Water sorption and activation energy in polyimide thin films

The water sorption behavior and the activation energy were investigated for various chemical structure polyimide thin films; BPDA‐PDA, BPDA‐ODA, PMDA‐ODA, and 6FDA‐ODA. The activation energy for the water diffusion varied in the range of 5.53 to 9.27kcal/mol, and was in the increasing order: BPDA‐PDA < BPDA‐ODA < PMDA‐ODA < 6FDA‐ODA. BPDA‐PDA and BPDA‐ODA polyimide films showed relatively well‐ordered morphological structure, which results in relatively low diffusion coefficient and high activation energy. It was found that the diffusion coefficient and the activation energy are significantly related to the in‐plane orientation, crystallinity, and packing order in the polyimide thin films. The morphological structure was predominant factors for the water diffusion coefficient and activation energy in the polyimide thin films. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 2714–2720, 2000     

Nanoindentation studies of polyimide thin films with various internal linkages in the diamine component

Polyimide thin films were synthesized from 3,3′,4,4′‐biphenyltetracarboxylic acid dianhydride (BPDA) and four different diamines (p‐phenylene diamine, 4,4′‐oxydiphenylene diamine, 4,4′‐biphenylene diamine, and 4,4′‐sulfonyldiphenylene diamine). The nanoindentation behavior of the resulting polyimides, namely, poly(p‐phenylene biphenyltetracarboximide) (BPDA‐PDA), poly(4,4′‐biphenylene biphenyltetracarboximide) (BPDA‐BZ), poly(4,4′‐oxydiphenylene biphenyltetracarboximide) (BPDA‐ODA), and poly(4,4′‐sulfonyldiphenylene biphenyltetracarboximide) (BPDA‐DDS), were investigated. Also, the morphological properties were characterized with a prism coupler and wide‐angle X‐ray diffraction and were correlated to the nanoindentation studies. The nanoindentation behavior and hardness varied quite significantly, depending on the changes in the chemical and morphological structures. The hardness of the polyimide thin films increased in the following order: BPDA‐DDS < BPDA‐ODA < BPDA‐BZ < BPDA‐PDA. For all the polyimide thin films, except that of BPDA‐BZ, the hardness decreased with an increase in the load. The birefringence, a measure of the molecular in‐plane orientation, increased in the following order: BPDA‐DDS < BPDA‐ODA < BPDA‐PDA < BPDA‐BZ. The X‐ray diffraction studies revealed that the crystallinity of the polyimide thin films varied with the changes in the chemical structure. The studies showed that the indentation response with an applied load and the hardness by nanoindentation for the BPDA‐based polyimides were closely related to the morphological structure. The nanoindentation and birefringence results revealed that the mechanical properties of the polyimide thin films were dependent on the crystallinity, which arose because of the chain order along the chain axis and the molecular packing order. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 861–870, 2004     

Photosensitive fluorinated polyimides with a low dielectric constant based on reaction development patterning

