Mechanical characterization of unplasticised polyvinylchloride thick pipes by optical methods

In this work a number of techniques (electronic speckle pattern interferometry, holographic interferometry, strain gauge and finite element method) are brought to bear in order to establish consistency in the results of strain measurement. This is necessary if optical non-destructive testing methods, such as those used here, are to gain acceptance for routine industrial use. The FE model provides a useful check. Furthermore, ESPI fringe data facilitates the extension of FE models, an approach that is of growing importance in component testing.

The use of in-plane and out-of-plane sensitive electronic speckle pattern interferometry (ESPI) for non-destructive material characterization of thick unplasticised polyvinylchloride (uPVC) pipes is presented. A test rig has been designed for stressing pipes by internal pressure. ESPI gives a complete mapping of the displacement field over the area imaged by the video camera. The results for the strain of uPVC obtained from ESPI data and from strain gauges are in good agreement. The value of Young's modulus has been obtained from the fringe data and compared with results obtained using holographic interferometry and from strain gauge measurements. The FE model also produces fringe data that is consistent with the ESPI results.     

Point load determination of static elastic moduli using laser speckle interferometry

Electronic speckle interferometry (ESPI) is used to determine the Young's modulus E and Poisson ratio ν of an isotropic material. Micron scale deformations of the surface of the block of polymethyl-methacrylate (PMMA) are induced by normal application of a known near-point force. These deformations are recorded in speckle interferometric fringe patterns. An iterative minimum error inversion technique is developed to obtain the elastic properties from the positions of fringe peaks and troughs observed in the fringe patterns. Sensitivity tests of the method on calculated fringe patterns using measured experimental uncertainties suggest the technique will provide measures of the elastic moduli to better than 5%. In an experimental test on a bloc of PMMA (acrylic) the technique gave values of E and ν that differed from corresponding measures obtained using more conventional strain-gauge methods by less than 4%.     

Measurement of the a.c. impedance of aluminium samples by holographic interferometry

In the present investigation, holographic interferometry was utilized for the first time to measure the alternating current (a.c.) impedance of aluminium samples during the initial stage of anodization processes in aqueous solution without any physical contact. The anodization process (oxidation) of the aluminium samples was carried out chemically in different sulphuric acid concentrations (0.5–3.125% H₂SO₄) at room temperature. In the mean time, a method of holographic interferometric was used to measure the thickness of anodization (oxide film) of the aluminium samples in aqueous solutions. Along with the holographic measurement, a mathematical model was derived in order to correlate the a.c. impedance of the aluminium samples in solutions to the thickness of the oxide film of the aluminium samples which forms due to the chemical oxidation. The thickness of the oxide film of the aluminium samples was measured by the real-time holographic interferometry. Consequently, holographic interferometry is found very useful for surface finish industries especially for monitoring the early stage of anodization processes of metals, in which the thickness of the anodized film as well as the a.c. impedance of the aluminium samples can be determined in situ. In addition, a comparison was made between the a.c. impedance values obtained from the holographic interferometry measurements and from measurements of electrochemical impedance spectroscopy. The comparison indicates that there is good agreement between the data from both techniques.     

High-speed ESPI and related techniques: overview and its application in the automotive industry

This paper provides an overview of recent developments and applications of high-speed electronic speckle pattern interferometry (ESPI) and related techniques ranging from high-speed pulsed laser techniques to high-speed camera methods. Different methods for extracting the phase distribution from high-speed ESPI fringe patterns are compared. Unique applications in the automotive industry using these techniques are provided. Finally, the outlook for high-speed ESPI and high-speed digital holographic interferometry are discussed.     

The measurement of residual stresses by sandwich holographic interferometry

Sandwich holographic interferometry was first proposed by Prof. N. Abramson in 1974. There are many advantages in using this method. One of its most important virtues is that it can compensate for rigid body displacements between the two exposures and is very convenient in practical operation. The authors have already made a detailed theoretical analysis of in-plane and out-of-plane displacements. This paper describes experimental measurements of the residual stresses in welds, by studying the curvature or the second-order derivative of the fringes of in-plane or out-of-plane displacements, using sandwich holographic interferometry. The stresses are obtained quantitatively, and are verified by an experiment involving measurements of the stresses of a flat plate.     

