Al2O3绝缘层的AlGaN/GaN MOSHEMT器件研究

在研制AlGaN/GaN HEMT器件的基础上,采用ALD法制备了Al₂O₃ AlGaN/GaN MOSHEMT器件.通过X射线光电子能谱测试表明在AlGaN/GaN异质结材料上成功淀积了Al₂O₃薄膜.根据对HEMT和MOSHEMT器件肖特基电容、器件输出以及转移特性的测试进行分析发现：所制备的Al₂O₃薄膜与AlGaN外延层间界面态密度较小,因而MOSHEMT器件呈现出较 关键词： 2O₃')" href="#">Al₂O₃ ALD GaN MOSHEMT     

高场应力及栅应力下AlGaN/GaN HEMT器件退化研究

采用不同的高场应力和栅应力对AlGaN/GaN HEMT器件进行直流应力测试,实验发现：应力后器件主要参数如饱和漏电流,跨导峰值和阈值电压等均发生了明显退化,而且这些退化还是可以完全恢复的;高场应力下,器件特性的退化随高场应力偏置电压的增加和应力时间的累积而增大;对于不同的栅应力,相对来说,脉冲栅应力和开态栅应力下器件特性的退化比关态栅应力下的退化大.对不同应力前后器件饱和漏电流,跨导峰值和阈值电压的分析表明,AlGaN势垒层陷阱俘获沟道热电子以及栅极电子在栅漏间电场的作用下填充虚栅中的表面态是这些不同应 关键词： AlGaN/GaN HEMT器件 表面态(虚栅) 势垒层陷阱 应力     

界面处理对AlGaN/GaN MIS-HEMTs器件动态特性的影响

研究不同界面处理对AlGaN/GaN金属-绝缘层-半导体(MIS)结构的高电子迁移率晶体管(HEMT)器件性能的影响。采用N_2和NH_3等离子体对器件界面预处理,实验结果表明,N_2等离子体预处理能够减小器件的电流崩塌,通过对N_2等离子体预处理的时间优化,发现预处理时间10 min能够较好地提高器件的动态特性,30 min时动态性能下降。进一步引入AlN作为栅介质插入层并经过高温热退火后能够有效提高器件的动态性能,将器件的阈值回滞从411 mV减小至111 mV,动态测试表明,在900 V关态应力下,器件的电流崩塌因子从42.04减小至4.76。     

具有阻挡层的H等离子体处理增强型p-GaN栅AlGaN/GaN HEMT研究

采用H等离子体处理p-GaN盖帽层来制备p-GaN栅AlGaN/GaN高电子迁移率晶体管(HEMT).在p-Ga N层表面上先沉积2 nm的Al₂O₃薄膜,以减少H等离子体注入p-GaN时对表面造成的损伤.经研究表明沉积Al₂O₃阻挡层的器件栅极反向泄漏电流降低了一个数量级,开关比提高了约3倍.由于栅极泄露电流的减小,关态击穿电压从410 V提高到780 V.针对栅极反向泄漏减小的现象,进行了变温IG-VG测试,验证了栅极反向泄漏电流的主导机制是二维变程跳跃(Two-dimensional variable range hopping,2D-VRH)模型.分析了减小栅极反向电流的原因是由于Al₂O₃阻挡层改变了HR-Ga N的表面态,使陷阱能级的活化能升高.此外,器件动态特性也表现出更稳定的趋势,这是Al₂O₃薄膜阻挡过多的H等离子体的注入,使AlGaN势垒和沟道陷阱态数量减少,电流崩塌效应减弱.     

Al2O3绝缘栅AlGaN/GaN MOS-HEMT器件温度特性研究

采用原子层淀积(ALD)实现了10nm Al₂O₃为栅介质的高性能AlGaN/GaN金属氧化物半导体高电子迁移率晶体管(MOS-HEMT). 通过对MOS-HEMT器件和传统MES-HEMT器件室温特性的对比,验证了新型MOS-HEMT器件饱和电流和泄漏电流的优势. 通过分析MOS-HEMT器件在30—180℃之间特性的变化规律,与国内报道的传统MES-HEMT器件随温度退化程度对比,得出了器件饱和电流和跨导的退化主要是由于输运特性退化造成的,证明栅介质减小了引 关键词： 原子层淀积 AlGaN/GaN MOS-HEMT器件 温度特性     