The fluorinated polyimide PI(6FDA/HFBAPP) was prepared by the reaction of 4,4′‐(hexafluoroisopropylidene)diphthalic anhydride (6FDA) with 2,2‐bis[4‐(4‐aminophenoxy)phenyl]hexafluoropropane (HFBAPP) in 1‐methyl‐2‐pyrrolidone/toluene. A multiblock copolyimide with both fluorinated and rigid‐rod segments, PI(6FDA/HFBAPP)(BPDA/2‐DMB), was prepared by the addition of a second dianhydride, 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA), and a second diamine, 2,2′‐dimethylbenzidine (2‐DMB), to the polyimide main chain. The potential lithographic performance of photosensitive polyimides composed of nonphotosensitive fluorine‐containing polyimides and photosensitive diazonaphthoquinone (DNQ) was studied on the basis of a new imaging principle recently proposed by our laboratory, that is, reaction development patterning. Neat PI(6FDA/HFBAPP) showed a low dielectric constant (?) of 2.41 and a low dissipation factor (tan δ) of 0.0027 at 20 GHz, and a 10‐μm resolution of the fluorinated polyimide/DNQ system was demonstrated with reactive development with a solution including ethanolamine after ultraviolet exposure. Although slight changes in the dielectric properties were observed in the presence of DNQ residues, these values (? = 2.63 and tan δ = 0.0033 at 20 GHz) were low enough for use in microelectronic applications. However, PI(6FDA/HFBAPP)(BPDA/2‐DMB), having a lower coefficient of thermal expansion (CTE; 33 ppm/°C) than PI(6FDA/HFBAPP) (49 ppm/°C), exhibited good positive photosensitivity, whereas the relatively low‐CTE multiblock copolyimide displayed a much higher ? value (3.48 at 1 MHz) than the highly fluorinated polyimide (2.88 at 1 MHz). A film consisting of PI(6FDA/HFBAPP)(BPDA/2‐DMB) and the remaining DNQ derivatives showed a CTE value comparable to that of the neat polyimide film. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 861–871, 2003     

Novel Non‐Coplanar and Tertbutyl‐Substituted Polyimides: Solubility,Optical, Thermal and Dielectric Properties

A novel aromatic diamine monomer bearing tertbutyl and 4‐tertbutylphenyl groups, 3,3′‐ditertbutyl‐4,4′‐diaminodiphenyl‐4′′‐tertbutylphenylmethane (TADBP), was prepared and characterized. A series of non‐coplanar polyimides (PIs) were synthesized via a conventional one‐step polycondensation from TADBP and various aromatic dianhydrides including pyromellitic dianhydride (PMDA), 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA), 4,4′‐oxydiphthalic anhydride (OPDA), 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride (BTDA) and 4,4′‐(hexafluoroisopropylidene)dipthalic anhydride (6FDA). All PIs exhibit excellent solubility in common organic solvents such as N,N‐dimethylformamide (DMF), N,N‐dimethylacetamide (DMAc), N‐methyl‐2‐pyrrolidone (NMP), dimethyl sulfoxide (DMSO), chloroform (CHCl₃), tetrahydrofuran (THF), and so on. Furthermore, the obtained transparent, strong and flexible polyimide films present good thermal stability and outstanding optical properties. Their glass transition temperatures (T_gs) are in the range of 298 to 347°C, and 10% weight loss temperatures are in excess of 490°C with more than 53% char yield at 800°C in nitrogen. All the polyimides can be cast into transparent and flexible films with tensile strength of 80.5–101 MPa, elongation at break of 8.4%–10.5%, and Young's modulus of 2.3–2.8 GPa. Meanwhile, the PIs show the cutoff wavelengths of 302–356 nm, as well as low moisture absorption (0.30% –0.55%) and low dielectric constant (2.78–3.12 at 1 MHz).     

Gas‐transport properties of indan‐containing polyimides

A series of indan‐containing polyimides were synthesized, and their gas‐permeation behavior was characterized. The four polyimides used in this study were synthesized from an indan‐containing diamine [5,7‐diamino‐1,1,4,6‐tetramethylindan (DAI)] with four dianhydrides [3,3′4,4′‐benzophenone tetracarboxylic dianhydride (BTDA), 3,3′4,4′‐oxydiphthalic dianhydride (ODPA), (3,3′4,4′‐biphenyl tetracarboxylic dianhydride (BPDA), and 2,2′‐bis(3,4′‐dicarboxyphenyl) hexafluoropropane dianhydride (6FDA)]. The gas‐permeability coefficients of these four polyimides changed in the following order: DAI–BTDA < DAI–ODPA < DAI–BPDA < DAI–6FDA. This was consistent with the increasing order of the fraction of free volume (FFV). Moreover, the gas‐permeability coefficients were almost doubled from DAI–ODPA to DAI–BPDA and from DAI–BPDA to DAI–6FDA, although the FFV differences between the two polyimides were very small. The gas permeability and diffusivity of these indan‐containing polyimides increased with temperature, whereas the permselectivity and diffusion selectivity decreased. The activation energies for the permeation and diffusion of O₂, N₂, CH₄, and CO₂ were estimated. In comparison with the gas‐permeation behavior of other indan‐containing polymers, for these polyimides, very good gas‐permeation performance was found, that is, high gas‐permeability coefficients and reasonably high permselectivity. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 2769–2779, 2004     

