动态扭振法研究聚甲基丙烯酸甲酯/蒙脱土纳米复合材料的本体插层聚合

用动态扭振法研究热塑性塑料聚甲基丙烯酸甲酯(PMMA)/蒙脱土(MMT)复合体系的本体插层聚合.并试用处理交联体系固化的Flory理论、非平衡态热力学涨落理论和Avrami方程研究PMMA/MMT复合体系的本体插层聚合,求取表观活化能Ea.实验发现,PMMA/MMT插层聚合转化率曲线中后期与热固性树脂的固化曲线极为类似,表明剥离后的蒙脱土片层在复合材料中起到交联点的作用.     

酸酐固化环氧树脂/蒙脱土复合材料的等温固化动力学

用等温差示扫描量热法(DSC)研究了酸酐固化环氧树脂/蒙脱土复合材料的等温固化过程，考察了未处理的蒙脱土(MMT)和有机蒙脱土(OMMT)对环氧树脂固化动力学的影响. 实验表明， 环氧树脂的固化过程包含自催化机理，加入蒙脱土没有改变固化反应机理. 用Kamal方程对该体系的固化过程进行拟合，得到反应级数m、n，反应速率常数k1、k2，总反应级数(m + n)在2.4～3.0之间. MMT的加入使环氧树脂体系的k1、k2有所降低，而OMMT的加入对体系的k1、k2影响较为复杂，加入蒙脱土对环氧树脂固化体系的活化能影响较小.     

液晶环氧树脂/蒙脱土纳米复合材料的制备和固化反应动力学研究

用带有介晶基元的联苯二酚二缩水甘油醚 (BP)、4 氨基苯基磺酰胺 (SAA)和有机化蒙脱土 (93A)采用浇铸成模固化成型的方法制备出液晶环氧树脂 蒙脱土纳米复合材料 .WRXD结果表明 93A含量是 2 %时可形成剥离型纳米材料 ,而当 10 %时形成插层型纳米材料 ,5 %时则形成剥离和插层混合型的纳米材料 ;POM结果表明蒙脱土的存在能够破坏原有的扇形近晶相液晶织构 .DSC研究表明体系的固化反应动力学 ,可用变形的Kissinger Akahira Sunose法 (VKAS)表征 ,从求出的反应活化能和转化率关系 ,发现反应初期 ,蒙脱土使反应活化能降低 ,能够促进液晶环氧树脂的固化 .     

悬浮缩聚法制备酚醛树脂/蒙脱土纳米复合材料

采用悬浮缩聚方法在酸性催化剂作用下制备了酚醛树脂/蒙脱土纳米复合材料。以三种不同的蒙脱土：天然土、带有脂肪链季铵盐修饰蒙脱土和带有苯环基团的插层剂修饰的蒙脱土为原料制备了纳米复合材料,并考察了不同插层剂对纳米复合材料形貌的影响,发现带有苯环的插层剂修饰的蒙脱土与酚醛树脂的相容性能更好;研究了固化过程对纳米复合材料形貌的影响,XRD和TEM的结构表明固化过程可以促进带有脂肪链季铵盐修饰的蒙脱土进一步剥离,对其他两类的影响不大;此外还用TGA研究了纳米复合材料的热性能。     

动态扭振法在树脂固化研究中的最新应用

用计算机全自动控制的LHX-Ⅱ型树脂固化仪对热固性树脂基蒙脱土纳米复合材料、热塑性树脂PMMA基蒙脱土纳米复合材料以及聚合物互穿网络等体系进行了固化反应的研究。借用Avrami理论来处理树脂基纳米复合材料的固化行为,求取固化反应表现动力学参数。     

不饱和聚酯/有机蒙脱土复合材料的固化动力学

用动态扭振法研究不饱和聚酯／有机蒙脱土复合材料的固化动力学行为。结果表明该实验体系能够很好地应用Flory理论和Avami方程进行拟合。用非平衡态热力学涨落理论对纳米复合材料的固化作了理论顸估,顸估结果与实验固化曲线有很好的相符性。有机蒙脱土的加入降低了不饱和聚酯的固化反应速率,对固化反应表现活化能和复合材料的形成过程没有很大的影响。根据实验结果分析不饱和聚酯在有机蒙脱土存在下的固化分为定型和熟化两个阶段,在一定的固化温度和填充含量下。从动态扭振曲线上可以明显地观察到这种“二次固化”现象。     

