尖端螺型位错的干涉问题。应用复变函数解析延拓技术与奇性主部分析方法,得到了位错位于半圆形夹杂内部时,半无限基体和半圆形夹杂内复势函数的解析解。然后利用保角映射技术得到了穿透圆形夹杂界面的半无限楔形裂纹尖端螺型位错产生的应力场以及作用在位错上的位错力的解析表达式。主要讨论了螺型位错对裂纹的屏蔽效应以及从楔形裂纹尖端发射位错的临界载荷条件。研究结果表明正的螺型位错可以削弱楔形裂纹尖端的应力强度因子,屏蔽裂纹的扩展,屏蔽效应随位错方位角的增大而减小。位错发射所需的无穷远临界应力随发射角的增加而增大,最可能的位错发射角度为零度,直线裂纹尖端位错的发射比楔形裂纹尖端位错的发射更容易,硬基体抑制位错的发射。     

Cracking characteristics of mixed mode dislocations near a lip-like mode crack

This work is concerned with the cracking characteristics of mixed mode dislocations near a lip-like mode crack, stress intensity and strain energy density factor are obtained by using conformal mapping, singularity analysis and Cauchy integrals. Shielding effect generated by screw dislocation near a lip-like mode crack decreases with the increment of the distance between screw dislocation and crack tip. Larger distance between two faces of the crack leads to the shielding effect waning. The strain energy density factor of mode III decreases with the increment of the distance between dislocation and crack tip. Larger distance between two faces of lip-like mode crack also leads to the strain energy density factor waning and encourages crack initiation; the shielding effects generated by edge dislocation near the crack decrease with the increment of the distance between edge dislocation and crack tip.     

INTERACTION OF A DISLOCATION DIPOLE WITH A MODE Ⅲ INTERFACE CRACK

Interaction between a screw dislocation dipole and a mode Ⅲ interface crack is investigated. By using the complex variable method, the closed form solutions for complex potentials are obtained when a screw dislocation dipole lies inside a medium. The stress fields and the stress intensity factors at the tip of the interface crack produced by the screw dislocation dipole are given. The influence of the orientation, the dipole arm and the location of the screw dislocation dipole as well as the material mismatch on the stress intensity factors is discussed. zThe image force and the image torque acting on the screw dislocation dipole center are also calculated. The mechanical equilibrium position of the screw dislocation dipole is examined for various material property combinations and crack geometries. The results indicate that the shielding or anti-shielding effect on the stress intensity factor increases abruptly when the dislocation dipole approaches the tip of the crack. Additionally, the disturbation of the interface crack on the motion of the dislocation dipole is also significant.     

INTERACTION OF A DISLOCATION DIPOLE WITH A MODE III INTERFACE CRACK

Interaction between a screw dislocation dipole and a mode III interface crack is investigated. By using the complex variable method, the closed form solutions for complex potentials are obtained when a screw dislocation dipole lies inside a medium. The stress fields and the stress intensity factors at the tip of the interface crack produced by the screw dislocation dipole are given. The influence of the orientation, the dipole arm and the location of the screw dislocation dipole as well as the material mismatch on the stress intensity factors is discussed. The image force and the image torque acting on the screw dislocation dipole center are also calculated. The mechanical equilibrium position of the screw dislocation dipole is examined for various material property combinations and crack geometries. The results indicate that the shielding or anti-shielding effect on the stress intensity factor increases abruptly when the dislocation dipole approaches the tip of the crack. Additionally, the disturbation of the interface crack on the motion of the dislocation dipole is also significant.     

Energy dissipation mechanisms in ductile fracture

The objective is to investigate energy dissipation mechanisms that operate at different length scales during fracture in ductile materials. A dimensional analysis is performed to identify the sets of dimensionless parameters which contribute to energy dissipation via dislocation-mediated plastic deformation at a crack tip. However, rather than using phenomenological variables such as yield stress and hardening modulus in the analysis, physical variables such as dislocation density, Burgers vector and Peierls stress are used. It is then shown via elementary arguments that the resulting dimensionless parameters can be interpreted in terms of competitions between various energy dissipation mechanisms at different length scales from the crack tip; the energy dissipations mechanisms are cleavage, crack tip dislocation nucleation and also dislocation nucleation from a Frank-Read source. Therefore, the material behavior is classified into three groups. The first two groups are the well-known intrinsic brittle and intrinsic ductile behavior. The third group is designated to be extrinsic ductile behavior for which Frank-Read dislocation nucleation is the initial energy dissipation mechanism. It is shown that a material is predicted to exhibit extrinsic ductility if the dimensionless parameter bρ_disl^1/2 (b is Burgers vector, ρ_disl is dislocation density) is within a certain range defined by other dimensionless parameters, irrespective of the competition between cleavage and crack tip dislocation nucleation. The predictions compare favorably to the documented behavior of a number of different classes of materials.     

Molecular dynamics simulation of crack-tip processes in copper

The crack tip processes in copper under mode II loading have been simulated by a molecular dynamics method. The nucleation, emission, dislocation free zone (DFZ) and pile-up of the dislocations are analyzed by using a suitable atom lattice configuration and Finnis & Sinclair potential. The simulated results show that the dislocation emitted always exhibits a dissociated fashion. The stress intensity factor for dislocation nucleation, DFZ and dissociated width of partial dislocations are strongly dependent on the loading rate. The stress distributions are in agreement with the elasticity solution before the dislocation emission, but are not in agreement after the emission. The dislocation can move at subsonic wave speed (less than the shear wave speed) or at transonic speed (greater than the shear wave speed but less than the longitudinal wave speed), but at the longitudinal wave speed the atom lattice breaks down. The project supported by the National Natural Science Foundation of China     

EFFECTS OF DISLOCATION CONFIGURATION, CRACK BLUNTING AND FREE SURFACES ON THE TRIGGERING LOAD OF DISLOCATION SOURCES

The effects of dislocation configuration,crack blunting and free surfaces on the triggering load of dislocation sources in the vicinity of a crack or a wedge tip subjected to a tensile load in the far field are investigated.An appropriate triggering criterion for dislocation sources is proposed by considering the configurational forces acting on each dislocation.The triggering behaviors of dislocation sources near the tips of a crack and a wedge are compared.It is also found that the blunting of crack tip and the presence of free surfaces near the crack or the wedge have considerable influences on the triggering load of dislocation sources.This study might be of significance to gaining a deeper understanding of the brittle-to-ductile transition of materials.     

Nonlocal elasticity and dislocation image force due to cracks

Summary   Fundamental field equations of nonlocal elasticity are presented. With these equations, the image force on a screw dislocation due to a crack is analyzed using the conformal mapping technique. Two cases are considered: one is for a finite-length crack, the other is for an infinite one. All classical singularities of the dislocation image force are eliminated when the dislocation tends to the crack tip. The maximum of the force is obtained at the crack tip. Received 10 June 1999; accepted for publication 8 February 2000