Stress behaviors and thermal properties of polyimide thin films depending on the different curing process

The effect of high boiling point solvent on the residual stress behaviors of semiflexible structure poly(4,4′‐oxydiphenylene pyromellitimide) (PMDA‐ODA) and pseudo‐rodlike poly(p‐phenylene biphenyltetracarboximide) (BPDA‐PDA) polyimide was investigated. As a solvent, a mixed solution of 20 wt % cyclohexyl‐2‐pyrrolidone (CHP; bp = 307 °C) and 80 wt % n‐methyl‐2‐pyrrolidone (NMP; bp = 202 °C) was used. The effects of solvent system and imidizing history on the morphological structure, as well as residual stress, were significantly high in the BPDA‐PDA having high chain rigidity, but relatively low in the semiflexible PMDA‐ODA with low chain rigidity. In addition, rapidly cured films prepared from PAA (NMP/CHP) showed higher residual stress and a lower degree of molecular anisotropy than slowly cured film imidized from PAA (NMP). This was induced by high chain mobility in polyimide thin films prepared from PAA (NMP/CHP) during the thermal cure process. Therefore, molecular anisotropy, depending on the solvent system and imidizing history, might be one of the important factors leading to low residual stress in polyimide thin films. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 2879–2890, 2000     

Synthesis and characterization of novel polyimides containing stilbene unit in the side chain and their controllability of nematic liquid crystal alignment on the rubbed surfaces

Four polyimides containing hexylene spacer and a fluorostilbene unit in the side chains were prepared in thin‐film form by two‐step condensation of 3,3′‐bis[(4′‐fluoro‐4‐stilbenyl)oxyhexyloxy]‐4,4′‐biphenyldiamine (FS6B) with pyromellitic dianhydride (PMDA), benzophenone‐3,3′,4,4′‐tetracarboxylic dianydride (BTDA), 4,4′‐oxydi(phthalic anhydride) (ODPA), and 4,4′‐hexafluoroisopropylidenedi(phthalic anhydride) (6FDA), respectively, and their controllability of liquid crystal (LC) alignment on rubbed surfaces was investigated. Pretilt angles of LCs were achieved in the 2–9° range, depending on the rubbing density and backbone structures. The effect of the mesogenic stilbene group on the pretilting of LCs was distinctive in FS6B‐PMDA. Contact‐angle measurements on thin films annealed at 120 °C revealed that FS6B‐PMDA potentially had the better alignment stability than FS6B‐6FDA. © 2001 John Wiley & Sons, Inc. J Polym Sci Part A: Polym Chem 39: 3622–3632, 2001     

Synthesis and characterization of novel fluorinated aromatic polyimides derived from 1,1‐bis(4‐amino‐3,5‐dimethylphenyl)‐1‐(3,5‐ditrifluoromethylphenyl)‐2,2,2‐trifluoroethane and various aromatic dianhydrides

