Effect of twin boundary spacing on deformation behavior of nanotwinned magnesium

The effect of twin spacing and temperature on the deformation behavior of nanotwinned magnesium is investigated using molecular dynamics simulation. The results indicate that there is a pronounced shift in the mechanical behavior of nanotwinned magnesium when twin spacing is smaller than 2.9 nm, and that the yield strength decreases with increasing temperature. The results show that at relatively high temperatures, a strength softening can be observed when twin spacing is larger than 7.8 nm. This study demonstrates that the yield strength is associated with the dislocation storage ability of nanotwinned magnesium and the repulsive force between twin boundaries and dislocations.     

Molecular dynamics investigation of plastic deformation mechanism in bulk nanotwinned copper with embedded cracks

The plastic deformation of bulk nanotwinned copper with embedded cracks under tension has been explored by using molecular dynamics simulations. Simulation results show that the cracks mainly act as dislocation sources during the plastic deformation and occasionally as sinks at later stage. The dislocation pile-up, accumulation and transformation at twin boundaries (TBs) control the plastic hardening and softening deformations. The TB dislocation pile-up zone is estimated to be 5.6–8 nm, which agrees well with previous experimental and simulation results. Furthermore, it is found that the flow stress vs. dislocation density at the hardening stage follows the Taylor-type relationship.     

纳米Cu颗粒等温晶化过程的分子动力学模拟研究

采用分子动力学方法和镶嵌原子势,模拟了500个Cu原子(简称Cu₅₀₀) 组成的纳米颗粒的等温晶化过程.利用修正的均方位移、键对分析技术和内在结构(IS) 等方法对该过程中的结构和动力学行为进行分析研究.结果显示:与块体金属不同的是, Cu₅₀₀纳米颗粒在某一温度保温时,其晶化时间并不是一个定值, 而是存在一个统计分布,并且保温温度越低其晶化时间的分布范围越广, 最长晶化时间越长.在低温晶化时, Cu₅₀₀经历了一系列中间构型的转变才达到晶态, 表现出多步晶化的特征.文章作者研究了颗粒的初始构型对晶化进程的影响, 发现颗粒的初始结构特征和能量状态对其随后的晶化过程有着重要的影响, 同一温度下,颗粒初始构型的IS能量越低其晶化时间越长,这一点在低温时尤其明显.     

分子动力学模拟尺寸对纳米Cu颗粒等温晶化过程的影响

采用分子动力学方法和镶嵌原子势, 模拟了4000个Cu原子和13500个Cu原子(简称Cu₄₀₀₀和Cu₁₃₅₀₀)组成的纳米颗粒以及块体Cu的等温晶化过程. 通过对这些颗粒在晶化过程中结构和动力学行为的分析研究, 发现低温时, 不同尺寸的纳米Cu颗粒均出现多步晶化, 且晶化时间的分布曲线远比高温时范围大; 除了温度, 颗粒尺寸对晶化行为也有重要的影响, 尺寸越大, 晶化时间越长, 最终的晶化程度越高; 但是晶化时间随尺寸增大而增加的趋势不会一直持续, 发现存在一个临界尺寸r_c, 小于r_c时, 晶化时间随颗粒尺寸增大而增加, 大于r_c时,晶化时间随尺寸增大而减小.     

多晶银纳米线拉伸变形的分子动力学模拟研究

纳米尺度金属Ag以其独特的导电和导热性,广泛应用于微电子、光电子学、催化等领域,特别是在纳米微电极和纳米器件方面的应用.本文采用分子动力学方法模拟了不同晶粒尺寸下多晶银纳米线的拉伸变形行为,详细分析了晶粒尺寸对多晶银纳米线弹性模量、屈服强度、塑性变形机理的影响.发现当晶粒尺寸小于13.49 nm时,多晶Ag纳米线呈现软化现象,出现反Hall-Petch关系,此时的塑性变形机理主要以晶界滑移、晶粒转动为主,变形后期形成五重孪晶;当晶粒尺寸大于13.49 nm时,塑性变形以位错滑移为主,变形后期产生大量的孪晶组织.     

