金刚石材料对螺旋线慢波组件散热性能的影响

螺旋线慢波组件的散热性能是影响行波管输出功率、工作稳定性及可靠性的重要因素. 金刚石材料具有极高的导热性能,将金刚石材料应用于螺旋线慢波组件的制备,可以在一定程度上改善组件散热性能. 本文计算模拟分析了沉积金刚石薄膜的夹持杆、沉积金刚石薄膜的螺旋线以及金刚石夹持杆对慢波组件散热性能的影响. 结合实验和模拟对比研究,使计算机仿真与实验测试紧密关联,提高了计算机模拟研究准确性,为金刚石材料在慢波组件中的应用提供了重要的参考依据. 关键词： 螺旋线行波管 慢波组件 散热性能 金刚石     

螺旋线慢波结构夹持性能测试方法研究

提出了一种由螺旋线慢波结构热分布特性来获知其夹持性能的方法. 设计了基于光纤光栅和热电偶的分布式温度测试平台, 计算和分析了光纤光栅等测温元件对慢波结构散热特性的影响. 搭建了实验系统, 研制了分布式微型光纤光栅温度传感阵列, 并对某型X波段行波管慢波结构进行对比测试. 结果表明, 实验获得的温差曲线可准确判别慢波结构夹持性能的优劣, 且不破坏器件结构与性能. 关键词： 慢波结构 夹持特性 散热能力 光纤光栅传感阵列     

微结构接触界面热阻

微纳米结构的接触热传输是热电转换、超导冷却、集成芯片散热等高技术领域面临并必须着力解决的技术问题,它区别于宏观热传输,具有为尺度依赖效应和多个微观特征量。文中从微结构接触热传输阻力角度出发,探讨了接触热阻及界面热阻区别,阐释了微尺度的特征量,接触界面热阻实验及理论研究方法、实验参数的测量,接触热阻及界面热阻的材料选择。通过接触界面热阻这些方面的研究,为研究接触界面热阻研究提供了较全面的参考。     

复合隔热结构活塞界面材料接触热阻实验研究

复合隔热结构活塞是一种新型的高功率密度柴油机活塞,其结构由多种材料组合而成,而材料间的界面接触热阻会对活塞的隔热效果产生影响。本文基于稳态热流法搭建测量接触热阻实验装置,分别对钛合金与耐热钢之间的接触热阻和耐热钢与铝合金之间的接触热阻进行了测量,并对试验的误差进行分析,确定试验过程中界面热阻的最大测试误差为5.81%,研究了活塞工况下的压力和温度对材料界面接触热阻的影响.结果表明:相同压力下,随界面温度的升高接触热阻呈下降趋势.在界面压力较小条件下,温度的变化对接触热阻影响比较明显。相同温度下,材料接触界面处的压力越大,其接触热阻值就越小,但是在不同的温度阶段,接触热阻减小幅度不同.同样的载荷与温度条件下,耐热钢和铝合金的界面接触热阻比钛合金和耐热钢材料组合的接触热阻小.     

带状注行波管双矩形螺旋线慢波结构高频特性北大核心CSCD

针对新型螺旋线慢波结构——双矩形螺旋线慢波结构,即在金属屏蔽框内平行加载两个具有矩形横截面形状的自由螺旋线慢波结构,利用三维电磁仿真软件对其高频特性(色散特性和耦合阻抗)进行模拟研究。结果表明:在相同位置处,与单矩形螺旋线慢波结构相比,双矩形螺旋线慢波结构色散特性变化很小,却有着更高的耦合阻抗;同时,在包含这些位置的空间部分,可采用带状电子注与该慢波结构进行注波互作用,使输出功率进一步得到提高。     

金属纳米粒子薄膜对辐射散热的影响的研究

通过分析不同螺旋线慢波组件的散热性能,研究了金属纳米粒子薄膜的采用对辐射散热性能的改善作用.利用实验测试和模拟仿真的方法,分析比较了采用普通金属管壳,沉积普通金属铱膜管壳和沉积纳米铱膜管壳的慢波组件的导热能力.结合实验数据,准确地推算出几种研究材料的热辐射发射率,并利用模拟仿真给予了验证.实验结果和模拟结果具有很好的一致性.研究表明,与普通金属材料相比,金属纳米粒子薄膜具有较强的热辐射能力,能够改善器件的散热性能.     

