首页 | 本学科首页   官方微博 | 高级检索  
相似文献
 共查询到18条相似文献,搜索用时 140 毫秒
1.
使用焦散线法与光弹法测定三维裂纹混合型应力强度因子   总被引:1,自引:0,他引:1  
本文介绍了将焦散线法与应力冻结,“解冻”技术相结合,使焦散线法用于测量三维体内部裂纹前缘应力强度因子的实验方法,并针对复杂应力状态下三维裂纹前缘的不同应变奇异场,合理地综合运用焦散线法与三维光弹法,实际测量与分离了三维裂纹前缘混合型应力强度因子。  相似文献   

2.
赵大华  李华锋 《实验力学》2006,21(4):513-518
工程结构裂纹尖端应力强度因子(SIF)由于形状、荷载的复杂性及边界条件的不确定性,难以用解析法得到,数值计算也有困难,而光弹性法弥补了上述方法的不足。本文用环氧树脂制作圆轴模型,采用机加工的方法制作圆轴模型裂纹,然后将加载模型进行应力冻结,通过光弹性实验研究分析了圆轴裂纹尖端应力分布。由于带环形裂纹的圆轴在弯扭组合变形时,离中性轴最远的裂纹尖端处于复合裂纹状态,而三维光弹性应力冻结法是测定复杂三维问题复合裂纹的有效方法。本文用双参数法测定I型应力强度因子,用切片逐次削去法测定Ⅲ型应力强度因子,实验误差较小。  相似文献   

3.
声焦散线及其与应力强度因子的关系   总被引:1,自引:1,他引:0  
根据焦散线的形成原理,以及含I型裂纹试件受力前后光程差与声程差表达式的相似性,提出了声焦散线的概念,得到了声焦散线沿横向最大尺寸与应力强度因子的关系,为通过声焦散线法确定应力强度因子打下了基础.  相似文献   

4.
张忠平  王锋会 《力学季刊》2001,22(3):359-362
基于焦散线的形成原理及含裂纹受力试件在裂尖附近区域的应力分布,得到了焦散线法确定应力强度因子的条件:初始曲线半径与试件厚度之比大于0.5。当满足该条件时,对光学各向同性材料及光学各向异性材料前表面反射的情形,只需测量焦散线沿横向的最大尺寸便可较精确地确定应力强度因子;而对于光学各向异性材料的透射或后表面反射情形,只有在忽略远场非奇异应力的影响后,才可借助焦散线的横向尺寸近似确定应力强度因子。  相似文献   

5.
管大椿  金江 《实验力学》1996,11(4):457-462
为提高焦散线法求解应力强度因子的精度,提出了两种基于多点非线性最小二乘法的改进方法。文中推导了控制方程,编制了程序,阐述了实验技术。作为应用实例,对三种典型裂纹试件作了测试与处理。结果表明,用本文方法处理的结果比文[1]经典法的结果有很大改进。作者还对图像处理用于焦散线法应力强度因子的提取作了初步探讨[5  相似文献   

6.
本文介绍焦散线-光弹性方法,在一次曝光时,能记录焦散线和光弹性二种信息,具有光路简单,信息丰富等优点,利用实验结果不仅能确定断裂力学中的应力强度因子 K_I,而且进一步能分离裂尖附近的主应力分量,同时讨论了与该方法有关的一些问题。  相似文献   

7.
在考虑远场非奇异应力σax、σoy、τ0影响的基础上,建立了Ⅰ-Ⅱ混合型裂纹应力强度因子与等差线条纹上点的极坐标间的非线性方程,为通过该方程确定应力强度因子,将θ=0及θ=π/2两极轴与三等差线条纹交点的坐标先后代入方程,并利用差分法得到了一种光弹性法确定Ⅰ-Ⅱ混合型裂纹应力强度因子的五参数法。作为实例,本文测定了环氧树脂及聚碳酸酯在不同载荷、不同裂纹条件下的应力强度因子,并将所得结果与相应的理论计算值及三参数法的结果进行了比较,发现本文提出的五参数法确定Ⅰ-Ⅱ混合型裂纹应力强度因子的方法,充分反映了远场非奇异应力的影响,所得结果精度较高。  相似文献   