晶界对纳米多晶铝中冲击波阵面结构影响的分子动力学研究

用分子动力学方法研究了纳米多晶铝在冲击加载下的冲击波阵面结构及塑性变形机理.模拟研究结果表明:在弹性先驱波之后,是晶界间滑移和变形主导了前期的塑性变形机理;然后是不全位错在界面上成核和向晶粒内传播,然后在晶粒内形成堆垛层错、孪晶和全位错的过程主导了后期的塑性变形机理.冲击波阵面扫过之后留下的结构特征是堆垛层错和孪晶留在晶粒内,大部分全位错则湮灭于对面晶界.这个由两阶段塑性变形过程导致的时序性塑性波阵面结构是过去未见报道过的. 关键词： 晶界 塑性变形 冲击波阵面 分子动力学     

Theory and simulation of coupled grain boundary migration and grain rotation in low angle grain boundaries

Abstract

Microstructure evolution due to coupled grain boundary migration and grain rotation in low angle grain boundaries is studied through a combination of molecular dynamics and phase field modeling. We have performed two dimensional molecular dynamics simulations on a bicrystal with a circular grain embedded in a larger grain. Both size and orientation of the embedded grain are observed to evolve with time. The shrinking embedded grain is observed to have two regimes: constant dislocation density on the grain boundary followed by constant rate of increase in dislocation density. Based on these observations from the molecular dynamics simulations, a theoretical formulation of the kinetics of coupled grain rotation is developed. The grain rotation rate is derived for the two regimes of constant dislocation density and constant rate of change of dislocation density on the grain boundary during evolution. The theoretical calculation of the grain rotation rate shows strong dependence on the grain size and compares very well with the molecular dynamics simulations. A multi-order parameter based phase field model with coupled grain rotation is developed using the theoretical formulation to model polycrystalline microstructure evolution.     

Cu50Ni50合金快速凝固的分子动力学模拟

采用分子动力学模拟的方法研究了Cu₅₀Ni₅₀合金在不同冷却速度下的凝固过程,利用均方位移、径向分布函数和结构可视化等方法分析其微观结构.并对凝固模型进行拉伸模拟,通过应力应变曲线和直观结构变化分析其性能.研究表明：冷却速度对Cu₅₀Ni₅₀合金凝固形成的结构有较大影响,随着冷却速度的升高,凝固形成的结构中晶体含量减少,在较低的冷却速度下,如冷却1×10¹²K/s时,Cu₅₀Ni₅₀合金凝固形成晶体结构;在较高的冷却速度下,如1×10¹⁴K/s时,Cu₅₀Ni₅₀合金凝固形成非晶体结构,且非晶Cu₅₀Ni₅₀合金的抗拉性能要优于晶体Cu₅₀Ni₅₀合金.     

大角度Cu晶界在升温、急冷条件下晶界结构的分子动力学研究

应用分子动力学方法模拟了大角度重位点阵数Σ=5（310）/［001］对称倾斜Cu 晶界在被升温、降温到300,800和1100 K时的晶界结构. 结果表明，随着温度的升高晶界区域的结构发生变化.在远低于块体熔点温度时，晶界就已经发生了预熔化，在晶界区域存在着晶体-熔体共存的现象. 通过对高温晶界的急冷处理，改变了晶界处的原子结构. 关键词： 分子动力学 晶界 熔化 凝固     

Molecular dynamics simulation of stress and grain evolution

A three-dimensional molecular dynamics simulation is carried out to study the evolution of grains and stresses during the deposition of atoms on the (100) plane of a fcc regular crystal, using the cubic system with x–y periodic boundary conditions. At the bottom an atomic surface and at the top a reflecting wall are assumed. Atoms in the system interact via the Lennard–Jones potential. During simulation the films grow according to the Volmer–Weber mode and exhibit specific shape of the stress curves. When the film becomes continuous, the stress during the growth possesses a maximum value, but later new grain boundaries are formed. Individual atoms in the grain boundaries generate compressive stress in the films.     