螺旋线型三导体脉冲形成线快波抵消方法

针对螺旋线型三导体脉冲形成线的快波振荡问题,提出一种阻抗分两段阶梯变化的螺旋线结构,分析了此类螺旋线快波反射与慢波反射相互抵消快波的条件,给出两段变阻抗螺旋线慢波系数之间的关系式以及匝数密度之比计算方法,通过仿真计算证明该方法能有效消除快波反射对螺旋线输出脉冲的影响。     

考虑界面接触热阻的一维复合结构的热整流机理

建立了考虑变截面、变热导率及界面接触热阻效应的组合热整流结构的温度场及热整流系数的理论模型和有限元解.数值算例证明了本文模型及算法的可靠性,进而通过参数影响研究确定了若干几何及材料参数对结构热整流系数的影响规律,揭示界面接触热阻对热整流效果的影响机理.研究结果表明长度比、截面半径变化率、热导率、边界条件温差和界面接触热阻等因素必须通过优化设计才能得到最大的热整流系数,同时界面接触热阻的引入也为调控热整流系数提供了一条新的途径.     

超晶格结构对铝硅界面热阻的影响

近年来,提高微纳电子器件的散热和原子尺度界面热输运性能受到了广泛的关注,很重要的原因是界面热阻导致的微纳电子器件发热制约了性能的稳定性。因此,我们提出利用超晶格结构来降低界面热阻的方法。本文采用非平衡分子动力学模拟的方法,研究了室温(300 K)下硅同位素超晶格结构对铝硅界面热阻的影响。计算结果表明利用硅超晶格结构可以明显地降低铝硅界面热阻。并且对结果给予了讨论,这有助于更好地理解界面热输运的机制。     

微纳米电子器件散热过程中的物理问题

微纳米电子器件的散热问题是目前制约半导体工业发展的重要瓶颈.将电子器件工作时产生的热量传输到封装外壳后再耗散到环境中去需要好几个步骤,每个步骤需要不同的方法,其中有些步骤涉及到了固体中的界面热传导问题和高性能导热材料.文章先介绍了近期关于微纳米尺度器件散热问题中碰到的热传导问题在理论和实验两方面的研究进展.在热传导理论和计算方法方面,作者讨论了傅里叶定律在微纳米尺度的适用性,介绍了玻尔兹曼方程、分子动力学模拟和格林函数方法.在热传导实验方面,介绍了用扫描热显微镜测量样品表面温度和用超快激光反射法测量薄膜材料的热导率及其界面热阻.然后介绍了界面热传导问题,包括界面热阻的计算以及电子—声子相互作用对界面热阻的影响.最后作者介绍了关于高性能导热材料方面的最新进展,包括碳基导热材料、晶格结构类似于石墨烯的氮化硼材料、高分子有机材料以及界面热阻材料.     

The thermal contact problem in nano- and micro-scale photothermal measurements

Thermal contact resistance between two solids is discussed with regard to its influence on the measurements of temperature and thermo-physical parameters in micro- and nano-structures. Two important applications are considered: thin film coatings on substrates and local measurements with a nano-probe in scanning thermal microscopy. The mechanical contact of a copper layer on carbon is measured by adhesion strength experiments and correlated to the thermal transport across the interface deduced from infrared radiometric measurements. A novel quantity the thermal wave contrast is introduced which takes into account the interface resistance and modifications of the coating and substrates at the interface. With regard to scanning thermal microscopy the contact resistance problem is discussed for 3ω-measurements in the active mode and for temperature measurements in the passive mode. It is shown that the thermo-elastic response can offer a means to avoid the influence of the thermal contact resistance on local temperature measurements.     

冲击压缩下金属/窗口界面热弛豫过程的热阻模型研究

 研究了金属/窗口界面在冲击压缩下的热弛豫过程。从热阻模型出发，给出了弛豫时间常数与界面热阻以及材料热输运系数之间的函数关系。讨论了本文模型与Grover和Urtiew模型之间的关系。对两种不同的实验记录图像进行了解释，对产生界面热阻的原因进行了初步分析。     

测定双层组合介质接触热阻

 当激光辐照双层固体组合介质的外表面时，在变物性及界面接触热阻不变的条件下，数值计算了介质内部温度场时空分布。实验测定该双层介质背面对应点的温度曲线，与数值计算的结果进行比较，从而确定介质界面间的接触热阻。     

Overheating or overcooling of electrons in a metal because of the effect of an interface with an insulator

It has been shown that the temperatures of electrons and phonons are different at a heat flow through a metal-insulator interface. This effect leads to an additional contribution to the Kapitza thermal resistance because electrons transferring heat in the metal do not transfer it through the interface, but are rather involved in heat transfer only at a certain distance from it. Consequently, heat transfer near the interface is less efficient. The effect is independent of the insulator adjacent to the metal. An exact solution has been obtained in a linear approximation. The results explain the qualitative difference of predictions of previously accepted models from experimental data in the case of large transmission coefficients of phonons through the interface.     

