Interest of NH3 and N2 plasmas for polymer surface treatment before “electroless” metallization

The electroless metallization of polymers needs an activation of their surface which consists of palladium chemisorption. In this study, the effect of surface treatments of polystyrene and polyamide substrates by reactive gas plasmas (O₂, NH₃, N₂) has been followed by XPS analysis. According to the functional groups grafted on the surface, specific chemisorption reactions can occur. The latter have been highlighted through a comparative investigation of two activation processes, viz. a conventional way using successively SnCl₂ and PdCl₂ solutions and a new procedure, developed by the authors, using only a PdCl₂ solution. This work shows that this simplified process can be extended to any polymer whose surface is grafted with nitrogenated functions.     

Conductive thin film formation onto radiation grafted polymeric surfaces using electroless plating technique

Surface modification of polypropylene films (PP) was carried out via radiation induced graft copolymerization of 4‐vinyl pyridine (4VP) and acrylamide (AAm) to enhance the adhesion ability of the PP surface for electroless deposition of copper. Factors affecting the grafting process such as suitable solvent, comonomer composition and concentration and irradiation dose were optimized. The grafted films produced were characterized by studying their Fourier‐transform infrared (FTIR) spectra and thermal stability. The grafted films were copper‐plated by electroless deposition using Pd as the catalyst to initiate the redox reaction. The influence of catalytic activation method parameters on the plating rate were studied. Scanning electron microscopy revealed a dense and void‐free copper deposited film. The adhesion of the deposited copper film to the modified PP films was determined by measuring the tensile strength of the copper plated films. The electrical characteristics of the copper plated films in comparison with grafted films were studied. The results showed the high adhesion of the deposited copper film to the grafted PP film as well as the high electrical conductivity. Copyright © 2008 John Wiley & Sons, Ltd.     

Influence of electroless nickel plating of hydrogen-absorbing alloys on cycle characteristics of nickel-metal hydride batteries

The effects of electroless nickel plating of a hydrogen-absorbing alloy on the cycle characteristics of a nickel-metal hydride battery were investigated. The cycle life was improved by employing an electroless nickel-plated hydrogen-absorbing alloy for the negative electrode, which retained the same high-rate level and low-temperature characteristics compared to a cell using a non-plated hydrogen-absorbing alloy. The electroless nickel-plated hydrogen-absorbing alloy provided better electrochemical characteristics when its surface was partly and tightly covered by nickel particles under optimal electroless plating conditions.     

The effect of component concentrations in electroless nickel plating solution on topography and microrelief of Ni-P coatings

Topography and microrelief of Ni-P coatings deposited by electroless plating from solutions with different composition are examined as a function of concentrations of nickel and acetate ions, solution pH, and stabilizing additives, namely, PbCl₂ and thiourea. The coating growth involves the formation of surface spheroids of which a large percentage are strongly extended in the substrate plane and grow by the layered-growth mechanism. In terms of this mechanism, the changes in the topography and microrelief of coatings and also in the spheroid size as a function of the composition of electroless nickel plating solutions are explained. In solutions studied, the rates of formation of new two-dimensional layers and their propagation in the substrate plane are assessed. As the concentration of hydrated nickel ions in solution decreases, spheroids less extended in the substrate plane are formed and grow probably by the normal growth mechanism. The size distribution of spheroids is obtained and the reasons for the partial formation of spheroids with sizes deviating from those predicted by the normal law are analyzed.     

硝酸铈及热处理对化学镀Ni-W-P合金的性能影响

为提高化学镀Ni-W-P镀层的耐蚀性和耐磨性,拓宽其应用,采用电化学方法和热处理等手段,研究了镀液中添加剂硝酸铈(Ce(NO3)3)的质量分数和热处理对化学镀Ni-W-P镀层的沉积速度、孔隙率、失重腐蚀速度、腐蚀电位、腐蚀电流、交流阻抗、显微硬度、摩擦系数等性能的影响。结果表明:添加1.0 wt%Ce(NO3)3时,所得镀层的沉积速度最大(36.5 g/m2·h),孔隙率最低(0.8个/cm2),耐腐蚀性能最好。镀层的组织均匀、致密、无缺陷和非晶态结构是其耐蚀性能高的重要原因。100~600℃热处理后,镀层硬度和耐磨性有所提高,而400℃热处理之后,合金显微硬度高达1100 HV,是镀态的1.8倍。     

Preparation and thermal treatment of Pd/Ag composite membrane on a porous alumina tube by sequential electroless plating technique for H2 separation

Pd/Ag/α-Al2O3 composite membranes were prepared by sequential electroless plating technique. The prepared membranes were characterized by X-ray diffraction （XRD）, scanning electron microscopy （SEM）, energy dispersive spectroscopy, and inductively coupled plasma atomic emission spectroscopy techniques （ICP-AES）. Effects of annealing time, Ag content, and air treatment on the hydrogen permeation flux and morphology of the alloys were investigated. The results of the investigation showed that the prepared type of tube had a good potential as substrate for membrane preparation. In addition, a uniform defect-free alloy was prepared by annealing at 550 ℃ in H2 atmosphere. The permeation results showed an increase in H2 permeation flux by increasing the Ag content and the annealing time. In addition, the air treatment of the prepared membranes at 400 ℃ for 1 h changed the morphology of the alloy and substantially enhanced the hydrogen flux.     