8.
利用权函数法推导了围压和径向荷载共同作用下,考虑裂纹面摩擦的预制裂纹巴西盘应力强度因子计算公式,从理论上分析了围压、径向荷载和裂纹面摩擦对巴西盘应力强度因子的影响。结果表明,围压对I型应力强度因子有很大影响,I型应力强度因子随围压的增大而减小。当裂纹面闭合后围压和摩擦系数对II型应力强度因子同样具有显著影响,考虑裂纹面有效剪应力的权函数法理论解与有限元数值解相吻合,表明理论分析的正确性。  相似文献   

9.
为研究叶片裂纹尖端的应力奇异性,以某型航空发动机压气机叶片为例,利用有限元方法研究了叶片裂纹尖端应力强度因子的计算方法,并研究了旋转叶片振动状态下裂尖应力强度因子随裂纹长度的变化规律。建立计算模型时,在裂纹尖端划分了三维奇异单元,在裂尖外围划分了过渡单元。计算结果表明:研究旋转叶片振动状态下的裂尖应力奇异性,仅利用I型应力强度因子就具有足够的精度;对于同一裂纹,绝大多数情况下叶盆面应力强度因子大于叶背面应力强度因子,故研究叶片应力强度因子时只需研究叶盆应力强度因子即可;随着裂纹扩展,叶盆面I型应力强度因子不断增大。本文的研究方法及结论为进一步研究叶片的裂纹扩展规律及损伤容限奠定了基础。  相似文献   

10.
虞吉林 《实验力学》1993,8(3):226-232
本文分析了非平行光反射焦散线法测量Ⅰ型裂纹动态应力强度因子的一些理论问题,讨论了焦散面的形成和摄影记录系统的光路布置及参数选择并提出一种采用单透镜的沙丁相机高速摄影技术。该技术可以获得尺寸比通常所得的焦散象大得多的焦散记录。  相似文献   

11.
By means of the complex variable function method and the technique of conformal mapping, the anti-plane shear problem of an elliptic hole with two straight cracks in one-dimensional hexagonal quasicrystals is investigated. The solution of the stress intensity factor (SIF) for mode III problem has been found. Under the condition of limitation, both the known results and the SIF solution at the crack tip of a circular hole with two straight cracks and cross crack in one-dimensional hexagonal quasicrystals can be obtained.  相似文献   

12.
数字光弹性法综述   总被引:8,自引:3,他引:8  
将光弹性法与计算机图像处理技术相结合 ,来自动采集光弹性数据和分析应力的方法 ,称为数字光弹性法 ,与传统光弹性法相比 ,它可以进一步提高实验速度和精度。本文详细讨论了以下两个方面 :一是光弹性条纹的细化和倍增处理技术 ;二是自动确定光弹性参数的技术 ,包括相移法、傅立叶变换法、逐步载荷法、广谱分析法和RGB光弹性法等。通过对近二十年来国内外在这些方面的研究、应用和进展作了综述 ,认为采用白光的彩色域相移技术计算光弹性等倾角 ,结合采用白光源或三色光源的相移法来确定光弹性等色线级数 ,有望成为解决静态二维和三维冻结模型薄切片应力分析的最佳方法 ;另外 ,设计一种能实时和同步采集多幅条纹图的实验装置 ,通过相移法来自动获取动态光弹性数据 ,是数字动态光弹性法很有前景的发展方向  相似文献   

13.
全息光弹性中等和线是获得断裂力学中应力强度因子的一种有效方法之一。但用传统的全息光弹性方法获取等和线需暗房,要经过显影定影及再现,而且不能直接数字化使其应用受到限制。本文提出一种将全息光弹性与相移电子散斑干涉(Electric Speckle Pattern Interferometry,简称ESPI)有机结合的方法,不但克服传统全息光弹性的不足,而且使全息光弹性实现了数字化。文中将这一方法成功应用于有预制裂纹的三点弯曲试件上,定量求得其应力强度因子(Stress Intensity Factor,简称SIF)K1,而且实验值和理论值具有相一致的结果。  相似文献   