The Effects of Motion on Dynamic Moiré Interferometry

Experimental techniques (e.g. laser interferometry, photoelasticity) that generate fringe data are currently being utilized for analyzing full-field surface deformations in a variety of dynamic problems in experimental mechanics. As opposed to static problems, the transience of surface deformations in dynamic problems poses a unique problem in accurately resolving the fringe data that is acquired. Neumann determined that for time-lapse, double-exposure holographic interferometry the fringe contrast depends on the data acquisition time, wavelength of the light source, and transience of the dynamic phenomena. Dally performed a similar analysis for dynamic photoelasticity, where the dependence was on the stress gradients instead of the wavelength of the light source. This paper attempts to extend the analysis of Neumann and Dally to the analysis of transient fringe intensity data obtained from using dynamic moiré interferometry. It is found that the fringe contrast can depend on the frequency of the fringe field rather than the wavelength of the light source or stress gradients, and the fringe contrast will decay more rapidly for Gaussian light sources than constant intensity light sources. © 1997 Elsevier Science Ltd. All rights reserved.     

Electrochemical impedence spectroscopy versus optical interferometry techniques during anodization of aluminium

In the present investigation, holographic interferometry was utilized for the first time to measure in situ the thickness of the oxide film, alternating current (AC) impedance, and double layer capacitance of aluminium samples during anodization processes in aqueous solution without any physical contact. The anodization process (oxidation) of the aluminium samples was carried out by the electrochemical impedance spectroscopy (EIS), in different concentrations of sulphuric acid (1.0–2.5% H₂SO₄) at room temperature. In the mean time, the real-time holographic interferometric was used to measure the thickness of anodized (oxide) film of the aluminium samples in aqueous solutions. Also, mathematical models were applied to measure the AC impedance, and double layer capacitance of aluminium samples by holographic interferometry, during anodization processes in aqueous solution. Consequently, holographic interferometric is found very useful for surface finish industries especially for monitoring the early stage of anodization processes of metals, in which the thickness of the anodized film, the AC impedance, and the double layer capacitance of the aluminium samples can be determined in situ. In addition, a comparison was made between the electrochemical values obtained from the holographic interferometry measurements and from measurements of EIS. The comparison indicates that there is good agreement between the data from both techniques.     

Analysis by speckle interferometry of the dependency of yield stress on residual stress

We used electronic speckle pattern interferometry (ESPI) to measure in situ displacement fields nondestructively and with high resolution (10⁻² μm) by using the interferometry principle and the phase-shift technique. We measured the depth profile of the residual stress in steel pipe manufactured by thermomechanically controlled processing using a quantitative model, which explains the relationship between residual stress and displacement measured by ESPI in chemical etching. We analyzed the variation of yield stresses measured by the indentation technique and the residual stresses at various depths. The relationship between the residual stresses and the yield stresses was consistent with simulated results and can be used for indirect evaluation of the residual stresses from the yield stresses.     

The optical measurement station for complex testing of microelements

The paper presents a concept of optical measurement station for complex testing of microelements including MEMS, MOEMS and electronic components and assemblies. The wide selection of examples proves that the specific measurement requirements are fulfilled by alternative usage of combined conventional and grating interferometers CI/GI (reflective surfaces), in-plane and out-of-plane ESPI (scattering surfaces) and digital holographic interferometry DHI (mixed surfaces) supported by thermovision. All these methods are realized by integrated microinterferometer (IWaM) based on a glass waveguide or air cavity waveguide arrangements. The air cavity IWaM allows to form a thermal output for combined thermovision CI/GI or ESPI measurements.IWaM has a compact design insensitive to mechanical vibrations and may be easily rearranged to work with the selected measurement techniques. It is also fully integrated with an optical microscope and it is designed to work both in laboratories and in production environments.     

Digital phase stepping speckle interferometry

A variation of electronic speckle pattern interferometry (ESPI) is presented whereby phase fringes are produced in contrast to speckle correlation fringes. Digital phase stepping speckle interferometry uses a phase measurement technique developed for holographic interferometry, which involves phase shifting of the reference beam in a conventional speckle interferometer. Saw-tooth phase fringes are produced by subtracting the phases of the speckle fields before and after object deformation in a digital frame store. This enables the sign of the deformation to be distinguished. After application of a special low-pass digital filter, the phase fringes are of adequate quality to be counted automatically.     

