共查询到20条相似文献,搜索用时 187 毫秒
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《工程热物理学报》2016,(1)
基于连续介质理论建立了定向碳纳米管/橡胶(CNTs/Rubber)复合材料的代表体积元(RVE)模型,借助有限元方法(FEM)进行数值计算获得复合材料的等效热导率。将数值计算结果与Nielsen模型与Ce-WenNan模型预测值对比,验证了模型的有效性。基于此模型研究了CNTs体积分数及界面热阻对复合材料导热性能的影响。研究发现,在低填充量(0.2%~1%)下,复合材料的热导率随着填充量的增加而增大,且增大幅度随着体积分数的增大而逐渐减小;界面热阻的存在阻碍了CNTs与橡胶基体之间的热传递,对复合材料的热导率有很大的影响,另外在不同体积分数下,随着界面热阻的增大,复合材料热导率都先开始减小,当界面热阻降低到一定大小时,复合材料的热导率随着界面热阻的增大都基本保持不变。 相似文献
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提高环氧树脂热界面材料热导率对解决5G等微电子芯片高热流密度散热问题具有重要意义.采用非平衡态分子动力学方法,重点研究了纳米金刚石填料的不同填充方式对环氧树脂基复合物热导率的影响.结果表明,单颗粒填充方式下,复合物热导率随金刚石尺寸的增大而增大,大尺寸金刚石填料可以降低复合物的自由体积分数,对热导率的提升效果更显著;多颗粒填充方式下,复合物热导率随颗粒数的增多呈先增大后减小的趋势,增加颗粒数可以减小复合物的自由体积分数,但具有更大的比表面积及界面热阻,其对热导率的削弱作用更为显著.此外,同一质量分数下,增大纳米金刚石颗粒尺寸比增加颗粒数对复合物热导率的提升效果更为显著.本文研究对具有高热导率的纳米金刚石/环氧树脂复合物热界面材料的设计和制备具有指导意义. 相似文献
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《工程热物理学报》2021,42(10):2642-2648
石墨烯作为一种具有超高导热性能的二维纳米材料,不断引起人们的关注。实际应用中,石墨烯需附着在一定的衬底材料上,从而导致界面处强烈的声子散射和热导率的显著降低。为解决此类问题,本文采用一种原位催化生长技术制备出了金刚石/石墨烯复合材料。与转移到SiO_2/Si衬底的结构相比,在金刚石上生长得到的复合结构热导率被明显提高(约793 W·m~(-1)·K~(-1)),且石墨烯与金刚石衬底的界面热阻小于4.85×10~(-5)m~2·K·W~(-1)。这源于金刚石衬底为石墨烯提供了可观的热学贡献,而原位键合的生长让界面中产生有别于非键相互作用的杂化结构,使得界面热阻被降低。该结构优异的传热性能为石墨烯复合材料提供了一种新的方案。 相似文献
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《物理学报》2021,(17)
采用第一性原理计算和实验相结合的方法,研究了金刚石/铝复合材料的界面性质及界面反应.计算结果表明:金刚石(100)/铝(111)界面粘附功更大,相比金刚石(111)/铝(111)的界面粘附功4.14 J/m~2提高了41%.同时,金刚石(100)/铝(111)界面处形成Al—C键合的趋势更强. Al—C键的引入能够促进金刚石(100)/铝(111)界面处C—C键的形成,提高界面粘附功.利用真空气压浸渗法制备金刚石/铝复合材料,并对金刚石/铝复合材料的界面结构进行多尺度表征.在金刚石{100}面观察到界面产物Al_4C_3,且界面脱粘多发生在金刚石{111}面,实验现象与计算结果相一致.湿热实验研究了界面反应对金刚石/铝复合材料的影响,进一步表明抑制Al_4C_3生成、改善界面选择性结合对于提高金刚石/铝复合材料性能及稳定性具有重要意义.本文的研究为第一性原理计算金刚石/金属的界面性质提供了新的思路,也对金刚石/金属复合材料的设计具有重要的指导意义. 相似文献
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本文利用非平衡分子动力学方法研究了位错和堆垛层错对氮化镓晶体热导率的影响。研究结果表明氮化镓中刃型位错的存在不仅对垂直位错线方向的热量传输有影响,也对平行于位错线方向有较大影响。本文利用非平衡分子动力学方法对氮化镓晶体中小角度晶界、晶界c面(0001)堆垛层错以及a面(1210)面堆垛层错结构的界面热阻进行了计算,并且研究了氮化镓晶体中c面堆垛层错的界面热阻的变化规律。研究结果表明氮化镓晶体中c面堆垛层错的界面热阻随着层错厚度的增加而增大,随着体系长度的增大而减小。 相似文献
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采用拉曼热测量技术结合有限元热仿真模型,分析比较新型铜/石墨复合物法兰封装与传统铜钼法兰封装的GaN器件的结温与热阻,发现前者的整体热阻比铜钼法兰器件的整体热阻低18.7%,器件内部各层材料的温度分布显示铜/石墨复合物法兰在器件中的热阻占比相比铜钼法兰在器件中的热阻占比低13%,这证明使用高热导率铜/石墨复合物法兰封装提高GaN器件热扩散性能的有效性.通过对两种GaN器件热阻占比的测量与分析,发现除了封装法兰以外,热阻占比最高的是GaN外延与衬底材料之间的界面热阻,降低界面热阻是进一步提高器件热性能的关键.同时,详细阐述了使用拉曼光热技术测量GaN器件结温和热阻的原理和过程,展示了拉曼光热技术作为一种GaN器件热特性表征方法的有效性. 相似文献
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用热压烧结法制备得到纳晶铜块体. 用激光法测定了不同温度下制备得到的纳晶铜块体的热导率, 并建立卡皮查热阻模型对样品热导率进行模拟. 通过对比, 模拟结果与实验数据基本一致. 随着热压烧结温度的升高, 纳晶铜晶粒尺寸也随之增大. 在900和700 ℃其热导率分别达到了最大和最小值且所对应的热导率分别为200.63和233.37 W·m-1·K-1, 各占粗晶铜块体热导率的53.4%和60.6%. 验证了纳晶铜热导率在一定的晶粒尺寸范围内具有尺寸效应, 随着晶粒尺寸的减小, 热导率逐渐减小. 相似文献
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ZnO是一类具有潜力的热电材料, 但其较大声子热导率影响了热电性能的进一步提高. 纳米复合是降低热导率的有效途径. 本文以醋酸盐为前驱体, 溶胶-凝胶法制备了Ag-ZnO纳米复合热电材料. 扫描电镜照片显示ZnO颗粒呈现多孔结构, Ag纳米颗粒分布于ZnO的晶粒之间. Ag-ZnO纳米复合材料的电导率比未复合ZnO材料高出100倍以上, 而热导率是未复合ZnO材料的1/2. 同时, 随着Ag添加量的增加, 赛贝克系数的绝对值逐渐减小. 综合以上原因, 添加7.5%mol Ag的Ag-ZnO纳米复合材料在700 K时的热电优值达到0.062, 是未复合ZnO材料的约25倍. 在ZnO基体中添加导电金属颗粒有利于产生导电逾渗通道, 提高材料体系的电导率, 但同时导致赛贝克系数的绝对值减小. 总热导率的差异来源于声子热导率的差异. 位于ZnO晶界的纳米Ag颗粒, 有利于降低声子热导率.