AlGaN/GaN 高速电子迁移率晶体管器件电流坍塌效应与界面热阻和温度的研究

本文系统研究了AlGaN/GaN基高速电子迁移率晶体管器件界面热阻和工作温度对器件在高功率下的电流坍塌效应的影响规律.研究发现低漏极电压下热电子是导致负微分输出电导的重要因素,器件工作温度变高会使负微分输出电导减小.高漏极电压下自加热效应是导致电流坍塌的一个重要因素.随着界面热阻的增加,器件跨导降低,阈值电压增大.同时,由于工作环境温度的增高,器件随之温度增高,载流子迁移率会显著降低. 最终这两种因素会引起AlGaN/GaN基高速电子迁移率晶体管器件显著的电流坍塌效应,从而降低了器件整体性能. 关键词： AlGaN/GaN HEMT 器件 热电子效应 自加热效应 电流坍塌效应     

Al2O3绝缘栅AlGaN/GaN MOS-HEMT器件温度特性研究

采用原子层淀积(ALD)实现了10 nm Al2O3为栅介质的高性能AlGaN/GaN金属氧化物半导体高电子迁移率晶体管(MOS-HEMT).通过对MOS-HEMT器件和传统MES-HEMT器件室温特性的对比,验证了新型MOS-HEMT器件饱和电流和泄漏电流的优势.通过分析MOS-HEMT器件在30-180℃之间特性的变化规律,与国内报道的传统MES-HEMT器件随温度退化程度对比,得出了器件饱和电流和跨导的退化主要是由于输运特性退化造成的,证明栅介质减小了引入AlGaN界面的表面态是提高特性的重要原因.     

具有高开启/关断电流比的Al2O3/AlGaN/GaN金属氧化物半导体高电子迁移率晶体管

采用原子层淀积(ALD)方法,制备了Al₂O₃为栅介质的高性能AlGaN/GaN金属氧化物半导体高电子迁移率晶体管(MOS-HEMT)。在栅压为-20 V时,MOS-HEMT的栅漏电比Schottky-gate HEMT的栅漏电低4个数量级以上。在栅压为+2 V时,Schottky-gate HEMT的栅漏电为191μA;在栅压为+20 V时,MOS-HEMT的栅漏电仅为23.6 nA,比同样尺寸的Schottky-gate HEMT的栅漏电低将近7个数量级。AlGaN/GaN MOS-HEMT的栅压摆幅达到了±20 V。在栅压V_gs=0 V时, MOS-HEMT的饱和电流密度达到了646 mA/mm,相比Schottky-gate HEMT的饱和电流密度(277 mA/mm)提高了133%。栅漏间距为10μm的AlGaN/GaN MOS-HEMT器件在栅压为+3 V时的最大饱和输出电流达到680 mA/mm,特征导通电阻为1.47 mΩ·cm²。Schottky-gate HEMT的开启与关断电流比仅为10⁵,MOS-HEMT的开启与关断电流比超过了10⁹,超出了Schottky-gate HEMT器件4个数量级,原因是栅漏电的降低提高了MOS-HEMT的开启与关断电流比。在V_gs=-14 V时,栅漏间距为10μm的AlGaN/GaN MOS-HEMT的关断击穿电压为640 V,关断泄露电流为27μA/mm。     

在Al2O3衬底上GaN的APMOCVD生长

含氮Ⅱ一Ⅴ族化合物(包括GaN、AIN、InN和GaAIN)是直接带隙半导体材料,它们的禁带宽度可以从1.9eV到6.2eV,是目前最重要的蓝光半导体材料,不仅适合制作从可见光到紫外波段的光电器件,例如蓝光发光二极管、激光器和光电探侧器,而且可用于制作耐高温、大功率的电子器件.特别是利用APMOCVD技术在蓝宝石衬底上制备GaIV单晶膜取得突破性进展,并且制作了高亮度发光二极管后[1],Ⅱ-Ⅴ族含氮化合物半导体材料受到广泛重视.     

氮化镓/蓝宝石异质结构中极性的研究

用低压金属有机气相外延方法设备在蓝宝石衬底两个相反取向的C面上同时生长六方相氮化镓薄膜,对此进行了扫描电子显微镜、透射电子显微镜的分析和研究.发现当衬底表面是向籽晶面时,生长的六方相氮化镓薄膜为(0001)取向,而当衬底表面是背籽晶面时,生长的氮化镓薄膜则为(0001)取向.     