Speckle interferometric damage investigation of fibre-reinforced composites

With the aid of the recently reported technique of adding up phase images modulo 2π that correspond to stepwise applied load increments, the fringe density that can be achieved in electronic speckle pattern interferometry (ESPI) has been substantially improved. This technique also allows the measurement of much larger deformations than were hitherto possible with ESPI. The analytical power of the method is demonstrated in the measurement of high local displacement gradients in carbon fibre-reinforced plastics (CFRPs). In-plane and out-of-plane displacement field measurements, performed with one single optical instrument, are compared with finite-element models. This paper reports how the technique is used to detect and quantify damage in fatigued CFRP laminates via its effect on the surface displacement field. Moreover, the measured displacement fields are used to validate a finite-element damage model. The correctness of the delamination measurement is verified with the aid of ultrasonic C-scan reference results.     

A comprehensive ESPI based system for combined measurement of shape and deformation of electronic components

This paper describes a very simple and reliable procedure for measuring shape and deformation of electronic components with a single experimental set-up. The procedure is based on two electronic speckle pattern interferometry (ESPI) techniques referred to as conventional ESPI and phase shifting ESPI (PS-ESPI). The present research is motivated by the fact that mismatch in thermal expansion coefficients of the different materials included in electronic packaging (EP) may cause mechanical failures since thermal stresses will change sharply through subsequent loading cycles. ESPI is particularly suitable for measurements on EP since it allows us to perform non–contact testing of non-planar heterogeneous surfaces. It is apparent that gathering detailed topographic information will certainly help us to measure accurately surface deformations of EP along with modeling correctly numerical analysis.As is known, the accuracy of results obtained with ESPI may be significantly improved by phase shifting techniques (PST). Therefore, this paper compares the relative merits of different phase-stepping strategies in order to find which strategy will perform the best for the optical set-up utilized in the experiments. Preliminary investigations on a standard specimen under three-point-bending served to choose properly the optical set-up and phase-stepping procedure which yield the best fringe visibility. Four-phases achieved the best fringe visibility and the minimum number of invalid pixels.These information have been utilized in the experimental campaign on standard and surface mounted technology (SMT) electronic components. ESPI and PS-ESPI have been used for analyzing the transient state and the steady state of devices, respectively. From the experimental results obtained here, it appears possible to measure strains induced by thermal loading cycles. The experimental set-up, based on the Lendeertz's interferometer, proved itself also able to contour specimen surface at a good level of detail. Remarkably, by using the same set-up for deformation and shape measurements we can preserve the pixel by pixel relationship between displacements and surface depth which will hold true if correlation between different exposures is not destroyed.The results obtained in this research justify using PS-ESPI in order to understand better failure mechanisms of electronic components. This fact along with the exact knowledge of object shape may be particularly useful in the different design stages (including FEM modeling and analysis) of electronics for special applications.     

Estimation of the 2D measurement error introduced by in-plane and out-of-plane electronic speckle pattern interferometry instruments

Optical interferometric metrology techniques are being increasingly used in industry. These techniques assure a greater accuracy in measuring displacements caused by deformations. One such technique, electronic speckle pattern interferometry (ESPI), has been used successfully to measure in-plane and out-of-plane deformations. The usual model describing ESPI instruments behaviour is only valid in or near the centre of the illuminated surface. In general, this model is used as such for all the points on the surface creating thus an approximate figure of the reality. This study has led to an improved 3D vectorial model, allowing us to assess qualitatively and quantitatively what is actually measured throughout all the inspected surface. Calculations with practical parameters taken from real ESPI instruments designed in the Joint Research Centre of Ispra (Italy) were carried out. The results showing three-dimensional diagrams of the measurement errors are presented and discussed.     