A novel fluorinated aromatic diamine, 1,1‐bis(4‐amino‐3,5‐dimethylphenyl)‐1‐(3,5‐ditrifluoromethylphenyl)‐2,2,2‐trifluoroethane (9FMA), was synthesized by the coupling reaction of 3′,5′‐ditrifluoromethyl‐2,2,2‐trifluoroacetophenone with 2,6‐dimethylaniline under the catalysis of 2,6‐dimethylaniline hydrochloride. A series of fluorinated aromatic polyimides were synthesized from 9FMA and various aromatic dianhydrides, including pyromellitic dianhydride, 3,3′4,4′‐biphenyl tetracarboxylic dianhydride, 4,4′‐oxydiphthalic anhydride, 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride (BTDA), and 4,4′‐hexafluoroisopropylidene diphthalic anhydride, via a high‐temperature, one‐stage imidization process. The inherent viscosities of the polyimides ranged from 0.37 to 0.74 dL/g. All the polyimides were quickly soluble in many low‐boiling‐point organic solvents such as tetrahydrofuran, chloroform, and acetone as well as some polar organic solvents such as N‐methyl‐2‐pyrrolidinone, N,N′‐dimethylacetamide, and N,N′‐dimethylformamide. Freestanding fluorinated polyimide films could be prepared and exhibited good thermal stability with glass‐transition temperatures of 298–334 °C and outstanding mechanical properties with tensile strengths of 69–102 MPa and elongations at break of 3.3–9.9%. Moreover, the polyimide films possessed low dielectric constants of 2.70–3.09 and low moisture absorption (<0.58%). The films also exhibited good optical transparency with a cutoff wavelength of 303–351 nm. One polyimide (9FMA/BTDA) also exhibited an intrinsic negative photosensitivity, and a fine pattern could be obtained with a resolution of 5 μm after exposure at the i‐line (365‐nm) wavelength. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 2665–2674, 2006     

Preparation of novel,high‐modulus,swollen‐ or jungle‐gym‐type polyimide gels end‐crosslinked with 1,3,5‐tris(4‐aminophenyl)benzene

A novel preparation approach for high‐performance polyimide gels that are swollen or have a jungle‐gym‐type structure is proposed. A new rigid and symmetric trifunctional amine, 1,3,5‐tris(4‐aminophenyl)benzene (TAPB), was synthesized as a crosslinker. Three different kinds of amic acid oligomers derived from pyromellitic dianhydride (PMDA), 4,4′‐oxydiphthalic anhydride (ODPA), p‐phenylenediamine (PDA), and 4,4′‐oxydianiline (ODA) were end‐crosslinked with TAPB at a high temperature to make polyimide networks with different structures. Transparent polyimide gels were obtained from the ODPA–ODA/TAPB series with high compression moduli of about 1 MPa at their equilibrium swollen states in N‐methylpyrrolidone. Microscopic phase separation occurred during the gelation–imidization process when polyimide networks were generated from PMDA–PDA/TAPB and PMDA–ODA/TAPB. After these opaque polyimide networks were dried, a jungle‐gym‐like structure was obtained for the PMDA–PDA/TAPB and PMDA–ODA/TAPB series; that is, there was a high void content inside the networks (up to 70%) and little volume shrinkage. These polyimide networks did not expand but absorbed the solvent and showed moduli as high as those of solids. Therefore, using the highly rigid crosslinker TAPB combined with the flexible monomers ODPA and ODA and the rigid monomers PMDA and PDA, we prepared swollen, high‐performance polyimide gels and jungle‐gym‐type polyimide networks, respectively. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 2501–2512, 2002     

Syntheses and properties of organosoluble polyimides based on 5,5′‐bis[4‐(4‐aminophenoxy)phenyl]‐4, 7‐methanohexahydroindan