Molecular dynamics simulations on the direct sputtering of Al2O3 insulating film in a magnetic tunneling junction

The molecular dynamics (MD) simulation is used to study the direct deposition of aluminum-oxide (Al₂O₃) to grow an insulating thin film on cobalt substrate in a magnetic tunneling junction (MTJ). The direct deposition of Al₂O₃ may produce a very thin film with very smooth surface and form an averagely oxidized insulator. A high magnetoresistance ratio is desired in an MTJ device, so that smooth surface and good structural integrity for the insulating thin film is anticipated. The MD simulation is an effective way in determining optimal processing parameters that can be used to fabricate high-quality MTJ devices. The Buckingham and many-body tight-binding potentials are applied in the MD simulations for different interactions between particles. The effects of the cluster size and the incident energy on the thin film’s surface morphology and Al₂O₃ purity are investigated. Some optimal parameters that could be used as the reference for practical processing purposes are derived.     

Development and characteristic analysis of a field-plated Al2O3/AlInN/GaN MOS–HEMT

We present an AlInN/AlN/GaN MOS–HEMT with a 3 nm ultra-thin atomic layer deposition (ALD) Al₂O₃ dielectric layer and a 0.3 μm field-plate (FP)-MOS--HEMT. Compared with a conventional AlInN/AlN/GaN HEMT (HEMT) with the same dimensions, a FP-MOS--HEMT with a 0.6 μm gate length exhibits an improved maximum drain current of 1141 mA/mm, an improved peak extrinsic transconductance of 325 mS/mm and effective suppression of gate leakage in both the reverse direction (by about one order of magnitude) and the forward direction (by more than two orders of magnitude). Moreover, the peak extrinsic transconductance of the FP-MOS--HEMT is slightly larger than that of the HEMT, indicating an exciting improvement of transconductance performance. The sharp transition from depletion to accumulation in the capacitance--voltage (C--V) curve of the FP-MOS--HEMT demonstrates a high-quality interface of Al₂O₃/AlInN. In addition, a large off-state breakdown voltage of 133 V, a high field-plate efficiency of 170 V/μ m and a negligible double-pulse current collapse is achieved in the FP-MOS--HEMT. This is attributed to the adoption of an ultra-thin Al₂O₃ gate dielectric and also of a field-plate on the dielectric of an appropriate thickness. The results show a great potential application of the ultra-thin ALD-Al₂O₃ FP-MOS--HEMT to deliver high currents and power densities in high power microwave technologies.     

Microstructure Study on Heterostructures of AIInGaN/GaN/Al2O3 by Using Rutherford Backscattering/Channelling and XRD

A quaternary AlInGaN layer is grown by metal-organic chemical vapour deposition on a sapphire （0001） substrate with a thick （〉 1μm） GaN intermediate layer. The compositions of In and A1 are determined by Rutherford backscattering （RBS）. The low ratio between the channelling yield and random yield according to the spectra of RBS/C （χmin = 1.44%） means that the crystal quality of the AllnGaN film is perfect. The perpendicular and the parallel elastic strain of the AIlnGaN layer, e^⊥=-0.15% and e^//= 0.16%, respectively, are derived using a combination of XRD and RBS/channelling.     

Acoustic phonon dynamics in strained cubic and hexagonal GaN/Al2O3 superlattices

We study the acoustic-phonon spectra in periodic and quasiperiodic (Fibonacci type) superlattices made up from III–V nitride materials (GaN) intercalated by sapphire (Al₂O₃). Due to the misalignments between the sapphire and the GaN layers that can lead to threading dislocation densities as high as 10⁸-10¹⁰ cm^-1, and a significant lattice mismatch (~14%), the phonon dynamics is described beyond the continuum elastic model using coupled elastic and electromagnetic equations, stressing the importance of the piezoelectric polarization field in a strained condition. We use a transfer-matrix treatment to simplify the algebra, which would be otherwise quite complicated, allowing a neat analytical expressions for the phonon dispersion relation. Furthermore, a quantitative analysis of the localization and magnitude of the allowed band widths in the phonon's spectra, as well as their scale law and the parametric spectrum of singularities f(α), are presented and discussed.     

Interface traps contribution to capacitance of Al2O3/(GaN)AlGaN/GaN heterostructures at low frequencies

Influence of interface traps at Al₂O₃/(GaN)/AlGaN interface on low and high frequency capacitance of Al₂O₃/(GaN)/AlGaN/GaN heterostructure capacitor was studied. New features were observed in the capacitance curves. Obtained experimental results were modeled and simulated and accordance with the experiment has been obtained. For lower frequencies a new capacitance peak in the depletion and increase of the capacitance in a plateau region were measured. The capacitance peak in the depletion region was successfully explained by a capacitance response of the interface traps with U-shape density distribution. On the other hand the increase of the capacitance plateau was modeled by the homogeneous interface trap distribution. We assume that the traps located near the band edges having the highest density are able to respond to the low frequency measuring.