Influence of bath temperatures on the wettability of copper films surface prepared by electroless plating method on beech wood

Copper films were coated on beech wood substrates by electroless plating method. The influence of bath temperature on the copper films properties was studied by varying the bath temperatures 25, 35, 45 and 55 °C. Scanning electron microscopy (SEM) equipped with energy dispersive spectroscopy (EDS), X‐ray diffraction (XRD) pattern, X‐ray photoelectron spectroscopy (XPS), micro Raman spectroscopy and contact angle measurements were used to both characterize the physical and chemical copper films properties and understand the influence of bath temperature on the wettability of copper surface. In our studies, we have found that the gained copper mass significantly increased at 55 °C. The crystalline nature of the coated copper was confirmed by XRD. The presence of Cu₂O and CuO was observed by XPS and micro Raman techniques, which confirms the oxidization of the coated copper surface. Also these characterization techniques have shown the big influence of bath temperature on the morphology, grain size, chemical composition and the film thickness of the coated copper. The wettability was highly influenced by increasing CuO on the coated copper, which is increased by the bath temperature. The contact angle measurements have demonstrated the influence of C―O, O―C?O and CuO components of the surface on the wettability of the samples. Copyright © 2016 John Wiley & Sons, Ltd.     

化学复合镀Ni-P-PTFE镀层的组成分析

近年来化学复合镀技术在工业中应用日益广泛 ,本文运用ＳＥＭ、ＡＥＳ和ＸＰＳ等手段对用化学复合镀制得的Ｎｉ Ｐ ＰＴＦＥ镀层的结构和组分进行了分析 ,并就其耐腐蚀性能与前期得到的Ｎｉ Ｓｎ Ｐ[1 ] 、Ｃｕ Ｓｎ Ｐ[2 ] 、Ｎｉ Ｐ ＣｅＯ2 [3] 、Ｎｉ Ｐ ＳｉＯ2 [4] 镀层进行了比较 ,结果表明 :含量一定的ＰＴＦＥ(聚四氟乙烯 )的共存增强镀层的耐腐蚀性及镀层表面的润滑性。1　实验部分1 1　仪器日产Ｄ/ＭＡＸⅢＡ型Ｘ 射线衍射仪 ,铜靶 ,管压 2 5ｋＶ ,电流 1 0ｍＡ。国产ＪＪＣ 1型润滑湿角测量仪。美国ＰＥＲＫＩＮ ＥＬＭＥＲＰ…     

Organophosphorus pesticides detection using acetylcholinesterase biosensor based on gold nanoparticles constructed by electroless plating on vertical nitrogen-doped single-walled carbon nanotubes

An acetylcholinesterase (AChE) biosensor was constructed based on gold nanoparticles (AuNPs) using electroless plating on vertical nitrogen-doped single-walled carbon nanotubes (VNSWCNTs) for detecting organophosphorus pesticides (OPs). AChE was immobilised on AuNPs via Au–S bonding, and VNSWCNTs were produced by spontaneous chemical adsorption of NSWCNTs on gold electrode, also via Au–S bonding. This modified electrode exhibited excellent electron transfer capacity due to the synergy between AuNPs and VNSWCNTs. The developed biosensor showed good linear relations at concentrations of 10^?5 – 1 ppb, and the detection limits were 3.04 × 10^?6 ppb for methyl parathion, 1.96 × 10^?6 ppb for malathion and 2.06 × 10^?6 ppb for chlorpyrifos, respectively. The AChE biosensor revealed satisfactory stability, excellent sensitivity and good repeatability. These results suggest that this biosensor has good application prospects and can function as a sensitive device in OPs analysis.     