14.
The aim of the present work is to investigate the numerical modeling of interfacial cracks that may appear at the interface between two isotropic elastic materials. The extended finite element method is employed to analyze brittle and bi-material interfacial fatigue crack growth by computing the mixed mode stress intensity factors (SIF). Three different approaches are introduced to compute the SIFs. In the first one, mixed mode SIF is deduced from the computation of the contour integral as per the classical J-integral method, whereas a displacement method is used to evaluate the SIF by using either one or two displacement jumps located along the crack path in the second and third approaches. The displacement jump method is rather classical for mono-materials, but has to our knowledge not been used up to now for a bi-material. Hence, use of displacement jump for characterizing bi-material cracks constitutes the main contribution of the present study. Several benchmark tests including parametric studies are performed to show the effectiveness of these computational methodologies for SIF considering static and fatigue problems of bi-material structures. It is found that results based on the displacement jump methods are in a very good agreement with those of exact solutions, such as for the J-integral method, but with a larger domain of applicability and a better numerical efficiency (less time consuming and less spurious boundary effect).  相似文献   

15.
Layered structures are used in protection systems such as personal and heavy armor, windshields and also in functionally graded thermal barriers. The focus of this study is to understand the behavior of cracks in such systems, especially when the crack orientation is such that there are property changes along the crack front. Layered plates were prepared by bonding together sheets of epoxy and Polymethylmethacrylate (PMMA) using an epoxy adhesive. Among the two, epoxy has higher elastic modulus and lower fracture toughness compared to PMMA. Two different layer configurations; a single sheet of epoxy bonded to a single PMMA sheet (two layer) and a single sheet of epoxy sandwiched between two PMMA sheets (three layer) were considered. Single edge notched specimens were loaded in three point bending and the thickness averaged stress intensity factor (SIF) was estimated through photoelasticity. Subsequently, the behavior of crack-extension in these plates was also investigated. In both configurations, crack growth initiated in the epoxy layer first and extended stably before the start of crack extension in the PMMA layer. Once the crack extension started in the PMMA layer, the plate looses its structural integrity. It was observed that the onset of crack extension in the epoxy layer can be predicted using the thickness averaged SIF. A method using analysis of patched cracks is presented for estimating the load at which the plate completely looses its load carrying capacity. The estimates from this method match well with experimental results.  相似文献   

16.
Based on Chun-Tu Liu's result for Reissner's plate, an equation of caustics in cracked plate under symmetric bending was obtained. The shape and the distribution of light intensity of the caustic curve were discussed in detail. The relation between the stress intensity factor (SIF) and the size of the caustic curve was found by numerical method, and a simple and accurate experimental method for evaluating SIF in plate under bending was proposed.  相似文献   

17.
估算裂纹应力强度因子的新方法   总被引:1,自引:0,他引:1  
吴志学 《力学学报》2006,38(3):414-420
根据裂纹形状与裂纹尖端应力强度因子分布之间的固有关系,在线弹性断 裂力学条件下,提出了一种按已知I型裂纹应力强度因子分布规律求裂纹形状及相应应力强 度因子的无梯度迭代法. 通过有限厚度、有限宽度板穿透裂纹和表面裂纹的数值模拟实例验 证了所提出方法的有效性和实用性,并对不同应力强度因子分布规律对裂纹形状以及相应的 应力强度因子大小的影响进行了分析和讨论. 所提出的方法有助于提高实际扩展裂纹应 力强度因子的估算精度以及更合理地预测疲劳裂纹形状演化.  相似文献   

18.
Antiplane shear deformation of several edge-cracked geometries is considered. Analytical expressions are derived for the mode III stress intensity factor (SIF) of circular shafts with edge cracks, bonded half planes containing an interfacial edge crack, bonded wedges with an interfacial edge crack and also DCB’s. The results are extracted for simple isotropic materials as well as anisotropic materials and also bonded dissimilar materials and it is shown that the same expressions are obtained for the SIF under the same geometries but with different above-mentioned material properties. Different boundary conditions are assumed and the SIF relations are derived in each case. As the special cases, the SIF’s of the two bonded quarter planes containing an edge crack at the interface and infinite strip with a semi-infinite edge crack are extracted which coincide with the results cited in the literature.  相似文献   

设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号