Laser metrology — a diagnostic tool in automotive development processes

Laser measurement techniques are widely used in automotive development processes. Applications at Volkswagen are presented where laser metrology works as a diagnostic tool for analysing and optimising complex coupled processes inside and between automotive components and structures such as the reduction of a vehicle's interior or outer acoustic noise, including brake noise, and the combustion analysis for diesel and gasoline engines to further reduce fuel consumption and pollution. Pulsed electronic speckle pattern interferometry (ESPI) and holographic interferometry are used for analysing the knocking behaviour of modern engines and for correct positioning of knocking sensors. Holographic interferometry shows up the vibrational behaviour of brake components and their interaction during braking, and allows optimisation for noise-free brake systems. Scanning laser vibrometry analyses structure-born noise of a whole car body for the optimisation of its interior acoustical behaviour.Modern engine combustion concepts such as in direct-injection (DI) gasoline and diesel engines benefit from laser diagnostic tools which permit deeper insight into the in-cylinder processes such as flow generation, fuel injection and spray formation, atomisation and mixing, ignition and combustion, and formation and reduction of pollutants. The necessary optical access inside a cylinder is realised by so-called ‘transparent engines’ allowing measurements nearly during the whole engine cycle. Measurement techniques and results on double-pulse particle image velocimetry (PIV) with a frequency-doubled YAG laser for in-cylinder flow analysis are presented, as well as Mie-scattering on droplets using a copper vapour laser combined with high-speed filming, and laser-induced fluorescence (LIF) with an excimer laser for spray and fuel vapour analysis.     

Noise reduction in electronic speckle pattern interferometry fringes by merging orthogonally polarised speckle fields

The noise in sawtooth fringes generated by electronic speckle pattern interferometry (ESPI) is investigated. When deformations of depolarising objects are studied, the scattered object light can be decomposed into two orthogonal linearly polarised speckle patterns which are partially decorrelated. Their correlation coefficient decreases with increasing depolarisation coefficient of the object. By suitable merging of the phase distributions of these two speckle fields on the basis of a modulation depth analysis, the rms phase error in the ESPI sawtooth fringes can be reduced significantly.     

Displacement measurements in structural elements by optical techniques

Speckle metrology and holographic interferometry (HI) have been used in several civil engineering applications. We present the results obtained by applying speckle photography (SP) to the study of two quadratic shearwalls with different boundary conditions, and the potential of the technique in the study of this kind of structures is described. The analysis of Young's fringes obtained with this technique at certain points on each shearwall provides the whole field of displacement measurements. HI has been used to measure the three components of absolute displacement, verifying that the bulging phenomenon does not affect the in-plane components when the applied load remains on the same plane as the shearwall. A qualitative analysis is carried out following an electronic speckle pattern interferometry (ESPI) technique. The results obtained by optical techniques are compared to the numerical results obtained by the finite element method (FEM), finding good correlation between them in all the cases.     

Holographic interferometry using a reference wave with a sinusoidally modulated amplitude

A method of holographic interferometry which uses an amplitude-modulated reference wave is proposed for investigating vibration phases. Sinusoidal amplitude modulation of a reference wave yields hologram fringes which are characterized by a function J²₁(α)cos²Δ, where α and Δ are related to vibration amplitudes and phases on object points, respectively. The resultant fringes indicate that vibration amplitude information and phase information are stored separately. The phase information of the vibration is easily obtained as brightness variations of the fringes, independently of the amplitude information.     

Simultaneous 2D in-plane deformation measurement using electronic speckle pattern interferometry with double phase modulations

Electronic speckle pattern interferometry(ESPI) and digital speckle pattern interferometry are wellestablished non-contact measurement methods. They have been widely used to carry out precise deformation mapping. However, the simultaneous two-dimensional(2D) or three-dimensional(3D) deformation measurements using ESPI with phase shifting usually involve complicated and slow equipment. In this Letter, we solve these issues by proposing a modified ESPI system based on double phase modulations with only one laser and one camera. In-plane normal and shear strains are obtained with good quality. This system can also be developed to measure 3D deformation, and it has the potential to carry out faster measurements with a highspeed camera.     

Proposal for underwater structural analysis using the techniques of ESPI and digital holography

The purpose of this article is to study the application of the holographic interferometry techniques in the structural analysis of submarine environment. These techniques are widely used today, with applications in many areas. Nevertheless, its application in submarine environments presents some challenges. The application of two techniques, electronic speckle pattern interferometry (ESPI) and digital holography, comparison of advantages and disadvantages of each of them is presented. A brief study is done on the influence of water properties and the optical effects due to suspended particles as well as possible solutions to minimize these problems.     

Electronic speckle pattern interferometry using a CO2 laser

The advantages and problems of using electronic speckle pattern interferometry (ESPI) at longer (infra-red) wavelengths are discussed. The adjustment and use of an ESPI set-up with a CO₂ laser and pyroelectric vidicon are described and illustrated by some experimental results.