Molecular dynamics simulation study on mechanical responses of nanoindented monolayer-graphene-nanoribbon

We investigated the mechanical responses of the nanoindented graphene-nanoribbon (GNR)-resonator using classical molecular dynamics simulations. The nanoindented force in this work was applied to the GNR's local point and then, GNR-resonator's frequency could be tuned by a nanoindented depth. We found the hardening or the softening of the GNR during its nanoindented-deflections, and such properties were recognized by the shift of the resonance frequency. The linear elastic regime in low applied force is explicitly separated with the non-linear elastic regime in high applied force. In particular, at the threshold point, a very small change of the nanoindented depth can cause great change in the resonance frequency, and this property can enable the GNR to be applied to electromechanical relay switching devices and the quantum-computer in quantum-mechanical coupling as well as mass detectors, pressure sensors, accelerometers, and alarms.     

铜、银和铂原子纳米团簇负热容现象的分子动力学模拟研究

本文采用微正则分子动力学方法模拟研究了铂、铜和银原子纳米团族从固态到液态的熔化过程,得到热容量随温度变化关系,结果表明这三种金属纳米团簇在熔化过程中均出现了负热容现象,并通过对团簇热能随温度的变化关系以及团簇原子数径向分布的分析,探讨了产生负热容现象的微观机制.     

Effect of grain boundary sliding on the toughness of ultrafine grain structure steel: A molecular dynamics simulation study

Molecular dynamics simulations are carried out to investigate the mechanisms of low-temperature impact toughness of the ultrafine grain structure steel. The simulation results suggest that the sliding of the {001}/{110} type and {110}/{111} type grain boundary can improve the impact toughness. Then, the mechanism of grain boundary sliding is studied and it is found that the motion of dislocations along the grain boundary is the underlying cause of the grain boundary sliding. Finally, the sliding of the grain boundary is analyzed from the standpoint of the energy. We conclude that the measures which can increase the quantity of the {001}/{110} type and {110}/{111} type grain boundary and elongate the free gliding distance of dislocations along these grain boundaries will improve the low-temperature impact toughness of the ultrafine grain structure steel.     

Grain size effects on microstructural stability and creep behaviour of nanotwinned Ni free-standing foils at room temperature

Creep tests were performed on the high stacking fault energy (SFE) nanotwinned (NT) Ni free-standing foils with nearly the same twin thickness at room temperature (RT) to investigate the effects of grain size and loading rate on their microstructural stability and creep behaviour. The grain growth mediated by the twinning/detwinning mechanism at low applied stresses (<800 MPa) and grain refinement via the detwinning mechanism at high applied stresses (>800 MPa) were uncovered in the present NT-Ni foils during RT creep, both of which are attributed to the interactions between dislocations and boundaries. It appears that a higher initial dislocation density leads to a faster primary creep strain rate and a slower steady-state creep strain rate. Unlike the non-twinned metals in which grain growth often enhances the creep strain rate, the twinning/detwinning-mediated grain growth process unexpectedly lowers the steady-state creep strain rate, whereas the detwinning-mediated grain refinement process accelerates the creep strain rate in the studied NT-Ni foils. A modified phase-mixture model combined with Arrhenius laws is put forward to predict the scaling behaviour between the creep strain rate and the applied stress, which also predicts the transition from grain growth-reduced to grain refinement-enhanced steady-state creep strain rate at a critical applied stress. Our findings not only provide deeper insights into the grain size effect on the mechanical behaviour of nanostructured metals with high SFE, but also benefit the microstructure sensitive design of NT metallic materials.     