Electron beam-treated organic monolayers as a negative resist for Cu immersion plating on Si

In the present work, we investigate selective immersion plating of Cu on n-type Si(111) surfaces chemically modified with different organic monolayers and subsequently directly patterned by an electron-beam (e-beam). The organic molecules (1-undecylenic acid, 1-decene and 1-octadecene) were covalently attached to a hydrogen-terminated Si surface. The use of such monolayers as masks for electroless copper deposition by immersion plating on Si surfaces was investigated. Clearly, a masking effect can be observed, the efficiency of which depends on the type of molecule. Further, the effect of e-beam irradiation to improve the masking properties of the organic monolayers was studied. For this, the monolayers were locally irradiated using a scanning electron microscope (SEM) equipped with a lithographic tool. The results show that e-beam-modified organic monolayers can be used as a negative tone resist for copper electroless plating. The selectivity of the Cu deposition at e-beam-untreated regions strongly depends on the applied e-beam dose and on the nature of organic molecules. By optimizing the electroless deposition parameters, homogeneous deposition with complete selectivity can be achieved, leading to high lateral resolution of the Cu patterns.Dedicated to Zbigniew Galus on the occasion of his 70th birthday.     

Surface modification of a liquid‐crystalline polymer for copper metallization

The effects of different surface modifications on the adhesion of copper to a liquid‐crystalline polymer (LCP) were investigated with X‐ray photoelectron spectroscopy, scanning electron microscopy, atomic force microscopy, contact‐angle measurements, and pull tests. High pull‐strength values were achieved when copper was sputter‐deposited onto plasma and reactive‐ion‐etching (RIE)‐pretreated LCP surfaces. The values were comparable to the reference pull strengths obtained with laminated copper on the LCP. The adhesion was relatively insensitive to the employed feed gas in the pretreatments. The surface characterizations revealed that for RIE and plasma treatments, the enhanced adhesion was attributable to the synergistic effects of the increased surface roughness and polar component of the surface free energy of the polymer. However, if the electroless copper deposition was performed on RIE‐ or plasma‐treated surfaces, very poor adhesion was measured. Good adhesion between the LCP substrate and electrolessly deposited copper was achieved only in the case of wet‐chemical surface roughening as a result of the creation of a sufficient number of mechanical interlocking sites, together with a significant loss of oxygen functionalities, on the surface. © 2003 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 41: 623–636, 2003     

双光子微纳加工技术结合化学镀工艺制备三维金属微弹簧结构

利用飞秒激光双光子微纳加工技术与化学镀工艺制备了三维金属微弹簧结构.采用扫描电子显微镜(SEM)及选区电子能谱(EDS)对镀层进行了表征,当化学镀时间为15 min时,所得到的镀层厚度约为130 nm.对不同电镀时间下获得的镀层电阻率进行了测定,实验结果表明,当电镀时间为35 min时得到的镀层电阻率约为80×10^-9 Ω·m,仅为银块体材料电阻率16×10^-9 Ω·m的5倍.利用这种方法,我们制备了总长度为28.75 μm、周期为2.93 μm的悬空金属弹簧结构,其中弹簧圈数为9圈,直径为6 μm,弹簧线分辨率为1.17 μm.文中所述的将双光子微纳加工技术与化学镀技术相结合的方法可以实现任意三维微金属结构与器件的制备,在微光学器件、微机电系统(MEMS)及微传感器等领域有着广泛的应用前景.     

Synthesis of nickel nanoparticles supported on metal oxides using electroless plating: Controlling the dispersion and size of nickel nanoparticles

Nickel nanoparticles supported on metal oxides were prepared by a modified electroless nickel-plating method. The process and mechanism of electroless plating were studied by changing the active metal (Ag) loading, acidity, and surface area of metal oxides and were characterized by UV–vis spectroscopy, transmission electron microscopy, scanning electron microscopy, and H₂ chemisorption. The results showed that the dispersion of nickel nanoparticles was dependent on the interface reaction between the metal oxide and the plating solution or the active metal and the plating solution. The Ag loading and acidity of the metal oxide mainly affected the interface reaction to change the dispersion of nickel nanoparticles. The use of ultrasonic waves and microwaves and the change of solvents from water to ethylene glycol in the electroless plating could affect the dispersion and size of nickel nanoparticles.     

From a 1D Sb Coordination Polymer to a 3D Sb Framework with Pyrazine: Switching off the Stereochemically Active Lone-Pair

The one-dimensional coordination polymer ¹_∞[SbCl₃(pyz)] ( 1 ) and the three-dimensional frameworks ³_∞[Sb₂Cl₆(pyz)₃] ( 2 ) and ³_∞[Sb₂I₆(pyz)₃] ( 3 ) were obtained from SbX₃ (X: Cl, I) and pyrazine (pyz). These coordination polymers are, to the best of our knowledge, among the first Sb-based coordination polymers constructed from antimony halides and N-donor ligands. While the Sb³⁺-cations in 1 are coordinated in a square-pyramidal coordination sphere indicating a stereochemically active lone-pair, no stereochemically active Sb-lone-pair is present in 2 and 3 having octahedral coordination spheres around Sb^III. Since 2 can be obtained by heating of 1 , the character of the Sb-lone-pair in 1 can be changed by thermal treatment. Thereby the interlinkage is increased via an additional pyrazine molecule resulting in the octahedral coordination in 2 .