A series of organosoluble aromatic polyimides (PIs) was synthesized from 5,5′‐bis[4‐(4‐aminophenoxy)phenyl]‐4,7‐methanohexahydroindan (3) and commercial available aromatic dianhydrides such as 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA), 4,4′‐oxydiphthalic anhydride (ODPA), 4,4′‐sulfonyl diphthalic anhydride (SDPA), or 2,2′‐bis(3,4‐dicarboxyphenyl) hexafluoropropanic dianhydride (6FDA). PIs (III_c–f), which were synthesized by direct polymerization in m‐cresol, had inherent viscosities of 0.83–1.05 dL/g. These polymers could easily be dissolved in N,N′‐dimethylacetamide (DMAc), N‐methyl‐2‐pyrrolidone (NMP), N,N‐dimethylformamide (DMF), pyridine, m‐cresol, and dichloromethane. Whereas copolymerization was proceeded with equivalent molar ratios of pyromellitic dianhydride (PMDA)/6FDA, 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride (BTDA)/6FDA, or BTDA/SDPA, or ½ for PMDA/SDPA, copolyimides (co‐PIs), derived from 3 and mixed dianhydrides, were soluble in NMP. All the soluble PIs could form transparent, flexible, and tough films, and they showed amorphous characteristics. These films had tensile strengths of 88–111 MPa, elongations at break of 5–10% and initial moduli of 2.01–2.67 GPa. The glass transition temperatures of these polymers were in the range of 252–311°C. Except for III_e, the 10% weight loss temperatures (T_d) of PIs were above 500°C, and the amount of carbonized residues of the PIs at 800°C in nitrogen atmosphere were above 50%. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 1681–1691, 1999     

Synthesis and properties of fluorinated polyimides. 1. Derived from novel 4,4″‐bis(aminophenoxy)‐3,3″‐trifluoromethyl terphenyl

A new diamine monomer, 4,4″‐bis(aminophenoxy)‐3,3″‐trifluoromethyl terphenyl (ATFT) was synthesized that led to a number of novel fluorinated polyimides by solution as well as thermal imidization routes when reacted with different commercially available dianhydrides like pyromellatic dianhydride (PMDA), benzophenone tetracarboxylic acid dianhydride (BTDA), or 2,2‐bis(3,4‐dicarboxyphenyl) hexafluoropropane (6FDA). The polyimides ATFT/BTDA and ATFT/6FDA derived from both routes were soluble in several organic solvents such as N,N‐dimethylformamide, N,N‐dimethylacetamide, and dimethyl sulfoxide. The polyimide ATFT/PMDA was only soluble in N‐methylpyrollidone. The polyimide films had low water absorption of 0.3–0.7%, low dielectric constants of 2.72–3.3 at 1 Hz, refractive indices of 1.594–1.647 at 589.3 nm, and optical transparency >85%. These polyimides showed very high thermal stability with decomposition temperatures (5% weight loss) up to 532 °C in air and good isothermal stability; only 7% weight loss occurred at 400 °C after 7 h, and less than 0.6% weight loss was observed at 315 °C for 5 h. Transparent thin films of these polyimides exhibited tensile strengths up to 112 MPa, a modulus of elasticity up to 3.05 GPa, and elongation at break up to 21% depending on the repeating unit structure. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 1016–1027, 2002     

Partly Imidized Polyamic Acid and Its UniaxialStretched Polyimide Films

Partly imidized polyamic acid(PAA) has been used to prepare high performance polyimide films. The behaviors of two polyamic acids derived from pyromellitic dianhydride(PMDA)/4,4′-oxydianiline(ODA) and 3,3′,4,4′-biphenyltetracarboxylic diahhydride(BPDA)/paraphenylenediamine(PPD) containing dehydrating agents composed of acetic anhydride and a tertiary amine as the catalyst were investigated. The gel point was dependent on imidization degree in despite of temperature and the molar ratio of catalyst to acetic acid. Imdization content was about 35% for PMDA/ODA and about 22% for BPDA/PPD. The effect of catalyst on imidization possessed an order of triethylamine>3-methylpyridine>pyridine>isoquinoline>2-methylpyridine. The stretching of the films greatly reduced the coefficient of linear thermal expansion(CTE) either in the longitudinal direction or transversal direction. Compared to the film from polyamic acid, the partly imidized film had greater stretching ratio, so that the uniaxial stretched polyimide film from partly imidized PAA had higher tensile strength and tensile modulus, but lower elongation in the stretching direction.     