界面旋转角对双晶镁力学性质影响的分子动力学模拟

采用分子动力学模拟方法,研究了在拉伸载荷下晶界对双晶镁变形机制的影响,对不同旋转角度的模型以及对称与非对称结构的模型进行了研究.模拟结果表明:应变加载方向与晶向所成角度对双晶镁塑形变形阶段的流动应力能够产生明显的影响;对称结构的双晶镁模型的塑性性质明显优于非对称结构模型.研究结果还发现,由于晶界区域不同的位错成核及发射等运动,大角度双晶模型的塑性响应明显优于对应小角度模型的塑性响应.     

应变效应对金属Cu表面熔化影响的分子动力学模拟

采用Mishin镶嵌原子势，通过分子动力学方法模拟了金属Cu 的(110)表面在不同应变下的熔 化行为，分析了表面熔化过程中系统结构组态和能量的变化以及固液界面迁移情况.金属Cu 的(110)表面在低于热力学熔点的温度下发生预熔化，准液体层的厚度随温度升高而增加.当 温度高于热力学熔点时，固液界面的移动速度与温度成正比，外推得到热力学熔点为1380K ，与实验结果1358K吻合良好.应变效应（包括拉伸和压缩）导致热力学熔点降低，并促进表 面预熔化进程.在相同温度条件下，准液体层的厚度随应变绝对值的增加而增大.应变效应导 致的固相自由能增加是金属Cu(110)表面热稳定性下降的主要因素，且表面应力和应变方向 的异同也会影响表面预熔化的进程. 关键词： 表面预熔化 热力学熔点 表面应力 分子动力学     

镍基单晶超合金Ni/Ni3Al晶界的分子动力学模拟

在镍基单晶超合金中，由于单晶Ni的晶格常数比单晶Ni₃Al的稍小，在Ni/Ni3Al晶界面 上必然要出现错配.采用分子动力学模拟了镍基单晶超合金的Ni/Ni₃Al晶界的结 构，考虑 了两个不同的初始模型，并进行了分子动力学弛豫.弛豫的结果均表明：由于晶格的差异形 成的错配能不是通过长程晶格错配的方式来释放，而是通过在局部区域形成位错的方式释放 的.由于Ni₃Al相周围Ni相环境的不同，形成的位错也有所不同. 关键词： 镍基单晶超合金 晶界 分子动力学模拟     

Molecular dynamics simulation of mechanical properties of nanocrystalline platinum: Grain-size and temperature effects

A series of molecular dynamics simulations has been carried out to study the mechanical properties of nanocrystalline platinum. The effects of average grain size and temperature on mechanical behaviors are discussed. The simulated uniaxial tensile results indicate the presence of a critical average grain size about 14.1 nm, for which there is an inversion of the conventional Hall-Petch relation at temperature of 300 K. The transition can be explained by a change of dominant deformation mechanism from dislocation motion for average grain size above 14.1 nm to grain boundary sliding for smaller grain size. The Young's modulus shows a linear relationship with the reciprocal of grain size, and the modulus of the grain boundary is about 42% of that of the grain core at 300 K. The parameters of mechanical properties, including Young's modulus, ultimate strength, yield stress and flow stress, decrease with the increase of temperature. It is noteworthy that the critical average grain size for the inversion of the Hall-Petch relation is sensitive to temperature and the Young's modulus has an approximate linear relation with the temperature. The results will accelerate its functional applications of nanocrystalline materials.     

Molecular dynamics simulation of low-energy bombardment of Pt (1 1 1) surface by Cu atoms with various incident angles

The low-energy bombardment of Pt (1 1 1) surface by Cu atoms with various incident angles (θ) is studied with MD simulations. In the case of near-normal incidence (θ≤20°), the result of energy deposition is similar to that of θ=0°. In contrast, in the case wherein the incident angles are higher than 60°, the incident atom cannot penetrate through the first layer and is scattered directly on the surface. The low-energy deposition has no obvious effect on the substrate. For 20°≤θ≤60°, the oblique incidence contributes to uniformity of nucleation and layer-by-layer growth of film as well as the layer-by-layer removal of atoms in the surface layers. Based on our MD simulations, the mechanism behind the deposition and thin film formation is related to the horizontal component and the vertical component of the impact momentum.