Nd0.7Sr0.3MnO3陶瓷中界面“陷阱态”相关电阻转变行为

通过固相烧结和高能球磨后热处理两种方法分别得到不具晶(相)界和具有明显晶(相)界的两种Nd_0.7Sr_0.3MnO₃陶瓷样品, 并用两线法和四线法分别对这两种样品的电极-块体接触界面和晶(相)界界面的I-V和电脉冲诱导电阻转变效应(EPIR)进行研究. 结果发现, 在两线法测试下, 电极-块体界面具有回滞的非线性I-V特征, 并能产生稳定的EPIR效应, EPIR的稳定性随温度的升高逐渐减弱并消失; 而对具有明显晶(相)界的陶瓷样品, 四线法测试结果表明, 虽然其I-V行为也具有非线性和回滞性特点, 但不能产生EPIR 效应. 这些奇特的界面输运行为与界面中的各种缺陷充当“陷阱”并实现对载流子的捕捉和释放过程密切相关. 而大量的晶(相)界界面及其复杂的连接方式导致较大的漏导则是晶(相)界不能出现EPIR效应的主要原因.     

Effect of reflecting modes on combined heat transfer within an anisotropic scattering slab

Under various interface reflecting modes, different transient thermal responses will occur in the media. Combined radiative-conductive heat transfer is investigated within a participating, anisotropic scattering gray planar slab. The two interfaces of the slab are considered to be diffuse and semitransparent. Using the ray tracing method, an anisotropic scattering radiative transfer model for diffuse reflection at boundaries is set up, and with the help of direct radiative transfer coefficients, corresponding radiative transfer coefficients (RTCs) are deduced. RTCs are used to calculate the radiative source term in energy equation. Transient energy equation is solved by the full implicit control-volume method under the external radiative-convective boundary conditions. The influences of two reflecting modes including both specular reflection and diffuse reflection on transient temperature fields and steady heat flux are examined. According to numerical results obtained in this paper, it is found that there exits great difference in thermal behavior between slabs with diffuse interfaces and that with specular interfaces for slabs with big refractive index.     

Electronic structure and adhesion on metal-aluminum-oxide interfaces

This paper reports on the results of the systematic analysis of the atomic and electronic structure of the Me/α-Al₂O₃(0001) interfaces for two series of isoelectronic metals (Me = Cu, Ag, Au and Ni, Pd, Pt), depending on the termination of the oxide substrate and the configuration of oxide films. The calculations have been performed by the pseudopotential method in the plane-wave basis set. The adhesion energy of metal films has been calculated depending on the cleavage plane. It has been shown that the adhesion energy is maximum at the oxygen interface, which is caused by the ion component in chemical bonding at this interface. The aluminum and aluminum-enriched interfaces are characterized by the metallic type of bonding. The local densities of states and the charge distribution near the interface have been analyzed. It has been demonstrated that oxygen vacancies at the interface substantially weaken the adhesion due to the partial breaking of Me-O bonds.     

Numerical investigation on thermal properties at Cu-Al interface in micro/nano manufacturing

A hybrid model by integrating TTM (two-temperature model) and MD (molecular dynamics) is proposed to investigate the properties on interface of dissimilar materials under thermal flux conditions. This model can describe the electron phonon coupling and phonon scattering at the interface of different metals easily. By comparing the Cu-Cu interface and Cu-Al interface, the atoms of the Cu-Cu interface at different sides tend to move together; while, the atoms displacements of Cu and Al are opposite along the interface, which may cause stress and voids at the interface. Moreover, the propagation mechanisms of nanocracks and the corresponding change of temperature distribution and thermal flux are investigated. The results show that the interfaces of dissimilar materials are prone to crack initiations, leading to delaminations because of the high temperature. All these are useful for understanding the deformation and failure of the interfaces structures. It implies a potential method for design and analysis of interface structure in micro/nano manufacturing.