环氧树脂/桐油酸酐/蒙脱土纳米复合材料固化动力学

环氧树脂/桐油酸酐/蒙脱土纳米复合材料固化动力学;固化反应;DSC     

4,4'-二氨基二苯醚二苯酮固化环氧树脂/粘土纳米复合材料的研究

采用离子交换法, 用十六烷基三甲基溴化铵处理钙基蒙脱土(MMT), 使蒙脱土的层间距由1.49 nm扩大到2.21 nm, 制备了环氧树脂/ BADK/MMT纳米复合材料, 并用XRD等手段研究了有机蒙脱土在环氧树脂中的插层及剥离行为. 研究结果表明, 蒙脱土含量及环氧树脂与有机土的混合温度和时间均对固化后复合材料的剥离产生影响, 只有在特定条件下才能得到剥离型纳米复合材料.     

动态扭振法研究聚甲基丙烯酸甲酸／蒙脱土纳米复合材料的本体插层聚合

用动态扭振法研究塑性塑料聚甲基丙烯酸甲酸（PMMA）／蒙脱土（MMT）复合体系的本体插层聚合，并试用处理交联体系固化的Folry理论，非平衡态热力学涨落理论和Avrami方程研究PMMA／MMT复合体系的本体插层聚合，求取表观活化能Ea.实验发现，PMMA／MMT插层聚合转化率曲线中后期与热固性树脂的固化曲线极为类似，表明剥离后的蒙脱土片层在复合材料中起到交联点的作用。     

苯并噁嗪/蒙脱土插层体系和苯并噁嗪体系的动态固化行为比较

比较了苯并噁嗪单体(BZ)和插层于蒙脱土层间的苯并噁嗪单体(BZ/MMT)两种体系的动态固化特性.实验发现,经有机化处理的蒙脱土在BZ/MMT体系的固化行为中起着重要的作用,使该体系存在催化聚合和热聚合两类固化单元反应.结果造成两种体系在特征固化温度、固化速率、反应热、反应级数以及表观活化能上存在明显的差别.     

Polystyrene‐modified novolac epoxy resin/clay nanocomposite: Synthesis,and characterization

A polystyrene‐modified epoxidized novolac resin/montmorillonite nanocomposite was fabricated and characterized successfully. For this purpose, novolac resin (NR) was epoxidized through the reaction of phenolic hydroxyl group with epichlorohydrin in super basic medium to produce epoxidized novolac resin (ENR). Afterward, a polystyrene was synthesized by atom transfer radical polymerization (ATRP) technique, and then brominated at the benzylic positions using N‐bromosuccinimide (NBS). The brominated polystyrene (PSt‐Br) was reacted with ethanolamine in basic medium in order to afford an amine‐functionalized polystyrene (PSt‐NH₂). An organo‐modified montmorillonite (O‐MMT) was synthesized through the treatment of MMT with hexadecyl trimethyl ammonium chloride salt. Finally, ENR‐PSt/MMT nanocomposite was fabricated through curing a mixture of ENR (70 wt.%) and O‐MMT (5 wt.%) with PSt‐NH₂ (25 wt.%). Transition electron microscopy (TEM) and powder X‐ray diffraction (XRD) analysis revealed that the fabricated nanocomposite has an exfoliated structure. Thermal property studies using thermogravimetric analysis (TGA) showed that the curing of ENR by PSt‐NH₂, as well as incorporation of a small amount of MMT have synergistic effect on the thermal stability of the ENR resin.     

Chemorheological study of the curing kinetics of a phenolic resol resin gelled

The changes in the resin viscosity, conductivity, mass, and enthalpy during curing reactions have been studied to obtain kinetic parameters that allow modeling of the resin behavior throughout its industrial application. In this work, isothermal rheological tests of a phenolic resol resin were performed in order to study its complex viscosity during crosslinking reactions. Samples were prepared by a precuring treatment in a heated plate press to reach gel point of the resin. Rheological analyses of resol resin curing were carried out at five different temperatures (80-100 °C), and the kinetic models of Arrhenius and Kiuna were applied. The resol resin curing presented an activation energy of 72.1 kJ/mol according to the Arrhenius model. The Kiuna model was proposed to fit the non-linear evolution of the resin’s complex viscosity at the highest temperatures. This kinetic model was suitable for predicting the changes in the complex viscosity of the resol resin after its gelation, and the process activation energy obtained for the second order polynomial applied in this model was 88.1 kJ/mol. In addition, the profile for the degree of curing of resol resin was determined from measurements of the material’s elastic modulus.     