Polyimide containing internal acetylene units linked para to the aromatic ring

4,4′-Diaminodiphenylacetylene (p-intA) was reacted with 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA), 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA) and pyromellitic dianhydride (PMDA) in N-methyl-2-pyrrolidone (NMP) to give poly(amic acid) solution of moderate to high viscosity. Thermal imidization gave polyimide having acetylene units that are linked para to the aromatic connecting unit. Polyimide having acetylene units that are linked meta to the aromatic connecting unit also was prepared utilizing 3,3′-diaminodiphenylacetylene (m-intA) for comparison. The crosslinking behavior of the acetylene units was observed with DSC. Exotherm due to the crosslinking of the para-linked acetylene units appeared at ca. 340 to 380°C depending on the structure of polyimide, whereas meta-linked acetylene units appeared at lower temperature as 340–350°C. After thermal treatment at high temperature such as 350 or 400°C, the amount of the exotherm became smaller and finally disappeared on DSC, confirming the progress of crosslinking. Dynamic mechanical properties of the polyimide films show that glass transition temperature increased with higher heat treatment, also confirming the progress of crosslinking. Tensile properties of the polyimide films showed that rigid polyimide films consisting of p-intA with BPDA or PMDA have considerably higher modulus than those consisting of m-intA. Cold-drawing of the poly(amic acid) followed by imidization gave much higher modulus in the case of rigid polyimide. © 1997 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 35 : 2395–2402, 1997     

Low dielectric constant polyimide nanomats by electrospinning

The proper combination of material (i.e. fluorinated polyimides) and processing technique (electrospinning) could lead to the formation of polyimides with low dielectric constant, high thermo‐oxidative stability and glass transition temperature, and high hydrophobicity. The polyimides in this work were based on 4, 4‐bis [3′‐trifluoromethyl‐4′ (4′‐amino benzoxy) benzyl] biphenyl (Q) and various fluorinated and non‐fluorinated dianhydrides namely benzene‐1,2,4,5‐tetracarboxylic dianhydride, 3,3′,4,4′‐biphenyltetracarboxylic dianhydride, benzophenone‐3,3′,4,4′‐tetracarboxylic dianhydride, and 4,4′‐(hexafluoroisopropylidene)diphthalic anhydride (6FDA). Processing of the polyimides was carried out in poly(amic acid) stage by two different methods—electrospinning and solution casting for comparison purposes. The processing of polyimides by electrospinning led to enhancement in mechanical properties (dianhydride‐structure dependent) and hydrophobicity without sacrificing thermo‐oxidative stability and glass transition temperatures significantly. Also, low dielectric constants (as low as 1.43) could be attained by suitable combination of dianhydride (6FDA) with 4, 4‐bis [3′‐trifluoromethyl‐4′ (4′‐amino benzoxy) benzyl] biphenyl diamine. Copyright © 2011 John Wiley & Sons, Ltd.     

Preparation and absorption spectrum studies of aromatic and alicyclic poly(amide acid) ammonium salts in water and DMF and in films

A series of ammonium salts of poly(amide acid)s (PAS) were prepared from various poly(amide acid)s (PAA) with tertiary amines. The solubility of poly(amide acid) ammonium salts prepared from PAA(PMDA/ODA) in water is related to the ion concentration of tertiary amines. In order to elucidate the influence of the chemical structures of poly(amide acid)s and poly(amide acid) ammonium salts on their absorption spectra, pyromellitic dianhydride (PMDA), 3,3′,4,4 ′-biphenyltetracarboxylic dianhydride (BPDA), and 3,3′,4,4 ′-benzophenonetetracarboxylic dianhydride (BTDA) were chosen to react with p-phenylenediamine (PDA) and (4,4′-diaminodicyclohexyl)methane (DCHM) to give three kinds of aromatic PAAs and three kinds of alicyclic PAAs. The corresponding PASs were prepared by the reaction of PAAs with triethanolamine (TEA). Their ultraviolet–visible (UV–vis) absorption spectra were investigated compared to those of model compounds. A transparent film without absorption above 320 nm was obtained for PAS(PMDA/DCHM). The difference in absorption spectra of PAS(PMDA/PDA) from that of PAS(PMDA/DCHM) can be related to the existence of intra- and intermolecular charge transfer (CT) for PAS(PMDA/PDA). The absorption spectra of PASs with PDA in films are red shifted compared to those of corresponding PAAs in films, while the absorption spectra of PASs in water are blue shifted compared to those of corresponding PAAs in DMF. No differences in the absorption spectra of PAAs and PASs were found in DMF/H₂O (9/1) mixed solvent. © 1998 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 36: 1329–1340, 1998     