关键词:
热电材料
ZnO
纳米复合
热导率 相似文献
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T. S. Pan Y. Zhang J. Huang M. Gao Y. Lin 《Applied Physics A: Materials Science & Processing》2014,114(3):973-978
Fabricating composite thin films is an effective and economic solution to improve the thermal performance of the films. The diamond particles of different sizes were successfully embedded in AlN thin films by a chemical solution approach, which was confirmed by scanning electron microscope, x-ray diffraction analysis and x-ray photoelectron spectroscopy. The thermal properties of the films embedded with different diamond particles were studied by using a 3-omega method, which was observed to be strongly dependent on the particle size. A 19 % enhancement in thermal conductivity can be achieved by embedding diamond particles of 1-μm radius in AlN thin films. However, the thermal conductivity decreases after embedding with 10-nm radius diamond particles. The results are discussed with high volume model, which confirms that the interface thermal resistance between the embedded materials and the films plays an important role in determining the thermal conductivity of the as-grown carbon material embedded AlN films. 相似文献
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In order to study the thermal conductivity of nanocrystalline (NC) materials, a two-phase composite model consisting of grain interior (GI) regarded as an ordered crystal phase and plastically softer grain boundary-affected zone (GBAZ) phase was presented. The effects of GI and GBAZ on thermal conduction were considered, respectively. In this work, time independent Schrodinger’s wave equation (TISWE) was used to study the carriers’ transmission in a crystal particle, through which we can get the thermal conductivity of the GBAZ. The thermal conductivity of GI was calculated based on a kinetic theory. The whole effective grain thermal conductivity was simulated by a modified formula for composite materials. The results showed that as the grain size decreases to 80 nm, it has a strong size effect, and the thermal conductivity decreases with the decreasing of grain size. 相似文献
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针对高超声速飞行器工作时头锥恶劣的热环境,为了保证飞行器头锥的尖锐外形, 提出疏导式热防护结构,利用内置高导热碳材料结构为飞行器头锥提供热防护. 采用流固耦合方法对头锥疏导式防热结构进行了分析,验证了头锥内置高导热碳材料具有较好防热效果, 其中来流马赫数(Ma)为9时头锥前缘壁面最高温度下降了21.9%,尾部最低温度升高了15.2%, 实现了热流由高温区向低温区的转移,削弱了头锥的热载荷,强化了头锥的热防护能力. 本文对外蒙皮结构参数、材料参数以及内部高导热碳材料导热率对头锥热防护性能的影响进行了分析, 其中头锥最高温度随着蒙皮材料导热系数的增加而降低到一个稳定值; 随着蒙皮材料表面黑度的增加而降低;随着蒙皮厚度的增加而升高;随着高导热碳材料导热系数的 增加而呈抛物线下降. 相似文献
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理论分析了声子和电子输运对Cu, Ag金属纳米线热导率的贡献. 采用镶嵌原子作用势模型描述纳米尺寸下金属原子间的相互作用, 应用平衡分子动力学方法和Green-Kubo函数模拟了金属纳米线的声子热导率; 采用玻尔兹曼输运理论和Wiedemann-Franz定律计算电子热导率; 并通过散射失配模型和Mayadas-Shatzkes模型引入晶界散射的影响. 在此基础上, 考察分析了纳米线尺度和温度的影响. 研究结果表明: Cu, Ag纳米线热导率的变化规律相似; 电子输运对金属纳米线的导热占主导地位, 而声子热导率的贡献也不容忽视; 晶界散射导致热导率减小, 尤其对电子热导率作用显著; 纳米线总热导率随着温度的升高而降低; 随着截面尺寸减小而减小, 但声子热导率所占份额有所增加.