Mechanism Studies on Water Sorption and Permeation in Epoxy Resin by Impedance Spectroscopy. II. Cure Kinetics of O-Cresol Novolac Resin with Esterfied Phenol Novolac Resin

Abstract

To study the effect of water affinity of the cured epoxy resin on water sorption and permeation in the cured epoxy resin, a novel hardener (esterfied phenol novolac was synthesized and used for obtaining the cured product without free hydroxyl group. Differential Scanning Calorimetry (DSC) and Fourier Transform Infrared Spectroscopy (FT-IR) were used to study the cure kinetics of o-cresol novolac epoxy resin using esterfied phenol novolac resin as curing agent in the presence of 2-methylimidazole as accelerator. Some kinetic parameters of the curing reaction such as the reaction order, activation energy, and frequency factor were obtained in the temperature range studied. The results show that this curing process is a first-order kinetic mechanism, which was different with that cured with phenol novolac resin.     

Energitics of micellizaion of sodium n-dodecyl sulfate at physiological conditions using isothermal titration calorimetry

The curing kinetics of nanocomposites based on phenolic resol cured with triethylamine (TEA) containing different amounts of organic montmorillonite was analyzed by differential scanning calorimetry. Kissinger-Akahira-Sunose (KAS) model-free kinetics has been applied to correlate the dynamic cure behaviour in the presence of modified montmorillonite. The effect in the curing of the use of different clay modifiers has also been studied. A commercial clay with hydroxyl groups (Cloisite 30B) and a customized montmorillonite (PheMMT) whose reactive groups induce condensation reactions with the resol matrix have been used. Strong dependency of activation energy on apparent conversion has been observed for all compounds.     

活性酯固化邻甲酚环氧树脂反应机理的研究

采用交叉反应研究在促进剂2-甲基咪唑存在下活性酯固化邻甲酚环氧树脂的反 应机理，用傅立叶转换红外（FTIR）原位测量技术，NMR，气-质联用（GC-MS）等 手段研究了模型化合物的反应动力学，并提出了其反应机理。结果表明，在促进剂 2-甲基咪唑存在下活性酯固化邻甲酚环氧树脂的反应是通过分子内机理进行的。     

Curing reaction of biphenyl epoxy resin with different phenolic functional hardeners

The investigation of cure kinetics and relationships between glass transition temperature and conversion of biphenyl epoxy resin (4,4′-diglycidyloxy-3,3′,5,5′-tetramethyl biphenyl) with different phenolic hardeners was performed by differential scanning calorimeter using an isothermal approach over the temperature range 120–150°C. All kinetic parameters of the curing reaction including the reaction order, activation energy, and rate constant were calculated and reported. The results indicate that the curing reaction of formulations using xylok and dicyclopentadiene type phenolic resins (DCPDP) as hardeners proceeds through a first-order kinetic mechanism, whereas the curing reaction of formulations using phenol novolac as a hardener goes through an autocatalytic kinetic mechanism. The differences of curing reaction with the change of hardener in biphenyl epoxy resin systems were explained with the relationships between T_g and reaction conversion using the DiBenedetto equation. A detailed cure mechanism in biphenyl-type epoxy resin with the different hardeners has been suggested. © 1998 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 36: 773–783, 1998     

Isothermal cure kinetics of epoxy/phenol‐novolac resin blend system initiated by cationic latent thermal catalyst

The investigation of the cure kinetics of a diglycidyl ether of bisphenol A (DGEBA)/phenol‐novolac blend system with different phenolic contents initiated by a cationic latent thermal catalyst [N‐benzylpyrazinium hexafluoroantimonate (BPH)] was performed by means of the analysis of isothermal experiments using a differential scanning calorimetry (DSC). Latent properties were investigated by measuring the conversion as a function of curing temperature using a dynamic DSC method. The results indicated that the BPH in this system for cure is a significant thermal latent initiator and has good latent thermal properties. The cure reaction of the blend system using BPH as a curing agent was strongly dependent on the cure temperature and proceeded through an autocatalytic kinetic mechanism that was accelerated by the hydroxyl group produced through the reaction between DGEBA and BPH. At a specific conversion region, once vitrification took place, the cure reaction of the epoxy/phenol‐novolac/BPH blend system was controlled by a diffusion‐control cure reaction rather than by an autocatalytic reaction. The kinetic constants k₁ and k₂ and the cure activation energies E₁ and E₂ obtained by the Arrhenius temperature dependence equation of the epoxy/phenol‐novolac/BPH blend system were mainly discussed as increasing the content of the phenol‐novolac resin to the epoxy neat resin. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 2945–2956, 2000