Influence of Steric Hindrance Between Hydrogen Atoms of Linkage Groups and Adjacent Phenyls on Properties of Polyimide

A diamine monomer 4,4′-methylenedianiline(MDA) was introduced to modify the polyimide of pyromellitic dianhydride(PMDA) and 4,4′-oxydianiline(ODA) by polycondensation. A series of polyamic acids was synthesized from MDA and ODA of different molar ratios with PMDA of sum mole of moles of MDA and ODA, and polyimide films were obtained by thermal imidization. Polyimide(PI) films were characterized by tensile testing, dynamic mechanical analysis(DMA), thermal gravimetry analysis(TGA), Fourier transform infrared spectroscopy (FTIR), wide X-ray diffraction(WAXD) and molecular simulation. With the increase of MDA content, the tensile strength and thermal decomposition temperature remained generally stable compared with those of PMDA/ODA polyimide. Unexpectedly, the glass transition temperature(T_g) and Young’s modulus increased from 388.7 ℃ and 2.37 GPa to 408.3 ℃ and 5.74 GPa, respectively. The results of WAXD and molecular simulation indicate the steric hindrance among hydrogen atoms of the linkage groups and adjacent phenyls enhanced the properties of the polyimide modified with MDA.     

High‐pressure sorption of carbon dioxide and methane in all‐aromatic poly(etherimide)‐based membranes

The sorption of compressed carbon dioxide and methane in a series of all‐aromatic poly(etherimide) (PEI) thin films is presented. The polymer films are derived from the reactions between an arylether diamine (P1) and four different dianhydrides [3,3′,4,4′‐oxydiphthalic dianhydride (ODPA), 3,3′,4,4′ biphenyltetra‐carboxylic dianhydride (BPDA), 3,3′,4,4′‐benzo‐phenonetetracarboxylic dianhydride (BTDA), and pyromellitic dianhydride (PMDA)] that have been selected to systematically change the flexibility of the polymer backbone, the segmental mobility, and the nonequilibrium excess free volume (EFV) of the polymer. The EFV, gas sorption capacities, and sorption‐ and temperature‐induced dynamic changes in film thickness and refractive index have been investigated by spectroscopic ellipsometry. The sorption capacity depends to a great extent on the PEI backbone composition. PMDA‐P1 shows the highest carbon dioxide sorption, combined with the lowest sorption selectivity because of the predominant sorption of methane in the EFV. For ODPA‐P1, the highest sorption selectivity is obtained, while it shows little long‐term relaxations at carbon dioxide pressures up to 25 bar. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2016 , 54, 986–993     

Organosoluble polyimides and copolyimides based on 1,1‐bis[4‐(4‐aminophenoxy)phenyl]‐1‐phenylethane and aromatic dianhydrides