关键词:
纳米线
热导率
表面散射
晶界散射 相似文献
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以CaCO3作为Ca2+源, 利用传统固相烧结法制备了Cd1-xCaxO (x=0, 0.01, 0.03, 0.05) 多晶块体样品并研究了Ca2+掺杂对CdO高温热电性能的影响. CaCO3的掺入会导致CdO多晶载流子浓度降低, 使Cd1-xCaxO的电阻率ρ和塞贝克系数的绝对值|S|增大、电子热导率κe减小. 同时, 在CdO中掺入CaCO3会引入点缺陷和气孔并可抑制CdO晶粒长大、晶界增多, 从而增加了对声子的散射, 使样品的声子热导率κp减小. 由于总热导率的大幅降低, Cd0.99Ca0.01O多晶样品在1000 K时的热电优值ZT可达0.42, 比本征CdO提高了约27%, 为迄今n型氧化物热电材料报道的最好结果之一. 相似文献
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Yingguang Liu Shingbing Zhang Zhonghe Han Yujin Zhao 《Journal of nanoparticle research》2016,18(10):296
In order to study the influence of grain size and lattice strain on the thermal conductivity of nanocrystalline (NC) materials, both experimental and theoretical studies were carried out on NC copper. The NC copper samples were prepared by hot isostatic pressing of nano-sized powder particles with mean grain size of 30 nm. The thermal behaviors of the samples were measured to be 175.63–233.37 W (m K)?1 by using a laser method at 300 K, which is 45.6 and 60.6 % of the coarse-grained copper, respectively. The average grain size lies in the range of 56–187 nm, and the lattice strain is in the range of ?0.21 to ?0.45 % (in the direction of 111) and ?0.09 to 0.92 % (in the direction of 200). In addition, a modified Kapitza resistance model was developed to study the thermal transport in NC copper. The theoretical calculations based on the presented theoretical model were in good agreement with our experimental results, and it demonstrated that the thermal conductivity of NC materials show obvious size effect. It is also evident that the decrease in the thermal conductivity of NC material can be mainly attributed to the nano-size effect rather than the lattice strain effect. 相似文献
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Filler-matrix thermal boundary resistance of diamond-copper composite with high thermal conductivity 总被引:1,自引:0,他引:1
A composite material with a high thermal conductivity is obtained by capillary infiltration of copper into a bed of diamond
particles of 400 μm size, the particles having been pre-coated with tungsten. The measured thermal conductivity of the composite
decreases from 910 to 480 W m−1 K−1 when the coating thickness is increased from 110 to 470 nm. Calculations of the filler/matrix thermal boundary resistance
R and the thermal conductivity of the coating layer λ
i
using differential effective medium, Lichtenecker’s and Hashin’s models give similar numerical values of R and λ
i
≈ 1.5 W m−1 K−1. The minimal thickness of the coating h ∼ 100 nm necessary for ensuring production of a composite while maximizing its thermal conductivity, is of the same order
as the free path of the heat carriers in diamond (phonons) and in copper (electrons). The heat conductance of the diamond/tungsten
carbide coating/copper interface when h is of this thickness is estimated as (0.8–1) × 108 W m−2 K−1 and is at the upper level of values characteristic for perfect dielectric/metal boundaries. 相似文献
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Improving the thermal stability of diamond and other superhard materials has great significance in various applications. Here, we report the synthesis and characterization of bulk diamond–cBN–B_4C–Si composites sintered at high pressure and high temperature(HPHT, 5.2 GPa, 1620–1680 K for 3–5 min). The results show that the diamond, cBN, B_4C,B_xSiC, SiO_2 and amorphous carbon or a little surplus Si are present in the sintered samples. The onset oxidation temperature of 1673 K in the as-synthesized sample is much higher than that of diamond, cBN, and B_4C. The high thermal stability is ascribed to the covalent bonds of B–C, C–N, and the solid-solution of B_xSiC formed during the sintering process. The results obtained in this work may be useful in preparing superhard materials with high thermal stability. 相似文献