1,1‐Bis[4‐(4‐aminophenoxy)phenyl]‐1‐phenylethane (BAPPE) was prepared through nucleophilic substitution reaction of 1,1‐bis(4‐hydroxyphenyl)‐1‐phenylethane and p‐chloronitrobenzene in the presence of K₂CO₃ in N,N‐dimethylformamide, followed by catalytic reduction with hydrazine and Pd/C. Novel organosoluble polyimides and copolyimides were synthesized from BAPPE and six kinds of commercial dianhydrides, including pyromellitic dianhydride (PMDA, I_a ), 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride (BTDA, I_b ), 3,3′,4,4′‐ biphenyltetracarboxylic dianhydride (BPDA, I_c ), 4,4′‐oxydiphthalic anhydride (ODPA, I_d ), 3,3′,4,4′‐diphenylsulfonetetracarboxylic dianhydride (DSDA, I_e ) and 4,4′‐hexafluoroisopropylidenediphthalic anhydride (6FDA, I_f ). Differing with the conventional polyimide process by thermal cyclodehydration of poly(amic acid), when polyimides were prepared by chemical cyclodehydration with N‐methyl‐2‐pyrrolidone as used solvent, resulted polymers showed good solubility. Additional, I_a,b were mixed respectively with the rest of dianhydrides (I_c–f) and BAPPE at certain molar ratios to prepare copolyimides with arbitrary solubilities. These polyimides and copolyimides were characterized by good mechanical properties together with good thermal stability. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 2082–2090, 2000     

Synthesis and characterization of novel fluorinated polyimides derived from 4,4′‐[2,2,2‐trifluoro‐1‐(3‐trifluoromethylphenyl)ethylidene]diphthalic anhydride and aromatic diamines

A novel fluorinated aromatic dianhydride, 4,4′‐[2,2,2‐trifluoro‐1‐(3‐trifluoromethyl‐phenyl)ethylidene]diphthalic anhydride (TFDA) was synthesized by coupling of 3′‐trifluoromethyl‐2,2,2‐trifluoroacetophenone with o‐xylene under the catalysis of trifluoromethanesulfonic acid, followed by oxidation of KMnO₄ and dehydration. A series of fluorinated aromatic polyimides derived from the novel fluorinated aromatic dianhydride TFDA with various aromatic diamines, such as p‐phenylenediamine (p‐PDA), 4,4′‐oxydianiline (ODA), 1,4‐bis(4‐aminophenoxy)benzene (p‐APB), 1,3‐bis(4‐amino‐phenoxy)benzene (m‐APB), 4‐(4‐aminophenoxy)‐3‐trifluoromethylphenylamine (3FODA) and 1,4‐bis(4‐amino‐2‐trifluoromethylphenoxy)benzene (6FAPB), were prepared by polycondensation procedure. All the fluorinated polyimides were soluble in many polar organic solvents such as NMP, DMAc, DMF, and m‐cresol, as well as some of low boiling point organic solvents such as CHCl₃, THF, and acetone. Homogeneous and stable polyimide solutions with solid content as high as 35–40 wt % could be achieved, which were prepared by strong and flexible polyimide films or coatings. The polymer films have good thermal stability with the glass transition temperature of 232–322 °C, the temperature at 5% weight loss of 500–530 °C in nitrogen, and have outstanding mechanical properties with the tensile strengths of 80.5–133.2 MPa as well as elongations at breakage of 7.1–12.6%. It was also found that the polyimide films derived from TFDA and fluorinated aromatic diamines possess low dielectric constants of 2.75–3.02, a low dissipation factor in the range of 1.27–4.50 × 10^?3, and low moisture absorptions <1.3%. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 4143–4152, 2004     

Synthesis of polyimide and poly(imide-benzoxazole) in polyphosphoric acid

A polyimide made from 4,4′-diaminodiphenyl ether (ODA) and 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA) was synthesized in polyphosphoric acid. Although the polymerization proceeded heterogeneously, a polyimide with an inherent viscosity of 0.90 was obtained, and a tough and flexible film was made from this polyimide. This polymerization was a one-step reaction including polycondensation and imidization; this was also confirmed by a model reaction between aniline and phthalic anhydride. Utilizing this polymerization method, 3,3′-dihydroxy-4,4′-diaminobiphenyl and 2 mol of 4-aminobenzoic acid were reacted in PPA, then BPDA was reacted to obtain an alternate copolymer containing imide and oxazole rings. This reaction gave a homogeneous solution of the poly(imide-benzoxazole). © 1993 John Wiley & Sons, Inc.